#pcb component assembly

[rfantennaindia]

schottky diode smd - PCB Antenna

A diode is a two-terminal electronic component that allows current to flow in one direction while blocking it in the other direction. It is a semiconductor device made up of a p-type material and an n-type material, which are joined together to form a p-n junction.

Diodes are commonly used in electronic circuits for a variety of purposes, such as rectification (converting AC to DC), voltage regulation, and signal modulation. They are also used in power supply circuits, lighting circuits, and electronic displays.

[perlina-hitechcircuits]

PCB Manufacturing-PCB Assembly-Hitech Circuits

Hitech Circuits is a lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on PCB Design, PCB Layout, Circuit board fabrication, Turnkey PCB assembly, and electronic parts sourcing services.

With mature supply chain, talented design team, advanced manufacturing techniques and quality control systems, Hitech is able to provide one-stop electronics manufacturing services and solution for our customers to help them stand out in the marketplace.

We offer a full range of Electronic manufacturing services.

-LED PCB

-Heavy Copper PCB

-Multilayer PCB

-HDI PCB

-Flexible PCB

-Rigid-Flex PCB

-High Speed PCB

-High Frequency PCB

-PCB Reverse Engineering

[cynthia-hitechpcba]

Multilayer SMT Manufacturing PCBA Board

For a Express PCB prototype assembly quote, please email the following files to sales11@hitechpcb.com :

BOM list

Gerber files

Quantity required

Our team is qualified to manage the complete process, which includes the sourcing of all components (PCB and Components), online order tracking and their management, PCB assembly, quality control and delivery.

We have specialized experts to deliver fast-turnaround, prototype printed circuit board assembly with surface-mount (SMT), through-hole (THT) and mixed-technology components. Our efficient and express PCBA prototyping service team can assemble printed circuit boards in as little as 24 hours.

[shreeramelectronics]

High-Quality Components Assembly by Shree Ram Electronics

Components assembly is a crucial process in delivering reliable electronic solutions, and Shree Ram Electronics specializes in providing top-notch services in this domain. Our expertise ensures efficient and precise assembly, catering to a wide range of requirements. With a commitment to delivering high-quality, innovative, and cost-effective end-to-end electronics solutions, we leverage unparalleled manufacturing experience, advanced design capabilities, and state-of-the-art infrastructure. Whether for large-scale production or customized projects, our components assembly services meet the highest standards of excellence, making us the trusted choice for valuable customers worldwide. 

[viasiontechnology]

Explore the commonly used components in PCB assembly, including resistors, capacitors, diodes, and more. Learn how Viasion ensures high-quality assembly for reliable PCBs.

[creativeera]

Press Fit Connectors: Enabling Reliable and Durable Connections in Electronics Manufacturing

Automating Connections With Press Fit Technology Press connectors provide a simple yet robust method for creating secure electrical connections through automated assembly processes. By utilizing a press or insertion tool, press connectors can be rapidly installed with minimal labor costs compared to traditional wiring methods. This makes them well-suited for high-volume manufacturing environments where quick and reliable connections are essential. Press connectors work by using a mating male and female connection design where the male pin is pressed or inserted into the female housing. The housing features a series of contact beams that flex inward during insertion of the pin. Once the pin is fully seated, the contact beams resiliently grip the pin to hold it securely in place without the need for soldering or crimping. Some key advantages of this press-in joining technology include: - Speed of installation. Press fit connectors can typically be installed in less than a second using automated insertion tools, significantly increasing throughput compared to hand-wiring methods. This reduces assembly time and costs. - Secure, vibration-resistant connections. When fully seated, press fit connections experience contacting pressures of around 40 pounds per square inch, ensuring a tight grip that withstands shock, vibration, and thermal cycling better than loose wire connections. - No heat or complex tooling required. Press Fit Connectorsutilize cold metal-to-metal joining, avoiding the use of soldering irons or crimping tools and heat that could damage sensitive components. Simple automated press tools suffice. - Repeatable connections. The consistent mechanical joining process of press fits provides highly repeatable connections from one unit to the next, improving product quality and reliability compared to hand-wired versions. - Ease of inspection. Fully seated press fit connections are self-locking so visual inspection confirms proper installation. Any missing or loose connections are obvious. - Compatibility with automated assembly. The simple press-in action is easily implemented using pick-and-place robots, conveyor-based presses, or other automated assembly equipment suited to high-volume manufacturing environments. Variations in Press Fit Designs While the general principle of press connectors remains the same, connector manufacturers have developed various innovative designs optimized for different application needs. Some common variations include: - Board-to-board connectors. Often used to make connections between circuit boards stacked vertically in enclosures. Board-to-board press fits feature male pins on one board that press directly into plated-through holes on the mating board below. - Box-header connectors. House receptacles or sockets in an insulating box or header, commonly used for applications like motor controls that need to break out many individual connections. The box speeds assembly and adds grip retention. - Power connectors. Larger press fit connectors may be designed to handle heavier loads like battery connections. Overmolded plastic housings provide strain relief while metal inserts securely join high-current power pins. - Compact right-angle connectors. Useful in space-constrained designs, right-angle press fits allow headers and receptacles to mate vertically instead of inserting straight inline. This saves valuable board area. - Water-resistant connectors. Gaskets and seals incorporated into the connector housing design provide an extra level of protection against moisture ingress for applications demanding an IP rating. Get more insights on Press Fit Connectors

