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#diodes and triodes
rfantennaindia · 1 year
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schottky diode smd - PCB Antenna
A diode is a two-terminal electronic component that allows current to flow in one direction while blocking it in the other direction. It is a semiconductor device made up of a p-type material and an n-type material, which are joined together to form a p-n junction.
Diodes are commonly used in electronic circuits for a variety of purposes, such as rectification (converting AC to DC), voltage regulation, and signal modulation. They are also used in power supply circuits, lighting circuits, and electronic displays.
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boypussydilf · 1 year
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the graybles eps r so funny just for cuber. if you thought adventure time slang was weird NOW wait until language has changed over ANOTHER thousand years. actually he might just be an alien idk.
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forgottenbones · 1 year
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Why The First Computers Were Made Out Of Light Bulbs
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andris1968 · 1 month
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1950’S TRANSISTOR TRAINING FILM " SEMI-CONDUCTORS: DIODE AND TRIODE FUN...
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98995 · 1 month
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Best Capacitors manufacturer in India
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Electronic component:
An electronic component is any basic discrete electronic device or physical entity part of an electronic system used to affect electrons or their associated fields. Electronic components are mostly industrial products, available in a singular form and are not to be confused with electrical elements, which are conceptual abstractions representing idealized electronic components and elements. A datasheet for an electronic component is a technical document that provides detailed information about the component’s specifications, characteristics, and performance.
Advantages of Electronic components:
These leads connect to other electrical components, often over wire, to create an electronic circuit with a particular function (for example an amplifier, radio receiver, or oscillator). Basic electronic components may be packaged discretely, as arrays or networks of like components, or integrated inside of packages such as semiconductor integrated circuits, hybrid integrated circuits, or thick film devices. The following list of electronic components focuses on the discrete version of these components, treating such packages as components in their own right.
Classification Electronic components:
Active components rely on a source of energy (usually from the DC circuit, which we have chosen to ignore) and usually can inject power into a circuit, though this is not part of the definition.[1] Active components include amplifying components such as transistors, triode vacuum tubes (valves), and tunnel diodes.
Passive components cannot introduce net energy into the circuit. They also cannot rely on a source of power, except for what is available from the (AC) circuit they are connected to. As a consequence, they cannot amplify (increase the power of a signal), although they may increase a voltage or current (such as is done by a transformer or resonant circuit). Passive components include two-terminal components such as resistors, capacitors, inductors, and transformers.
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Electromechanical components can carry out electrical operations by using moving parts or by using electrical connections.
Most passive components with more than two terminals can be described in terms of two-port parameters that satisfy the principle of reciprocity — though there are rare exceptions.[2] In contrast, active components (with more than two terminals) generally lack that property.
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Electronic components like Resistors, Capacitors, Inductors, semiconductor ICs, Relays form the backbone of all the technological advances today. With these, you can design any system, any model for your project.
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cynthia-hitechpcba · 2 months
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Component description of PCBA patch processing
PCBA patch processing mainly includes two major processes: PCB circuit board production and SMT patch processing. Electronic components are indispensable in the process. Electronic components are the basic part of PCBA patch processing and an important factor affecting the performance and quality of PCBA finished products. So what are the commonly used electronic components for PCBA patch processing?
1. Resistor
Resistors are electronic components with resistance characteristics and are one of the most widely used components in PCBA processing. Resistors are divided into fixed resistors and variable resistors (potentiometers), which play the role of voltage division, current division and current limiting in the circuit.
2. Capacitors
Capacitors are also one of the basic components in PCBA processing. They are components that store electrical energy and play the role of coupling, filtering, DC isolation and tuning in electronic circuits.
3. Inductor coils
Inductor coils are referred to as inductors and have the function of storing magnetic energy. Inductor coils are usually composed of skeletons, windings, shielding covers, magnetic cores, etc.
4. Potentiometers
Resistors with variable resistance values, that is, resistors that can be continuously adjusted within a specified range, are called potentiometers. The potentiometer consists of a housing, a sliding end, a rotating shaft, a ring resistor and three lead-out terminals.
