#mmWave IC

[everythingwaschocolateandsugar]

The global 5G Chipset Market size is estimated to be USD 1.53 billion in 2019 and is predicted to reach USD 90.79 billion by 2030 with a CAGR of 44.95% from 2020-2030.

[faststream]

5G ORAN BASE STATION

Faststream has been at the forefront of mobile networking evolution, seamlessly transitioning from 4G to 5G technologies. Our commitment lies in delivering cutting-edge, next-generation experiences and connections for customers and partners. Early investments in key 5G technologies have empowered us to provide highly differentiated offerings in 5G Base Station, Core Network, RAN, Management, and Applications.

5G Ecosystem Overview

5G Revolution

The advent of 5G promises a revolutionary shift in mobile networking, significantly increasing wireless data capacity and unlocking new possibilities for driverless vehicles, smart factories, remote surgery, and more. Establishing a sophisticated ecosystem of hardware, apps, and services is crucial, along with deploying 5G networks in the mmWave frequency, including the 26 GHz pioneer band.

Open RAN in Focus

Investors are keenly interested in the Open RAN instrument. This design promotes interoperability of wireless network hardware/software, breaking free from vendor lock-in. Open RAN fosters innovation by allowing new vendors to contribute use cases, apps, and services, driving competition and potentially reducing costs for mobile operators.

Components of a 5G Network

Macrocell: The Key Component

A 5G macrocell, a vital component of the network, utilizes Multiple-Input, Multiple-Output (MIMO) technology to provide cellular network radio coverage. Positioned on towers, these macrocells, with their MIMO antennas, can link billions of devices while minimizing latency.

Base Station Components

Central Unit (CU)

In a 5G network, the CU consolidates and manages upper-layer protocols across Distributed Units (DUs). Designed for data center deployment, the CU enables cost-effective creation of large capacity networks using FPGAs, Network Synchronization ICs, Ethernet, and Precision Crystal & SAW Oscillators.

Distributed Unit (DU)

Functioning like the typical modem of a 5G Base Station network, the DU is essential for delivering increased capacity and expanded capabilities, such as coordinated multipoint (CoMP). Faststream engineers face challenges in delivering higher capacity at a fraction of the power and cost per bit.

Radio Hardware Unit (RU)

The RU transforms radio signals from and to the antenna into digital signals for packet networks. It manages the digital front end, lower PHY layer, and digital beamforming. Considerations for RU design include size, weight, and power consumption.

Radio Frequency and Massive MIMO

MIMO System

The MIMO system, utilizing "Multiple Input, Multiple Output," enables 5G macrocells to send and receive data through antennas with multiple connections. "Massive MIMO" allows macrocells to connect with an even larger number of users without a significant increase in physical size.

5G MacroCell Range

The range of 5G macrocells can extend kilometers, providing service to major towns. Despite the extensive antenna ports, massive MIMO base station antennas maintain a size comparable to 4G and 3G base station antennas.

5G Software Components and Functionality

To meet the growing data demands of smartphone capabilities, infrastructure design in digital mobile communication systems is evolving. Integrated DDC (Digital Down Converter) and DUC (Digital Up Converter) channels play a crucial role in achieving faster data rates. Leveraging DSPs, FPGAs, and ASICs streamlines design efforts, saving costs and power.

Conclusion

Faststream's commitment to innovation and strategic investments has positioned us at the forefront of the 5G revolution. From advanced network components to embracing open standards, we are dedicated to delivering unparalleled 5G experiences for a connected future.

[efrost]

5G Chipset Market to Scale New Heights as 5G Chipset Market Players Focus on Innovations 2022 – 2027

A Latest intelligence report published by AMA Research with title "Global 5G Chipset Market Outlook to 2027. This detailed report on 5G Chipset Market provides a detailed overview of key factors in the Global 5G Chipset Market and factors such as driver, restraint, past and current trends, regulatory scenarios and technology development.

5G Chipset is the main component in consumer devices, and network infrastructure equipment, it allows the user to form a wireless network which is based on the 5G standard. It is also referred to as the next generation of mobile networks that is far away from the current 4G LTE mobile network. These networks provide a wide range of frequency which ensures a great performance of the network and empowers new user experiences to the new industries. Increasing establishment of 5G infrastructure and 5G chipset unlocks varieties of opportunities and classifies a broad range of industries with different segments of day to day life such as connected services from education to retail, healthcare to consumer electronics and transportation to entertainment. Rising urbanization coupled with the need of high-speed internet globally will drive the market for the 5G chipset.

