#wirebond

[kay2xenox]

Kay2 Wirebond - A bond That Sets New Standards of Excellence

The use of steel wire bonding ensures that the TMT bars are securely held together, providing strength and stability to the reinforced concrete structure. This helps in maintaining the structural integrity and load-bearing capacity of the construction.

[roseofrevolt]

Severed

They never taught you how to crash properly. The exogene that housed your consciousness had been a few klicks above the stratosphere on a test run, when a couple of Chromestrippers decided to take notice of your wares. A shiny prize swinging above the orbit away from the right eyes, it was almost inevitable when their Hungry Crow units had descended upon you like a storm, clawing for any strand of tech they could pry apart from the threads of synth muscle that kept everything together. It hurt. The wirebond that kept your head in the organic mass was too deep not to register their jagged fingers running down your back, frantic and wanting, digging into where they knew the most prizes lay thrumming against the surface. Your frantic movements in response did little to dissuade them. You had too much system haze to sit and think properly, the blending of sensations that made your heart bang and crash in your chest. With a swing of an arm thousands of miles away from any danger, your fist connected against the thin plastic body of one unfortunate raider. The mere difference in weight was enough to have its wings crumble, and with a squawk of radio chatter it fell to the infinite Earth below. It didn’t take long for the remaining one to know when to cut their losses, the dozen or so ocular units taking in its handiwork on your expensive machine-body. With a burst of radio static, the harsh cackle of vindication, it raised its claws to tear down into the thin membrane between the arm-wings of your exogene.The deep gash was enough to ruin what stability you still had so far up in the air. A more experienced pilot would have found a means of escaping the sudden roar of system alarms and rushing air. You had every opportunity to pull the plug and send yourself back down into the flesh that awaited you, but you couldn’t quite understand the flash code that buzzed into your skull. As the ground grew closer and closer you reached out in desperation to any source of help that your system could latch onto. A flare of communication shot out into the unknown. “Hello, you reached the NovaGen Innovations support line. Please state the issue we can help you with.” “I’m falling!” “Thank you. We will create a ticket with the information provided. A NovaGen technician will reach out to you. You are currently 10th in line. We appreciate your patronage and happy flying!” You remember reaching 6th before the system failure washed over everything that you could sense.

[kamdhenulimited]

Binding Wire - Choose quality, Choose Kamdhenu wirebond.

Manufactured using state-of-the-art technology and premium raw materials, our binding wire guarantees exceptional performance and longevity and is approved by ISO 9001:2015. With its strong tensile strength and resistance to corrosion, you can rely on it for all your applications.

[cynthia-hitechpcba]

Aluminum Nitride Ceramic PCB

Aluminum Nitride Ceramic PCB have good high-frequency and electrical performance, and have high thermal conductivity, excellent chemical and thermal stability. Excellent corrosion resistance, it widely used in semiconductor and microelectronic circuit packaging pcb, High-brightness Led chip carrier board, automotive electronics and lighting components, high-power electronic component heat dissipation materials, etc.

Technical Parameters

Aluminium Nitride (ALN) material

0.5mm Ceramic thickness

1 Oz Coppper thickness

ENEPIG suitable for gold wirebonding

Solder mask: White, Legend: Black

Laser Scribed

Application: Semi-Conductor

If you want to know ceramic PCBs, please feel freely to contact Cynthia at sales11@hitechpcb.com

[ryn2sashn]

Robert Miller CEO of Future Electronics, Headquartered in Montreal

The Nexperia NextPowerS3 family spans across the highly-reliable LFPAK package range. These packages are completely free of wirebonds, meaning they deliver a competitive RDS(on) (industry best in 25 V) as well as low Rth, low inductance and excellent board level reliability.

[ainsleyview]

Wire Bond Designs

Wedge Bonding Anvil Blocks are used as a platform to support the leadframe pad and fingers when the finger clamp applies a downward force for the wedge bonding process. Read more: https://oricus-semicon.com/products/wire-bond/

[dieattach]

Best semiconductor manufacturing industry - Oricussemicon.

