#Thermal Properties of Epoxy Molding Compounds

[zohasen]

The Role of Glass Transition Temperature in Epoxy Molding Compounds

The Glass Transition Temperature (Tg) plays a pivotal role in determining the performance and durability of epoxy molding compounds. Tg refers to the temperature at which the polymer transitions from a rigid, glassy state to a more flexible, rubbery one. Understanding the impact of Tg on epoxy resin is crucial, particularly in high-temperature epoxy applications, as it directly influences the material's mechanical properties, thermal stability, and overall performance.

Epoxy Glass Transition Temperature and Its Significance

The Glass Transition Temperature in Epoxy is a defining factor in the epoxy resin molding process. As epoxy resins cure, their epoxy curing temperature influences how the resin bonds and behaves at different thermal conditions. If the Tg in epoxy resins is too low, the material may lose structural integrity when exposed to elevated temperatures. Conversely, a higher Tg results in improved thermal stability and makes the resin more resistant to heat and mechanical stress.

For industries relying on epoxy molding compounds, such as electronics and automotive, selecting the right epoxy resin performance can greatly affect product longevity and reliability. Understanding epoxy mold material properties and how they correlate with the Cure-Temperature-Glass-Transition can optimize the manufacturing process, ensuring that the final product meets the necessary performance criteria.

Optimizing Epoxy Tg for Better Results

In many applications, especially those involving high-performance environments, Epoxy Tg optimization is essential. Manufacturers can manipulate thermal properties of epoxy molding compounds to achieve the desired Tg, balancing flexibility and strength. The Impact of Tg on epoxy is especially evident in epoxy resin molding techniques, where fine-tuning the epoxy resin thermal stability allows for better control over product quality. The Tg and mechanical properties of epoxy are key to ensuring that the final molded parts exhibit durability and strength under varying conditions.

As an adhesive manufacturer in India, Kohesi Bond understands the critical importance of optimizing epoxy resin manufacturing process to deliver high-quality products. By mastering the control of epoxy bonding adhesive and its thermal properties, Kohesi Bond ensures superior performance across a wide range of applications.

For more information, visit Kohesi Bond's website!

[marketingreportz]

Thermoset Molding Compound Market - Forecast(2024 - 2030)

Thermoset Molding Compound Market Overview

Thermoset Molding Compound Market size is projected to reach US$11.4 billion by 2027, after growing at a CAGR of 6.8% during the forecast period 2022–2027. Thermosetting molding compounds such as phenolic resins, epoxy resins, polyester resins, urea formaldehyde and melamine formaldehyde possess properties such as good electrical insulation, corrosion and heat resistance, which make them an ideal material for a variety of end-use applications. A thermoset molding compound is widely employed in the electrical & electronics industry. Since the global electrical & electronics industry is growing, it is supporting the thermoset molding compound industry growth. The Japan Electronics and Information Technology Industries Association (JEITA) forecasted that the production by the global electronics and IT industries would grow by 2% year-on-year in 2020 to reach US$2,972.7 billion and would grow by 7% year on year in 2021 to reach a record US$3,175.6 billion. Factors such as the need for lighter weight in aerospace and transportation drive the growth of the thermosetting molding compound market. Several end-use industries in the Thermoset Molding Compound industry suffered negative effects as a result of the novel coronavirus pandemic, which had a direct impact on the Thermoset Molding Compound market size in the year 2020.

Sample Report:

Thermoset Molding Compound Market Report Coverage

The “Thermoset Molding Compound Market Report — Forecast (2022–2027)” by IndustryARC, covers an in-depth analysis of the following segments in the Thermoset Molding Compound industry.

By Type: Phenolic Resins, Epoxy Resins, Polyester Resins, Urea Formaldehyde, Melamine Formaldehyde and Others. By End-use Industry: Automotive [Passenger Vehicles (PV), Light Commercial Vehicles (LCV) and Heavy Commercial Vehicles (HCV)], Aerospace (Commercial Aircrafts, Military Aircrafts and Others), Electrical & Electronics (Antennas, Circuit Breakers, Switchgears and Others) and Others. By Geography: North America (the USA, Canada and Mexico), Europe (the UK, Germany, France, Italy, the Netherlands, Spain, Belgium and the Rest of Europe), Asia-pacific (China, Japan, India, South Korea, Australia and New Zealand, Indonesia, Taiwan, Malaysia and the Rest of APAC), South America (Brazil, Argentina, Colombia, Chile and the Rest of South America) and the Rest of the World (the Middle East and Africa).

Key Takeaways

Asia-pacific dominates the Thermoset Molding Compound market, owing to the increase in investment in the electronics sector and transportation infrastructure in Asia-pacific. This increase can be attributed to the increasing per capita income and growing population in Asia-pacific.

The market is expanding as a result of the positive attributes of Thermoset Molding Compounds, such as their anti-corrosiveness, increased heat resistance and toughness, which make them ideal for use in electrical and electronic applications.

The emergence of nanotechnology, these compounds’ superior performance in comparison to their alternatives and the surge in interest in lightweight and fuel-efficient cars offer the sector promising growth prospects.

However, it is estimated that the high investment cost of Thermoset Molding Compounds may impede the expansion during the forecast period.

For More Details on This Report — Request for Sample

Thermoset Molding Compound Market Segment Analysis — by Type

The phenolic resins segment held a significant share in the Thermoset Molding Compound market share in 2021 and is estimated to grow at a CAGR of 6.9% during the forecast period 2022–2027, due to their improved properties. Phenolic resins are appropriate for use in insulation due to their low thermal conductivity. Due to its water resistance, high thermal stability and fire resistance, phenolic resin is used as a permanent binder and adhesive for wooden building panels as well as a binder for mineral wool insulation. By altering the manufacturing catalyst, phenolic resin’s properties can be altered for each application. As a result, the demand for phenolic resin-based Thermoset Molding Compound is on a significant upsurge, thereby driving segmental growth.

Inquiry Before Buying:

Thermoset Molding Compound Market Segment Analysis — by End-use Industry

The electrical & electronics segment held a significant share in the Thermoset Molding Compound market share in 2021 and is projected to grow at a CAGR of 7.4% during the forecast period 2022–2027. The electrical and electronics industries benefit from thermoset molding compounds such as phenolic resins, epoxy resins, polyester resins, urea formaldehyde and melamine formaldehyde because they effectively insulate against electricity and heat. A strong molding material with strong dielectric properties, thermal shock resistance, corrosion resistance, arc resistance and electrically insulating properties is required for parts like circuit breakers, electrical enclosures or housings, covers, relays, switches, insulators and motor components. Furthermore, various electrical & electronic products such as covers, housings and circuit breakers require a molding material that protects sensitive internal electronics and components. This is accelerating the demand for Thermoset Molding Compound in the industry, which is subsequently propelling the segment growth.

Thermoset Molding Compound Market Segment Analysis — by Geography

Asia-pacific held the largest Thermoset Molding Compound market share of up to 42% in 2021, owing to the bolstering growth of the electrical & electronics sector in Asia-pacific. For instance, the consumer electronics and home appliance sector in India generated $9.84 billion in revenue in 2021 and is projected to grow to US$21.18 billion by 2025, according to the India Brand Equity Foundation (IBEF). The global electronics industry is expected to produce 7% more in 2021 than it did in 2020, reaching US$3,175.6 billion, according to the Japan Electronics and Information Technology Industries Association (JEITA). China’s electronic information manufacturing sector experienced steady growth in revenue and profits last year, according to the February 2022 report. According to the Ministry of Industry and Information Technology, operating revenue for the sector reached approximately 14.1 trillion yuan (roughly $2.2 trillion) in 2021, an increase of 14.7 percent from the previous year. With the increasing electrical & electronics production, the demand for molding materials significantly increased, which accelerated the demand for Thermoset Molding Compound in Asia-pacific.

Schedule A Call:

Thermoset Molding Compound Market Drivers

Increasing Automobile Production:

Thermoset Molding Compound provides lightweight materials for use in automotive manufacturing. The high-end vehicle manufacturers use carbon fiber composites to provide an enhanced finish. According to the Germany Trade & Invest (GTAI), German passenger car and light commercial vehicle OEM generated foreign market revenue of EUR 274 billion in 2021, an increase of ten percent over 2020. The International Organization of Motor Vehicle Manufacturers (OICA) estimates that heavy truck production in Europe increased by 31%, from 236,328 units in 2020 to 308,300 units in 2021. India’s domestic automobile production increased between FY16 and FY20 at a compound annual growth rate (CAGR) of 2.36 percent, with 26.36 million vehicles produced in FY20, according to the India Brand Equity Foundation (IBEF). With the increasing automobile production, the demand for lightweight automotive components is also increasing, thereby acting as a driver for the Thermoset Molding Compound market during the forecast period.

Flourishing Aerospace Sector:

In the aerospace industry, Thermoset Molded internal components are used within the cabins of civilian, commercial and military aircraft as they aid in making aircraft lightweight. The demand for aircraft is on an upsurge in various regions. According to Boeing’s current business forecast, the Middle East would need 2,520 new aircraft by 2030. Also, according to Boeing India, there is a demand for 2,300 aircrafts worth US$320 billion over the next 20 years. According to Boeing, in 2020, 8,995 aircraft fleets were delivered in North America. It is estimated to reach 10,610 fleets by 2039. Considering the importance associated with lightweight airplanes, it is expected that the increasing aerospace industry would act as a driver for the Thermoset Molding Compound market.

Thermoset Molding Compound Market Challenge

Fluctuating Raw Material Prices:

The raw materials often used for the production of Thermoset Molding Compounds are the downstream products of crude oil, such as epoxy resins. During the previous few years, the price of crude oil has been extremely volatile. The price of Brent crude oil has increased from US$43.73/bbl in 2016 to US$71.31/bbl in 2018 and then decreased to US$64.21/bbl in 2019 and US$41.84/bbl in 2020, according to the BP Statistical Review of World Energy. The volatility in the price of oil has caused fluctuation in the prices of raw materials for the manufacturing of thermoset molding compounds. Thus, the fluctuation in the price of crude oil has a direct influence on the price of the Thermoset Molding Compounds, which is a significant challenge for the market during the forecast period.

Buy Now :

Thermoset Molding Compound Industry Outlook

Technology launches, acquisitions and R&D activities are key strategies adopted by players in the Thermoset Molding Compound market. The top 10 companies in the Thermoset Molding Compound market are:

Ashland Global Holding Inc.

BASF SE

Eastman Chemical Company

Evonik Industries AG

Hexion Inc.

Huntsman Corporation

Kolon Industries Inc.

Kyocera Chemical Corporation

Plastics Engineering Company

Rogers Corporation

Recent Developments

In March 2021, BASF announced a partnership with Sumitomo (SHI) Demag to create the first fully-automated, all-electric injection moulding cell for new high-performance polymer manufacturing.

In April 2020, Evonik announced the completion of the Marl expansion of its polyamide plant. The substance also combines quality and performance with excellent parameter estimation, uses very little water, has great structural correctness and has excellent UV resistance.

Relevant Reports

NanoParticles Market — Industry Analysis, Market Size, Share, Trends, Application Analysis, Growth and Forecast Analysis

Report Code: HCR 0272

Metal And Metal Oxide Nanoparticles Market — Industry Analysis, Market Size, Share, Trends, Application Analysis, Growth and Forecast Analysis

Report Code: CMR 67878

Magnesium Oxide Nanoparticle Market — Industry Analysis, Market Size, Share, Trends, Application Analysis, Growth and Forecast Analysis

Report Code: CMR 68243

For more Chemicals and Materials Market reports, please click here

[aluminiumrepair]

The Ultimate Guide to Cast Aluminum Repair: Tips and Techniques

Cast aluminum is a popular material known for its strength, lightweight nature, and corrosion resistance. It’s commonly used in a variety of applications, from automotive parts and machinery to outdoor furniture and decorative items. However, even the most durable cast aluminum pieces can suffer from damage over time. Whether it's a cracked engine part or a dented patio table, cast aluminum repair is often a practical solution to extend the lifespan of these items. In this blog, we'll explore effective methods and tips for successful cast aluminum repair.

