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hitechpcb · 1 year ago

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What is PCB Assembly ?

PCB Assembly manufacturer - Hitech Circuits Co., Limited

It’s the step in the manufacturing process in which you populate a blank board with the electronic components needed to make it into a functional printed circuit board. It’s these components that make a board into the circuit that enables an electronic product to function. PCB assembly typically takes place via one of two processes:

1. Surface-mount technology

SMT: SMT stands for “Surface Mount Technology“. The SMT components are very small sizes and comes in various packages like 0201, 0402, 0603, 1608 packages for resistors and capacitors. Similarly for Integrated circuits ICs we have SOIC, TSSOP, QFP and BGA.

The SMT components assembly is very difficult for human hands and can be time taking process so it is mostly done by automated pick and place machine.

2. Through-hole manufacturing

THT: THT stands for “Through hole Technology”. The components with leads and wires, like resistors, capacitors, inductors, PDIP ICs, transformers, transistors, IGBTs, MOSFETS are example.

The component has to be inserted on one side of PCB and pulled by leg on other side and cut the leg and solder it. The THT components assembly is usually done by hand soldering and is relatively easy.

Printed Circuit Board Assembly Techniques

There are only two common PCBA techniques available for use by a PCB designer. The methods are:

1. Automated PCB Assembly Techniques

Generally, this technique employs the use of state of the art machines, which are fully automatic. For example, the surface mount components are worth positioning with the aid of an automated pick and place machine.

Again, reflow soldering is commonly for surface mount components usually done in a reflow oven. An automated solder stencil is also used to apply the solder paste on the PCB.

Finally, high tech inspection machines are used to confirm and check the quality of the PCBA. Some of which include: Automated optical inspection machine (AOI), X-ray inspection machines, etc.

Above all, due to the precise monitoring, control of soldering, no human input and versatile machines.

This technique ensures utmost efficiency, output consistencies, and limits defects.

2. Manual PCB Assembly Techniques

This method is favorite for use with through-hole parts, which needs manual placement on the board. Besides, with these through-hole parts, it’s advisable you use wave soldering. Note that in the through- hole assembly process, you need to place the components and electronics on the PCB.

After that, you use wave soldering to solder the leads. Typically, you will need an individual to insert a component into a marked PTH. Once done, transfer the PCB to the next station where the next person will be on standby tasked with fixing another part.

What are the Benefits of SMT PCB Assembly?

SMT assembly provides many benefits and some of them are as follows:

It can be used to incorporate small components.

In SMT, the components can be placed on both sides of the board.

It assures high component densities.

Fewer holes need to be drilled for surface mounting than through-hole.

It require low initial costs and time for setting up the mass production.

SMT is the simpler and faster-automated assembly when compared to through-hole.

Errors regarding the component placement can be easily rectified.

Surface mount PCBs feature strong joints, which can easily withstand vibrations.

What are the techniques used in Surface Mount Technology?

There are several techniques for the reflow process. After applying the solder paste or a flux mixture on the board and after placing the components, the boards are conveyed to a reflow soldering oven. The techniques used for reflowing soldering include infrared lamps, hot gas convection, fluorocarbon liquids with a high boiling point, and so on.

What are the different testing methods used in SMT PCB Assembly?

Hitech Circuits as the PCB assembly manufacturer, we perform the following testing and inspection to ensure the quality of surface mount PCBs.

Automated Optical Inspection (AOI): This is performed before and after the soldering to identify the component placement, presence, and solder quality.

X-ray Testing: In this type of testing, the operator relies on the X-ray images of the PCB to check the solder joints and lead-less components such as Quad Flat Packs and ball grid arrays, which are generally not visible to naked eyes.

In-Circuit Testing (ICT): This method is used to detect manufacturing defects by testing the electrical properties in the SMT Assembly.

What type of files or documents should I send for SMT PCB Assembly?

Gerber Files: The file contains all details of physical board layers including solder masks, copper layers, drill data, legends, and so on.

Bill of Materials (BOM): This contains information on the list of items needed for the PCB manufacturing and the instructions of manufacturing.

Pick and Place File: This file contains information on all components to be used in the PCB design and their rotation and X-Y coordinates.

The whole process of PCB Assembly

1. Bare board loader machine

The first step in the PCB assembly is to arrange the bare boards on the rack, and the machine will automatically send the boards one by one into the SMT assembly line.