Oricussemicon is a leading manufacturer of semiconductors. From Oricussemicon, we manufacture a wide range of standard customised requirements.

Wire bonding is the process of using tiny wires composed of materials like gold and aluminium to create electrical links between semiconductors (or other integrated circuits) and silicon chips. Gold ball bonding and aluminium wedge bonding are the two most frequent methods. During semiconductor device manufacture, wire bonding is a process for making electrical connections between a silicon chip and the external leads of a semiconductor device using very fine bonding wire. Copper (Cu), Gold (Au), and Aluminum (Al) are used to make these wires (Al).

ASM AB339 Eagle, ASM Eagle 60 Wire Bonder, ASM Eagle 589 Wire Bonder, MDB-2575 Manual Wedge Wire Bonder, and different valuable Wire Bonding instruments such as Capillary and Wire Clamps are employed. There are various Wire Bond methods which are as follows: 1) Thermocompression Bonding 2) Ultrasonic Bonding 3) Thermosonic Bonding To know more: Visit here

[latestanalysis]

Global Multi-chip Module Market 2021 -2027 Size , Share, Growth rate , Growth Demand , Application Report

Global Multi-chip Module Market

Multi-chip module is an integral part of modern electronic systems which contains up to five chips. These chips are connected via wirebonds to a multilayer circuit board & a molded encapsulant is used for its protection. Multi-chip module provide high-integration density, better performance, and low power consumption.

Market Drivers

The increase in demand for semiconductor products having low electromagnetic interference and high capacitance is expected to boost the global multi-chip module market growth. Furthermore, the growth of IoT create requirements for memory, which further positively influence the multi-chip module market growth during this forecast timeline. Also, the growth of connected cars is expected to witness massive demand for a multi-chip module during this forecast period. Moreover, advent of power efficient and smarter connecting devices such as smart TV and different home automation products is also anticipated to fuel the market growth. In addition, the growing need of consumer electronics manufacturers to minimize manufacturing cost of the product is also propel the demand of multi-chip module in near future.

Get Sample Copy of this Report @ https://qualiketresearch.com/request-sample/Multi-chip-Module-Market/request-sample

Market Restraints

High initial cost is the major challenging factor which expected to hinder the global multi-chip module market growth over the forecast period. Also, cyclical nature of semiconductor industry may hamper the market growth.

Market Segmentation

The Global Multi-chip Module Market is segmented into type such as NAND-Based MCP, NOR-Based MCP, eMCP, and uMCP. Further, market is segmented into end user such as Automotive, Consumer Electronics, Healthcare, Aerospace & Defense, and Others.

Also, the Global Multi-chip Module Market is segmented into five regions such as North America, Latin America, Europe, Asia Pacific, and Middle East & Africa.

Market Key Players

Various key players are discussed in this report such as Texas Instruments, Infineon Technologies, STMicroelectronics, Intel, SK Hynix Inc.,Samsung Electronics, Micron Technology, Macronix International Co., Ltd., Cypress Semiconductor Corporation, and Tektronix, Inc.etc.

Market Taxonomy

By Type

· NAND-Based MCP NOR-Based MCP eMCP uMCP

By End User

· Automotive Consumer

· Electronics Healthcare

· Aerospace & Defense

· Others

By Region

· North America

· Latin America

· Europe Asia Pacific

· Middle East & Africa

Browse Full Research Report @ https://qualiketresearch.com/reports-details/Multi-chip-Module-Market

About Us

QualiKet Research is a leading Market Research and Competitive Intelligence partner helping leaders across the world to develop robust strategy and stay ahead for evolution by providing actionable insights about ever changing market scenario, competition and customers. QualiKet Research is dedicated to enhancing the ability of faster decision making by providing timely and scalable intelligence. We use different intelligence tools to come up with evidence that showcases the threats and opportunities which helps our clients outperform their competition.