Understanding Cast Aluminum

Before diving into repair techniques, it's essential to understand what cast aluminum is and why it behaves the way it does. Cast aluminum is created by pouring molten aluminum into a mold, which solidifies into a specific shape. This process gives the material its unique properties, such as excellent machinability and resistance to rust. However, cast aluminium repair can be prone to issues like cracking and warping, particularly if subjected to stress or impact.

Common Cast Aluminium Problems

Cracks: Cracking is one of the most frequent issues with cast aluminium. It can occur due to thermal stress, mechanical impact, or improper casting.

Dents and Gouges: Physical damage from collisions or abrasive actions can lead to dents and gouges on the surface.

Corrosion: Although aluminium is resistant to rust, it can still suffer from corrosion, particularly in harsh environments.

Techniques for Cast Aluminum Repair

Preparing the Surface

Before you start any repair work, proper preparation is key. Clean the damaged area thoroughly to remove any dirt, grease, or paint. Use a wire brush or a sanding disk to ensure a clean surface, which will help the repair material adhere better. For more stubborn contaminants, consider using a degreaser or solvent.

Welding

For structural repairs or cracks, welding is often the most effective solution. Cast aluminum welding requires specialized equipment and techniques due to the material's unique properties. Here’s a brief overview of the process:

Equipment: Use a TIG (Tungsten Inert Gas) welder with an aluminium filler rod. Ensure your welder is compatible with aluminium and capable of handling the specific alloy.

Technique: Heat the aluminium gradually to avoid further cracking. Maintain a steady hand and weld in small sections. Allow the weld to cool slowly to minimize the risk of new cracks forming.

Epoxy Repair

For minor cracks or surface damage, epoxy repair can be a suitable alternative. Follow these steps for a successful epoxy repair:

Preparation: Clean the area thoroughly and sand it to create a rough surface for better adhesion.

Application: Mix the epoxy resin and hardener according to the manufacturer’s instructions. Apply the mixture to the damaged area, ensuring it fills the crack or gouge completely.

Curing: Allow the epoxy to cure fully as per the instructions, typically for 24 hours. Sand the repaired area once it’s dry to achieve a smooth finish.

Cast Aluminium Repair Kits

For DIY enthusiasts, pre-packaged cast aluminium repair kits can be incredibly useful. These kits often include everything you need, such as:

Filler: Specialized compounds designed to bond with aluminium and fill gaps.

Cleaner: For preparing the surface before application.

Instructions: Step-by-step guides tailored to the kit’s specific products.

Cast aluminium repair is a practical skill that can save you money and extend the life of your valuable items. Whether you choose welding, epoxy repair, or a pre-packaged kit, understanding the material and the right techniques is crucial for successful repairs. By following the tips and methods outlined in this guide, you can confidently tackle cast aluminum repair projects and maintain your items in excellent condition.

[antiskidindustries]

Commercial kitchens are bustling environments that require flooring solutions capable of withstanding heavy foot traffic, spills, and rigorous cleaning routines. Epoxy floor coatings have emerged as a popular choice among restaurant owners and chefs due to their durability, hygiene benefits, and aesthetic appeal. Here’s a comprehensive look at why epoxy floor coatings are ideal for commercial kitchens:

1. Durability and Resistance:

Epoxy coatings are known for their robust durability, able to endure the daily wear and tear of a busy kitchen environment.

They are resistant to stains, chemicals, oils, and grease, which are common in food preparation areas.

This resistance makes epoxy floors easy to clean and maintain, ensuring a sanitary and safe workspace.

2. Safety and Hygiene:

The seamless and non-porous surface of epoxy flooring prevents bacteria, mold, and mildew growth, promoting a cleaner and more hygienic kitchen environment.

Its slip-resistant properties can be enhanced with additives, providing traction and reducing the risk of slips and falls, crucial in busy kitchens.

3. Thermal and Impact Resistance:

Epoxy floor coatings can withstand thermal shock and impact from dropped utensils or equipment, maintaining their integrity over time.

This durability minimizes the need for frequent repairs or replacements, contributing to cost-effectiveness for kitchen operators.

4. Aesthetic Customization:

Available in a variety of colors, textures, and finishes, epoxy coatings can be customized to match the decor and ambiance of the kitchen.

Its glossy surface enhances the brightness of the space by reflecting light, contributing to a more inviting atmosphere for patrons and staff alike.

5. Quick Installation and Minimal Downtime:

Epoxy coatings can often be installed quickly, minimizing disruption to daily operations in commercial kitchens.

They can be applied directly over existing concrete or other flooring materials, reducing downtime and labor costs associated with renovations.

6. Regulatory Compliance and Sustainability:

Many epoxy coatings meet stringent health and safety regulations, including USDA and FDA guidelines for food preparation areas.

Some formulations are low VOC (Volatile Organic Compound), contributing to indoor air quality and environmental sustainability in commercial settings.

Conclusion: Commercial kitchen epoxy floor Perth coatings not only enhance the aesthetic appeal of culinary spaces but also improve safety, hygiene, and operational efficiency. By choosing epoxy flooring, restaurant owners and kitchen managers in Perth can invest in a long-lasting, cost-effective solution that withstands the rigors of daily use while maintaining a clean and inviting environment for both employees and patrons.

[jedyfwf]

Phenol Market Analysis: Assessing Growth Opportunities

Phenol, a vital aromatic compound, serves as a foundational building block in the chemical industry, finding extensive applications across various sectors. This blog aims to delve into the dynamics of the global phenol market, exploring its demand drivers, key applications, emerging trends, and future growth prospects.

Understanding Phenol:

The Phenol Market, also known as carbolic acid, is an aromatic organic compound with the chemical formula C6H5OH. It is a white crystalline solid at room temperature with a distinct, sweet odor. Phenol is widely used in the production of phenolic resins, bisphenol-A (BPA), caprolactam, and various other chemicals.

Market Dynamics:

Resilient Chemical Industry Demand: Phenol serves as a key intermediate in the production of numerous chemicals, including phenolic resins used in adhesives, coatings, and molded products, contributing to its steady demand in the chemical industry.

Polycarbonate and Epoxy Resins: Phenol is a crucial raw material in the production of polycarbonate and epoxy resins, which find extensive use in automotive, electronics, construction, and aerospace industries due to their strength, durability, and heat resistance properties.

Bisphenol-A (BPA) Production: Phenol is a primary component in the synthesis of Bisphenol-A (BPA), which is utilized in the manufacturing of polycarbonate plastics, epoxy resins, and thermal paper coatings, among other applications.

Nylon Production: Caprolactam, demand from phenol, is a key intermediate in nylon-6 production, which is used in textiles, automotive components, engineering plastics, and industrial applications.

Applications Across Industries:

Chemical Industry: Phenolic resins, polycarbonate, epoxy resins, caprolactam.

Automotive and Aerospace: Composite materials, coatings, automotive components.

Electronics: Circuit boards, electrical components.

Construction: Adhesives, coatings, insulation materials.

Market Trends:

Sustainability and Environmental Concerns: The phenol market is witnessing a shift towards sustainable production methods, including bio-based phenol derived from renewable sources, to address environmental concerns and meet regulatory requirements.

Technological Advancements: Ongoing research focuses on developing novel production processes, improving phenol derivatives' properties, and exploring new applications to enhance market competitiveness.

Emerging Applications: Phenol and its derivatives are finding new applications in areas such as healthcare, renewable energy, and specialty materials, expanding the market's scope and driving innovation.

Future Prospects:

The global Phenol market is poised for continued growth, driven by its versatile applications, technological advancements, and evolving consumer preferences towards sustainable products. As industries prioritize performance, sustainability, and regulatory compliance, Phenol and its derivatives remain integral to diverse sectors, fueling innovation and economic growth.

Conclusion:

Phenol's significance as a versatile chemical compound spans across multiple industries, underpinning the production of essential materials and products. Navigating the global Phenol market requires a deep understanding of market dynamics, emerging trends, and technological advancements. With a focus on sustainability, innovation, and diversified applications, the Phenol market is positioned for sustained growth and remains a pivotal player in the global chemical landscape.

[informationandcommunication]

Thermoset Molding Compound Market – Forecast (2022-2027)

Thermoset Molding Compound Market size is projected to reach US$11.4 billion by 2027, after growing at a CAGR of 6.8% during the forecast period 2022-2027. Thermosetting molding compounds such as phenolic resins, epoxy resins, polyester resins, urea formaldehyde and melamine formaldehyde possess properties such as good electrical insulation, corrosion and heat resistance, which make them an ideal material for a variety of end-use applications. A thermoset molding compound is widely employed in the electrical & electronics industry. Since the global electrical & electronics industry is growing, it is supporting the thermoset molding compound industry growth. The Japan Electronics and Information Technology Industries Association (JEITA) forecasted that the production by the global electronics and IT industries would grow by 2% year-on-year in 2020 to reach US$2,972.7 billion and would grow by 7% year on year in 2021 to reach a record US$3,175.6 billion. Factors such as the need for lighter weight in aerospace and transportation drive the growth of the thermosetting molding compound market. Several end-use industries in the Thermoset Molding Compound industry suffered negative effects as a result of the novel coronavirus pandemic, which had a direct impact on the Thermoset Molding Compound market size in the year 2020.

Thermoset Molding Compound Market Report Coverage

The “Thermoset Molding Compound Market Report – Forecast (2022-2027)” by IndustryARC, covers an in-depth analysis of the following segments in the Thermoset Molding Compound industry.

By Type: Phenolic Resins, Epoxy Resins, Polyester Resins, Urea Formaldehyde, Melamine Formaldehyde and Others. By End-use Industry: Automotive [Passenger Vehicles (PV), Light Commercial Vehicles (LCV) and Heavy Commercial Vehicles (HCV)], Aerospace (Commercial Aircrafts, Military Aircrafts and Others), Electrical & Electronics (Antennas, Circuit Breakers, Switchgears and Others) and Others. By Geography: North America (the USA, Canada and Mexico), Europe (the UK, Germany, France, Italy, the Netherlands, Spain, Belgium and the Rest of Europe), Asia-pacific (China, Japan, India, South Korea, Australia and New Zealand, Indonesia, Taiwan, Malaysia and the Rest of APAC), South America (Brazil, Argentina, Colombia, Chile and the Rest of South America) and the Rest of the World (the Middle East and Africa).

Key Takeaways

Asia-pacific dominates the Thermoset Molding Compound market, owing to the increase in investment in the electronics sector and transportation infrastructure in Asia-pacific. This increase can be attributed to the increasing per capita income and growing population in Asia-pacific.

The market is expanding as a result of the positive attributes of Thermoset Molding Compounds, such as their anti-corrosiveness, increased heat resistance and toughness, which make them ideal for use in electrical and electronic applications.

The emergence of nanotechnology, these compounds' superior performance in comparison to their alternatives and the surge in interest in lightweight and fuel-efficient cars offer the sector promising growth prospects.

However, it is estimated that the high investment cost of Thermoset Molding Compounds may impede the expansion during the forecast period.