Major Players in this Report Include are

Qualcomm Technologies (United States)

Intel (United States)

Nokia (Finland)

Samsung Electronics (South Korea)

Xilinx (United States)

IBM (United States)

Qorvo (United States)

Infineon Technologies (United States)

Integrated Device Technology (United States)

Anokiwave (United States)

Market Drivers: Growing Demand for High-Speed Internet and Broad Network Coverage

Increase in Demand for Mobile Broadband Services

Increasing Electronic Devices with Internet Compatibility Globally

Market Trend: Adoption of Latest Technologies, Such As Artificial Intelligence and Machine-To-Machine Communication

Opportunities: Integration Of 5G Services with Satellite Communication

Growing Number of Research and Development Activities Related To 5G Technology in Developing Nations

The Global 5G Chipset Market segments and Market Data Break Down by Type (Radio Frequency Integrated Circuit (RFIC), Application-Specific Integrated Circuit (ASIC), Cellular Integrated Circuit (Cellular IC), Millimeter Wave Integrated Circuit (mmWave IC)), Application (Automotive & Transportation, Energy & Utilities, Healthcare, Retail, Building Automation, Industrial Automation, Consumer Electronics, Public Safety & Surveillance), Operation Frequency (Sub-6 GHz, Between 26 and 39 GHz, Above 39 GHz), Product Type (Devices, Customer Premises Equipment, Network Infrastructure Equipment) Geographically World 5G Chipset markets can be classified as North America, Europe, Asia Pacific (APAC), Middle East and Africa and Latin America. North America has gained a leading position in the global market and is expected to remain in place for years to come. The growing demand for Global 5G Chipset markets will drive growth in the North American market over the next few years.

Presented By

AMA Research & Media LLP

[akash-lokhande]

5G Chipset Market Download Free Research Report Sample PDF: https://cutt.ly/UCoCDWJ By Type: *RFIC

ASIC

Cellular IC

mmWave IC

[powerelec]

pSemi's mmWave beamformer and up-down converter ICs reach volume production

pSemi’s mmWave beamformer and up-down converter ICs reach volume production

 pSemi® announced the production readiness of two new mmWave ICs targeted for active antenna systems in 5G base stations, 5G customer premises equipment and point-to-point radio communication applications. In addition to the 8-channel beamforming front end and dual-channel up-down converter ICs, pSemi offers a complete support package of tools and technical expertise to simplify mmWave design and…

[worldwideanalysis]

Gallium Nitride Semiconductor Devices Market To Reach $72,813.1 Million by 2030

The gallium nitride semiconductor devices market shall touch $72,813.1 million in 2030 from $12,084.6 million in 2021. Moreover, the market is predicted to grow at a 22.1% CAGR from 2021 to 2030 owing to the lower costs of GaN semiconductor devices in comparison to silicon variants, swifter device speed, and greater efficiency of energy. Furthermore, the global market is influenced by the rising count of robot shipments, which increased by 100,000 in 2022 from 500,000 in 2020.

The rapid integration of advanced technologies in electronics will drive the gallium nitride semiconductor devices market. It is projected that by 2025, mobile data traffic will reach 160 exabytes every month. The surging demand can be satisfied by supporting high data transfer rates and large bandwidths through extremely high-frequency bands. For instance, 5 mmWave ranges from 24 GHz to 300 GHz will offer smooth connectivity, enhanced performance, and increased coverage. Capitalizing on the new technology, an American telecommunication company launched a mmWave 5G network in 2020, accompanied by the introduction of the S20 Ultra and Galaxy S20 Plus.

The opto-semiconductors category led the product type segment of the gallium nitride semiconductor devices market in 2021, generating revenue of approximately $5.0 billion. This can be attributed to the wide usage of semiconductors in several sectors, majorly consumer electronics and aerospace & defense, for numerous devices. Additionally, the application of these devices in the automotive sector, for pulse-powered laser systems and automotive lights, is rising, which, in turn, will fuel growth in the market. A lucrative opportunity for market players in the opto-semiconductors market is the surging demand for ADAS.