[kamdhenulimited]

Kamdhenu Wirebond has good finish, provides safety and is easy to wind..

kamdhenu Wirebond keeps tightness with saria without getting lose

https://www.kamdhenulimited.com/wire-bond.php

[globalmarketreports]

Multi-chip Module Market Size, Future Scope and Forecast Report to 2027

Multi-chip module is an integral part of modern electronic systems which contains up to five chips. These chips are connected via wirebonds to a multilayer circuit board & a molded encapsulant is used for its protection. Multi-chip module provide high-integration density, better performance, and low power consumption.

Request Sample Copy of this Report @ https://qualiketresearch.com/request-sample/Multi-chip-Module-Market/request-sample

Market Drivers

The increase in demand for semiconductor products having low electromagnetic interference and high capacitance is expected to boost the global multi-chip module market growth. Furthermore, the growth of IoT create requirements for memory, which further positively influence the multi-chip module market growth during this forecast timeline. Also, the growth of connected cars is expected to witness massive demand for a multi-chip module during this forecast period. Moreover, advent of power efficient and smarter connecting devices such as smart TV and different home automation products is also anticipated to fuel the market growth. In addition, the growing need of consumer electronics manufacturers to minimize manufacturing cost of the product is also propel the demand of multi-chip module in near future.

Market Restraints

High initial cost is the major challenging factor which expected to hinder the global multi-chip module market growth over the forecast period. Also, cyclical nature of semiconductor industry may hamper the market growth.

Market Key Players

Various key players are discussed in this report such as Texas Instruments, Infineon Technologies, STMicroelectronics, Intel, SK Hynix Inc., Samsung Electronics, Micron Technology, Macronix International Co., Ltd., Cypress Semiconductor Corporation,  and Tektronix, Inc.etc.

Market Taxonomy

By Type

NAND-Based MCP

NOR-Based MCP

eMCP

uMCP

By End User

Automotive

Consumer Electronics

Healthcare

Aerospace & Defense

Others

By Region

North America

Latin America

Europe

Asia Pacific

Middle East & Africa

Get discount on this report @ https://qualiketresearch.com/request-sample/Multi-chip-Module-Market/ask-for-discount

About Us:-

QualiKet Research is a leading Market Research and Competitive Intelligence partner helping leaders across the world to develop robust strategy and stay ahead for evolution by providing actionable insights about ever changing market scenario, competition and customers. QualiKet Research is dedicated to enhancing the ability of faster decision making by providing timely and scalable intelligence. We use different intelligence tools to come up with evidence that showcases the threats and opportunities which helps our clients outperform their competition.

Contact Person:-

Vishal Thakur

Research Support Specialist

QualiKet Research

6060 N Central Expy #500, TX 75204, U.S.A

Email: sales@qualiketresearch.com

Website: https://qualiketresearch.com

[ainsleyview]

Rubber Tip Designs

Rubber Tips

Rubber Tips are a line of replaceable Pick-Up Tools that can take care of a wide scope of various applications. One of the principles helps its capacity to assimilate the effect that the Pick and Place cycle might have on the pass-on or gadget.

Oricus' Rubber tips come in NBR (Nitrile Rubber), HPR (High-Performance Rubber), UPR (Ultra Performance Rubber), and CR (Composite Rubber) materials. All our elastic materials are created and fabricated in-house extraordinarily for our Pick Up Tools.

It tends to be made in Round, Square, Rectangular, and Custom planned external profiles. Different tip plans like Flat, Vacuum Relief, Groove, Multi-Hole, and Side Contact can be made to suit your specific kick the bucket or gadget.

Flat Tips

Rubber Flat Tip plans are flexible elastic tips that are reasonable for a wide scope of uses. Level Tip plans to highlight a solitary vacuum opening and a level contact surface controlled to tough evenness resistances.

Oricus makes a broad scope of standard Rubber Flat-Tip sizes with focal and offsets vacuum opening arrangements in different sizes. Redone Flat Tip plans with miniature slight dividers (≥0.05mm divider thickness) can likewise be created for exceptional applications.