5. Transformer
The transformer consists of an iron core (or magnetic core) and a coil. The coil has two or more windings, of which the winding connected to the power supply is called the primary coil, and the remaining windings are called the secondary coil.
The transformer is a device that converts voltage, current and impedance. When an AC current flows through the primary coil, an AC magnetic flux is generated in the iron core (or magnetic core), causing a voltage (or current) to be induced in the secondary coil. The transformer is mainly used for AC voltage conversion, current conversion, power transmission, impedance conversion and buffer isolation, etc. It is one of the indispensable important components in the PCBA machine.
6. Crystal diode
The crystal diode (i.e. semiconductor diode, hereinafter referred to as diode) is made of a PN junction, electrode leads and an external sealed tube shell, and it has a unidirectional conductive characteristic.
7. Crystal triode
The crystal triode (hereinafter referred to as triode) is the core device for signal amplification and processing, and is widely used in PCBA machines.
8. Field Effect Transistor
Field effect transistor (FET for short) is also a semiconductor device with PN junction. Unlike triode, it does not use the conductive property of PN junction, but its insulating property.
9. Electroacoustic Device
The device used to complete the conversion between electrical signal and sound signal in the circuit is called electroacoustic device. There are many types of it, including speakers, microphones, headphones (or earplugs), transmitters, receivers, etc.
10. Photoelectric Device
Photoconductive devices that work with the photosensitive properties of semiconductors, photovoltaic cells and semiconductor light-emitting devices that work with semiconductor photovoltaics are collectively referred to as photoelectric devices.
11. Display Device
Electronic display device refers to a photoelectric conversion device that converts electrical signals into optical signals, that is, a device used to display numbers, symbols, text or images. It is a key component of electronic display devices and has a great impact on the performance of display devices.
12. Sensor
The sensor can sense the specified measured value and convert it into a usable signal according to a certain rule. It is usually composed of a sensitive element and a conversion element.
13. Surface Mount Components
Surface mount components (SMC and SMD) are also called patch components or chip components. They include resistors, capacitors, inductors and semiconductor devices, etc. They have the characteristics of small size, light weight, no leads or very short leads, high installation density, high reliability, good vibration resistance, and easy automation.
14. Thyristor
SCR, short for silicon-controlled rectifier, is a high-power semiconductor device with a four-layer structure of three PN junctions, also known as thyristor. It has the characteristics of small size, relatively simple structure and strong functions, and is one of the more commonly used semiconductor devices.
15. Switches, relays, and various connectors
Switches are used to cut off, connect or convert circuits in electronic equipment. Relays are automatic control devices that will change the output in a jumpy manner when the input quantity (electricity, magnetism, sound, light, heat) reaches a certain value.
If you have interest in our service, please feel freely contact Cynthia at [email protected] & 86 18126197150.
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alisa-hitechpcb · 5 months
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SMT production process
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Program the SMT placement machine
According to the BOM position map provided by the customer, program the coordinates of the location of the components. Then carry out the first piece with the SMT chip processing data provided by the customer.
Printing solder paste
The solder paste is stenciled to the PCB board where the electronic component SMD needs to be soldered to prepare for the soldering of the components. The equipment used is a screen printing machine (printing machine), which is located at the forefront of the SMT chip processing production line.
SPI
Solder paste detector, detects whether the solder paste printing is a good product, whether there is less tin, leaking tin, more tin and other undesirable phenomena.
4.SMT
Accurately install the electronic components SMD on the fixed position of the PCB. The equipment used is a placement machine, which is located behind the screen printing machine in the SMT production line.
The placement machine is divided into high-speed machine and general-purpose machine.
High-speed machine: used to paste components with large pin spacing and small pin spacing
Universal machine: paste small pin pitch (pin density), bulky components.
High temperature solder paste melting
Mainly, the solder paste is melted at high temperature, and after cooling, the electronic components SMD and the PCB board are firmly welded together. The equipment used is a reflow soldering furnace, which is located behind the placement machine in the SMT production line.