Within the component segment, the power ICs category will rule the gallium nitride semiconductor devices market from 2021 to 2030. Because of the need for real-time air traffic control, efficient navigation, and collision avoidance, the requirement for GaN-based power ICs is increasing. These factors will offer opportunities to the key players by increasing the demand for these components. Moreover, the technological advancements in power ICs designed for telecom and automotive applications by top manufacturers will augment growth in the market.

[marketwire]

5g ICs Market Size Forecast to Reach $58.3 Billion by 2026

The Global 5G ICs market size is forecast to reach $58.3 billion by 2026, growing at a CAGR of 25.4% from 2021 to 2026. Growing demand for high-speed internet services supporting broad network coverage, increasing adoption for cellular IoT connections and rise in mobile data traffic overtime attributes to the growth of 5G ICs market. With the surge of COVID-19 pandemic, there is significant growth towards work from home activities, driving the need for high-speed bandwidth cellular networks like 5G modems, routers and others. Additionally, growing investments towards 5G smartphone and high adoption of advanced technologies like IoT, AI and others have also emerged as the major factors driving its market growth. PCB designing using gallium nitrides with higher power density over silicon have been propelling its deployment in 5G radio frequency solutions due to smaller form factors. Rising investments towards connected vehicles, smart healthcare services, factory automation and others will propel the need for high speed wireless communication, driving the market growth forward.

5G ICs Market Segment Analysis- By Type

Millimeter Wave Integrated Circuit (mmWave IC ) segment is analyzed to grow with the highest CAGR of around 9.5% in the global 5G ICs market during 2021-2026. Factors such as high transmission quality, security, and others have been attributing towards its wider deployment of across demanding applications including smart hospitals, industrial manufacturing, connected cars and others. Due to its capability of offering high bandwidth requirements, adoption of 5G mmWave have been facing significant rise over the years, creating potential of delivering application areas be it augmented reality, cloud gaming, autonomous guided vehicles and others, as a part of improving digitization and connectivity. According to recent studies conducted by IndustryARC, mmWave spectrum have started becoming more widely available within countries such as US, Italy, Japan, Finland and South Korea with a number of other countries on the way to follow up in the coming time, further propelling the demand for 5G mmWave integrated circuits or chipsets. In June 2021, MixComm Inc. announced about the launch of a 5G mmWave frond-end IC, named SUMMIT 3741. This mmWave IC is capable of operating at frequency range of 37-41GHz alongside integration with power amplifiers, low-noise amplifiers, beam-formers, power telemetry, high-speed SPI control and others, serving optimal partitioning required for 5G infrastructures. Such developments are further set to boost the market growth of 5G mmWave ICs in the long run.

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5G ICs Market Segment Analysis- By End Users

Automotive sector is analyzed to account for the highest CAGR of around 7.2% in the global 5G ICs market during 2021-2026. Automotive sector has been facing rapid evolution overtime along with technological advances with the high proliferation of 5G, IoT and artificial Intelligence with others. Usage of 5G cellular technology for serving automotive application areas including fleet management, navigation, vehicle to everything (V2X) communication and others have been growing significantly, impacting the need for 5G ICs. High investments towards R&D activities related to connected vehicles, self-driving cars, and others can be considered vital in driving the market growth for 5G ICs in the long run. Since low end field programmable array have been already popular for use in automotive applications, its potential of being power efficient, makes it an ideal choice for building constituents of 5G infrastructure. Deployment of 5G chipsets help the automotive manufacturers to enhance vehicular communication standards through supporting low latency high bandwidth data transmission, ensuring increased driving safety for the consumers. In August 2020, one of the leading automakers, General Motors had revealed about its plans of launching vehicles with 5G connectivity, for its Chinese consumers, beginning from the year 2022. This initiative by the company was taken as a part of its update towards providing faster connection for remote or over-the-air, updates and communications with other connected vehicles or infrastructures. Such factors are analyzed to enable technologies including autonomous vehicles and advanced driver-assist systems, depending majorly on requirements like high connectivity and advanced mapping with additional sensors or radars, thereby propelling the need for 5G ICs in the coming years.