Vacuum Relief Tips

Elastic Vacuum Relief Tips are intended to keep away from profiles or projections on your bites the dust and gadgets, with a serious level of customization accessible. The plan of our Vacuum Relief Tips highlights a stashed opening on the outer layer of the tip, which makes a repository of air to improve the vacuum pull force during application.

Oricus fabricates a wide scope of standard Rubber Vacuum Relief Tip sizes for normal applications and bite the dust sizes. Tweaked tip sizes highlighting meager dividers plans (≥0.15mm divider thickness) with focal, offset, and round alleviation setups can be planned and fabricated for your particular application.

Groove Tips

Rubber Groove Tips are explicitly intended for a dainty pass on application with bite the dust thickness ≤0.1mm. Tips utilized for Thin pass-on applications require stable vacuum force while boosting tip to bite the dust or gadget surface contact region.

The plan of our Groove Tips includes a focal vacuum opening, associated with numerous vacuum directing notches on the outer layer of the tip, which upgrades even and dispersed attractions force inclusion to the explicit region of the pass-on or gadget. Our restrictive depression plans help to hold the slim passes on delicately and safely during the application cycle.

Matrix Tips

Matrix Tip is the prevalent answer for dainty bite the dust applications with kick the bucket thickness ≤0.1mm. Tips utilized for Thin kick the bucket applications require stable vacuum force while augmenting tip to bite the dust surface contact region.

The plan of our Matrix Tips includes different vacuum openings bored on the outer layer of the tip, in a dispersed grid format. This plan enormously upgrades surface contact and stable pull force inclusion all through the outer layer of the pass on. Our Matrix Tip plans, utilized in mix with our Tri-Lock holders, offer Best-in-Class execution for slim pass on applications.

Side Contact Tips

Rubber Side Contact Tips are appropriate for use in applications where tip contact to the outer layer of the pass on ought to be restricted or kept away from. For these applications, we don't suggest the utilization of surface contact tip plans to defend the basic highlights on the pass on surface.

The plan of our Side Contact Tips highlights tightened contact points to contact the chose edges of the pass on. Our creative tip calculations guarantee the security and execution for such basic applications during the Pick and Place process.

[tastydregs]

Intel Has Successfully Fabricated a 17-Qubit Superconducting Chip

In Brief

Intel has announced that its 17-qubit superconducting chip has been submitted to partner QuTech for testing. The hardware could be a stepping stone to a fully fledged quantum computer.

Chip Off the Old Block

Intel has announced that it has successfully fabricated a 17-qubit superconducting test chip for quantum computing. The superconducting chip has been submitted to the company’s quantum research partner QuTech for further testing.

Quantum computing has the potential to be a truly revolutionary technology, providing a currently unprecedented amount of computational power. However, the qubits that underlie the hardware are notoriously fragile — Intel’s implementation requires an operating environment that maintains a temperature of 20 millikelvin to function.

VIDEO

The new chip boasts an improved design that provides better reliability, enhanced thermal performance, and a reduction of the amount of radio frequency interference between qubits. It also introduces a scalable interconnect scheme that makes it possible to exchange between 10 and 100 times more signals in and out of the chip, compared to a wirebonded alternative.

Crucially, Intel has employed processes, materials, and designs that will allow Intel to scale up its packagine for quantum integrated circuits, which are much larger than a standard silicon chip. This could prove to be an important step in moving from the production of components to a fully fledged quantum computer.

Next Generation of Superconducting

“Our quantum research has progressed to the point where our partner QuTech is simulating quantum algorithm workloads, and Intel is fabricating new qubit test chips on a regular basis in our leading-edge manufacturing facilities,” commented Dr. Michael Mayberry, the corporate vice president and managing director of Intel Labs, in a press release.Click to View Full Infographic

While the field of quantum computing has made significant advances in recent years, there is still plenty of work to be done before a large-scale universal quantum computer is viable. Intel is keeping its options open, continuing research into spin qubits in silicon even while focusing on superconducting qubits.