Priya Pandey is a dynamic and passionate editor with over three years of expertise in content editing and proofreading. Holding a bachelor's degree in biotechnology, Priya has a knack for making the content engaging. Her diverse portfolio includes editing documents across different industries, including food and beverages, information and technology, healthcare, chemical and materials, etc. Priya's meticulous attention to detail and commitment to excellence make her an invaluable asset in the world of content creation and refinement.

(LinkedIn- https://www.linkedin.com/in/priya-pandey-8417a8173/)

[suntronic]

What are the Key Considerations in Electronic Component Sourcing for Engineering Projects?

Navigate the intricate process of electronic component procurement with insights into stages, factors affecting sourcing, and the debate: in-house design team or Electronics Manufacturing Service (EMS) provider. Uncover strategies to ensure quality, availability, and timely delivery in your projects

[avalontec]

“Like a master conductor leading an orchestra, Avalon Technologies harmonizes design, engineering, and production to create the symphony of electronics manufacturing.”

[techav]

Stepping Backwards a Bit (or 24)

I was looking for a simpler project. My recent 68030 work has been challenging and really pushing the limits of what I can do. I wanted something I could work on, but perhaps where someone else has already worked out the hardest parts.

I find laying out PCBs to be rather relaxing. It's one of those repetitive, almost meditative tasks, like needlepoint or whittling. The kind of hobby where I can turn on some music or a comfortable old TV show, zone out for a few hours, and wake up to this new thing that I created.

Debugging however is very mentally taxing, and the design work required to have a functional schematic to create a PCB for is an active whole-mind prices. So what I really needed was an existing project I could design a board for.

Enter [Grant Searle]. If you're not familiar with [Grant Searle], he has excellent designs for breadboard computers with a very minimal parts count. I studied his minimal Z80 design when I was first starting to build my own computers and learned a lot from it. I highly recommend his work for anyone who is interested in learning how to build their own computer but doesn't know where to start.

I was recently given a Rockwell 6502 CPU pulled from a dead LED marquee. I've never actually worked with 6502, so this seemed like a good time to try building Grant's 8-chip (or 7-chip) 6502 computer.

A few hours later, I had a PCB design completed, gerbers generated, and an order placed. Less than $5 for 5 boards, including shipping. A couple weeks later they arrived in the mail.

I did end up making a few modifications to [Grant]'s design. Instead of a clock circuit made from a discrete crystal and a couple inverter gates, I used a TTL oscillator because I've always found them to be more reliable. I also added support for an FTDI USB Serial adapter chip so that the board can be used with a modern computer as a terminal. And finally, since a PCB is much harder to add new components to relative to a solderless breadboard, I added an expansion header. All of it wrapped up in a compact PCB with lots of helpful silkscreen marking.

I realized after I had ordered the PCBs that the 16kB ROM chips [Grant] used are no longer manufactured or readily available. I have plenty of 8kB EEPROM chips on hand however. Thankfully the OSI BASIC interpreter [Grant] ported to this design fits within 8kB, so I was able to make a few adjustments and re-assemble it to work with the ROM chips I have on hand.

After a small glitch with my EEPROM programmer, it works!

It's quite a change going from my 33MHz+ 68030 to this tiny 6502 running at just under 2MHz. The BASIC text-based Mandelbrot renderer that completes in seconds on my 68030 takes four and a half minutes on the 6502. Not bad at all, considering my bus-impaired 68000 build takes 9 minutes to do the same.

This was a fun little project. It was a nice little break from some of the more difficult projects I've been working on. I have shared the project on GitHub for anyone who might want to take a look.

I hope to have this project with me this weekend, June 14-16, 2024 at Vintage Computer Festival Southwest. I'll be at table 207 in the Tandy Assemble hall, just across the street from the main exhibit hall.

