#Semiconductor chips

[nselectronic]

The Crucial Role of Chips: Unveiling the Technological Advancements in China's 2023 College Entrance Examination

Introduction:

The 2023 College Entrance Examination in China witnessed an extraordinary leap in technological advancements, particularly in the field of chips. These tiny electronic components have become the backbone of modern society, revolutionizing various industries and empowering the development of cutting-edge technologies. In this blog post, we will explore the significance of chips in the context of the 2023 Chinese College Entrance Examination and the broader implications for China's technological landscape.

1. The Era of Smart Devices:

In recent years, China has witnessed a remarkable surge in the popularity of smart devices. Smartphones, tablets, and wearable gadgets have become an integral part of our daily lives. This trend heavily relies on the advancements in chip technology, specifically in terms of processing power, energy efficiency, and connectivity. The 2023 College Entrance Examination embraced this technological wave, as students were allowed to utilize electronic devices during certain sections of the exam, utilizing the power of chips to enhance their test-taking experience.

2. Empowering Artificial Intelligence:

Artificial Intelligence (AI) has emerged as a transformative force across various sectors, including education. In the 2023 College Entrance Examination, AI-powered systems were employed to analyze and evaluate students' answers, ensuring fair and accurate grading. The success of such systems largely depends on the performance of chips embedded within these AI frameworks. Advanced chips equipped with neural processing units (NPUs) can efficiently process massive amounts of data, accelerating AI algorithms and enabling real-time analysis.

3. The Rise of Edge Computing: 

The proliferation of Internet of Things (IoT) devices has given rise to the concept of edge computing, where data processing occurs closer to the source rather than relying solely on centralized cloud servers. Chips play a pivotal role in enabling efficient edge computing, ensuring low latency and enhancing data security. In the context of the 2023 College Entrance Examination, edge computing facilitated seamless data transfer and real-time interaction between students' devices and the examination system, thereby enhancing efficiency and reliability.

4. Next-Generation Chip

To maintain China's position as a global technological leader, significant investments have been made in developing next-generation chip technologies. The 2023 College Entrance Examination served as a testing ground for these advancements, showcasing chips with enhanced performance, power efficiency, and miniaturization. Technologies such as 7-nanometer and 5-nanometer process nodes, stacked chip architectures, and novel materials like gallium nitride (GaN) contributed to the creation of highly advanced chips that powered the examination systems.

5. Addressing Challenges and Future Prospects: 

Despite the remarkable progress in chip technology, challenges remain. The shortage of key raw materials, increasing energy consumption, and geopolitical considerations are among the obstacles that need to be addressed. However, China's commitment to research and development, collaboration with global partners, and strategic investments in semiconductor manufacturing capacity indicate a promising future for chip technology. The 2023 College Entrance Examination exemplified China's determination to leverage chips as a driving force behind its technological advancements.

Conclusion: 

The 2023 Chinese College Entrance Examination highlighted the vital role of chips in enabling technological progress across various sectors. From empowering smart devices and AI systems to facilitating edge computing, chips have revolutionized the way we interact with technology. China's dedication to chip research, development, and manufacturing is shaping a future where chips will continue to be at the forefront of technological innovation. As we move forward, it is crucial to address challenges and seize opportunities, ensuring a prosperous era for chip technology in China and beyond.

[civilmentor1]

CURRENT AFFAIRS -17 August 2024

1.Semiconductor What is a Semiconductor Chip? Semiconductor: semiconductor possess electrical conductivity properties intermediate between conductors and insulators, which can be modified by introducing dopants. Semiconductor chips, transistors, fabrication technology, and wafers are interdependent components essential for electronic device functionality. Transistors serving as the building…

[semiconductor-accessories-supply]

semiconductor equipment suppliers companies

Semiconductor products are closely related to our lives, and can even rise to the national strategic security field. We invent a large number of various brands of semiconductor equipment

Accessories consumables, the main supply and recycling products include:

American brand: lam-research,MKS, AE, UCT, ICHOR, Brooks, etc.;

Japanese brands: Kyocera, ebara, Horiba, Fujikin, Xintuang Electric, etc.;

European brand: Edward, Inficon, etc.