Theoretical research has propelled quantum computing forward by leaps and bounds over the past decade, but Intel’s investigations into the practical side of fabrication are essential for the next stage of the process.

[dorcasrempel]

Meet the first undergraduate users of MIT.nano

Last semester, MIT undergraduates completed the first-ever term of coursework to be done utilizing the facilities of MIT.nano, the Institute’s new 216,000 square-foot center for nanoscale research.

The course — 3.155/6.152 (Micro/Nano Processing Technology), offered jointly by the departments of Electrical Engineering and Computer Science (EECS) and Materials Science and Engineering (DMSE) — enrolled 25 undergraduate and nine graduate students from seven different departments in fall 2019. The students learned nanofabrication by using research space and equipment throughout MIT.nano to make solar cells, MEMS cantilever beams, and microfluidic devices.

“This 2019 cohort is part of MIT’s history — the first to complete coursework through hands-on research in MIT.nano,” says Vladimir Bulović, faculty director of MIT.nano and the Fariborz Maseeh (1990) Professor in Emerging Technology. “We are thrilled to see undergraduate and graduate students from multiple disciplines honing their skills in MIT.nano cleanrooms and labs. It was great to see them innovate with tools of MIT.nano as they designed outstanding projects. We very much look forward to welcoming the next cohort of hands-on scholars.”

Co-taught by Jurgen Michel, senior research associate at DMSE, and Jorg Scholvin, assistant director for user services at MIT.nano, the course was overhauled in 2017 to become more student-driven with an added element of creativity where students get to design and build their own devices. Scholvin emphasizes the importance of teaching the students not only how to run the equipment, but how to work safely and effectively in a cleanroom and to understand the theoretical background of the fabrication equipment.

“Being able to work at and understand the nanoscale is becoming more and more essential in all science and engineering fields,” says Scholvin. “In this course, we work with students from many departments with very different scientific backgrounds and interests to give them basic skills that they can use to implement their own ideas. Then, they can go forward and adapt these processes to address higher-level, complex, interesting problems in the future.”

Learn the basics, design your own solutions

Before being set loose on their own designs, students completed two lab modules. In the first, focused on solar cells, they fabricated a silicon-based device and then tested it using the ENI Solar Frontiers tools in the third-floor MIT.nano cleanroom. The students later packaged their finished solar cells using electronic and photonic packaging tools in the fifth-floor prototyping facility. Students worked under the guidance of Anu Agarwal, principal research scientist at MIT’s Microphotonics Center, and used equipment from the AIM Photonics Lab for Education and Application Prototypes toolset to connect their solar cells to circuit boards using wirebonds.

Choosing between MEMS cantilevers or microfluidic channels for the second module, students conducted wet etching of cantilever beams on the first-floor cleanroom of MIT.nano or fabricated microfluidics in the third-floor soft lithography lab. In addition to etching and fabrication, students learned about chemical and physical deposition, thermal processes, and device and materials characterization. These lab modules provide the background knowledge needed for students to apply one of these processes to their own projects.

“6.152 was a great opportunity to get first-hand nanofabrication experience combined with theoretical classroom knowledge,” says Ella Richards, a junior in DMSE. “The class showcased the creative research possibilities that MIT.nano has to offer, and the resilience needed to make them a reality.”

The real fun began in the final stage of the course, when students formulated their own device ideas, based on cantilevers or fluidic mixers, in a start-to-finish project. “First, the students get experience working in a cleanroom and learn the theory of processes and tools. Then, they apply their own background and interests to build and test something new,” says Scholvin. “This is when the creativity of the toolset is really driven by the students.”

Students from different departments chose different designs and projects based on their research focus. Scholvin emphasizes that this variety of work illustrates the importance of shared access to equipment. By not being dedicated to one project in one specific lab, but rather being housed at MIT.nano where any trained researcher can use it, he says, a tool can be applied to several projects in different disciplines.