Request Sample

Thermoset Molding Compound Market Segment Analysis – by Type

The phenolic resins segment held a significant share in the Thermoset Molding Compound market share in 2021 and is estimated to grow at a CAGR of 6.9% during the forecast period 2022-2027, due to their improved properties. Phenolic resins are appropriate for use in insulation due to their low thermal conductivity. Due to its water resistance, high thermal stability and fire resistance, phenolic resin is used as a permanent binder and adhesive for wooden building panels as well as a binder for mineral wool insulation. By altering the manufacturing catalyst, phenolic resin's properties can be altered for each application. As a result, the demand for phenolic resin-based Thermoset Molding Compound is on a significant upsurge, thereby driving segmental growth.

Thermoset Molding Compound Market Segment Analysis – by End-use Industry

The electrical & electronics segment held a significant share in the Thermoset Molding Compound market share in 2021 and is projected to grow at a CAGR of 7.4% during the forecast period 2022-2027. The electrical and electronics industries benefit from thermoset molding compounds such as phenolic resins, epoxy resins, polyester resins, urea formaldehyde and melamine formaldehyde because they effectively insulate against electricity and heat. A strong molding material with strong dielectric properties, thermal shock resistance, corrosion resistance, arc resistance and electrically insulating properties is required for parts like circuit breakers, electrical enclosures or housings, covers, relays, switches, insulators and motor components. Furthermore, various electrical & electronic products such as covers, housings and circuit breakers require a molding material that protects sensitive internal electronics and components. This is accelerating the demand for Thermoset Molding Compound in the industry, which is subsequently propelling the segment growth.

Thermoset Molding Compound Market Segment Analysis – by Geography

Asia-pacific held the largest Thermoset Molding Compound market share of up to 42% in 2021, owing to the bolstering growth of the electrical & electronics sector in Asia-pacific. For instance, the consumer electronics and home appliance sector in India generated $9.84 billion in revenue in 2021 and is projected to grow to US$21.18 billion by 2025, according to the India Brand Equity Foundation (IBEF). The global electronics industry is expected to produce 7% more in 2021 than it did in 2020, reaching US$3,175.6 billion, according to the Japan Electronics and Information Technology Industries Association (JEITA). China's electronic information manufacturing sector experienced steady growth in revenue and profits last year, according to the February 2022 report. According to the Ministry of Industry and Information Technology, operating revenue for the sector reached approximately 14.1 trillion yuan (roughly $2.2 trillion) in 2021, an increase of 14.7 percent from the previous year. With the increasing electrical & electronics production, the demand for molding materials significantly increased, which accelerated the demand for Thermoset Molding Compound in Asia-pacific.

Inquiry Before Buying

Thermoset Molding Compound Market Drivers

Increasing Automobile Production:

Thermoset Molding Compound provides lightweight materials for use in automotive manufacturing. The high-end vehicle manufacturers use carbon fiber composites to provide an enhanced finish. According to the Germany Trade & Invest (GTAI), German passenger car and light commercial vehicle OEM generated foreign market revenue of EUR 274 billion in 2021, an increase of ten percent over 2020. The International Organization of Motor Vehicle Manufacturers (OICA) estimates that heavy truck production in Europe increased by 31%, from 236,328 units in 2020 to 308,300 units in 2021. India's domestic automobile production increased between FY16 and FY20 at a compound annual growth rate (CAGR) of 2.36 percent, with 26.36 million vehicles produced in FY20, according to the India Brand Equity Foundation (IBEF). With the increasing automobile production, the demand for lightweight automotive components is also increasing, thereby acting as a driver for the Thermoset Molding Compound market during the forecast period.

Flourishing Aerospace Sector:

In the aerospace industry, Thermoset Molded internal components are used within the cabins of civilian, commercial and military aircraft as they aid in making aircraft lightweight. The demand for aircraft is on an upsurge in various regions. According to Boeing's current business forecast, the Middle East would need 2,520 new aircraft by 2030. Also, according to Boeing India, there is a demand for 2,300 aircrafts worth US$320 billion over the next 20 years. According to Boeing, in 2020, 8,995 aircraft fleets were delivered in North America. It is estimated to reach 10,610 fleets by 2039. Considering the importance associated with lightweight airplanes, it is expected that the increasing aerospace industry would act as a driver for the Thermoset Molding Compound market.

Thermoset Molding Compound Market Challenge

Fluctuating Raw Material Prices:

The raw materials often used for the production of Thermoset Molding Compounds are the downstream products of crude oil, such as epoxy resins. During the previous few years, the price of crude oil has been extremely volatile. The price of Brent crude oil has increased from US$43.73/bbl in 2016 to US$71.31/bbl in 2018 and then decreased to US$64.21/bbl in 2019 and US$41.84/bbl in 2020, according to the BP Statistical Review of World Energy. The volatility in the price of oil has caused fluctuation in the prices of raw materials for the manufacturing of thermoset molding compounds. Thus, the fluctuation in the price of crude oil has a direct influence on the price of the Thermoset Molding Compounds, which is a significant challenge for the market during the forecast period.

Buy Now

Thermoset Molding Compound Industry Outlook

Technology launches, acquisitions and R&D activities are key strategies adopted by players in the Thermoset Molding Compound market. The top 10 companies in the Thermoset Molding Compound market are:

Ashland Global Holding Inc.

BASF SE

Eastman Chemical Company

Evonik Industries AG

Hexion Inc.

Huntsman Corporation

Kolon Industries Inc.

Kyocera Chemical Corporation

Plastics Engineering Company

Rogers Corporation

Recent Developments

In March 2021, BASF announced a partnership with Sumitomo (SHI) Demag to create the first fully-automated, all-electric injection moulding cell for new high-performance polymer manufacturing.

In April 2020, Evonik announced the completion of the Marl expansion of its polyamide plant. The substance also combines quality and performance with excellent parameter estimation, uses very little water, has great structural correctness and has excellent UV resistance.

Relevant Reports

NanoParticles Market

Report Code: HCR 0272

Metal And Metal Oxide Nanoparticles Market

Report Code: CMR 67878

For more Chemicals and Materials Market reports, please click here

[agexpharma-123]

SELECTING THE RIGHT EPOXY RESIN FOR YOUR APPLICATION

Epoxy resin has many industrial applications and possesses greater thermal and chemical resistance – as well as strengthened mechanical properties – than other types of resin. When in liquid form, epoxy resin is poured into a mold or painted over a material in layers to create a protective outer coating. After curing, the material hardens into a solid and becomes durable and structurally stable. This combination of features makes epoxy resin extremely useful in a number of applications, from industrial tooling to art projects and automotive manufacturing.

The specific combination of chemical compounds and polymerization processes will impact the resulting core characteristics of an epoxy resin formula.

Glycidol (556-52-5 ) manufacturer USA herein highlights some of the trademark properties of epoxy resin formulas:

·         Heat-resistance

·         Absence of VOCs (volatile organic compounds)

·         Excellent fatigue strength and flexural strength

·         Electrical insulation

·         Chemical stability

·         Low moisture absorption

·         Durable adhesive bond

·         Anti-corrosive

·         Low shrinkage after curing

To begin the application process the epoxy resin is mixed with a co-reactant, also called a hardener, which typically comes in a separate compartment of the same package. The chemical reaction begins as soon as the two chemicals are mixed and depending on the formulation can become solid very quickly or slowly depending on your requirements.  The epoxy resin manufacturer should provide instructions about the ratio of epoxy to hardener that should be used to achieve maximum strength and performance.

What’s the Difference Between Casting and Coating Epoxy Resins?

Casting and coating epoxy resins are unique but related compounds. Choosing between the two will ultimately determine how the finished product will look and function.

Casting resins, also called “deep-pour resin” or “pouring plastic,” are used for clear encasings and suspensions. The user pours the material into a mold and then cures it to retain the same shape. Casting resins are commonly used to create crafts, jewelry, sculptures, and memorabilia. Manufacturers can also produce aggregate, molded plastics, or electrical insulation with casting resin. Engineers design automotive parts, aerospace devices, sports equipment, and hundreds of other products with compounds that are fortified with epoxy resin.

Coating resins, on the other hand, are aptly named: they are used to coat materials, such as metal, concrete, or wood, to make them stronger, chip-resistant, easier to clean, water-resistant, and rust-proof. A thin layer of coating resin can also glue materials together or preserve paper. In the electrical manufacturing sector, coating resins are applied to overmold circuits and transistors, which holds components together and protects against corrosion.

Beyond these differences in application, there are a few other notable distinctions between casting and coating epoxy resin:

·         Viscosity: Casting resins are normally thinner compared to coating resin.

·         Curing Times: Because liquid casting resin is poured into thick layers, they take longer to cure to avoid shrinkage and heat build up..

·         Hardness: Coating resins are usually stiffer and harder than casting resins.

·         Mix Ratio: Most coating resins use a 1:1 ratio, but casting resin formulas can vary, such as 1:1 or 2:1.

Even though there are significant similarities between the two formula types, it’s usually easier to use the formula that’s best suited to your intended application.

If you pour casting resin on a surface instead of using a thin layer of coating resin, for example, the resin will run off the edges and will be very slow to harden.

Alternatively, if you pour coating epoxy into a mold, you’ll need to pour multiple thin layers and wait for the material to cure between applications. Otherwise, the heat generated from the material poured in a large mass will accelerate the chemical reaction and cause yellowing or cracking.

Key Questions to Consider About Epoxy Resin

If you are not sure what type of epoxy resin to opt for, consider the following:

·         How thick is the layer of epoxy you need for this project?

·         How long can you wait for the epoxy to cure?

·         Do you need a mold or frame to prevent dripping and hold the epoxy while it cures?

·         How hard does this material need to be to withstand the expected wear?

·         Do you want to suspend materials in the epoxy resin?

·         Do you need the epoxy to have any special properties?

·         Will this material be exposed to extreme temperatures, water, chemicals, UV rays, or other potentially damaging elements?

Epoxy resin systems can be tailor-made to suit unique project needs. Manufacturers use a variety of co-reactants, including, for example, polyfunctional amines, phenols, and alcohols all of which produce slightly different results. The type of base epoxy and additives in the formula can also change the resin’s viscosity and intrinsic properties.

Epoxy Resin Viscosity

Viscosity describes a liquid’s degree of resistance to flow. Within the context of epoxy resin formulas, the viscosity determines if the material will drip or spread evenly and if it should be poured, dipped, or painted on the material. Viscosity also affects how much of the epoxy perforates the substrate and which physical properties are produced.

For example, at Glycidol (556-52-5 ) manufacturer USA, we manufacture three lines of epoxy resin with low, medium, or high viscosities:

1.      Low Viscosity

Low-viscosity epoxy resin is thin and works well for deep-level penetration and filling small cavities. The consistency helps prevent air bubbles, which facilitates bonding between the epoxy and substrate. You can use low-viscosity epoxy resin for encapsulation, sealing, and potting.

2.      Medium Viscosity

Medium-viscosity epoxy is thick. It’s less permeable than low-viscosity formulas and offers greater mechanical strength. The material can withstand moderately high temperatures and is often used for filament winding, vacuum bagging, and tooling.

3.      High Viscosity Epoxy

High-viscosity epoxy has a paste-like consistency and is the most resilient option. It offers superior adhesion and shock- and heat-resistance. Technicians use this formula for projects that demand exceptional durability and strength.

Epoxy Resin Solutions At Agex Pharma

Agex Pharma has been a leading provider of quality epoxy resin solutions for over four decades. are thoroughly tested Our formulations for quality assurance and have demonstrated practical applications in a broad range of industries. To learn more about epoxy resins or about our products and capabilities, reach out to us or request a quote today.