[dbr2rooks]

Random Access Memory, Non volatile memories, what is Non Volatile FRAM

FM25CL64B Series 64 Kb (8 K x 8) 3.3 V SMT Serial F-RAM Memory - SOIC-8

[icgoodfind]

ICGOODFIND recommends to everyone: The commonly used chip models of Hisilicon Semiconductor

Huawei established the Huawei Integrated Circuit Design Center in 1991, and on this basis, HiSilicon Semiconductor Company was founded in 2004. Initially, HiSilicon focused on manufacturing chips for industrial applications, and later entered the fields of industrial control and mobile phone chips.

Huawei HiSilicon chips are a series of chips independently developed by HiSilicon Semiconductor Company under Huawei. ICgoodFind will also introduce some commonly sold chips in the industrial control industry other than the popular mobile phone Kirin chips.

Chip Features and Advantages:

Advanced Architecture Design: It features an advanced SoC architecture that can efficiently integrate multiple functional modules such as processors, communication modules, and graphics processing, achieving a balance between performance and power consumption.

Powerful Communication Capability: With the integrated self-developed communication baseband, it demonstrates excellent performance in communication, supporting multiple network standards and frequency bands, providing users with stable and fast network connections.

Excellent Artificial Intelligence Capability: It introduced artificial intelligence technology into chips relatively early. For example, the Kirin 970 is equipped with an artificial intelligence NPU chip, providing powerful computing power support for the intelligent applications of mobile phones.

Continuously Upgraded Process Technology: It has continuously evolved from the early 40nm process technology to adopt more advanced process technologies such as 16nm, 7nm, and even 5nm, improving the performance and energy efficiency of the chips.

Now, the commonly used models of HiSilicon chips in the industrial field are:

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We hope that the content summarized by ICgoodFind will be helpful to the vast number of hardware engineers and friends engaged in HiSilicon solution development. In the highly competitive semiconductor arena, Huawei HiSilicon chips are undoubtedly a shining star.

ICgoodFind has been always committed to following and interpreting the dynamics of the chip industry, especially the development of Huawei HiSilicon chips. From its establishment to its in-depth cultivation in different fields, from mobile phone chips to industrial control chips, Huawei HiSilicon chips have demonstrated extraordinary innovative capabilities and indomitable development spirit. The features and advantages of its chips not only reflect the advanced nature of technology but also indicate the future development direction of chips.

We believe that Huawei HiSilicon chips will continue to play an important role in the industry, injecting a continuous stream of impetus into the development of the global science and technology industry. Meanwhile, ICgoodFind will, as always, provide customers with high-quality electronic component chips and professional services, and witness the progress of science and technology together with everyone.

[jcmarchi]

US launches $1.6B bid to outpace Asia in packaging tech

New Post has been published on https://thedigitalinsider.com/us-launches-1-6b-bid-to-outpace-asia-in-packaging-tech/

US launches $1.6B bid to outpace Asia in packaging tech

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The US is betting big on the future of semiconductor technology, launching a $1.6 billion competition to revolutionise chip packaging and challenge Asia’s longstanding dominance in the field. On July 9, 2024, the US Department of Commerce unveiled its ambitious plan to turbocharge domestic advanced packaging capabilities, a critical yet often overlooked aspect of semiconductor manufacturing. 

This move, part of the Biden-Harris Administration’s CHIPS for America program, comes as the US seeks to revitalise its semiconductor industry and reduce dependence on foreign suppliers. Advanced packaging, a crucial step in semiconductor production, has long been dominated by Asian countries like Taiwan and South Korea. By investing heavily in this area, the US aims to reshape the global semiconductor landscape and position itself at the forefront of next-generation chip technology, marking a significant shift in the industry’s balance of power.

US Secretary of Commerce Gina Raimondo emphasised the importance of this move, stating, “President Biden was clear that we need to build a vibrant domestic semiconductor ecosystem here in the US, and advanced packaging is a huge part of that. Thanks to the Biden-Harris Administration’s commitment to investing in America, the US will have multiple advanced packaging options across the country and push the envelope in new packaging technologies.”

The competition will focus on five key R&D areas: equipment and process integration, power delivery and thermal management, connector technology, chiplets ecosystem, and co-design/electronic design automation. The Department of Commerce anticipates making several awards of approximately $150 million each in federal funding per research area, leveraging additional investments from industry and academia.