Experiencing the full spectrum of fabrication

The goal, according to the instructors, is not simply tool training, but to give students exposure to the full spectrum of research in nanofabrication. The students must conceive of their own devices, pitch their ideas to the class, create CAD layouts, fabricate the device, debug the process, and test the results. And, as in any research project, they write a paper and have the opportunity to present their ideas and results to a broader technical audience.

At the conclusion of the course, prizes were awarded for the most innovative designs and the three best papers. Andison Tran, Ella Richards, and Stefan Wan were honored for their designs. Tran and Wan are majoring in chemical engineering, Richards in materials science and engineering. Kristina Greenwood, Kyle James, and Blair Anaman Williams received awards for their papers; all three are chemical engineering majors.

“I really enjoyed taking 6.152. It was the first time I was exposed to nanofabrication and I’m grateful for the amount of effort the course staff put into making what was such a new concept to me both interesting and easy to understand. I appreciated how we were given liberty to create our own devices, which brought to life all the principles and skills we learned in the class. Getting to spend time in the cleanrooms was an experience I’ll never forget,” says Williams, a junior in chemical engineering.

The 6.152J/3.155J students were eligible to present their projects at the Microsystems Annual Research Conference (MARC), co-sponsored by MIT.nano and Microsystems Technology Laboratories at the end of January. Five undergraduates and two graduate students from the class presented their work — Williams from chemical engineering; Abdulmalik Alghonaim, Michael Dubrovsky (graduate student), Danielle Grey-Stewart, Ella Richards, and Ava Waitz, all from DMSE; and Shubham Yadav (graduate student) from the Program in Media Arts & Sciences. Heyi Li (mechanical engineering) and Zachary Pitcher (EECS), both undergraduates, also attended the conference.

The micro/nano processing technology course will be offered again in fall 2020.

Meet the first undergraduate users of MIT.nano syndicated from https://osmowaterfilters.blogspot.com/

[cdicdd]

Approvisionneur

Afin d'accompagner notre développement, Valtronic Technologies Maroc recrute un Approvisionneur pour le domaine Electronique. De formation Bac+5 (Ecole d’ingénieur ou équivalent) en management de la logistique / Achats.

Valtronic est un partenaire délivrant des solutions complètes d’engineering, design, développement et de fabrication pour les secteurs Médical, Automobile et Industriel.

Forte de ses 25 ans d’expériences dans l’assemblage des Microsystèmes, SMT (Wirebonding) soudage à la vague , encapsulation, marquage et intégration finale; Valtronic dispose de deux salle blanches (IS07 et IS08) dédiées à…

[itsjohnleeblog]

Fingerprint module industry analysis: 2016 is the first year of fingerprint identification market -fingerprint module of Guangzhou Zhongyi Technology Co., Ltd

Fingerprint module industry analysis: 2016 is the first year of fingerprint identification market -fingerprint module of Guangzhou Zhongyi Technology Co., Ltd

The fingerprint recognition function meets the user's pain points. A new feature on the mobile phone has become a standard after being tested. The key is to cut the pain points of users. Cameras, touch screens, large screens, etc. have become the standard for mobile phones. Fingerprint recognition not only meets the pain points of mobile smart devices, but also meets the needs of users. This year is the first year of the fingerprint identification market. More mobile phones with fingerprint recognition will be available next year, and the market will break out.

We judge the trend of the fingerprint identification industry:

1) On the mobile terminal application, the push-type fingerprint identification scheme will be the mainstream;

2) Fingerprint recognition is placed on the front to have a better user experience;

3) IFS may become one of the mainstream ways for Android phones to match fingerprints;

4) Touch ICs are the first-line mobile phone customers, and their fingerprint identification products are also easier to enter first-line customers.

The required packaging process was analyzed from Apple's fingerprint identification chip disassembly diagram. From the chip layout of the famous dismantling website Chipworks to the fingerprint recognition chip of iPhone5S, we can see that there is a "dark" area on the upper and lower edges of the die, which is actually formed by partial deep reactive etching. The "trench", through the RDL process, puts the Pad in the trench, for wirebond to connect the fingerprint chip to the carrier board, and then to do SiP and module assembly.