2. Printing solder paste

When PCB on the SMT production line, firstly, we have to print solder paste on it, and the solder paste will be printed on the pads of the PCB. These solder pastes will be melt and solder the electronic parts to the circuit board when it passes through the high-temperature reflow oven.

In addition, when testing new products, some people will use film board/adhesive cardboard instead of solder paste, which can increase the efficiency for adjusting the SMT machines.

3. Solder paste inspection machine(SPI)

Since the quality of solder paste printing is related to the quality of welding of subsequent parts, some SMT factories will use optical machine to check the quality of solder paste after printed the solder paste in order to ensure stable quality. If there any poorly printed solder paste board, we will wash off the solder paste on it and reprint, or remove the excess solder paste if there is redundant solder paste on it.

4. High speed SMT machine

Usually, we will put some small electronic parts (such as small resistors, capacitors, and inductors) to be printed on the circuit board first, and these parts will be slightly stuck by the solder paste just printed on the circuit board, so even if the speed of printing is very fast and the parts on the board will not fall away. But large parts are not suitable for use in such high speed SMT machines, which will slow down the speed of small parts assembly. And the parts will be shifted from the original position due to the rapid movement of the board.

5. Universal SMT machine

Universal SMT machine is also known as "slow machine", it will be assembled some large electronic components, such as BGA IC, connectors, etc., these parts need more accurate positions, so the alignment is very important. Use a camera to take a picture to confirm the position of the parts, so the speed is much slower than High speed SMT machine we taked before. Due to the size of the components here, not all of them are packed in tape and reel, and some may be packed in trays or tubes. But if you want the SMT machine to recognize the trays or tube-shaped packaging materials, you must configure an additional machine.

Generally, traditional SMT machines are using the principle of suction to move electronic parts, and in order to place the parts successfully, and there must be the flat surface on these electronic components for the suction nozzle of the SMT machine to absorb. However, for some electronic parts don’t have a flat surface for these machines, and it is necessary to order special nozzles for these special-shaped parts, or add a flat tape on the parts, or wear a flat cap for thees electronic parts.

6. Manual parts or visual inspection

After assembled all parts by the high speed SMT machine or Universal SMT machine and before going through the high-temperature reflow oven, and we will set up a visual inspection station here and to pick out the deviation parts or missing components boards etc., because we have to use a soldering iron to repair if there are still defectives boards after passing the high-temperature oven, which will affect the quality of the product and will also increase the cost. in addition, for some larger electronic parts or traditional DIP parts or some special reasons cannot be processed by the SMT machine before, they will be manually placed on pcb here.

7. Reflow oven

The purpose of reflow oven is to melt the solder paste and form a non-metallic compound on the component feet and the circuit board, that means to solder electronic components on the circuit board. The temperature rise and fall curves often affect the soldering quality of the entire circuit board. According to the characteristics of the solder materials, usually the reflow oven will set the preheating zone, soaking zone, reflow zone, and cooling zone to achieve the best soldering effect.

For example, the melting point for SAC305 solder paste with lead-free is about 217°C, which means that the temperature of the reflow oven must be higher than the melting points to remelt the solder paste. What's more, the maximum temperature in the reflow furnace should not exceed 250°C, otherwise many parts will be deformed or melted because they cannot withstand such a high temperature.

Basically, after the pcb passed through the reflow oven, the assembly for the entire circuit board is almost complete. If there are hand-soldered parts, we need to transfer to DIP process, and then we have to check the quality after reflow oven by QC department.

8. Automatic optical inspection(AOI)

The main purpose of setting up AOI is because some high density boards can’t be process the following ICT test, so we used AOI inspection to replace it. But even using AOI inspections, there still have the blind spots for such checking, for example, the solder pads under the components cannot be checked by AOI. At present, it can only check whether the parts have side standing issue, missing parts, displacement, polarity direction, solder bridges, lack of soldering etc., but cannot checking the BGA solderability, resistance value, capacitance value, inductance value and other components quality, so far AOI inspection can’t completely replace ICT test.

Therefore, there is still some risk if only AOI inspection is used to replace ICT testing, but ICT test is also not 100% make sure the good quality, we suggest these two ways can be combined with together to make sure the good quality.