This strategic investment comes at a crucial time, as emerging AI applications are pushing the boundaries of current technologies. Advanced packaging allows for improvements in system performance, reduced physical footprint, lower power consumption, and decreased costs – all critical factors in maintaining technological leadership.

The Biden-Harris Administration’s push to revitalise American semiconductor manufacturing comes as the global chip shortage has highlighted the risks of overreliance on foreign suppliers. Asia, particularly Taiwan, currently dominates the advanced packaging market. According to a 2021 report by the Semiconductor Industry Association, the US accounts for only 3% of global packaging, testing, and assembly capacity, while Taiwan holds a 54% share, followed by China at 16%.

Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio outlined an ambitious vision for the program: “Within a decade, through R&D funded by CHIPS for America, we will create a domestic packaging industry where advanced node chips manufactured in the US and abroad can be packaged within the States and where innovative designs and architectures are enabled through leading-edge packaging capabilities.”

The announcement builds on previous efforts by the CHIPS for America program. In February 2024, the program released its first funding opportunity for the National Advanced Packaging Manufacturing Program (NAPMP), focusing on advanced packaging substrates and substrate materials. That initiative garnered significant interest, with over 100 concept papers submitted from 28 states. On May 22, 2024, eight teams were selected to submit complete applications for funding of up to $100 million each over five years.

According to Laurie, the goal is to create multiple high-volume packaging facilities by the decade’s end and reduce reliance on Asian supply lines that pose a security risk that the US “just can’t accept.” In short, the government is prioritising ensuring America’s leadership in all elements of semiconductor manufacturing, “of which advanced packaging is one of the most exciting and critical areas,” White House spokeswoman Robyn Patterson said.

The latest competition is expected to attract significant interest from the US semiconductor ecosystem and shift that balance. It promises substantial federal funding and the opportunity to shape the future of American chip manufacturing. As the global demand for advanced semiconductors continues to grow, driven by AI, 5G, and other emerging technologies, the stakes for technological leadership have never been higher.

As the US embarks on this ambitious endeavour, the world will see if this $1.6 billion bet can challenge Asia’s stronghold on advanced chip packaging and restore America’s position at the forefront of semiconductor innovation.

(Photo by Braden Collum)

See also: Global semiconductor shortage: How the US plans to close the talent gap

Want to learn more about AI and big data from industry leaders? Check out AI & Big Data Expo taking place in Amsterdam, California, and London. The comprehensive event is co-located with other leading events including Intelligent Automation Conference, BlockX, Digital Transformation Week, and Cyber Security & Cloud Expo.

Explore other upcoming enterprise technology events and webinars powered by TechForge here.

Tags: ai, AI semiconductor, artificial intelligence, chips act, law, legal, Legislation, Politics, semiconductor, usa

[smbomcom]

What Is An Inductive Force Sensor?

An inductive force sensor is a type of sensor that utilizes the principle of electromagnetic induction to measure force. It operates by detecting changes in inductance caused by the force applied to the sensor, translating these changes into corresponding electrical signals. Typically, such sensors consist of coils, a magnetic core, and an outer casing. When force is applied, causing a displacement of the magnetic core, it alters the magnetic flux density within the coil, thereby generating measurable electrical signals.

Get more details: What Is An Inductive Force Sensor?

[dreaminginthedeepsouth]

Bill Day

* * * *

Wow! You can’t make this up!

March 21, 2024

ROBERT B. HUBBELL

It’s hard to believe that the dysfunction in the Republican Party could get worse, but Wednesday saw new heights (or depths?) of chaos in the GOP. You are undoubtedly interested in hearing how the GOP impeachment hearing directed at Joe Biden produced damning evidence—against Donald Trump! But first, let’s look away from the GOP car crash to view the important work that President Biden is doing on behalf of the American people. (You’re welcome!)

As Trump and the GOP were entering panic mode at warp speed, President Biden was delivering on his promises to the American people. The Biden administration began the day by announcing a rule that would accelerate the production of hybrid and all-electric cars. See NYTimes, Biden Administration Announces Rule Aimed at Expanding Electric Vehicles. (This article is accessible to all.)