The industrial chain of domestic fingerprint identification manufacturers. According to our research and analysis, the domestic manufacturing chain of press-type fingerprint identification chips of domestic Huiding, Si Liwei and Duntai can be roughly summarized as: chip circuit scheme and algorithm design-chip foundry-package (trench, RDL, wirebond, SiP) ) - Module.

The cost ratio of all links in the industry chain and the estimated size of the package testing + module processing market. The fingerprint recognition module is mainly composed of a chip, a sapphire, a metal ring, a soft board, a carrier board, etc., and the cost of a fingerprint recognition module such as an apple or a ceiling with a sapphire as a protective layer is about 10-13 dollars. Based on the results of our industry chain survey, we estimated the cost structure of the fingerprint recognition module of sapphire as a protective layer, in which the cost of module testing + module processing accounted for about 15% of the cost of the entire fingerprint identification module, thus estimating 2015/2016 The market size of the packaging and testing/module processing fee for fingerprint identification chips used in smartphones worldwide was 6.19/1.465 billion US dollars.

Looking back on the development history of these 20 years of mobile phones, time and time again, both from the shape and function have undergone earth-shaking changes, the mobile phone brands sought after by users have also been shuffled many times. Careful analysis of the history of the development of mobile phones, we found that a new function has been tested and become a standard, the key is to cut the pain points of users. Cameras, touch screens, large screens, etc. become the standard for mobile phones. Fingerprint recognition not only meets the pain points of mobile smart devices, but also meets the needs of users. This year is the first year of the fingerprint identification market. There are already several smart phones that have fingerprint recognition function after Apple. More mobile phones with fingerprint recognition will be available next year, and the market is full of explosions.

The judgment of the fingerprint identification industry trend is as follows:

1) On the mobile terminal application, the push-type fingerprint identification scheme will be the mainstream;

2) Fingerprint recognition is placed on the front to have a better user experience;

3) IFS may become one of the mainstream ways for Android phones to match fingerprints;

4) Touch ICs are the first-line mobile phone customers, and their fingerprint identification products are also easier to enter first-line customers.

From the chip layout of the famous dismantling website Chipworks to the fingerprint recognition chip of iPhone5S, we can see that there is a "dark" area on the upper and lower edges of the die, which is actually formed by partial deep reactive etching. The "trench", through the RDL process, places the Pad in the trench for wirebonding to connect the fingerprint chip to the outside world. The reason why the Pad is done in the trench and then wired, instead of directly bonding the Pad to the outside world, is because it can occupy the surface space, so that the fingerprint signal sensing chip is directly bonded to the sapphire film. Minimize the distance between the fingerprint and the sensing chip to provide a stronger capacitive signal for the chip. After the Apple fingerprint identification chip finishes RDL, it manufactures wirebond and SiP modules from ASE.

According to our research institute, the fingerprint identification manufacturers Huiding and Si Liwei, which have started mass production in China, are basically similar in manufacturing methods to Apple. The process required for the industrial chain is basically similar to that of Apple. So from the current point of view, the industry chain of push-type fingerprint recognition chips can be summarized as: chip circuit scheme and algorithm design - chip foundry - package (trench, RDL, wirebond, SiP) - module. The module also includes an assembly of a chip and a sapphire protective cover, a drive metal ring, a soft board, and the like.

The fingerprint recognition module is mainly composed of a chip, a sapphire, a metal ring, a soft board, a carrier board, etc., and the cost of a fingerprint recognition module such as an apple or a ceiling with a sapphire as a protective layer is about 10-13 dollars. Based on the results of our industry chain survey, we estimated the cost structure of the fingerprint recognition module of sapphire as a protective layer. Among them, the package test + module accounts for about 15% of the total cost of the module, thus estimating the global 2015/2016 The market size of the package testing + module processing fee for fingerprint recognition chips applied to smart phones is 6.19/1.465 billion US dollars.