[zoewang11]

hi,I'm zoe,a sales engineer in the Shenzhen STHL Electronics Co.,Ltd.we are a professional PCB & PCBA manufacturing servicer with more than 18 years of experience located in Shenzhen, China. Mainly provide services of electronic components sourcing + PCB fabrication + PCB Assembly + Housing assembly + Function testing services.

Our factory covers 7000+ square meters, has 5 (Panasonic) high-speed SMT production lines, 2 DIP lines, 2 testing lines, and 180+ workers, passed ISO9001, ISO14001, ISO13485 and IATF 16949 certifications, win recognization by Littelfuse, Hisense,Surfilter, etc.

[cherrieeeng]

PCB schematic/design/fabrication/assembly

MPN TECH Pte Ltd provides One-Stop PCBA Solutions in Singapore, which support from R&D prototype to mass production. We have built long-term collaborations with many local startups, SIMES, MNCS, etc. We also have lots of overseas PCBA projects in Europe and the US. If any questions feel free to let me know.

Our Solutions:

PCB Design;

PCB Fabrication;

Components souring;

PCB Assembly;(SG Local machine Assembly)

[cynthia-hitechpcba]

HDI PCB & High Interconnect PCB Manufacturing(from Hitech Circuits Co., Limited)

What is a high density PCB board (HDI PCB)?

The HDI board is based on the traditional double panel as the core board, which is made by continuously accumulating. This circuit board made by a continuous layer is also called the Build-Up Multilayer (BUM). Compared with the traditional circuit board, the HDI circuit board has the advantages of "light, thin, short, small".

The electrical connection between HDI's plate layer is achieved by conductive pores, buried holes, and blind holes. Its structure is different from ordinary multi -layer circuit boards. A large number of blind holes are used in HDI boards. HDI PCB uses laser direct drilling, and standard PCB usually uses mechanical drilling, so the number of layers and high width ratio often decreases.

HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.

High-density interconnect (HDI) PCBs are characterized by finer lines, closer spaces, and more dense wiring, which allow for a faster connection while reducing the size and bulk of a project. These boards also feature blind and buried vias, laser ablated microvias, sequential lamination, and via in-pads. As a result, a HDI board can house the functionality of the previous boards used. HITECH CIRCUITS is an HDI PCB manufacturer and provider in Shenzhen, China supports HDI PCB prototype and mass production with less expensive price and quick-turn lead time. Customers from a variety of industries we serve have a common that have high expectations in quality, reliability and on-time delivery in HDI PCB production. Our quality is not afterthought, but built into each process from front-end to fabrication and shipping.

HDI PCB's advantages

1. Reduce PCB cost: When the density of PCB increases beyond the eight-layer board, it will be manufactured in HDI, and the cost will be lower than that of traditional complicated press-forming process.

2. Better reliability: Due to the thin thickness and the aspect ratio of 1:1, the micropores have higher reliability when transmitting signals than ordinary through holes.

3. Improves thermal properties: The insulating dielectric material of the HDI board has a higher glass transition temperature (Tg) and therefore has better thermal properties.

4. Improve RF interference / electromagnetic interference / electrostatic discharge (RFI / EMI )

5. Increase design efficiency: Micro-hole technology allows the circuit to be arranged in the inner layer, so that the circuit designer has more design space, so the efficiency of the line design can be higher.

HDI PCB Manufacturing Process

The overall process for manufacturing HDI PCB is essentially the same as for fabricating other PCB board, with notable differences for PCB stack-up and hole drilling. Since HDI boards generally require smaller drill holes for vias, laser drilling is usually required. Although laser drills can produce smaller and more precise holes, they are limited by depth. Therefore, a limited number of layers can be drilled through at a time. For HDI boards, which are invariably multilayer and may contain buried and blind vias, multiple drilling processes may be required. This necessitates successive layer boding to achieve the desired stack-up or sequential lamination cycles. Not surprisingly, this can significantly increase PCB manufacturing time and cost. HDI PCB fabrication is an advanced technology and therefore requires expertise along with specialized equipment like laser drills, laser direct imaging (LDI) capability, and special clean room environments. In order to efficiently manufacture high-quality and reliable HDI PCB products, you must understand the HDI board manufacturing process and coordinate with your HDI PCB supplier to implement good DFM (Design for Manufacturability) for HDI layout design. Therefore, not all board factories have the ability to do the HDI, but Hitechpcb can, we will be here to support our customer needs.

-Consumer Driven Technology

The via - in - pad process supports 

More technology on fewer layers, proving that bigger is not always better. Since the late 1980's we have seen video cameras using cartridges the size of a novel, shrink to fit in the palm of your hand. Mobile computing and work at home have further promoted technology to make the computer faster and lighter, allowing consumers to do remote work from anywhere.