Per the NYTimes,

The Biden administration on Wednesday issued one of the most significant climate regulations in the nation’s history, a rule designed to ensure that the majority of new passenger cars and light trucks sold in the United States are all-electric or hybrids by 2032. Nearly three years in the making, the new tailpipe pollution limits from the Environmental Protection Agency would transform the American automobile market.

Accelerating the transition to hybrid and electric cars will deliver enormous economic and health benefits to the American people. Again, per the Times, the new regulation will

avoid more than seven billion tons of carbon dioxide emissions over the next 30 years . . . That’s the equivalent of removing a year’s worth of all the greenhouse gases generated by the United States . . . . The regulation would provide nearly $100 billion in annual net benefits to society [including] $13 billion of annual public health benefits thanks to improved air quality. The standards would also save the average American driver about $6,000 in reduced fuel and maintenance over the life of a vehicle, the E.P.A. estimated.

As the new “tailpipe emissions” standard was being announced, President Biden announced a massive investment in an Intel chip fabricating facility in Arizona. See Politico, Biden boosts Intel with massive CHIPS payout in swing state Arizona.

Per Politico, Biden said

“We will enable advanced semiconductor manufacturing to make a comeback here in America after 40 years. It’s going to transform the semiconductor industry and create entirely new ecosystems.” Biden said Intel would also invest “over $100 billion” across the country, in facilities in Arizona, Oregon, Ohio and New Mexico. Those investments should put the U.S. on track to produce roughly 20 percent of the world’s leading-edge chips by 2030, Biden said. He added that Intel’s new projects are expected to create 30,000 jobs nationwide in construction and manufacturing.

Beyond creating tens of thousands of jobs in the high-tech sector, the CHIPS and Science Act protects US national security. Recall that during the COVID pandemic, supply chain issues disrupted the flow of semiconductors into the US, hampering the manufacture and sale of hundreds of consumer products that rely on microprocessors. Manufacturing the chips in the US serves as a hedge against that future risk.

For most presidents, the Intel announcement and new tailpipe admissions standard would be the year's crowning achievements. For Joe Biden, those announcements were known as “Wednesday.” Biden gets stuff done. Tell a friend.

[Robert B. Hubbell Newsletter]

[lanshengic]

Daily Semiconductor Industry Information By Lansheng Technology

1. At the VLSI Symposium 2023, which will be held next month, Intel will demonstrate the PowerVia technology verification chip.

2. On May 5th, Samsung Electronics is expected to surpass its main competitor TSMC in the field of chip foundry within 5 years.

3. According to media reports, Meta recruited a team from the British artificial intelligence chip company Graphcore. The team previously worked in Oslo, Norway, and was developing AI networking technology at Graphcore until late last year.

4. On May 5, 2023, semiconductor product companies Alpha and Omega Semiconductor once fell by 11.64% in intraday trading, and once touched $20.64. The stock price hit a new low since November 18, 2020.

5. Following in the footsteps of #Samsung, SK Hynix and Micron, the US chip giant Qualcomm’s latest quarterly revenue fell -16.9% year-on-year to US$9.275 billion, and its net profit fell sharply -41.9%. The three major business segments of mobile phones, automobiles and IoT All have declined to varying degrees, and its forecast data for the third fiscal quarter is also lower than market expectations.

Lansheng Technology Limited (https://www.lanshengic.com/) is a global distributor of electronic components that has been established for more than 10 years, headquartered in Shenzhen China, who mainly focuses on electronic spot stocks

[northsentinelmapper]

Nations classified according to restrictions imposed on export of American AI Chips by American Government 🇺🇸 🌏

[sentivium]

Samsung Faces Another Chip Slump: Tough Times Ahead for Tech Giant

Samsung is bracing for another challenging year as the global chip market continues to face headwinds, impacting its semiconductor business and overall financial performance.

[gwydionmisha]

Latest US clampdown on China's chips hits semiconductor toolmakers

[bitcoinversus]

Arizona to Gain 20,000 Construction Jobs from TSMC's New Fabs

Taiwan Semiconductor Manufacturing Company (TSMC) is advancing U.S. semiconductor manufacturing with its substantial investment in Arizona. The company plans to build three state-of-the-art fabrication plants (fabs) in Phoenix, representing the largest foreign direct investment in a greenfield project in U.S. history. This initiative is expected to create over 6,000 high-tech, high-wage jobs and…