Fingerprint recognition provides a perfect experience to meet user pain points

A new feature to become the standard for smart mobile devices, the key is to cut the user's pain points

Since the 1990s, mobile phones have gradually entered the daily life of ordinary people. With the improvement of living standards and the development of technology, mobile phones have evolved from the original luxury goods to the necessary consumer electronics products. Looking back at the development history of these 20 years of mobile phones, changes have been made again and again, both in terms of styling and functions. The mobile phone brands sought after by users have also been shuffled many times. We believe that a new function has been tested and become a standard. The key is to cut the pain points of users. This is illustrated by the standard features of the camera, touch screen, and large screen.

The camera function caters to the pain points of mobile phone users to take photos anytime, anywhere, and share them at any time. According to ZDC statistics, there are more than 800 dual-camera models in the Chinese mobile phone market, accounting for more than 80%. The user's demand for mobile phone camera also promotes the continuous improvement of the pixel of the mobile phone camera.

The mobile phone has experienced the "big brother", blue screen mobile phone, ordinary straight mobile phone, full keyboard mobile phone, and has developed into the current touch screen smart phone. The biggest advantage of the touch screen is the direct click interaction mode, which realizes the jump of the information interface by clicking the finger. It is more direct and more convenient, as if we have returned to the original state, click-and-click, whether it is the elderly or children, the operation is simple and easy to learn. According to the ZDC survey results, more than 80% of users support touch as a mobile phone input method, which solves the pain point of the perfect experience of information input and becomes the standard for smart mobile devices.

The large screen of the screen solves the pain point of massive information ingestion of mobile intelligent terminals. For example, using a large screen to navigate on the map, you can see more places on the map, eliminating the need for a lot of zooming and moving operations, which is convenient; or when watching movies, reading books, sharing photos with friends, Big screen has a unique advantage, and even many users said that after getting used to the big screen, it is difficult to adapt to the use of small screens. These have made smartphones a big screen.

Fingerprint recognition cuts pain points: information security + mobile payment

By June 2014, the number of mobile Internet users in China reached 530 million, accounting for 83.4% of the total number of Internet users. Mobile phones carry more and more user information. The mobile Internet is changing the way people access the Internet and providing convenience. At the same time, its potential insecurity also lays mines.

The uniqueness of the fingerprint, build a firewall for the mobile phone

In mobile social networking: Nielsen Network's survey shows that 60.2% of mobile users are using social media software. For example, the real-time online functions of new social applications such as Weibo and WeChat make people's communication more convenient, and there are a large number of information about relatives and friends of users;

Mobile office: IDC related survey data shows that 82.0% of Chinese employees will use their smartphones for work; 35.0% will use tablets for work. People use smartphones to send and receive emails, read files, etc., and mobile phones can easily enter confidential documents such as customer lists and bid invitations. These information are easily obtained by others and will cause huge losses to individuals and businesses. Mobile office brings great convenience and benefits to enterprises and employees, and it also hides security risks invisibly;

Mobile payment: Mobile banking has greatly facilitated people's lives, and more and more people use smart phones for mobile shopping. At the fingertips, the transfer of funds can be completed, which also raises concerns about property safety;

Solving the pain of users' information security of smart mobile devices is an urgent task. Fingerprint recognition is a perfect combination of security and convenience. It not only meets the higher requirements of mobile smart devices for security, but also meets the convenience of users. demand.

  Guangzhou Zhongyi Technology Co.,Ltd-fingerprint module, fingerprint sensor  

http://www.zyjjhome.com/

[kay2xenox]

Binding Wire Used in Construction

Kay2 Wirebond is manufactured using modern technology for tying masonry walls to concrete, steel, and masonry. It undergoes strict laboratory testing to ensure quality and meets IS 280:2006 standards. Available in annealed and soft drawn types, the wirebond comes in diameters of 0.71, 0.90, and 1.25 mm, with standard packaging options of 5, 10, and 25 kgs. Key features include uniform manufacturing, absence of surface defects, and excellent packing. It offers high tolerance, no breakage or splitting during binding, and consistent weight.