[wsxchem]

What Is Epoxy Hardener Made Of

The epoxy resin itself is a thermoplastic linear structure. After heating, the solid resin can be softened and melted into a viscous or liquid state. The thermal viscosity of liquid resin decreases. Only when curing agent is added, epoxy resin can be used practically.

 Composition of epoxy resin

 A. Resin Composition

(1) Epoxy resin: Main component of resin composition, Bisphenol A epoxy resin and other types of epoxy resin

(2) Curing agent: reacting with epoxy resin to form three-dimensional network polymer compounds

 B. Modified components

(1) Plasticizers: Plasticizers give flexibility, but reduce heat resistance and drug resistance.

(2) Toughening agent: improve impact resistance, and make other properties reduced little, such as liquid acid carboxylated rubber

(3) Filler: increase weight, improve solidification, mechanical, thermal and electrical properties, such as calcium carbonate, mica, etc.

 C. Regulating fluidity components (1) Dilutants: reducing the viscosity of components, which are divided into active diluents and inactive diluents. Thixotropic agent: give thixotropy to components, such as asbestos, silicon powder, etc.

 D. Other ingredients: pigments, solvents, defoamers, levelers, tackifiers, etc.

 After learning what is epoxy resin hardener, you may want to know what they are used for. Epoxy resins can be widely used because of the combination of these components. Especially curing agent, once the epoxy resin is determined, curing agent plays a decisive role in the technological properties of epoxy resin components and the final properties of curing agent products (products). Epoxy resin itself is a linear structure of thermoplasticity. It can not be used directly. A second component must be added to the resin. Under certain temperature (or humidity) and other conditions, epoxy group of epoxy resin is used for addition polymerization or catalytic polymerization to produce cured materials with three-dimensional network structure (bulk network structure). This compound or resin, which acts as the second component, is called curing agent and is divided into additive curing agent and catalytic curing agent.

 Curing agent:

 A. Normal temperature curing

 Heavy-duty anticorrosive coatings; Civil building adhesives; Civil building coatings; FRP; General binders.

Straight chain aliphatic polyamines, polyamides, alicyclic polyamines, denatured polyamines, polymercaptan

 B. Heating curing

 (1) Electrical insulating materials: acid anhydride, imidazole compounds, BF3 complex.

(2) Laminating materials: Dicy, aromatic polyamines, linear phenolic resin.

(3) Coatings (Tank: Amino Resin, Phenolic Resin, Powder: Dicy, Aromatic Polyamines, Anhydride).

(4) Molding material: linear phenolic resin.

(5) Binders: Aromatic polyamines, anhydrides, imidazoles, BF3-complexes.

https://www.wsxchem.com/resources/what-is-epoxy-hardener-made-of.html

[digitalconvo]

Thermoset Molding Compound Market Trends, Analysis, Growth, and Forecast 2017 –

Global Thermoset Molding Compound Market: Snapshot

In the current past, thermosets have turned out to be superb trade for metallic or metallic components as they provide highly valuable properties, for instance, mechanical quality, high temperature resistance, compound resistance, electrical protection, and different other advantages. Swift urbanization is having a positive impact on many industries wherein lightweight and solidness of the items are fundamental needs in terms of product.  Therefore, the demand in the worldwide thermoset molding compound market is anticipated to grow at an exponential rate in the years ahead.

Get Brochure of the Report @  https://www.tmrresearch.com/sample/sample?flag=B&rep_id=1430    

The expanding requirement for security and safety in aerospace and transportation industries is an essential driver of the global thermoset molding compound market, as thermosets offer quality and sturdiness other than being lightweight. The requirement for financially suitable material to supplant heavy metals, expanding requirement for thermally steady and resistance to corrosion, and easy production of complex are some of the various dynamics pushing the growth of the worldwide thermoset molding compound market. On the other hand, fluctuating prices of crude oil and stringent administrative strategies relating to thermoset resin are anticipated to inhibit the development rate in the upcoming years.

Some of the key end users of thermoset molding are aerospace, electrical and electronics, and most of all automotive. The automotive industry is the probable leading end user owing to the use of thermoset molding in the manufacturing of interior and exterior automotive components.

Global Thermoset Molding Compound Market: Overview

In the recent past, thermosets have become excellent replacement for thermoplastic or metallic components as they offer highly useful properties such as mechanical strength, high temperature resistance, chemical resistance, electrical insulation, and other benefits. Rapid urbanization is reflecting positively on several industries wherein lightweight and durability of the products are essential. As a result, the demand in the global thermoset molding compound market is projected to expand at a robust rate during the forecast period of 2017 to 2025.

This report on global market for thermoset molding compound is an all-inclusive overview of the current condition and based a thorough analysis of all the factors that my influence the demand in the near future, it estimates the state of the market until 2025. This report has been prepared to act as an information guide for targeted audiences such as thermoset molding compound manufacturers, distributors and suppliers, raw material suppliers, end-use industries, and investment research firms. The hallmark of the report is its section on company profiles, wherein a number of prominent players currently active in this market have been overviewed for their market share, operating business segments, business performance, and key strategic moves and recent developments.

The global thermoset molding compound market can be segmented on the basis of resin type into phenolic, epoxy, polyester, and other resins, while on the basis of application, the market can be categorized into aerospace, electrical, automotive, and others. Geographically, the report studies the potential of the market in the regions such as Asia Pacific, North America, Europe, Latin America, and the Middle East and Africa.

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Global Thermoset Molding Compound Market: Trends and Opportunities

The increasing need for safety in transportation and aerospace industry is the primary driver of this market, as thermosets offer strength and durability besides being lightweight. The need for economically viable material to replace heavy metals, increasing need for thermally stable and resistance against corrosion, and ease in production of complex shapes are some of the other factors augmenting the demand the global thermoset molding compound market. Conversely, volatility of crude oil prices and stringent regulatory policies pertaining to thermoset resin are expected to hinder the growth rate during the forecast period.

Among all the resin type segments, polyester resin has maximum demand, owing to its property of remarkable flexibility and increasing application in automotive body panel. Polyester resin thermoset molding offers excellent resistance to a wide range of chemicals at room temperature such as gasoline, aliphatic hydrocarbons, alcohols, and glycols. Among the end-use application, the electrical and electronics segment continues to be most lucrative as thermoset molding compound are used for various types of electronic packages such as transistors, capacitors, memory devices, and central processing units (CPUs).

Global Thermoset Molding Compound Market: Regional Outlook

Countries such as China and India have become manufacturing hubs for several end-use industries in the recent past. This factor makes this Asia Pacific the most important regional market for thermoset molding compound. The growing economy, low cost labor, and escalating demand for low-maintenance products are some of the factors augmenting the demand from Asia Pacific region.

Companies mentioned in the research report

The report identifies Eastman Chemical Company, Ashland Global Holding Inc., BASF SE, Hexion Inc., Huntsman Corporation, Evonik Industries AG, Kolon Industries Inc., Plastics Engineering Company (Plenco), Kyocera Chemical Corporation, and Rogers Corporation as the key players in global thermoset molding compound market. Product development, collaboration and partnerships, and regional expansion are the key strategies adopted by these players to maintain their stronghold over the market. Some of the other notable players are Hitachi Chemical Company Ltd., Chang Chun Plastics Co. Ltd., Cosmic Plastics Inc., Saudi Basic Industries Corporation (SABIC), and Jiangsu Tianxin Chemical Co., Ltd.

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[sukoptfe-blog]

Properties of molded products

Molded products have excellent electrical properties (especially anti-leakage properties), mechanical properties, heat resistance, fire resistance, chemical corrosion resistance and dimensional stability, and can be adjusted according to the needs of each component type and dosage to obtain products with special performance requirements. The main performance is as follows：

1.Electrical property

Molded plastics are widely used in high voltage electrical applications due to their arc resistance, acer performance, flame resistance, dimensional stability, moulding and low cost. The ability of arc suppression is mainly due to the presence of inert inorganic fillers such as hydrated alumina, silica and ceramic. Add a small amount of polyethylene powder (5% by weight) and use nylon fiber to improve arc resistance. In order to obtain better arc resistance, the resin and glass fiber content should be reduced to the minimum, however, such results reduce the mechanical properties.

2. Mechanical property

The mechanical properties of molding materials vary with the types and proportions of reinforced fibers and resin substrates used. In DMC, when the fiber length exceeds 6.35mm, the modification of product properties is very small.

Most SMC products are made from short-cut felt, and there is no published data on the effect of fiber length changes. Although the length of the general fiber is 50mm, this length is not necessarily suitable for all applications.

Increasing the content of reinforcing materials can improve the mechanical properties, but too much fiber content will bring inconvenience to molding. For example, when the fiber content in DMC exceeds 20%, it has little influence on its mechanical properties.

3. Heat resistance or fire resistance

Heat resistance refers to the ability of products to withstand thermal decomposition for long periods of time below the flammable temperature. "Short-term thermal strength" or "thermal strength" is related to the thermal deformation temperature of the resin. Although some fillers can improve the heat resistance of products, the heat resistance and thermal strength mainly depend on the properties of the resin. Flammability is a measure of apparent combustion, divided into "non-ignition", "self-extinguishing" and "flame-retardant" according to the ability and speed with which a material is able to extinguish easily or when the ignition source is removed. Polyester resins achieve flame resistance by adding halogen and phosphorous compounds and by using alumina hydrate as the main filler in the components.

Phenolic resins are inherently fire-resistant. Halogen compounds and phosphorous compounds, as well as HET anhydride used as hardener, can make epoxy resins flame resistant.

4.Dimensional stability

General molding materials have good dimensional stability, water absorption rate: small, thermal expansion coefficient and aluminum is very similar, when continuous exposure to high temperature, size is almost no change.

5. Corrosion resistance

The chemical resistance or corrosion resistance of molding material mainly depends on the selected resin matrix. The suitable resin and filler can be used to prepare the moulded material which can meet the requirement of resisting special bristle dew

DMC can be made of acid-resistant and alkali-resistant ligulates and acid-resistant epoxy resins. The choice of a resin for SMC is currently limited because the resin must also have a chemical structure that thickens easily. In common fillers, clay and silica have better corrosion resistance and other properties.

6.Contractility

The shrinkage of moulded material is very low after release, the typical maximum shrinkage rate is 0.004, and the shrinkage rate of many moulded materials is close to 0.001, which is mainly due to the small thermal shrinkage of glass fiber and inorganic filler. However, the combination of low-shrinkage, high-strength fibers with the resin systems commonly used for rapid curing and high thermal shrinkage results in greater stress on the resin matrix between the fibers. The collateral effects of this stress cause surface ripples, cracks, warping, and internal voids. These defects can be reduced by the use of organic fiber reinforced materials compatible with resin shrinkage or by the use of short or filamentous glass fibers.

[anitakumarigrewal]

Automotive silicone is a heat-resistant & rubber-like polymer used in manufacturing lubricants, sealants, adhesives, and thermal & electrical insulation. It offers superior properties to increase the efficiency of the vehicle, for instance durability, strength, resistance, and ultraviolet resistance. Its resistance to ultraviolet radiation, abrasion, and chemicals make silicone the best choice in the automotive sector.