HDI technology is the main reason for these changes. The products do more, weigh less, and their bodies are smaller. Professional equipment, mini components and thinner materials reduce the size of electronic equipment, while expanding technology, quality and speed.

-Via in Pad Process

The inspiration from the surface installation technology pushed the restrictions of BGA, COB and CSP to a smaller square surface inch. The via in pad can be placed in the surface of flat land through the cushion process. The via is plated and filled with conductive or non-conductive epoxy resin, and then close and plat it to make it almost invisible.

It sounds simple, but there are eight steps to complete this unique process. Professional equipment and well -trained technicians followed closely to achieve perfect hiding.

-Via Fill Types

There are many different types of via fill materials: non -conductive epoxy, epoxy, copper filling, filling and electrochemical coating. All this leads to via buried in a flat land, and the land will be fully solders as normal land. Vias and mricrovias are drilled, blind or buried, plated, and then hidden under the SMT land. Processing vias of this type of Vias requires special devices and takes time. The process time of multiple drill cycles and controlling deep drills has increased.

-Cost Effective HDI

Although the size of some consumer products is reduced, quality is still the most important factor for consumers. Use HDI technology during the design process, you can reduce the 8-layer through-hole PCB to a 4 layer HDI Microvia technology packed PCB. The elaborate HDI 4-layer PCB wiring function can achieve the same or better functions as standard 8-layer PCB.

Although the Microvia process has increased the cost of HDI PCB, the appropriate design and decrease of layers of counting reduces the cost of the ingredients of the material, and the layer count is large.

-Laser Drill Technology

The smallest micro-vias can provide more technologies on the surface of the plate. Using a beam with a diameter of 20 microns (1 mil), this high impact can be cut through metal and glass to produce tiny via hole. There are new products, such as uniform glass materials, and they are low -loss layer pressure plates and low -dielectric constants. These materials have high heat resistance, can be used for lead -free components, and allows smaller holes.

-Lamination & Materials For HDI PCB Boards

Advanced multilayer technology allows designers to add other layers to form a multilayer PCB. Use laser drills to produce holes in the inner layer, and can be coated when pressed, imaging and etching. The process of this increase is called sequential construction. Hitechpcb HDI PCB manufacturing uses solid -filled VIA can better heat management, connect stronger connection and improve the reliability of the board.

The copper of the resin coating is a assistant with poor pores, with longer drilling time and thinner. Hitechpcb has ultra low contours and ultra thin copper foil, and its surface is fixed on a tiny nodule. This material has chemically treated and started chemical treatment and startup of the most fine and high quality lines and spacing technology.

The dry resistance of the layer pressure plate still uses heating scroll method to apply resistance to core materials. It is now recommended to preheat the material to the required temperature before the layer pressure process of the HDI printing circuit board. The preheating of the material can better apply dry resistance to the surface of the layer pressure plate, pull less calories from the heat roll, and keep the stable export temperature of the layer made products consistent. The consistent entrance and exit temperature cause less air clips under the movie. This is essential for the breeding of fine lines and spacing.

-How difficult is the HDI Printed Circuits Board?

The manufacturing of the HDI PCB (High Denity PCB) is relatively difficult because it needs to use complex manufacturing technique and technology. The following is some difficulties made by HDI PCB:

Multi-layer plate lamination: HDI Printed Circuits Boards are usually composed of multi-layer boards, and multi-layer boards need to be laminated. Multi-layer plates need to control parameters such as temperature, time, pressure to ensure the control quality and thickness control between multi-layer boards.

Blind holes and buried holes: HDI Printed Circuits Boards need to create blind holes and buried holes, which requires technologies such as laser drilling and chemical corrosion to ensure the accuracy and quality of the hole.

Impedance control: HDI Printed Circuit Boards need to control impedance, which requires fine design of the layout and circuit of the circuit board, and uses special materials and processes to achieve impedance control.

Small track space manufacturing: HDI Printed Circuits Boards need to make very small spacing tracks (conductions), which requires high-precision manufacturing equipment and technologies to ensure the accuracy and quality of the circuits.

-The difference between HDI board and normal PCB

The HDI board is generally made of accumulation method. The more times the accumulation layer, the higher the technical grade of the board. Ordinary HDI boards are basically one accumulation. The high-end HDI uses two or more accumulated technologies, and at the same time, advanced PCB technology such as stacked holes, plating filling, and laser direct punching. When the density of PCB increases more than eight layers board, it is made by HDI, and its cost will be lower than the traditional complex compact process.

The electrical performance and signal of the HDI board are higher than that of traditional PCB. In addition, HDI boards have improved better for radio frequency interference, electromagnetic wave interference, electrostatic release, and thermal conduction. High density integration (HDI) technology can make terminal product design more miniaturized, while meeting higher standards for electronic performance and efficiency.