5G ICs Market Segment Analysis- By Geography

APAC region is analyzed to witness the highest growth in the global 5G ICs market with a CAGR of around 11.4% during the forecast period 2021-2026. Rising adoption of advanced technologies like IoT, artificial intelligence and others, growing demand for high speed network connectivity overtime across various countries and shift towards smart automation across various end-use sectors have been attributing towards the market growth of 5G ICs within the region. Growing penetration of mobile devices, increasing investments towards the development of 5G network infrastructures along with high R&D activities related to 5G smartphones can be considered as prime factors anticipated to drive the market forward. According to IANS (Indo-Asian News Service), average traffic per smartphone user within India attributed to 14.6GB per month in 2020, in comparison to 13GB per month in 2019. Also, as per IANS report 2021, there will be nearly 330 million 5G smartphone subscriptions over the next five years, showing a rise of around 26% of mobile subscriptions within the country. With such predictions ahead, 5G smartphones penetration will be significantly growing in India, contributing towards the demand for 5G ICs in the long run. High investments from key market players including MediaTek Inc., Samsung Electronics Co. Ltd and others towards R&D activities will further boost the market growth. In February 2021, MediaTek announced about the launch of a 5G modem, named M80, capable of combining both mmWave as well as sub-6 GHz 5G technologies within a single chip. This was done in order to support ultra-fast speeds on standalone as well as non-standalone architectures, with a peak rate upto 7.67 Gbps and 3.76 Gbps for downlink and uplink respectively, thereby analyzed to drive the market forward for meeting more reliable connection requirements in the long run.

5G ICs Market Drivers

Growing investments towards development of 5G smartphones:

Growing investments towards development of 5G smartphones can be considered as one of the major drivers boosting the growth of 5G ICs market. With technological advances overtime and trends such as increasing demand for high speed internet connectivity, faster network coverage and others have helped the smartphone manufacturers to shift towards 5G technology. With increasing market competition as well as rising use of mobile services, the need for developing 5G smartphones to meet consumer expectations is also impacted significantly. Development of these smartphones will eventually drive the need for semiconductor integrated circuits, due to requirements like growing demand for high bandwidth, data storage, faster mobile connectivity and many more. Major Smartphone manufacturing companies such as Vivo, Samsung, Realme, Xiaomi and many others have already started investing on 5G smartphones to expand its customer base within the consumer electronics markets. In June 2021, Realme announced about its plans of launching a 5G smartphone at a price under Rs. 10,000 by the next year. Owing to this plan, the company had revealed about investing over Rs 2,100 crore (around USD 300 million) towards 5G research and development alongside setting up seven R&D centres across various locations including India. Such investments from key smartphone vendors overtime is further set to drive the demand for embedded device chipsets like 5G ICs in the long run.

Increasing adoption of advanced technologies such as IoT, AI and others drives the market forward:

Increasing adoption of advanced technologies such as IoT, AI, and others is analyzed to be one of the major drivers in the market growth of 5G ICs. With surge of connected and smart devices across enterprises to enhance digitalization, there is higher adoption of advanced technologies be it IoT, AI and so on.  Leveraging 5G technology helps in supporting a massive number of static as well as mobile IoT devices, in order to serve a broad range of requirements including high speed, bandwidth as well as quality of service. Usage of 5G integrated chipsets have been facing wider adoption across various end-use markets for supporting high-performance use cases like smart cities, industrial IoT, smart healthcare and so on. Since 5G technology act as a scalable and efficient solution for IoT or AI enabled devices to connect at higher speeds, making data streaming, transmission and storage, driving faster wireless connectivity. In April 2021, Vodafone Idea Ltd. Had revealed about the launch of a 5G ready IoT solution, consisting of connectivity, hardware, analytics, networks, application, security as well as support, as a part of serving enterprises digitize their businesses. Such factors are analyzed to boost the growth towards 5G ICs within various connectivity solutions and hardware in the long run.

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5G ICs Market Challenges

High costs related to IC designing, manufacturing or fabrication process:

High costs related to IC designing, manufacturing or fabrication process act as a major factor restraining the market growth of 5G ICs. Since 5G technology is still undergoing improvements alongside adoption of 4G technology being there in the markets, high costs associated with it significantly slows down its adoptability. Since the chip designers need to combine advantages such as low power consumption, high bandwidth support, network performance optimization and so on, which require skilled labour and expertise to handle its designing complexities, thereby adding to the overall operational costs for the manufacturers. Due to its high manufacturing costs, 5G chipsets incorporated within various applications, including smartphones, smart devices and many others eventually raises the purchasing costs for the consumers as well, which significantly hampers the growth of such 5G devices, adversely impacting the growth of 5G ICs.