AOI
Automatic optical detector to detect whether the soldered PCBA components have poor soldering, such as tombstone, displacement, empty soldering, etc.
Visual inspection
The key items of manual inspection and inspection: whether the PCBA version is the changed version; whether the customer requires components to use substitute materials or components of designated brands and brands; IC, diodes, triodes, tantalum capacitors, aluminum capacitors, switches, etc. Whether the direction of the directional components is correct; defects after welding: short circuit, open circuit, fake parts, fake welding.
Packaging
Products that have passed the test will be packaged separately. The commonly used packaging materials are anti-static bubble bags, electrostatic cotton, and blister trays. There are two main packaging methods, one is to use anti-static bubble bags or electrostatic cotton into rolls, which are the most commonly used packaging methods at present; the other is to customize blister trays according to the size of PCBA. Put it in a blister tray and unpack it, mainly for PCBA boards that are sensitive and have vulnerable patch components.
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funnysideolife · 1 year
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Watch "As Foxconn-Vedanta deal snaps, a look at semiconductors & 'design giant' India’s 40-yr chip struggle" on YouTube
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In layman's term a semiconductor has minaturised huge electronic ckts. These electronic ckt were earlier made of glass tubes called triodes and diodes out of which logical ckt were made and a single blow of any tube would stall the whole system
The triode got replaced with transistors but still occupied space ,with the advent of semiconductors ,the physical space occupied by a single transistor on printed circuit board, now can be filled with millions of transistors.This is the magic of semiconductors which brought about miniturisation
Moreover These electronic ckts were not robust,they consumed lot of electricity,and space.
With the invention of semiconductors, computing power has increased million folds a smart phone has more computing power which can easily fit in your poket than an earlier Main frame computers which occupied 1000 's sq foot area earlier.
Nano technology is packing more logical ckts on the earlier version of semiconductor with size remaining the same or even getting minaturised further.
THIS IS HOW YOU SHOULD EXPLAIN.A JOURNALIST LIKE U SHOULD CONSULT SOME EXPERT ,RATHER THAN SPEAK IN A CONFUSED WAY.
You waisted many minutes
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Mohalli was the wrong choice ...for SCL
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smartximtechnology · 1 year
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Exploring the Ultimate Electronic Component Guide
As the world becomes more digitized and interconnected, electronic components have become an integral part of modern society. From smartphones to automobiles, electronic devices are ubiquitous, and each one is made up of a complex network of electronic components. In this article, we will explore the ultimate electronic component guide, focusing on the triode manufacturer, diode distributor, and…
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vans213 · 2 years
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How Can You Recover Precious Metals From Electronic Wastes?
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It is not only the gold that makes your old electronic gadgets precious. They have various metals like platinum, copper, silver and similar other metals. Some people may have told you that old electronic gadget, especially their integrated circuits, diode and transistors are made of gold. Then, is your mobile a good source of gold? Probably, it is not. Gold might be a precious metal but it cannot carry electricity as other metals can. So, apart from gold, many other metals can be used for some reasons. So, let’s consider electronic waste and look into it to notice what is inside it.
The current trend of e-waste
Most people know that e-waste is made of precious metals (PMs), and has some great economic value, but most researchers and recycling experts do not have invested time in finding them out. Hence, it is still new to the world to recycle e-waste and bring out PMs.
For a brief moment, it is possible to obtain something from e-waste. Hence, it is possible to recover at least some of the value of the investment from the IT equipment but only from gold.
The Motherlode of e-waste is and its myth
E-Waste may contain various kinds of plastic materials and other ad-hoc metals that are always common to every piece of equipment used to build the cases and bodies. Glass, plastic, fiber, etc., are the materials that are very common in building traditional electronic gadgets. On the other hand, it contains IC, transistors, diodes, and triodes. It also contains capacitors and resistors. They all contain precious metals, but not for high electric conductivity and precise electric supply, but to improve the corrosion resistance and hardness of electronic devices.