The HDI board uses a blind hole plating to perform secondary pressure, divided into one order, second order, third order, fourth, fifth order, etc. The first order is relatively simple, and the processes and processes are easy to control. The main problem of the second order is the issue of the place, and the other is the problem of punching and copper plating. There are many second order design. One is the wrong position of each order. When connecting the secondary neighborhood, it is connected to the middle layer through the wire. The method is equivalent to two first order HDI. The second is that the two order holes are overlapped. The second -order is realized by the superposition method. The processing is similar to the two first order, but there are many key points of the process. The third type is to punch perforation directly from the outer layer to the third layer (or N-2 layer). There are many different techniques from the front, and the difficulty of punching is even more difficult.

In PCB proofing, HDI costs high, so general PCB proofing manufacturers are unwilling to do it. HITECHPCB can be a HDI Blind PCB board that others are unwilling to do. At this stage, the HDI technology adopted by HITECH has exceeded the highest number of layers of 20 layers; the number of blind holes is 1st to 4th; the minimum pore diameter is 0.076mm, and the process is laser drilling.

HDI PCB Manufacturer & Assembly – One-stop services from China

-HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiring density is high.

HDI PCB Manufacturer & Assembly – One-stop service The HDI PCB is defined as a micro via with a hole diameter of 6 mils or less and a hole diameter of 0.25 mm or less. The contact density is above 130 points/square, and the wiring density is with a line width/pitch of 3 mil/3 mil or less. HDI PCB, the full name is High Density Interconnect PCB, it requires much higher wiring density with finer trace and spacing, smaller vias and higher connection pad density. Blind and buried vias’ design is one of their marked feature. HDI PCB board is widely used in Cell phone, tablet computer, digital camera mother board PCB, GPS, Automobile board, LCD module and other different area.

HDI PCB is the abbreviation for High Density Interconnect PCB or High Density PCB. An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. Hitech Circuits Co., Limited is a professional high density interconnect PCBs, HDI PCB board manufacturer, supplier and design company from China, if you are looking for reliable high density interconnect PCB board partner from China, please don’t hesitate to contact sales11@hitechpcb.com, from Cynthia.

[shreeramelectronics]

Components Soldering: Ensuring Quality and Precision in Electronics Manufacturing

When it comes to electronics manufacturing, components soldering is a crucial process that determines the reliability and performance of electronic devices. Proper soldering connects various components on a circuit board, creating a secure and conductive path for electricity to flow. This essential step is integral to achieving high-quality electronic products, and at Shree Ram Electronics, we take pride in delivering top-notch, innovative, and cost-effective solutions that meet and exceed industry standards.

In components soldering, precision is key. The technique requires the right tools, including soldering irons, solder wire, flux, and desoldering pumps, all essential for achieving accurate results. A critical aspect of the process is ensuring that each component is connected securely to prevent potential malfunctions. If done incorrectly, poor soldering can result in weak connections, impacting the functionality and durability of the final product. We leverage our extensive manufacturing experience and state-of-the-art infrastructure to handle every step of soldering with utmost accuracy.

Components soldering also plays a significant role in the product lifecycle by affecting the longevity and performance of electronics. High-quality soldering not only ensures that electronic devices perform optimally but also minimizes the need for repairs and replacements, which is essential for end-users and manufacturers alike. Our dedicated team understands we nuances and follows strict quality control protocols, ensuring every component is soldered to perfection.

We are committed to providing reliable, end-to-end electronics solutions. We combine our innovative design capabilities with cutting-edge infrastructure to meet the varied needs of our customers. Whether for large-scale production or custom electronics projects, our approach to components soldering is rooted in delivering quality and efficiency at every stage.

For manufacturers looking for dependable electronics solutions, this is a trusted partner in the industry. We understand that soldering quality directly impacts product performance, so we focus on delivering components soldered with precision, backed by a team of skilled professionals dedicated to excellence.

[adafruit]

Selective soldering 🔧🔬🔥

Selective soldering involves attaching specific components to printed circuit boards (PCBs) and molded modules, a method particularly useful for items susceptible to heat damage from standard reflow ovens or wave soldering found in conventional surface-mount technology (SMT) or through-hole assembly techniques. Typically, this method is applied after an initial SMT oven reflow phase. The components targeted for selective soldering are often nestled among others already soldered via a surface-mount reflow method. This demands high precision in the selective soldering process to prevent damage to the surrounding elements.

[circuitwala]

Printed Circuit Board Basics

Most of us are using Printed Circuit Board in our daily life. Printed Circuit Boards are used in almost all the Electronic products, from consumer gadgets such as PCs, tablets, smartphones, and gaming consoles to industrial and even high tech products in strategic and medical electronics domains.