5G ICs Market Landscape

Product launches, partnerships and R&D activities are key strategies adopted by players in the 5G ICs market. 5G ICs top 10 companies include Qualcomm, Skyworks Solutions Inc., MediaTek Inc., Xilinx Inc., Qorvo, Samsung Electronics Co. Ltd., Broadcom Inc., Marvell Technology Inc., Analog Devices Inc. and Intel Corporation among others.

Acquisitions/Technology Launches/Partnerships

In March 2021, Samsung Electronics and Marvell had jointly developed a SoC in order to enhance 5G network performance. Designing of this SOC was meant to help implementation of new technologies, which can improve cellular radios through increasing capacity and coverage, while reducing power consumption as well as size.

In February 2021, Qualcomm Technologies Inc. announced about the launch of a fourth-generation 5G modem-to-antenna solution, named Snapdragon X65 5G Modem-RF System. This development was done in order to support fastest 5G speeds currently available combined with fibre-like wireless performance serving ultimate network flexibility, capacity as well as coverage.

Key Takeaways

Growing investments towards development of 5G smartphones with increasing adoption of advanced technologies such as IoT, AI and others is analyzed to drive the 5G ICs market during 2021-2026.

5G mmWave IC market is anticipated to grow with the highest CAGR during the forecast period, for serving high bandwidth requirements across applications like augmented reality, autonomous guided vehicles and others.

APAC is analyzed to account for the fastest-growing region during 2021-2026, due to the growing demand for high speed network connectivity, shift towards smart automation and others.

Related Reports:

A. 5G Connector Market

https://www.industryarc.com/Report/18776/5g-connector-market

B. 5G Transceiver Market

https://www.industryarc.com/Report/19299/5g-transceiver-market.html

For more Electronics Market related reports, please click here

[market-research-analysis]

The Global 5G ICs market size is forecast to reach $58.3 billion by 2026, growing at a CAGR of 25.4% from 2021 to 2026.

[everythingwaschocolateandsugar]

The global 5G Chipset Market size is estimated to be USD 1.53 billion in 2019 and is predicted to reach USD 90.79 billion by 2030 with a CAGR of 44.95% from 2020-2030.

[puzzomacgowan1938]

GlobalFoundries Introduces Innovative Solutions for a New Era of Semiconductor Manufacturing

GlobalFoundries Introduces Innovative Solutions for a New Era of Semiconductor Manufacturing GlobalFoundries®, a global leader in feature-rich semiconductor manufacturing, announced a portfolio of new features that extend its solutions roadmap and accelerate the next wave of innovation in chip design for smart mobile devices, datacenter, IoT and automotive.

The announcements come as the industry is experiencing unprecedented demand for semiconductor chips, with the market expected to double to more than $1 trillion by the end of the decade. Semiconductor chips are now pervasive - inside everything from appliances to thermostats, smartphones to automobiles, and industrial equipment to medical devices.

"The past eighteen months has demonstrated what a semiconductor is and that they are vital to everything we do. This awareness and demand have catalyzed innovation in areas such as automotive and IoT, and this requires a new way of thinking," said Juan Cordovez, Senior Vice President of sales at GF. "At GF, we are shattering the old paradigm of what innovation in semiconductor manufacturing means by delivering differentiated solutions that are more intelligent and intuitive, more connected and secure, more powerful and energy efficient to meet not only the demands of today but also for the future."

At the summit, GF introduced the new solutions, features and platforms for the fast-growing end markets and applications. Highlights include:

Smart, mobile devices: GF announced advanced feature sets for the newest generation of 5G and Wi-Fi 6/6e mobile phones and smart devices.