Volume is the key
When attempting to extract valuable precious metals from electronic waste, you must consider collecting a large number of electronic devices. More specifically, you have to collect a huge amount of circuit boards like the RAMs, processors, ICs and all other related boards where a lot of ICs and memory chips are attached. To accumulate enough gold, platinum, silver, palladium, nickel, copper, aluminum, lithium, and some other rare metals, a lot of scrap IT products are essential. As a result, the accumulation of PMs is dependent on the collection and proper processing of e-waste.
Different local collectors and companies that accumulate all these materials are called “urban miners." 
As the gold rush goes on, other materials are mingled with the other materials, and the value of precious metals, reducing the processing and recycling costs. However, gold is not the only material that you will find from IT waste. We have mentioned the other materials that you will find from this waste.
Is there any importance of IT Hardware waste?
Yes, IT hardware has value in three ways. Resale gives a great amount if the product is good in its quality. Resale its parts. And the third is critically innovative to retrieve PMs from them.
All the ways you can get benefits from all this IT hardware waste depends on its present condition. The component's modernity, performance, storage type, device category, and, finally, the overall process for locating precious metals
If the product is out of life
When the product is out of its life, there is no way except for destroying the products in bulk in a way that will be safe for the environment and bring out the metals with which it is made.
How are they bought or collected?
Scrap commodities are traded by weight or in bulk. The collectors provide a bulk price for all the IT products. Sometimes, they collect the hardware parts only by weight.
The recycling process
Previously, it is mentioned that when any part is reusable, they are used for that purpose. On the other hand, when they are not reusable, they are destroyed and sent to the demolition ground for bringing out the precious metals. The latter is always taken into account in some industries so that e-waste does not harm or pollute Mother Earth and processing experts profit from it. The quantity of precious metals is a fraction of their original weight.
An approximate measure of derived metals
Scrap IT commodities are measured in weight. 8 LB laptops or 25lb monitors may contain a few grams of precious metals at most. Amazingly, the majority of the device’s weight comes from less valuable materials like plastic, and aluminum. Iron, nickel, rung, glass and more. The valuable metals remain only on the IC, transistors, processors, RAMs and similar other equipment.
Going deeper into the scrapped material and its derived products, shredded laptops might end up being the material worth about $10 per pound of material. However, old laptops and IT devices produce more precious materials, including gold. Newer generation devices comparatively produce less gold as the researchers try to reduce the production cost.
Modern IT equipment is forced to design with less cost, thinner, lighter and less resource investing produces.
The sum of IT parts and derived PMs
Some devices are resold or reused. This will bring out some extra amount compared to the derivation of precious metals. The value of metals is here irrelevant. When they are not reusable and come to the demolition center, they are targeted to bring out the precious metals. The laptop RAM, processors etc. come out from the collectors in bulk and are sent to the special demolition ground to bring out the metals embedded in it.
In this way, the bulk IT products are collected and sent to derive precious metals as well as other by-products that will give a huge source of plastic, fiber, regular metals, as well as precious metals. As a result, precious metals recovery has been handled by a much-improved recycling facility.
If you want to start a lucrative business with all these IT wastes, you can contact Vans Chemistry. Contact them now.
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ajason798-blog · 2 years
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diode LED element forming machine.mp4 from ASCEN technology on Vimeo.
ascen.ltd/Products/raidal_lead_former/ Diode LED element forming machine apply to LED/light emitting diode,triode,aluminum electrolytic capacitor,metallic film capacitor,safety capacitor,quartz crystal and other upright type elements,which packed by in bulk or tape type.
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e-energyit · 2 years
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Chip Production Manufacturing Process|E-energy
Chip Production Manufacturing Process
The Chip Production Manufacturing Process is very complex, closely interlocked, the lack of any link, will lead to IC production yields low or even failure.
1、IC complete production process
IC production process is to produce wafers as the starting point, led by IC design, production by the wafer manufacturer, and finally need to go through packaging and testing, after completing these steps we can get the chip we need.