Here, we have some statistics for you that shows how many electronic devices connect worldwide from 2015 to 2025. This statistic shows an increase in the use of a number of PCB in people daily life. Hence, CircuitWala took this opportunity to provide a basic knowledge about PCB via this article.

There are so many books available online which teach about Printed Circuit Board design and hardware part. There are few links available online which shows only a few basic fundamentals of PCB and few are there for Basics of Printed Circuit Board (PCB) Design. Few which gives good know knowledge on Printed Circuit Board terminology. But in the end for the hobbyist, there is no such material available which make their work easy.

Now days there few online designing websites available which allow hobbyist and students to create their design and Printed Circuit Board fabrication part. These websites provide limited features and charge high for the full edition. We, @CircuitWala are in try to provide one platform which provides plenty of Printed Circuit Board knowledge digitally to make your work simple and easy.

Alternatives of PCB include wire wrap and point-to-point construction. Creating a layout of PCB is a little bit time-consuming method as compared to its alternative solution but manufacturing of PCB is cheaper and faster then other wiring methods as electronic components are mounted and wired with one single part.

Let’s start with some basics of Printed Circuit Board with this article. Here in this article we will discuss about history of PCB to understand the emerge of PCB, Types of PCB to make your complex PCB a very simple using different types, Usage of PCB to provide you an idea to create more Printed Circuit Board projects, Advantages and Disadvantages, Possible Future to know about new technological change in Printed Circuit Board manufacturing and also about how to destroy and manage your PCB’s e-waste? We know you are eager to know all the stuff in details but before that let’s make a simple definition of Printed Circuit Board.

What is Printed Circuit Board?Printed Circuit Board is an electronic device made of conductive material(FR-4) like copper which connects components mounted on it to to get desired output by providing an input on another end.

When the board has not mounted with any of the components is called as Printed Circuit Board or Printed Wired Board. Mounting of an electronic component on Printed Circuit Board is called as PCB assembly.

History of Printed Circuit BoardThe invention of Printed Circuit Board was by Austrian engineer Paul Eisler as part of a radio set while working in England around 1936.

In early days before Printed Circuit Board became common in use, Point-to-Point construction was used. This meant some bulky and unreliable design that required plenty of sockets and regular replacement of it. Most of this issue directly address when PCB went into regular production.

Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components’ leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called Through-Hole construction. There is one other method to mount component is called as Surface Mount.

Type of Printed Circuit BoardPCBs are produced from the different types of material and on the basis of that material PCBs are divided mainly into two parts: Rigid PCB and Flexible PCB. Nowadays, a combination of Rigid and flexible PCB is also possible and that is called as Flexi-Rigid PCBs.

Most of the PCBs are built in layers. The inner layer is the base material called as a substrate. Rigid PCBs are mainly made of material like epoxy materials and Flexible PCBs are made of plastic material that can withstand high temperatures.

Rigid PCBs are generally, hard materials that hold the component in a better way. The motherboard in the tower of a computer is the best example of Rigid PCBs. Flexible PCBs fundamental material allows PCB to fit into forms that Rigid PCBs can not. Flexible PCBs can turn round without harmful the circuit on PCB.

All Rigid and Flexible PCBs can come in three formats by layers: Single Layer, Double Layer, and Multi-Layer.

1. Single Layer PCBSingle Layer PCBs have been around since the late 1950s and still dominate the world market in sheer piece volume. Single Sided PCBs contain only one layer of conductive material and are best suited for low-density designs. Single-sided PCBs are easy to design and quick to manufacture. They serve as the most lucrative platform in the industry.

2. Double Layer PCBDouble Layered printed circuit board technology is conceivably the most popular type of PCB in the industry. Double Sided PCB (also known as Double-Sided Plated Thru or DSPT) circuits are the gateway to advanced technology applications. They allow for a closer (and perhaps more) routing traces by alternating between top and bottom layers using vias.

3. Multi Layer PCB

Multilayer PCB is a circuit board that has more than two layers. Unlike a Double-Sided PCB which only has two conductive layers of material, all multilayer PCBs must have at least three layers of conductive material which are buried in the center of the material.

Usage of Printed Circuit BoardBy reading this article till this point, we hope that you are now able to get about printed circuit boards. Now, we will make you understand about different applications of printed Circuit Board.