9. PCB unloader machine

After the board is fully assembled, it will be retracted to the unloder machine, which has been designed to allow the SMT machine to automatically pick and place the board without damaging the quality for PCB.

10. Visual inspection for finished products

Normally there will be a visual inspection area in our SMT production line whether there is an AOI station or not, and it will help to check if there are any defectives after completed assembled the pcbs. If there is an AOI station, it can reduce the visual inspection worker on our SMT line, and to reduce the potential cost, and because it is still necessary to check some places that cannot be judged by AOI, many SMT factories will provide the mainly visual inspection templates at this station, which is convenient for visual inspection worker to inspect some key parts and polarity for components.

11. DIP process

DIP process is a very important process in the whole PCBA processing, and the processing quality will directly affect the functional for PCBA boards, so it is necessary to pay more attention to the DIP process. There are many preliminary preparations for DIP process. The basic process is to re-process the electronic components first, like to cut the extra pins for some DIP components, our staff received the components according to the BOM list, and will check whether the material part numbers and specifications are correct or not, and performs pre-production pre-processing according to the PCBA samples. The steps are: Use various related equipment (automatic capacitor pins cutting machine, jumper bending machine, diode and triode automatic forming machine, automatic belt forming machine and other machines) for processing.

12. ICT test

Printed Circuit board open/short circuit test (ICT, In-Circuit Test), The purpose of ICT test is mainly to test whether the components and circuits on the printed circuit board are open or short issues. It can also measure the basic characteristics of most components, such as resistance, capacitance, and inductance values to judge whether the functions of these parts are damaged, wrong parts or missing parts etc. after passing through the high-temperature reflow oven.

ICT test machines are divided into advanced and basic machines. The basic ICT test machines are generally called MDA (Manufacturing Defect Analyzer). It’s just to measure the basic characteristics of electronic components and judge open and short circuits issue we talked above.

In addition to all the functions of the basic ICT test machines, for advanced ICT test machine can also test the whole PCBA by using power, start to testing the PCBA boards by setting the program in the test machine. The advantage is that it can simulate the function of the printed circuit board under the actual power-on condition, this test can partly replace the following functional test machine (Function Test). But the cost for the test fixture of this advanced ICT test can probably buy a car, it’s too expensive and we suggest it can be used in mass production products.

13. PCBA function test

Functional testing is to make up for the ICT test, because ICT only tests the open and short circuits on the the PCBA board, and other functions such as BGA and other fuctions are not tested, so it is necessary to use a functional testing machine to test all functions on the whole PCBA board.

14. Cutting board (assembly board de-panel)

Normally, printed circuit boards will be produced in panel, and it will be assembled to increase the efficiency of SMT production. It means several single boards in one panel, such as two-in-one, four-in-one etc. After finished all the pcb assembly process, it needs to be cut into single boards, and for some printed circuit boards with only single boards also need to cut off some redundant board edges.

There are several ways to cut the printed circuit board. You can design the V-cut using the blade cutting machine (Scoring) or directly manually break off the board (not recommended). For more high density circuit boards, it will be used the professional splitting machine or the router to split the board without any damage the electronic components and printed circuit boards, but the cost and working hours will be a little longer.

Why Choose Hitech Circuits PCB Assembly Manufacturer for Your PCB Assembly Projects?

There are several PCB manufacturers specializing in PCB assemblyservices. However, Hitech Circuits PCB Assembly stands out owing to the following:

Assistance in Material Procurement:

Technically, in PCB assembly services, the quality of parts is the responsibility of the OEM; however, we ease your job by assisting you to make the right selection. We can help you procure all your parts of the same type own a single part number, thanks to our supply chain and vendor network as well as experience. This saves time and cost that goes in ordering single parts as you plan.

Testing procedures:

We are very focused on quality and thus implement stringent testing procedures at each stage of the assembly and after completion.

Fast Turnaround Times:

Our well-equipped facility and the right tools enable us to complete your requirements well before time, and without compromising on the quality or functioning of the PCBs. For simple designs we revert in 24 to 48 hours.

Cost Effectiveness:

While PCB assembly is a cost-effective alternative, we go a step further and assure that the parts you list are of a good quality and suitable for your requirement. Also, you can control the part flow and replenish them as needed. This eliminates the need to buy extra stock and store it.