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2、Wafer manufacturing
Wafers are also often called silicon wafers by the semiconductor industry, wafers in the chip, as the foundation of the house. Similarly, the circuitry on the chip is built on the wafer, and the quality of the wafer will directly affect the yield and quality of the chip.
The subdivision process of wafers is very complex.
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This complex process is actually the quartz rock into the furnace for purification, quartz rock into a pure silicon ingot with a purity of 99.999999999% , and finally cut and ground to get wafers.
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3、IC design process
IC design can be divided into several steps, in order: specification development → logic design → circuit layout → post-layout simulation → photomask production, where the first step to the fourth step is not a one-time success, sometimes need to be repeatedly verified.
STEP1:Specification
Specification development is the need to determine the function of the IC, IC package and pin definition, etc.. After reading this sentence is not still do not know what IC specification development is? No hurry, the following begins to speak human. This process is similar to the communication process between a house manufacturer and an architect to determine the function, area, orientation, floor, how many rooms, how many bathrooms, etc. of a house.
Take CPU as an example, when designing CPU for customers, we need to confirm with customers the target CPU's computing speed (operating frequency), cache capacity, operating voltage, bus mode, power consumption and other important performance indicators, and also need to determine the number of cores, selected process technology and external interfaces, etc. This process is the specification development process.
STEP2: Logic design
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The logic design is composed of simple logic components, not semiconductor circuit components (such as diodes, crystals, etc.).
Logic components: AND Gate, OR Gate, etc.
Commonly used EDA: Mentor's Modelsim, Synopsys' VCS, and Cadence's NC-Verilog can be used to verify the design of RTL-level code.
STEP3: Chip Circuit Layout
https://energy-sale-images.oss-cn-hongkong.aliyuncs.com/sale_images/s91ldbpgx65tbnfn01gt.jpg
Convert the verified logic design into a circuit diagram composed of semiconductor circuit components, including crystal diodes, triodes, MOS tubes, etc.
STEP4: Post-layout simulation
The physical layout of the completed wiring is verified in terms of function and timing, and there are many items to be verified, so interested readers can do it by Baidu or Google.
STEP5: Mask fabrication
Based on the verified physical layout, we make the required mask and send the mask to the IC manufacturing company.
The difficulty of this link: the above process is only a simplified process of IC design, in fact, IC design is a very complex profession, although the continuous development of EDA allows IC design to accelerate, but IC design is very dependent on the wisdom of engineers, each step described here has its own specialized knowledge, all of which can become a multi-disciplinary course independently.
For example, STEP2 involves a hardware description language that requires not only familiarity with the programming language, but also an understanding of how logic circuits work and how to convert the required algorithms into programs.
4、IC Manufacturing
The IC manufacturing process is the most complex part of the entire production chain. In fact, IC manufacturing is to transfer the circuit diagram on the photomask to the wafer (wafer). Its process is actually like building a house with Lego, first with wafers as the foundation, and then layer by layer after the stacking of the chip manufacturing process.
IC manufacturing the basic steps of each layer of the process.
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5、IC packaging and testing
Compared with the IC design and manufacturing process, the technical difficulty of the process is relatively low. Test link according to the test object can be divided into WAT, CP, FT three stages, the main reason for phased testing is to control the cost of packaging, before the chip package, first part of the test, in order to exclude some of the broken chips.
Among them, WAT: Wafer Acceptance Test, is the testkey test before the wafer is shipped, generally Fab in order to detect any fluctuations in its process.
CP: Circuit Probe, is the packaging before the wafer level test. Here it involves testing the basic functions of the chip, this link is mainly to verify that the design is error-free. After passing the WAT and CP tests, the wafer will be cut into dice to enter the packaging process.
FT: Final test, after the completion of the packaging test, this step of the test is mainly to test the packaging process to see if there are problems.
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The flow of packaging
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Prepare your supply chain
Buyers of electronic components must now be prepared for future prices, extended delivery time, and continuous challenge of the supply chain. Looking forward to the future, if the price and delivery time continues to increase, the procurement of JIT may become increasingly inevitable. On the contrary, buyers may need to adopt the "just in case" business model, holding excess inventory and finished products to prevent the long -term preparation period and the supply chain interruption.