In this digital world, Printed Circuit Board is in almost all our daily life electronic devices and in our industrial electronics as well. Below are the industries where PCBs are used:

Possible FutureNowadays, most of the circuits are replaced to produce Printed Circuit Board from the old methods. Revolution in technology made many of the processes automated and hence it is easy to manufacture PCB. But still, these processes are a bit expensive to hire, involve toxic waste and use high temperatures and acids. With technological advances we have seen in the past years, it is not hard to imagine PCB will soon be revolutionized. Not only that but research institutes predict a more ‘green’ future for PCBs; PCBs being made of paper.

Electronic Waste (e-waste)Electronic Waste or e-waste is described as discarded electrical or electronic devices. Informal processing of e-waste in developing countries can lead to adverse human health effects and environmental pollution.

Electronic scrap components contain a hazardous substance such as lead, cadmium, beryllium, or brominated flame retardants. Recycling and disposal of e-waste may involve significant risk to health of workers and communities in developed countries and great care must be taken to avoid unsafe exposure in recycling operations

Nowadays, developing countries are encouraging electronic users to take care while recycling the e-waste or submit them to the organization who are involved in such activities.

SummaryIn this blog, we have learned the basics of Printed Circuit Board. CircuitWala is planning to write as many blogs to provide more and more knowledge of Printed Circuit Board. Either it is basics or manufacturing or usages or advantages and disadvantages of PCBs. We will also try to make our users/customers up to date for the new technology innovations, including past histories and revolution of the PCB industries.

In the next blog, we will look at more briefly about the different types of Printed Circuit Board. We also understand the process to make it and different usage and application for the same.

[amy-hitechpcb]

LED PCB Assembly

What is the LED Circuit Board assembly?

Generally, LED PCB assembly is considered to be a circuit board that has the LED components soldered to it. The LED is soldered to the printed circuit board and features a chip that creates the light as electrically connected. A thermal heat sink and a ceramic base are used to bond the chip. Not all the PCB products can be used in Led industry, as an LED PCB is easy to create a high volume of heat, but making it hard to cool with traditional methods. For this reason, metal core PCB is widely used in LED application because of their enhanced ability to dissipate heat, especially aluminum pcb is often used to fabricate PCB for LED lights.

We’ve had great LED PCB assembly experiences with top LED chips to brand such as Cree, Luxeon, Osram, Nichia, Lumileds, MLS, EVERLIGHT, Samsung, LG, Seoul., etc. PCB LED lights can be incorporated into numerous lighting applications due to their combination of excellent energy efficiency, low cost and maximum design flexibility.

Application of LED PCB Assembly

Hitechpcba serves customers in different industries, providing highly reliable and innovative LED PCBs for various applications:

• Horticulture light LED PCB Assembly

• LED controller PCB Assembly

• Computer LED display and indicators

• LED lights PCB Assembly for medical use

• Automotive LED PCBs Assembly include PCBs for brake lights and headlights

• Street lighting LED PCB Assembly

• Flashlights and camping accessories

• Traffic light PCB Assembly

• Commercial lighting LED PCB Assembly

LED PCB Assembly specification

Number of layers for LED PCB

These layers are made up of aluminum and magnesium, but now have Copper base material  and Ceramic base materials for LED PCB industry, we can meet it.

Aluminum LED PCBs stand out among other PCBs because it has a good insulation characteristic and has a better machinery performance, the cheap cost is one important factor too.

Types of layers for LED PCB Assembly

Normally, the base layer is made using aluminum alloy metal.

This aluminum alloy substrate used in making the base makes it ideal for through-hole technology which transfers and dissipates heat.

A thermal insulation layer is made using some ceramic polymer which has good viscoelasticity characteristics.

It is highly heat resistant and protects the PCB against heat and mechanical stress.

The circuit layer, which is covered by a copper foil which can range from one to ten ounces.

LED Board type- single or in panel

Some boards are shapeless. For this reason, LED PCB panels are used. This reduces time, labor production and testing time.

Some LED PCB Assembly is done on a single board while others are done on panel boards.

LED PCB Assembly Process

Roughly, the PCBA process can be divided into theses phases: soldering paste printing > SMT (surface mounted technology) > reflow soldering > AOI (automated optical inspection)> THT (through-hole technology) > wave soldering > touch-up and cleaning > IC-programming > FCT (functional tests) > aging testing. 

Below we show you the process.

Step1. Summarizing Project Information

Before contacting your supplier, make sure you have all the project information. Suppliers will need info following for quoting LED PCB assembly:

Gerber

BOM

LED PCB specification

Quotation quantity

Once you have gathered these information, you can contact us and request for a quote.

Of course, you can also provide the schematic, LED PCB Assembly pictures and even samples to us. The more details they have, the more accurate the supplier’s quotation will be.