Quick Quote:

We offer a quick quote based on your BOM. All you need is a detailed BOM, Gerber files, your application requirement sheet, and quantity.

We’re not one to stand still, which is why we use the latest equipment and the finest minds to create your PCB projects. We’re constantly keeping our finger on the pulse of the latest trends. And as a result, we know how to deliver the highest standards of PCB assembly to meet all your requirements.

Our dedicated, friendly customer service team also means that we support you every step of the way. Offering our expert guidance to ensure a complete PCB project that you’re happy with.

No matter what your printed circuit board assemblyneeds are, we always aim to deliver efficient, dependable solutions. For more information about our services, do not hesitate to get in touch with us today for a no-obligation quote

#pcb assembly #pcb manufacturer #pcb fabrication #pcba factory

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amanpreetkaurs-blog · 17 days ago

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India's Best Custom PCB Manufacturer - Pcbcircuit

We specialize in delivering high-quality, precision-engineered PCBs tailored to your exact specifications. From concept to final product, our team ensures top-notch reliability and innovation at every stage. Trust us to power up your electronics with industry-leading PCB solutions! Best PCB manufacturers are known for their experience, customer support, and ability to scale production based on project requirements.

#top 10 pcb manufacturer #pcb fabrication #quick turn pcb fabrication #pcb stencil #pcbcircuit #low-cost pcb manufacturer

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gurpreetkaur09 · 23 days ago

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Innovations in Multilayer PCB Manufacturing and Leading Companies

A multilayer PCB manufacturer specializes in producing printed circuit boards with multiple layers of conductive material. These boards offer higher density, improved performance, and more complex designs compared to single-layer PCBs. Multilayer PCBs are widely used in advanced electronic applications such as smartphones, computers, and medical devices, requiring precise manufacturing processes for optimal functionality.

#pcb #pcb manufacturer #pcb design #pcb circuit board #pcb stencil

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singhsonia · 7 months ago

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Best Pcb Manufacturer Company in Bombay

Looking for the best PCB manufacturer in Bombay? Pcbcircuit is your go-to choice, offering high-quality, reliable, and cost-effective PCB solutions. With state-of-the-art technology and a dedicated team of experts, We ensures precision, durability, and prompt delivery for all your electronic needs. Trust Pcbcircuit for unparalleled service and top-notch products in the industry.

#prototype pcb manufacturing #quick turn PCB fabrication #Best pcb stencil maker in hyderabad #Two layer pcb stencil #Pcb stencil #Pcb manufacturer in delhi #pcbcircuit

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bgaassembly · 12 days ago

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Exploring BGA Assembly: The Key to High-Performance Electronics

Ball Grid Array (BGA) assembly has become a critical technology in the manufacturing of modern electronic devices, offering superior performance and reliability compared to traditional packaging methods. As electronic devices continue to shrink in size while increasing in complexity, BGA has emerged as the go-to solution for mounting integrated circuits (ICs) on printed circuit boards (PCBs). This article delves into the principles of BGA assembly, its benefits, the process involved, and why it has become essential in high-performance electronics.

What is BGA Assembly?

Ball Grid Array (BGA) is a type of surface-mount packaging used for mounting integrated circuits (ICs) onto PCBs. Unlike conventional packages that use leads or pins to make connections, BGA packages use a grid of small solder balls on the underside of the IC, which directly connect to corresponding pads on the PCB. The solder balls are typically made of a tin-lead or lead-free alloy and are arranged in a grid pattern. When the package is placed on the PCB and heated, the solder balls melt, creating a strong electrical and mechanical connection.

BGA assembly is favored for its ability to handle high-density packaging, improve thermal performance, and increase reliability. With the rapid growth of mobile devices, computers, and other high-performance electronics, BGA has become the preferred choice for many manufacturers.

The BGA Assembly Process

The BGA assembly process involves several crucial steps, from PCB preparation to final testing. Here’s an overview of the typical BGA assembly process:

1. PCB Preparation

Before the BGA component can be placed on the PCB, the board needs to be prepared. This step includes cleaning the board to remove any dirt or contaminants that could interfere with soldering. Next, a layer of solder paste is applied to the PCB pads that will correspond with the BGA’s solder balls. The solder paste is typically applied using a stencil to ensure precision.