As the shortage and the interruption of the supply chain continue, communication with customers and suppliers will be essential. Regular communication with suppliers will help buyers prepare for extension of delivery time, and always understand the changing market conditions at any time. Regular communication with customers will help customers manage the expectations of potential delays, rising prices and increased delivery time. This is essential to ease the impact of this news or at least ensure that customers will not be taken attention to the sudden changes in this chaotic market.
Most importantly, buyers of electronic components must take measures to expand and improve their supplier network. In this era, managing your supply chain requires every link to work as a cohesive unit. The distributor of the agent rather than a partner cannot withstand the storm of this market. Communication and transparency are essential for management and planning. In E-energy Holding Limited, we use the following ways to hedge these market conditions for customers:
Our supplier network has been reviewed and improved for more than ten years.
Our strategic location around the world enables us to access and review the company's headquarters before making a purchase decision.
E-energy Holding Limited cooperates with a well -represented testing agency to conduct in -depth inspections and tests before delivering parts to our customers.
Our procurement is concentrated in franchise and manufacturer direct sales.
Our customer manager is committed to providing the highest level of services, communication and transparency. In addition to simply receiving orders, your customer manager will also help you develop solutions, planned inventory and delivery plans, maintain the inventory level of regular procurement, and ensure the authenticity of your parts.
Add E-energy Holding Limited to the list of suppliers approved by you, and let our team help you make strategic and wise procurement decisions.
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smartxim · 2 years
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Find the Best Triode Manufacturer Company
If you are looking triode manufacturer company? So you've come to the right place. Smartxim Technology is a top-level electronic components manufacturer based in China. We manufacture Triodes, Diodes, Transducers, Transistors, etc., and meet all types of electronic component requirements all over the world at very competitive prices. For more information call us at 86-13312994935 or visit our website.
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pagooda · 3 years
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Hello everyone, I don't know if Mr. has encountered these problems: High procurement costs, technical constraints, poor delivery time, frequent hidden dangers in the quality of certain materials, technical development problems, etc. Maybe we can help you. In addition to products, our company's most powerful advantage is the technical development team, which has accumulated rich scientific and technological achievements for more than 20 years and can provide solutions for end customers. Wait for the above problems. Feel free to contact me anytime, thanks WeChat: pskj13622678159 Email: [email protected] WhatsApp: +86 13622678159
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fuzzkaizer · 2 years
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Rerun Electronics - The Marconi Musical Modulator 
“Built for Daniel Glatzel – Andromeda Mega Express Orchestra The Maconi Musical Modulator is a tube ring modulator effect unit built from an old defective Marconi universal bridge measuring device. When Daniel first expressed interest in an effects unit, we talked about many different possibilities: from a wah wah, to a reverb unit, and so on. However, what he really wanted was something that was very distinctive and prominent, hence we decided on a ring modulator. Normally seen as unmusical and rather harsh, this unit is anything but. First off, the signal goes through a simple transformer, then a vintage Germanium bridge rectifier and back through another transformer. This is the classic method of a passive ring modulator. The signal is then amplified by a single triode and mixed with the “dry” signal. The dry signal actually is able to be effected as well while a gain, mids and tone control are all available. The carrier section includes a multi-waveform (square, triangle or sine) inbuilt oscillator. A frequency range control on the large dial allows for a frequency from 10Hz to 1MHz in ten switchable steps– the pot in the middle allows the user to sweep this frequency. With a multi-turn null pot (here labelled “Sensitivity”) and perfectly matched diodes, carrier bleed-through is non-existent. The black jack input accepts an external carrier signal. Check out the unit in action by seeing the Andromeda Mega Express Orchestra!”
cred:  rerun-electronics.com
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vaulttecvevo · 2 years
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antique market haul from yesterday, two triode-heptodes, one double diode vari-mu pentode, and one w completely rubbed off markings
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