According to study, “Global Automotive Silicone Market Size study, by Type (Elastomers, Resins, Gels and Fluids), Application (Interior & Exterior, Engines, Electrical and Others and Regional Forecasts 2018-2025” the key companies operating in the global automotive silicon market are Momentive Performance Materials, Henkel AG & Co., Wacker Chemie AG, KCC Corporation, Evonik Industries AG, Dowdupont Inc., Elkem Silicones, Primasil Silicones Ltd., Shin Etsu Chemical Co. Ltd., Siltech Corp.,  Rogers Corporation, Kaneka Corporation, NuSil Technology LLC, Bostik, ACC Silicones Ltd., Kibaru Manufacturing Sdn Bhd, Milliken & Company, Novagard Solutions, Mccoy Performance Silicones Pvt., Permatex, Brb Internation BV., Wynca Tinyo Silicone Co., Ltd., GW Plastics,

Based on type, automotive silicon market is segmented into resins, fluids, elastomers and gels. Based on forms, market is segmented into compounds, bases, and liquid. In addition, based on application, market is segmented into engines, interior & exterior, electrical, and others (ventilation flaps, paint & plastic polishes, rain & distance sensors, sheathing & protecting, molds & prototypes and break-protection caps). Engines include gaskets, sealing, potting & bonding, radiator seals, filtration and vibration dampening. Interior & exterior include headlamps, airbags, exterior trim, exhaust hangers, membrane, interior trim, hoses, grommets, and shock absorbers. Additionally, electrical segment includes sparkplug boots, power transmission, ignition cables, HT cables, damping & insulation, EV battery seals, and connectors.

The automotive silicon market is driven by growth of novel applications, followed by stringent regulations on vehicular emissions & fuel efficiency, growth in automotive industry, increase in environmental concerns, rise in demand from end-use industries, increase in consumer preferences for high-performance vehicles, new product developments, rise in preference for vertical integration, surge in demand for pedestrian airbags and increase in demand of high efficiency & lightweight materials in automotive industry. However, high production cost and rise in adoption of electric vehicles may impact the market. Moreover, growth in emerging economies and rise in trend of using electric & hybrid vehicle are key opportunities for market.

Based on geography, the Asian-Pacific region dominates the automotive silicon market owing to growth in the automotive industry, rise in improvement in standards of living, and easy availability of raw materials used in the manufacture of automotive silicone in the region. The North-American and European regions are estimated to witness fastest growth rate due to rise in automobile production and growth in use of silicone-based film adhesives in car customization over the forecast period. It is projected that future of the market will be bright caused by rise in disposable income & increase in population, growth in technological advancements such as appropriate use of silicone rubber with thermoplastics to provide improvements in scratch or mar resistance & lowered frictional coefficient during the forecast period. It is angticipated that the market will be reached at US $3. 9 billion, by 2025.

To know more, click on the link below:-

Global Automotive Silicone Market Research Report

Related Reports:-

Global Electronic Potting and Encapsulating Market Study 2015-2025, by Segment (Epoxy, Silicones, Polyurethane), by Market (Consumer Electronics, Automotive, Medical), by Company (Henkel, Dow Corning, Hitachi Chemical)

Global Specialty Sealants Market Study 2015-2025, by Segment (Silicone, Silyl-Modified, Polyurethane), by Market (Automotive, Machinery, Electronics), by Company (Henkel, Arkema, H.B. FULLER)

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[juniperpublishersajop]

A Comparative Study of Multiwalled Carbon Nanotube Based Polystyrene and Toughened Polycarbonate Nanocomposites-Juniper Publishers

Authored by Nisha Bagotia                                                                            

Abstract

The main objective of this article is to describe the effect of different length (aspect ratio) of carbon nanotubes (CNTs) on the electrical conductivity and electromagnetic shielding effectiveness of polystyrene/l-MWCNT and toughened polycarbonate/s-MWCNT composites. Long and short MWCNTs having aspect ratio of ~666 - 1333 and ~157 respectively were used for melt-mixed with polystyrene and toughened polycarbonate in a micro compounder. The uniform dispersion of MWCNT in matrix was confirmed by scanning electron microscopy. The realization shielding effectiveness value of -21dB respectively for PS/l-MWCNT composites: and -27dB for TPC/s-MWCNT composites at 10phr loading of MWCNTs, which show their potential use in making of mechanically strong and light weight EMI shield used for commercial application.

Keywords: Polycarbonate; Polystyrene; Multiwalled carbon nanotube; Electrical properties; EMI shielding effectiveness

Abbrevations: Carbon Nanotubes; EC: Electrical Conductivity; EMI: Electromagnetic Interference; l-MWCNTs: Long Length Multiwalled Carbon Nanotubes; PC: Polycarbonate; PS: Polystyrene; PTT: Poly(trimethylene terephthalate); SE: Shielding Effectiveness; SEM: Scanning Electron Microscope; s-MWCNTs: Small Length multiwalled carbon nanotubes; s-MWCNTs: Small Multiwalled Carbon Nanotubes; SWCNTs: Single Walled Carbon Nanotubes; TEM: Transmission Electron Microscope; TPC: Toughened Polycarbonate; VNA: Vector Network Analyzer

    Introduction

The broad developments of electronic systems and telecommunications has led to a novel type of pollution i.e. electromagnetic interference (EMI). EMI has appeared as a major problem, which not only affecting the proper working of electronic devices but as well as causing harmful effects to the health of human beings [1,2]. Generally, mobile phone, radar, radio transceivers, microwave oven, and various electronic devices are the main causes of EMI [3,4]. The long time exposure of EM waves have also been recognized as strong cancer-causing agent [5]. Therefore, appropriate shield is required to reduce the effect of EM waves. Generally, electrically conductive or magnetic filler are used as a EMI shielding material, because these materials have capability to interact with coupled electric and magnetic fields of the incident EM waves [6,7]. Metals and metal loaded composites have been widely used as EMI shielding materials, but these materials have disadvantages such as high density, corrosion prone, inconvenient processing etc. which limits their practical applicability. As compare to the metals, carbon nanomaterials have appeared as promising alternative conductive filler for production of EMI shield [6,8,9].

Nowadays, the use of carbon nanotubes (CNTs), having ultra-high modulus and strength, good thermal and electrical properties, as filler in polymer nanocomposites prepare material with lower filler loadings having improved electrical and EMI shielding properties [10-15]. As reported in literature, mechanical strength, electrical conductivity or thermal properties and EMI shielding effectiveness of the polymer nanocomposites are affected by different factors such as the aspect ratio, dispersion, processing methods, treatment methods, and loading of CNTs [16]. Li et al. [15] studied the conductivity and EMI SE of epoxy/SWCNT nanocomposites filled with SWCNTs having different aspect ratios. The maximum EMI shielding effectiveness has been reported for epoxy/SWCNT composites having 15wt% SWCNTs-long (SE ∼49dB and 15-20dB obtained at 10MHz and in the 500MHz to 1.5GHz range respectively). In another study, Gupta et al. [17] reported EMI shielding properties (in Ku-band) of poly (trimethylene terephthalate) (PTT)/MWCNT nanocomposites. Electrical percolation of composites has been reported at 1wt% loading of MWCNT and SE of 36-42dB reported at 10wt% loading of MWCNT. Bai et al. [18] described the effect of nanotube aspect ratio on the electrical properties and mechanical strength of the epoxy/MWCNT nanocomposites using three different length of MWCNTs (~1,10,50μm). It has been found that the short length MWCNTs (10μm) report good mechanical properties while long length MWCNTs (50μm) improved electrical properties of nanocomposites. Singh et al. [19] investigated the effect of CNTs having different aspect ratio on the electrical, mechanical and EMI shielding properties of epoxy/CNTs nanocomposites at low loading of CNT (0.5wt%). It has been observed that high aspect ratio CNTs filled nanocomposites show higher electrical (percolation threshold at 0.02wt% loading of l-MWCNT), mechanical (125MPa at 0.3wt% loading of l-MWCNT) and EMI shielding properties (highest SE ~16dB) in comparison to those filled with lower aspect ratio MWCNTs (percolation threshold at 0.11wt%, flexural strength -113MPa at 0.3wt% and maximum shielding of ~11dB). Huang et al. [20] investigated the effect of heat treatment and CNTs with different aspect ratio on the EMI shielding effectiveness of epoxy/SWCNT nanocomposites (up to 15wt% SWCNTs). They reported that long SWCNTs based nanocomposites give high EMI SE (SE ~3 to 28dB) as compared to short annealed SWCNTs (SE ~21-23dB) and unannealed short SWCNTs (SE ~17-18dB). Al-Guo et al. [21] studied the effects of MWCNTs with high aspect ratio (313 and 474) on the electrical, mechanical, and thermal properties of PC/MWCNT nanocomposites. Above mentioned literature showed that most of studies either show EMI shielding effectiveness or mechanical properties of different types of MWCNTs based nanocomposites under higher loading of CNTs; or with both mechanical and EMI properties under lower loading of CNTs. Therefore, a comparative study of the preparation of higher loaded MWCNT nanocomposites and describing the effect of aspect ratio of MWCNTs on the mechanical, electrical and EMI shielding properties, of polymer nanocomposites is necessary.

The main objective of this paper to describe the effect of aspect ratio of MWCNTs on the electrical and EMI shielding properties of MWCNT based polystyrene (PS) and toughened polycarbonate (TPC) composites containing up to 10phr MWCNTs. The nanocomposites have been prepared by melt compounding of PS and TPC with MWCNTs in a twin screw micro-compounder. Two types of MWCNTs viz. long (l-MWCNT) having diameter ~7.5nm & length ~5-10μm (aspect ratio ~666- 1333) and short (s-MWCNTs) having diameter 9.5nm & length ~1.5μm (aspect ratio ~157) were used for the fabrication of nanocomposites. The dispersion of MWCNTs in matrix is investigated by scanning electron microscopy. The EMI shielding of nanocomposites was measured in X-band (frequency range of 8.2-12.4GHz). The morphology, electrical conductivity and EMI shielding effectiveness of composites have been interrelated with distribution density and aspect ratio of CNTs, under both lower and higher loading.

    Materials and Methods

Materials

Polystyrene (SC206) was purchased from Supreme Petrochem limited. Polycarbonate (PC) Lexan 143, procured from Sabic Innovative Plastic. Ethylene methyl acrylate (EMA) copolymer (Elvaloy® AC 1330 from DuPont) having 70% by weight ethylene and 30% by weight methyl acrylate are used in this investigation for toughening of PC [22,23]. Here, 5wt% EMA containing PC (TPC) is used for study. The long length MWCNTs (l-MWCNTs) were produced by CVD method using pongamia oil as a carbon source and ferrocene as catalyst and preparation process is mentioned elsewhere [24]. The diameter of l-MWCNT was in the range of 50-200nm and length is in the range 5-10μm. The short length MWCNTs (s-MWCNTs), grade NC7000 with 90% carbon purity (length ~1.5μm and diameter ~9.5nm) were obtained from Nanocyl, Belgium.

Methods

Fabrication of PS/MWCNT and TPC/MWCNT nanocomposites

The melt blending approach for fabrication of PS/l-MWCNT and TPC/s-MWCNT composites was used in this study. Drying of PS, TPC and MWCNTs was performed before melt blending for 24 h at 70 °C in oven. Melt blending of nanocomposites was carried out by using micro-compounder at 270 °C processing temperature, screw speed 100rpm and mixing time 5min. The continuous strands obtained were pelletized and then followed by drying in the oven for injection molding. The micro-injection molding machine was used for the preparation of test specimen of PS/l-MWCNT and TPC/s-MWCNT nanocomposites. Cylinder temperature, mold temperature and pressure for injection molding were 250 °C, 100 °C and 640bar respectively. The formulation and sample designation of the PS/l-MWCNT and TPC/s-MWCNT composites are given in Table 1. The schematic representation of the nanocomposites fabrication is illustrated in Figure 1.

*where PS-polystyrene, TPC- toughened polycarbonate, l-CNT- long multiwalled carbon nanotube, s-CNT- small multiwalled carbon nanotube, Numerical value- MWCNT content.