2. Component Placement

In this step, the BGA component is aligned and placed onto the PCB. This is typically done using automated pick-and-place machines, which use precision robotics to pick up the BGA package and place it onto the PCB pads covered with solder paste. Unlike other surface-mount packages, the BGA package has no leads sticking out, making placement easier and more precise.

Due to the high number of solder balls in a typical BGA package, accurate placement is essential to avoid misalignment, which can lead to poor electrical connections and device failure.

3. Reflow Soldering

Once the BGA component is placed on the PCB, the assembly enters the reflow soldering phase. The entire PCB is heated in a reflow oven, where the temperature gradually rises until the solder paste melts, creating a strong bond between the BGA balls and the PCB pads. After the solder melts, it solidifies as the PCB cools, forming a reliable connection between the BGA and the board.

Reflow soldering is particularly advantageous in BGA assembly because it allows the solder balls to melt simultaneously, ensuring uniform solder joints around the entire package. This process eliminates the risk of cold or dry solder joints, which can result in electrical failures.

4. Inspection and Testing

After reflow soldering, the PCB undergoes inspection to ensure that the BGA has been properly soldered and that there are no defects in the connections. One of the key challenges in BGA assembly is ensuring the quality of solder joints, which are hidden under the package and not visible for visual inspection.

To address this, manufacturers use specialized inspection techniques:

X-Ray Inspection: X-ray imaging is commonly used to inspect the hidden solder joints beneath the BGA package. This allows for the detection of issues such as solder bridges, voids, or incomplete joints that could affect performance.

Automated Optical Inspection (AOI): While AOI is effective for inspecting surface-mounted components, it cannot directly inspect BGA solder joints. However, it is still useful for checking the placement of components and overall board quality.

Electrical Testing: Functional or in-circuit testing is conducted to verify that the BGA connections are electrically sound and the assembled PCB functions as expected.

5. Final Assembly and Packaging

Once the BGA component has passed inspection and testing, the PCB is integrated into its final assembly. This may involve attaching the PCB to other components, encasing it in a protective housing, or connecting it to a power supply or other systems. The finished product is then packaged for shipment or further distribution.

Advantages of BGA Assembly

BGA assembly offers several advantages, which explain why it is increasingly used in high-performance electronics manufacturing:

1. Higher Density and Compactness

One of the key benefits of BGA assembly is its ability to accommodate a high number of connections in a relatively small space. The grid of solder balls enables dense packaging, which allows more components to fit on the PCB without sacrificing size. This is crucial in devices like smartphones and laptops, where space is limited but performance needs are high.

2. Improved Electrical Performance

The BGA package’s direct connection between the chip and the PCB, using the solder balls as conductive paths, reduces the electrical resistance and improves signal integrity. This leads to faster, more reliable signal transmission, making BGA ideal for high-speed circuits and data-intensive applications.

3. Superior Thermal Performance

BGA packages also offer superior heat dissipation compared to traditional packages with leads or pins. The grid of solder balls allows for better heat distribution across the PCB, which is especially important for high-power or high-performance devices that generate a significant amount of heat.

4. Greater Reliability

BGA connections are more robust than traditional leaded packages because the solder balls provide multiple contact points, reducing the risk of mechanical failure. This is especially important in applications where durability and long-term reliability are critical, such as automotive, aerospace, and industrial devices.

5. Smaller Footprint

BGA assemblies have a much smaller footprint than other packaging types, such as leaded packages or chip-on-board (COB) configurations. The reduced size allows for more efficient use of PCB real estate and contributes to the overall compactness of modern devices.

Challenges of BGA Assembly

Despite its many benefits, BGA assembly does come with its own set of challenges:

Inspection and Testing: As mentioned, BGA solder joints are hidden under the component, making it difficult to visually inspect the connections. While X-ray inspection can address this issue, it is expensive and adds to the overall manufacturing cost.

Placement Accuracy: BGA components have a high number of solder balls, and precise placement is essential for creating reliable connections. Misalignment can result in poor performance or failure, which requires meticulous control during the assembly process.

Conclusion

BGA assembly plays a pivotal role in the development of high-performance, compact, and reliable electronic devices. By offering advantages in terms of density, electrical performance, thermal management, and reliability, BGA has become a staple in industries ranging from consumer electronics to automotive and medical technology. Despite challenges related to inspection and placement, advances in automation and inspection technologies continue to enhance the BGA assembly process, ensuring that it remains a cornerstone of modern electronics manufacturing. As technology continues to evolve, BGA assembly will likely remain a key enabler of the increasingly complex and compact devices that define our digital world.