Step2. Discussion and details about custom LED PCB Assembly

Different projects will have different requirements. Remember the special requirements mentioned in step 1? That’s going to be the focus of this session. Equipment and engineering capacity will not be identical between suppliers. Make sure your supplier has the equipment to produce and assemble major components and the corresponding testing capabilities.

For example, some vendors don’t have X-ray testing equipment, which means they can’t check the mount quality of BGA chips. Outsourcing this step will increase risk and cost. That’s what you don’t want.

Also, pay attention to time taken by the supplier to quote. Motherboards often contain hundreds or even thousands of components, and they are supplied by different manufacturers. To ensure the quality of the components, the supplier sourcing team will make multi-inquiries from these manufacturers or authorized suppliers to match customer’s requirement, which usually takes 2-3 business days, and even longer for some scarce chips. Therefore, if your project is complex and the supplier quotes you within few hours, double check with them.

Step3. Sample and feedback

After confirming the PI, the supplier will usually provide pre-production samples for your approval. At the same time, the supplier will also confirm with you the logistics plan of the bulk goods. Make sure they understand your shipping requirements, including details on packaging, customs clearance, taxes, etc.

For us to have a successful LED PCB Assembly process, its functions must be defined. Compliance requirement is defined to reduce the effect when components are selected.

The Bill of Materials is then generated from the information installed on the LED PCB.

All this information is used to assemble components which are identified from MOB to the LED PCB.

After that, the routing of traces is determined to each component, based on the size, shape of the circuit board and location of connectors.

Hitech Circuits is trusted by thousands of electronic engineers on their LED PCB assembly projects, from consumer, led bulb to precisely medical LED light, we can help you from the beginning of design stage; From commercial flood LED to industrial high power LED, from automotive LED to military LED, Venture is the perfect place for your LED PCB assembly requirement.

Hitech Circuits has been participated in hundreds and thousands of LED lighting projects, by providing LED PCB and also LED PCB assembly service.

Our LED PCB assembly had covered both ends of the Lighting Class LED size spectrum, assembling some of the largest (2 meter long boards) and some of the smallest LED Lighting applications which used in Medical Endoscopes.

LED PCB Assembly is very crucial in the current industrial development. Many electrical devises are being innovated and the old once being improved.

LED PCBs are useful due to the fact that they are made using materials that can transfer and dissipate heat. This characteristic increases device durability.

The world is changing with new technology, especially PCB technology that plays an essential role in the application of LED circuits. And the LED industry is taking advantage of this technology and growing faster.

As a full feature PCB solutions provider with more than a decade of experience, we're capable to provide LED PCB fabrication, components procurement and LED PCB assembly all under one roof. We can work with you to develop metal core PCB, aluminum circuit boards customized to your specific applications. We feature competitively priced PCBs made with standard FR-4 material that includes a thermal aluminum clad layer that will efficiently dissipate heat, keep all LED PCB components cool and significantly enhance the performance of your products.

LED pcb board, LED pcb assembly

LED with its advantages of high brightness, high efficiency, low heat, long life, is considered the most development potential in the 21st century lighting. In the market and policy driven by the rapid development of the domestic LED industry blowout has formed a relatively complete industrial chain, including the production of epitaxial wafers, chip preparation, packaging, integration, LED application. In 2010, China's LED industry scale, up from $ 827 billion in 2019 to 220 billion yuan, an annual growth rate of over 70%, higher than the 50% level of growth of the global LED lighting industry output value. Among them, the middle and lower reaches of the most complete industrial chain, accounting for 90% of the overall percentage of the GDP.Chinahas become the world's leading LED manufacturing base and important application market.

To further promote the technological innovation of the LED industry, construction and wide application of independent industry chain, China Electronic Appliance Corporation and industry associations to organize the theme of "Focus on the core energy LED Exhibition will be held November 9-11, 2010  in Shanghai International Expo Center and the 78th China Electronics Fair over the same period will be held will create from raw materials, epitaxial wafers, chip, LED bracket, LED accessories, LED packaging and supporting materials, the LED backlight upstream firm to the upstream and downstream enterprises of the display, lighting, landscaping, decorative lighting, traffic lights, automotive lighting, special lighting, to the equipment, instrumentation, software, finance, consulting and other service enterprises and technological exchanges and market trading platform, help the domestic industry sustained and healthy development, and promote the steady expansion of the LED application market.

In the LED industry chain upstream of the epitaxial wafers and LED chips accounted for 70% of the profits of the whole industry, and technology-intensive, capital-intensive, where the core technology of the LED. Well-known epitaxial wafer and chip production enterprises will be exhibited a number of energy-efficient, low heat, cost-effective LED products, many of whom have excellent products of international advanced level.

LED electronic pcb assembly manufacturing 100% Original LED Chip with one-stop in-house pcba services