Characterization of PS/MWCNT and TPC/MWCNT nanocomposites

PS and TPC nanocomposites were characterized by morphological, electrical, EMI shielding thermal and spectroscopy study. Surface morphology of these nanocomposites were inspected using scanning electron microscope (SEM Zeiss EVO 50 at magnification of 30,000) and transmission electron microscope (TEM Zeiss 200kV). The cryofractured surface of composites were used for SEM imaging. The electrical conductivity (EC) of the nanocomposites at room temperature was measured by two point contact method using a Keithley 224 programmable current source. Electromagnetic interference shielding of composites were recorded on Agilent E8362B Vector Network Analyzer (VNA) in 8.2-12.4GHz frequency range (X-band).

    Results and Discussion

Morphological characterization

SEM images of l-MWCNTs and s-MWCNT based PS and TPU nanocomposites are presented in Figure 2a - 2h respectively. MWCNTs are homogenously dispersed in the matrix, even at 10phr loading as observed from the images. Thus, melt blending using micro-compounder is an effective technique for homogenous dispersion of MWCNTs in matrix. From SEM images, it is also observed that, at any specific MWCNT loading, the distribution density of s-MWCNT in TPC matrix is higher compared to l-MWCNTs in PS matrix. These s-MWCNTs have more surface area in comparison to l-MWCNTs for interfacial interactions with TPC matrix, which are necessary for good mechanical strength and EMI shielding. On other side, l-MWCNTs with higher aspect ratio are expected to provide good stress transfer properties, low percolation threshold and long-range charge transport in PS matrix. Therefore, depending on the aspect ratio of MWCNTs, their distribution and loading inside matrix, significant mechanical, electrical and EMI shielding properties are expected.

Electrical conductivity (EC)

The EC of PS/l-MWCNT and TPC/s-MWCNT nanocomposites with respect to MWCNT loading is presented in Figure 3. The EC of nanocomposites based on l- and s-MWCNT increased with increasing MWCNT loading and shows a drastic increase (~ eight and seven orders of magnitude respectively) below 1phr MWCNT content, which show the formation of 3D conducting networks. Such a low percolation threshold value is due to the uniform dispersion of MWCNTs in matrix. It is reported in literature that percolation threshold is basically dependent on the different factors like the aspect ratio, intrinsic conductivity and dispersion of the conductive nanofiller [25-27]. Therefore, the exact value of threshold of l- and s-MWCNTs, has been projected by plotting the EC as a function of the MWCNT loading and performing data fitting using the scaling law [28-

where σ , σ 0 , ρ , ρ 0 and t represents the EC of the nanocomposites the intrinsic conductivity of the nanofiller, volume fraction of nanofiller, the volume fraction at the percolation threshold and the critical exponent related to the system dimensionality respectively.

The linear regression data fitting (Figure 4 b & 4c) gives ρ0 = 0.83phr & β = 1.54 for PS/l-MWCNT and ρ0 = 1.07 wt.% & β = 1.09 for TPC/s-MWCNT nanocomposites. Considering the good dispersion of both l- and s- MWCNTs, the low percolation threshold for l-MWCNTs can be attributed to its high aspect ratio as compared to s-MWCNTs. It can also be seen that at any loading level, EC of PS/l-MWCNT nanocomposite is higher than respective TPC/s-MWCNT nanocomposite. This can again be attributed to the higher aspect ratio of l-MCWNTs responsible for long range charge transport in nanocomposites. As the EMI shielding is also related to the EC, the observed EC trend of nanocomposites recommend that, at comparative loading, EMI shielding effectiveness of PS/l-MWCNT nanocomposites should be higher than TPC/s-MWCNT nanocomposites.

Electromagnetic interference shielding (EMI SE) of nanocomposites

The EMI SE is the capacity of a material to attenuate incident electromagnetic waves. The EMI shielding is a direct result of the absorption of the wave as it passes through the shield’s thickness, the reflection of the wave from the front face of the shield and multiple reflections of the waves at various interfaces. The presence of charge carriers in material helps in electromagnetic wave reflection via reflection mechanism electromagnetic wave penetrate through the material and get attenuated via the absorption. Absorption loss is more important for the magnetic field of electromagnetic wave than the electric field. Therefore, the electric field of electromagnetic wave is mostly reflected at the interface. The total SE of a material can be expressed in logarithmic power ratio as [32]

Where SEA, SER and SEM are the SE due to absorption, reflection and multiple reflections respectively and Pi is the power of incident wave and Pt is transmitted EM wave.

Figure 4a & 4b shows the total SE of PS/l-MWCNT and TPC/ s-MWCNT nanocomposites respectively. It can be observed that neat matrix (PS and TPC) sample gives negligible attenuation. However, incorporation of MWCNTs causes enhancement in SE for both PS/l-MWCNT and TPC/s-MWCNT nanocomposites obtaining SE value of - 21dB and - 27dB at 10phr loading of MWCNT, respectively as given in Table 2 & 3. This can be ascribed to the formation of conducting networks throughout the insulating PS and TPC matrix. The EMI shielding results also shown that at lower loading (up to 2phr MWCNT loading), SE of PS/l-MWCNT nanocomposites is higher compared to s-MWCNT based nanocomposites, but at higher loadings, s-MWCNT based composites show higher EMI SE. Accordingly, PS/l-MWCNT-1 and TPC/s-MWCNT-2 show approximate similar shielding effectiveness (~-7.8db). These results indicate the effectiveness of l-MWCNTs at lower loading and s-MWCNTs at higher loading.

The total SE have two components i.e. reflection and absorption (SER and SEA). Both SER and SEA increases with MWCNT loading can be observed from Figure 4c & 4d. The SEA increases at much faster rate as compare to SER in both the cases with increase in MWCNT loading. A brief investigation shows that at any given loading l-MWCNTs filled nanocomposites show superior SER value as compare to s-MWCNTs filled nanocomposites. However, absorption trend shown that below 5phr loading of CNT, PS/l-MWCNT nanocomposites show superior SEA values whereas at higher loadings, SEA of TPC/s MWCNT nanocomposites dominate. This can be attributed to the fact that at lower loadings, the interfacial polarization effects are not too dominant, and conductivity shows the important role. Consequently, the TPC/s-MWCNT nanocomposites with a lower conductivity compare to PS/l-MWCNT nanocomposites show lesser attenuation. However, at higher loadings, better input impedance matching in case of TPC/s-MWCNT nanocomposites allows more incident waves to enter inside the shield that can be effectively dominated by absorption mechanism.

    Conclusion

PS/MWCNT and TPC/MWCNT nanocomposites having up to 10phr loading of different aspect ratio MWCNTs (i.e. long and short MWCNTs respectively) have been prepared by melt mixing method. These nanocomposites show improved electrical conductivity and low electrical percolation threshold (i.e. 0.83 and 0.91phr for PS/l-MWCNT and TPC/s-MWCNT composites respectively) which is the sign of uniform dispersion of MWCNTs in the matrix. Further, the good electrical conductivity, processing induced morphology and difference in aspect ratio are responsible for observed maximum attenuation of -21dB and -27dB for PS/l- MWCNT and TPC/s-MWCNT nanocomposites respectively. It was also detected that PS/l-MWCNT nanocomposites show better SE at lower loading (up to 5phr) whereas TPC/s-MWCNT nanocomposites give better SE at higher loading. The aspect ratio of MWCNTs have been interconnected with the observed trends of electrical conductivity and EMI SE. These nanocomposites with good electrical conductivity along with high EMI shielding are considered as potential aspirant for making commercially feasible EMI shields.

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Thermoset Molding Compound Market - Detailed Study Analysis with Forecast by 2025

Global Thermoset Molding Compound Market: Snapshot

In the current past, thermosets have turned out to be superb trade for metallic or metallic components as they provide highly valuable properties, for instance, mechanical quality, high temperature resistance, compound resistance, electrical protection, and different other advantages. Swift urbanization is having a positive impact on many industries wherein lightweight and solidness of the items are fundamental needs in terms of product. Therefore, the demand in the worldwide thermoset molding compound market is anticipated to grow at an exponential rate in the years ahead.

The expanding requirement for security and safety in aerospace and transportation industries is an essential driver of the global thermoset molding compound market, as thermosets offer quality and sturdiness other than being lightweight. The requirement for financially suitable material to supplant heavy metals, expanding requirement for thermally steady and resistance to corrosion, and easy production of complex are some of the various dynamics pushing the growth of the worldwide thermoset molding compound market. On the other hand, fluctuating prices of crude oil and stringent administrative strategies relating to thermoset resin are anticipated to inhibit the development rate in the upcoming years.

Some of the key end users of thermoset molding are aerospace, electrical and electronics, and most of all automotive. The automotive industry is the probable leading end user owing to the use of thermoset molding in the manufacturing of interior and exterior automotive components.

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Global Thermoset Molding Compound Market: Overview

In the recent past, thermosets have become excellent replacement for thermoplastic or metallic components as they offer highly useful properties such as mechanical strength, high temperature resistance, chemical resistance, electrical insulation, and other benefits. Rapid urbanization is reflecting positively on several industries wherein lightweight and durability of the products are essential. As a result, the demand in the global thermoset molding compound market is projected to expand at a robust rate during the forecast period of 2017 to 2025.

This report on global market for thermoset molding compound is an all-inclusive overview of the current condition and based a thorough analysis of all the factors that my influence the demand in the near future, it estimates the state of the market until 2025. This report has been prepared to act as an information guide for targeted audiences such as thermoset molding compound manufacturers, distributors and suppliers, raw material suppliers, end-use industries, and investment research firms. The hallmark of the report is its section on company profiles, wherein a number of prominent players currently active in this market have been overviewed for their market share, operating business segments, business performance, and key strategic moves and recent developments.

The global thermoset molding compound market can be segmented on the basis of resin type into phenolic, epoxy, polyester, and other resins, while on the basis of application, the market can be categorized into aerospace, electrical, automotive, and others. Geographically, the report studies the potential of the market in the regions such as Asia Pacific, North America, Europe, Latin America, and the Middle East and Africa.

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Global Thermoset Molding Compound Market: Trends and Opportunities

The increasing need for safety in transportation and aerospace industry is the primary driver of this market, as thermosets offer strength and durability besides being lightweight. The need for economically viable material to replace heavy metals, increasing need for thermally stable and resistance against corrosion, and ease in production of complex shapes are some of the other factors augmenting the demand the global thermoset molding compound market. Conversely, volatility of crude oil prices and stringent regulatory policies pertaining to thermoset resin are expected to hinder the growth rate during the forecast period.

Among all the resin type segments, polyester resin has maximum demand, owing to its property of remarkable flexibility and increasing application in automotive body panel. Polyester resin thermoset molding offers excellent resistance to a wide range of chemicals at room temperature such as gasoline, aliphatic hydrocarbons, alcohols, and glycols. Among the end-use application, the electrical and electronics segment continues to be most lucrative as thermoset molding compound are used for various types of electronic packages such as transistors, capacitors, memory devices, and central processing units (CPUs).

Global Thermoset Molding Compound Market: Regional Outlook

Countries such as China and India have become manufacturing hubs for several end-use industries in the recent past. This factor makes this Asia Pacific the most important regional market for thermoset molding compound. The growing economy, low cost labor, and escalating demand for low-maintenance products are some of the factors augmenting the demand from Asia Pacific region.