#BGA Assembly

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pcbcircuit · 3 months ago

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Benefits of Multi-Color PCBs in Circuit Design

Multi-color printed circuit boards (PCBs) are transforming the landscape of electronic design by blending functionality with aesthetics. One of the primary benefits of multi-color PCBs is that different colors can indicate specific circuit functions or components, helping engineers and technicians quickly identify issues during manufacturing and testing. , the use of multi-color PCBs can improve thermal management and signal integrity

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melssblog · 29 days ago

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Why is cleaning needed

Harmful contaminants such as solder and adhesive residues, flux, and dust and debris from other manufacturing processes and handling are often formed during the course of electronics manufacture, and the primary purpose of cleaning is to remove these contaminants at regular intervals. This ultimately leads to increased lifetime of the electronic product by ensuring good surface resistance and by preventing current leakage due to PCB failure.

With the constantly evolving cleaning market to meet the demands of the ever-expanding electronics industry, it is of paramount importance that the level of cleanliness required be clearly defined. A correct method must then be used to ensure that the level of cleanliness achieved meets the standard specified by the electronics engineer.

When to perform cleaning

There are many stages where cleaning is required:

Before stencilling and soldering to remove contaminants from the previous production stages

After stencilling to remove excess solder/adhesive

After soldering to remove corrosive flux residues and any excess solder

How is cleaning performed

Precise application of solder is often achieved using a stainless steel stencil over the printed circuit board. Once the circuit design has been finalised, it is mostly purchased as a set of a stencil and many PCBs (a single stencil can be used on thousands of PCBs). The solder is applied on the stencil through which it flows precisely onto the PCB below.

The ultimate goal of cleaning is to remove unwanted residue from the surface and under components. This is achieved by considering selection of components, board material compatibility, placement and defining solder mask in the Design Phase. The cleaning agent must be according to the solder alloy and flux composition with proper heat exposure. The Cleaning Agent must be selected with reuse, environmental, temperature, use rate and Health and Safety considerations in mind. Any Cleaning Machine used must perform proper fluid management, give a good throughput and consume less energy.

Types of cleaning in electronics manufacturing

Proper cleaning can be categorised into PCB Cleaning, Stencil Cleaning and Maintenance Cleaning.

PCB cleaning This can be further categorised into inline and batch aqueous sprays for in-air cleaning, ultrasonic and batch immersion cleaning, manual PCB and benchtop cleaning and vapour degreasing.

While inline washers use high flow, energy and deflective forces, batch cleaning machines are designed to wash, rinse and dry assemblies of smaller footprint. In ultrasonic and batch immersion cleaning, the product being washed is completely immersed in the cleaning agent using either ultrasonic energy or spray-under-immersion forces. Manual PCB and benchtop cleaning is required in rework and repairs to production assemblies and after hand placement of BGAs, connectors or other surface mount components and this is achieved by using an aerosol can or a pump dispenser and ensuring the right cleaning chemistry. In vapour degreasing, the engineered cleaning fluid is a blend of solvents which behave like an azeotrope to produce a constant boiling system at a specific temperature range.

Stencil cleaning

According to some estimates, up to 70% of solder defects are attributed to the stencil printing process. Stencil cleaning is categorised into under-stencil wiping to remove soils, ultrasonic cleaning to remove trace levels of solder paste from stencil openings, solvent-based cleaning to clean wet solder paste, adhesives and flux residues from stencils, mis-printed PCBs, wave soldering pallets, tools and fixtures, spray-in-air aqueous wash/rinse to rapidly dissolve the solder paste, hand-held stencil cleaning to remove trace levels of solder paste from the apertures, and misprint cleaning to address misprints due to issues such as clogged apertures, stencil out of alignment and solder paste rheology shifts.

Maintenance cleaning

MELSS brings you cleaning solutions from KYZEN, the global leader in advanced electronics assembly cleaning technologies, who develop and deliver electronics manufacturing cleaning products and services for improved reliability, constantly innovating to match the changing requirements of the electronics industry.

#solderpaste #PCB

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