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Companies mentioned in the research report

The report identifies Eastman Chemical Company, Ashland Global Holding Inc., BASF SE, Hexion Inc., Huntsman Corporation, Evonik Industries AG, Kolon Industries Inc., Plastics Engineering Company (Plenco), Kyocera Chemical Corporation, and Rogers Corporation as the key players in global thermoset molding compound market. Product development, collaboration and partnerships, and regional expansion are the key strategies adopted by these players to maintain their stronghold over the market. Some of the other notable players are Hitachi Chemical Company Ltd., Chang Chun Plastics Co. Ltd., Cosmic Plastics Inc., Saudi Basic Industries Corporation (SABIC), and Jiangsu Tianxin Chemical Co., Ltd.

About TMR Research

TMR Research is a premier provider of customized market research and consulting services to business entities keen on succeeding in today’s supercharged economic climate. Armed with an experienced, dedicated, and dynamic team of analysts, we are redefining the way our clients’ conduct business by providing them with authoritative and trusted research studies in tune with the latest methodologies and market trends.

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[agexpharma-123]

SELECTING THE RIGHT EPOXY RESIN FOR YOUR APPLICATION

Epoxy resin has many industrial applications and possesses greater thermal and chemical resistance – as well as strengthened mechanical properties – than other types of resin. When in liquid form, epoxy resin is poured into a mold or painted over a material in layers to create a protective outer coating. After curing, the material hardens into a solid and becomes durable and structurally stable. This combination of features makes epoxy resin extremely useful in a number of applications, from industrial tooling to art projects and automotive manufacturing.

The specific combination of chemical compounds and polymerization processes will impact the resulting core characteristics of an epoxy resin formula.

Glycidol (556-52-5 ) manufacturer USA herein highlights some of the trademark properties of epoxy resin formulas:

·         Heat-resistance

·         Absence of VOCs (volatile organic compounds)

·         Excellent fatigue strength and flexural strength

·         Electrical insulation

·         Chemical stability

·         Low moisture absorption

·         Durable adhesive bond

·         Anti-corrosive

·         Low shrinkage after curing

To begin the application process the epoxy resin is mixed with a co-reactant, also called a hardener, which typically comes in a separate compartment of the same package. The chemical reaction begins as soon as the two chemicals are mixed and depending on the formulation can become solid very quickly or slowly depending on your requirements.  The epoxy resin manufacturer should provide instructions about the ratio of epoxy to hardener that should be used to achieve maximum strength and performance.

What’s the Difference Between Casting and Coating Epoxy Resins?

Casting and coating epoxy resins are unique but related compounds. Choosing between the two will ultimately determine how the finished product will look and function.

Casting resins, also called “deep-pour resin” or “pouring plastic,” are used for clear encasings and suspensions. The user pours the material into a mold and then cures it to retain the same shape. Casting resins are commonly used to create crafts, jewelry, sculptures, and memorabilia. Manufacturers can also produce aggregate, molded plastics, or electrical insulation with casting resin. Engineers design automotive parts, aerospace devices, sports equipment, and hundreds of other products with compounds that are fortified with epoxy resin.

Coating resins, on the other hand, are aptly named: they are used to coat materials, such as metal, concrete, or wood, to make them stronger, chip-resistant, easier to clean, water-resistant, and rust-proof. A thin layer of coating resin can also glue materials together or preserve paper. In the electrical manufacturing sector, coating resins are applied to overmold circuits and transistors, which holds components together and protects against corrosion.

Beyond these differences in application, there are a few other notable distinctions between casting and coating epoxy resin:

·         Viscosity: Casting resins are normally thinner compared to coating resin.

·         Curing Times: Because liquid casting resin is poured into thick layers, they take longer to cure to avoid shrinkage and heat build up..

·         Hardness: Coating resins are usually stiffer and harder than casting resins.

·         Mix Ratio: Most coating resins use a 1:1 ratio, but casting resin formulas can vary, such as 1:1 or 2:1.

Even though there are significant similarities between the two formula types, it’s usually easier to use the formula that’s best suited to your intended application.

If you pour casting resin on a surface instead of using a thin layer of coating resin, for example, the resin will run off the edges and will be very slow to harden.

Alternatively, if you pour coating epoxy into a mold, you’ll need to pour multiple thin layers and wait for the material to cure between applications. Otherwise, the heat generated from the material poured in a large mass will accelerate the chemical reaction and cause yellowing or cracking.

Key Questions to Consider About Epoxy Resin

If you are not sure what type of epoxy resin to opt for, consider the following:

·         How thick is the layer of epoxy you need for this project?

·         How long can you wait for the epoxy to cure?

·         Do you need a mold or frame to prevent dripping and hold the epoxy while it cures?

·         How hard does this material need to be to withstand the expected wear?

·         Do you want to suspend materials in the epoxy resin?

·         Do you need the epoxy to have any special properties?

·         Will this material be exposed to extreme temperatures, water, chemicals, UV rays, or other potentially damaging elements?

Epoxy resin systems can be tailor-made to suit unique project needs. Manufacturers use a variety of co-reactants, including, for example, polyfunctional amines, phenols, and alcohols all of which produce slightly different results. The type of base epoxy and additives in the formula can also change the resin’s viscosity and intrinsic properties.

Epoxy Resin Viscosity

Viscosity describes a liquid’s degree of resistance to flow. Within the context of epoxy resin formulas, the viscosity determines if the material will drip or spread evenly and if it should be poured, dipped, or painted on the material. Viscosity also affects how much of the epoxy perforates the substrate and which physical properties are produced.

For example, at Glycidol (556-52-5 ) manufacturer USA, we manufacture three lines of epoxy resin with low, medium, or high viscosities:

1.      Low Viscosity

Low-viscosity epoxy resin is thin and works well for deep-level penetration and filling small cavities. The consistency helps prevent air bubbles, which facilitates bonding between the epoxy and substrate. You can use low-viscosity epoxy resin for encapsulation, sealing, and potting.

2.      Medium Viscosity

Medium-viscosity epoxy is thick. It’s less permeable than low-viscosity formulas and offers greater mechanical strength. The material can withstand moderately high temperatures and is often used for filament winding, vacuum bagging, and tooling.

3.      High Viscosity Epoxy

High-viscosity epoxy has a paste-like consistency and is the most resilient option. It offers superior adhesion and shock- and heat-resistance. Technicians use this formula for projects that demand exceptional durability and strength.

Epoxy Resin Solutions At Agex Pharma

Agex Pharma has been a leading provider of quality epoxy resin solutions for over four decades. are thoroughly tested Our formulations for quality assurance and have demonstrated practical applications in a broad range of industries. To learn more about epoxy resins or about our products and capabilities, reach out to us or request a quote today.

[myjacksonposts-blog]

Global Underfill Market Overview – Key Futuristic Trends and Opportunities 2022

Underfills are composite materials, which are formulations of inorganic fillers and organic polymers which are utilized in the packaging of semiconductor unit to attain superior thermo-mechanical operation. Polymer adhesive materials are practiced as underfill material to spread mechanical stresses at fuse joint that happens due to variation in the coefficients of thermal expansion at the intersect.

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A variety of amine and phenolic based epoxy resin materials are employed as underfill material in the packaging industry for the semiconductors. Reworkability and high thermal stability are preferred properties for underfill material used in the packaging of semiconductors. They are also used in several packaging techniques like ball grid array (BGA), chip scale packaging (CSP) and flip chip, etc. Flip chip is a most important application for underfill materials. The global market for the flip chip is presenting substantial demand and is anticipated to witness rapid growth in coming years. The constantly growing demand for smaller, lighter, efficient however cost efficient devices has pulled significant attention towards the underfill material. No flow underfills (NUF), molded underfill (MUF), and capillary underfill (CUF) these are the application techniques used for underfill materials.

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The global underfill market is projected to experience substantial growth over the forecast period of 2017 to 2022 with decent compound annual growth rate. Lately, the microelectronic industry is influenced by more composite devices, owing to trending system in package (SIP) and system on chip (SOC). The trends in portable application market are fueling the growth of the global underfill market. The rising demand for high performing, small in size, low-cost devices is one of the key factors driving global underfill market growth. The escalating usage of underfill material in wafer level packaging and flip chip packaging owing rising demand in tablets and smart phones is a major driving factor for global underfill market. As underfill market is technology driven, it is expected to be obligated by the innovative progress in the electronic industry. The end-application market is presenting new constraint of compatibility with lead-free fuse paste material owing new trend of sustainability in the global market. Several top manufacturers in the global underfill market are proposing the underfill products which are well-suited with lead-free fuse paste.

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The key market players in the global underfill market are Jiangmen U-bond Hardware Co., Ltd, Henkel AG & Company, KGaA, Shin-Etsu Chemical Co., Ltd., Yantai Hightite Chemicals Co, Ltd, Won Chemical Co., Ltd., Panacol-Elosol GmbH, Sunstar Group, AIM Solder, Namics Corporation, Hitachi Chemical co., ltd., Dover Corporation, Fuji Chemical Industry Co., Ltd., Darbond Technology Co., Ltd., Zymet, Inc., Master Bond, Inc. and Bondline ltd. According to product types, the market industry is split into; Semiconductor Underfills and Board Level Underfills. By application, the global market is classified as; Consumer Electronics, Defense & Aerospace Electronics, Automotive Electronics and Other. Geographically, the global underfill market is segmented into regions which are; Southeast Asia, Asia-Pacific, North America, Europe and rest of the world.

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[led-taoyuan]

Research on Application of Modified Silicone Resin in LED Application

UV LEDs appeared in the 20th century, 60 years, the early 90s, due to its extension, the chip technology breakthrough, there has been full color, device input power, luminous brightness greatly improved, at present, LED industry has entered a high power Brightness of the high-speed development period. It is reported that China's power and high-power LED has reached the international advanced level of industrialization. Downstream device packaging to achieve high-volume production, has become the world's major LED packaging base. In the UV curing lamp industry, the research and production of epitaxial wafers and chips is progressing rapidly, but relatively neglected the study of packaging materials. For a long time, LED packaging process is not much change, packaging materials have been no revolutionary breakthrough. China's LED packaging materials and processes in the research and production started late, less variety, technical level and production scale and international level there is a big gap, and now only low-power LED with epoxy resin packaging materials. At present, high-end UV flashlight devices and high-power LED packaging silicone materials are imported, expensive, greatly restricting the development of China's LED industry. At present, the domestic and organic silicon materials related research units and manufacturing enterprises lack of understanding of the LED packaging industry, LED packaging silicone materials related to scientific research work carried out less, there are some domestic silicone packaging materials defects: refraction Low temperature, poor heat resistance, resistance to ultraviolet radiation is not strong, product adhesion is not enough, light transmission rate is not high These defects directly affect the LED device luminous efficiency and life. Based on the performance requirements of LED devices for packaging materials, this paper reviews the current research situation of high power LED packaging materials in recent years, and discusses the existing problems and the research direction of materials in organic silicon materials encapsulated in high power LED. 1, LED packaging materials with the performance requirements LED packaging materials on the one hand to meet the requirements of the packaging process, on the other hand to meet the requirements of LED work. At present, the traditional epoxy resin packaging materials in the resistance to ultraviolet light and thermal aging performance has been unable to meet the requirements of high-power LED packaging, many experts even believe that packaging materials and technology behind the LED industry has developed a bottleneck. Therefore, we need to understand the performance requirements of LED packaging materials. 1.1, the packaging process for the material performance requirements In order to meet the needs of the actual assembly of the LED process, the packaging material to have the appropriate viscosity, adhesion and heat resistance, including: a, the physical properties before curing, curing the general characteristics. The physical properties before curing are related to operability, where viscosity and curing properties are particularly important. Due to the high expansion rate of the polymer material, the material is cooled after heat curing, resulting in a significant shrinkage, resulting in stress at the interface with the surrounding material, which in turn causes peeling and cracks in the material. B, the surface adhesion; sealing the surface of the sealing material with a sticky, will lead to sealing materials between the mutual bonding, this can not be stripped from the selection machine on the situation will lead to reduced operability. In addition, in the course of use, will produce sticky dust, reduce the brightness of the situation. From the point of view of peeling resistance and crack resistance, we need a softer encapsulation material, but in general, the higher the viscosity of the soft material, so we need a material that has a good balance between the two , C, lead-free countercurrent. In recent years, lead-free solder surface treatment requirements are getting higher and higher, which also shows that the heat resistance of packaging materials is getting higher and higher. In the case of high temperature countercurrent, there will be due to color, severe thermal changes caused by peeling, cracks, wire breakage. 1.2, light transmittance LED packaging materials on the absorption of visible light will lead to lower light absorption, packaging materials to have a low light absorption, high transparency. Silicone resin and epoxy resin, compared with a higher degree of transparency. The use of silicone resin prepared by the packaging material in the ultraviolet region has greater than 95% transmittance, increasing the high power LED device light transmittance and luminous intensity. 1.3, refractive index LED chip and the refractive index between the packaging material will have a great impact on the rate of light, so improve the refractive index of the material, it is as close as possible to the LED chip refractive index, is conducive to the light through, in general , The refractive index of the LED chip (n = 2.2-2.4) is much higher than that of the silicone encapsulation material (n = 1.41). When the chip emits light through the encapsulation material, the total reflection effect occurs at its interface Most of the light reflected back into the chip, can not be effectively derived, brightness performance is directly damaged. To solve this problem, it is necessary to increase the refractive index of the encapsulated material to reduce the total reflection loss. Some studies have pointed out that with the increase in the refractive index of the package material, LED brightness will be increased, the red LED devices, when the package material refractive index of 1.7, the external light efficiency can be increased by 44%. Therefore, the development of high refractive index transparent materials to reduce the chip and packaging materials, the difference between the refractive index, the importance can be seen in general. 1.4, heat aging and light resistance In high-power high-brightness LED, the packaging material will not only be very strong light, but also by the impact of heat, so the packaging material needs to have both light resistance and heat resistance. Even if exposed to high temperatures for extended periods of time, the sealing material is required to ensure that it does not change color and that the physical properties are stable. 2, LED packaging materials research status 2.1, modified silicone resin / epoxy resin packaging materials With the LED power and brightness is growing, epoxy resin in the reliability, resistance to UV and anti-aging and so on more and more can not meet the requirements of the package. However, epoxy resin has excellent electrical properties, bonding properties, especially inexpensive, low cost. So in the past period of time, the researchers did not give up the use of epoxy resin, but to take the use of silicone to modify the way the epoxy resin to develop the advantages of both the packaging materials. Taking into account the LED chip heat is the main cause of the aging of the packaging material, and some packaging manufacturers in the vicinity of the chip using silicone material, and the outer lens material selected epoxy resin, PC, PMMA and so on. However, the actual application shows that epoxy resin, PC, PMMA as a lens material, in addition to insufficient anti-aging performance, but also with the inner packaging material interface is not compatible with the problem, so that LED devices after high and low temperature cycle test, Its luminous efficiency is drastically reduced. Studies have shown that the use of silicone modified epoxy resin as a packaging material, can improve the toughness of packaging materials and resistance to high and low temperature, reducing its shrinkage and thermal expansion coefficient. It has been reported that a mixture of a silicone and an epoxy resin is used as a packaging material, which is a base polymer containing a mixture of a polyorganosiloxane containing a vinyl Si-OH group and a specific structure of an epoxy resin, Agent, catalyst, thinner, dubbed package for LED packaging, heat-resistant experiment does not change color, -40 ~ 120 ℃ hot and cold impact without peeling and cracking phenomenon occurs, LED luminous efficiency is high. There is also a mixture of epoxy-modified polyorganosiloxane and epoxy compounds reported by the epoxy modified polyorganosiloxane and fat or alicyclic epoxy compounds mixed with acid anhydride as a curing agent dubbed The encapsulated material has the characteristics of anti-UV light aging, anti-hot and cold impact, high transparency, high hardness and good adhesion with the substrate, and is suitable for blue and white LED package with wavelength below 500nm. Specific structure of the packaging resin and polyorganosiloxane dyed LED package material can improve the heat resistance of epoxy resin, resistance to UV light aging, but also improve the adhesion of silicone materials, surface adhesion, Is worthy of attention to a development path. Japan Shin-Etsu Chemical Co., Ltd. will be silicon-containing vinyl silicone resin, hydrogen-containing silicone oil and a small amount of silicone elastomer added to the epoxy resin, the use of platinum-based catalyst catalytic hydrogen hydration reaction, alkoxy or acyl or silicon hydroxy aluminum For the epoxy curing agent, after injection molding to obtain a refractive index of up to 1.41-1.53, Shore hardness of 40-70 degrees, no vacuum, low modulus, low shrinkage of the LED packaging material by -40 ℃ / 120 ℃ hot and cold Impact 1000 times without cracking. The United States GE company using phenyl trichlorosilane, methyl trichlorosilane, dimethyldichlorosilane co-hydrolysis polycondensation, obtained hydroxy silicone resin; and then with the silicone modified epoxy resin blends, with methyl six Hydrogen-phthalic anhydride as curing agent, stannous octoate as curing catalyst, heat vulcanization molding, to obtain the refractive index of 1.53 packaging materials, modified materials in the artificial aging machine by the wavelength of 380nm light radiation 500h or 150 ℃ Under the wavelength of 400 ~ 450nm ultraviolet light irradiation 500h, the light transmittance is still up to 80% or more (sample thickness 5mm). LED package material heat resistance and thermal conductivity, often add less than 400mm particle size of inorganic fillers, such as quartz powder, monocrystalline silicon, aluminum powder, zinc powder, glass fiber and so on. H.Ito et al. Added silica and spherical glass powder having a particle size of 5 to 40 nm to a silicone-modified epoxy resin, and the light transmittance of the material after vulcanization was 95.7% (25 ℃), the refractive index of 1.53 ~ 1.56 (sample thickness 1mm, wavelength 589.3nm), linear expansion coefficient of about 200 times -25 ℃ after the cold and heat damage rate of only 4% to 12.5% 2.2, modified silicone packaging materials Although the silicone resin can improve the performance of epoxy resin encapsulation, but the organic structure of silicone modified epoxy resin containing epoxy, as its LED encapsulation material is still poor resistance to radiation, easy to yellowing and other shortcomings, It is difficult to meet the technical requirements of power LED package. The optical clarity and thermal stability of silicone materials play an important role in high brightness LEDs and high reliability applications. Silicone materials are rapidly replacing epoxy and other materials. For a wide range of LED applications to provide a wide range of potting materials, lens materials, adhesives, sealants and protective coating products. Currently on the market of silicone sealing materials are divided into two types: high refractive index and ordinary refractive index of silicone materials, including gels, silicone rubber and modified silicone. Ordinary refractive index (1.41 or so) type of silicon is mainly based on dimethyl siloxane, and high refractive index (1.53 or so) is a phenyl methoxylate-based. High refractive index of silicone materials and silicone materials, has become a number of foreign production of silicone products, large companies research hot spots and product sales hot spots. Reported high refractive index of the silicone material system, which can be used with LED packaging of silicone materials, the highest refractive index has reached 1.57. Currently on the market several mainstream silicone LED packaging materials suppliers are Japan Shin-Etsu, the United States Dow Corning, Momentive and Nusil Technolong and so on. They continue to introduce the refractive index of more than 1.50 silicone rubber and silicone products. One of the United States Dow Corning produced two-component resin SR2710, hard nature, for the LED components of the transparent resin. Has a high refractive index, excellent luminous transparency. Dow Corning products for LED packaging materials are OE-6336, JCR6175 and other transparent packaging materials. "Addition curing silincone resin composition", filed by Shin-Et-Su Chemical Company, Japan, has been prepared with three different functional groups of silicone to obtain silicone resins with high transparency, good tensile strength, elasticity and hardness. Some studies have reported: K1 Miyoshi and T.Goto and other chlorosilane co-hydrolysis process to obtain vinyl silicone resin, and then with the phenyl siloxane chain containing hydrogen-containing silicone oil catalyst in the platinum catalyst vulcanization molding , Access to LED packaging materials. The refractive index of the material can reach 1.51, Shore D hardness of 75 ~ 85 degrees, bending strength of 95 ~ 135MPa, tensile strength of 5.4 MPa, 500h after ultraviolet radiation transmission from 95% to 92%. And can improve the shrinkage of the silicone material in order to improve the mass fraction of the phenyl group in the encapsulating material, improve its resistance to cold and heat cycle impact performance, excellent machine performance and adhesive properties. T.Shiobara et al. Were molded by injection molding at a temperature of 165 ° C with a molded liquid silicone rubber to obtain a packaging material having a shrinkage ratio of 3.37%, a shrinkage ratio of only 0.04 and a refractive index of 1.50 to 1.60 (wavelength of 400 nm). E.Tabei et al. Also obtained LED encapsulation materials with Shore D hardness up to 50 degrees, elastic modulus 350 to 1500 MPa, light transmittance 88% to 92% (wavelength 400 nm sample thickness 4 mm). Addition of an appropriate amount of inorganic filler to the addition of liquid silicone rubber can improve the heat resistance and radiation resistance of the material. The LED encapsulation material is vulcanized at a certain temperature for 2 ~ 5h and the production cycle is long. LDBoardman et al., With D4 and 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, were subjected to ring-opening polymerization under concentrated sulfuric acid to obtain a vinyl silicone oil followed by addition of Hydrogen silicone oil, platinum catalyst and sensitizer, mixed evenly with visible light or ultraviolet light irradiation 15 ~ 20min can be cured completely, to obtain better performance LED packaging materials. Silicone LED packaging materials in the preparation process generally need to use platinum catalyst, and commonly used platinum catalyst after a period of time will turn yellow, continue to use will affect the LED packaging material light transmission rate. In order to overcome this drawback, K. Tomoko et al. Developed a non-discolored platinum catalyst using organosiloxane as a ligand, i.e., 1,3-dimethyl-1,3-divinylsiloxane The use of this catalyst to catalyze the vulcanization of the addition silicone rubber can be obtained with a refractive index higher than 1.50, light transmittance of 92% to 100% of the LED packaging material. From the current market point of view, silicone packaging materials in the amount of phenyl silicone resin encapsulated material significantly increased the amount of silicone resin has a good shape of solidification. After curing, transparency, refractive index, hardness, high strength characteristics. Silicone resin molecular structure in the introduction of 2-functional silicone segments with moderate elasticity, easy to crack, improved impact resistance, can replace the transparent epoxy resin used as blue, white LED packaging materials and alternative acrylic , Polycarbonate for lens material of LED. The number of linkages of the bifunctional siloxane segments in the silicone resin molecules is from 20 to 100; the amount of the 3-functional siloxane linkages and the amount of the dibasic siloxane linkages Ratio of 70 ~ 28: 70 ~ 20: 10 ~ 2; can be phenyl trichlorosilane, methyl vinyl dichlorosilane and 2-functional silicone oligomers, the co-hydrolysis of the reaction is worth In addition, there are UV-curable silicone encapsulant, which has the advantages of transparency, heat resistance, no discoloration, no cracking, etc., can replace epoxy resin for white power LED package. The main components of the encapsulant are prepared from the photoinitiator of the acrylate-based polyorganosiloxane, and may have MA chain, M link and Q link or link by MA-D, D chain and T chain , These polyorganosiloxanes may be used singly or in combination. The photoinitiator can be used as an optical planning initiator for any of the acrylic functional groups.