GF RF-SOI sub 6GHz Solutions include new features so chip designers can provide a stronger 5G connection today with fewer dead zones for more talking, playing, and streaming, and more time on a single charge. GF FDX™-RF Solutions include new features to enable the 5G mmWave generation of devices for more robust connections and more connected experiences. GF Wi-Fi Solutions now include new features for enhanced RF and Power Amplifier functionality so Wi-Fi 6 and 6e chip designers can provide a higher performing, stronger Wi-Fi connection for the newest generation of Wi-Fi-enabled products for more coverage and more connections. GF Display Solutions includes new features that allow display driver IC designers to enable variable refresh on OLED displays to deliver blazing fast refresh rates for more immersive gaming and moderated refresh rates for battery savings while browsing. GF Audio Solutions include new features, as well as a non-volatile memory option, that allow audio amp designers to provide more life-like sound quality with a minimal amount of noise or distortion resulting in crystal clear audio for playback and talk. GF Imaging Solutions now includes new features that allow image sensor designers to enable stacked CMOS image sensors with >200 Mpixels of resolution, high-dynamic range, slow-motion, and lower power for the newest generation of smartphone cameras. Datacenter: GF is extending its silicon photonics manufacturing leadership by announcing a new platform and features for more power and energy efficient. GF Silicon Photonics Solutions are available on GF's new Silicon Photonics 45nm platform which has passed critical technology milestones and is on track for full technology qualification by Q1 2022. The monolithic platform, combining RF CMOS and optical components on the same chip, includes an innovative new feature, the first micro ring resonator (MRR) optical component in 300 mm wafer technology. GF is engaged with leading customers and partners on this new platform. IoT: GF Microdisplay Solutions for IoT include new features that optimize and improve process speed and reduce leakage as well as provide enhanced pixel driver functionality for enabling smaller and lighter augmented reality (AR) glasses that last longer on a single battery charge. GF Microdisplay Solutions are based on the GF 22FDX+ platform which is seeing broad industry acceptance with more than $7.5 billion in design wins worldwide.

Automotive: GF announced the GF 22FDX™ platform is Auto Grade 1 Ready at Fab 1 in Dresden, Germany providing customers with faster time-to-market. GF has announced that it is making $1B investment in Dresden, as well as an additional $5B to expand capacity globally.

[abunayeem]

Hotspot unlimited data plan – Sneak Peek

Hotspot unlimited data plan – Sneak Peek

In any case, that wasn’t the pushed of Thursday’s demo, which was directed in the LA Live amusement region of downtown Los Angeles and chronicled in this article. It’s the region around the previous Staples Center (presently Crypto.com Arena and the Microsoft Theater) which is the place where the Los Angeles Lakers and other host groups play, so it’s very much dealt, with the previously mentioned ice arena and a wide range of shops. A Verizon representative said they set up a couple of gadgets to get to the organization nearby – a couple of squares wide – to flaunt the force of C-band. The C-band framework wasn’t available to simply anyone – business gadgets couldn’t get to it. Foundation in the space was provided by Ericsson.

Verizon hasn’t gave a specific chance to when the business C-band administration will dispatch, yet emphasized its obligation to cover 100 million individuals before the finish of March. “We’re certain we’ll do that,” the representative said on Friday. Members in the demo were given Samsung S21 gadgets, yet other viable C-band gadgets incorporate the Apple iPhone 12 and iPhone 13, Ho said. Given those are the primary gadgets to be upheld, Ho said his focus point is the exceptional endorsers will be dealt with first. “All that recommends is individuals who get [those devices] are generally top notch clients or high-esteem endorsers,” he noted.

Obviously, Verizon’s goal was to flaunt the special force of C-band, where on an unencubered network with not many clients the speed and limit are viable with millimeter wave (mmWave) yet the 3.7 GHz C-band has a lot farther reach. The representative said a few people detailed seeing predictable download speeds north of 200 Mbps in an underground parking structure, and quicker than that in a moving lift with speeds out in the open moving toward a gig now and again. C-band hubs were regularly a large portion of a pretty far from the test region and still gave broadband speed and execution. “This will permit us to extend our 5G Ultra Wideband assistance for portability and fixed remote access use cases to millions additional individuals,” the representative said through email.

[gladywoomeruqm61]

GlobalFoundries Introduces Innovative Solutions for a New Era of Semiconductor Manufacturing

GlobalFoundries Introduces Innovative Solutions for a New Era of Semiconductor Manufacturing GlobalFoundries®, a global leader in feature-rich semiconductor manufacturing, announced a portfolio of new features that extend its solutions roadmap and accelerate the next wave of innovation in chip design for smart mobile devices, datacenter, IoT and automotive.

The announcements come as the industry is experiencing unprecedented demand for semiconductor chips, with the market expected to double to more than $1 trillion by the end of the decade. Semiconductor chips are now pervasive - inside everything from appliances to thermostats, smartphones to automobiles, and industrial equipment to medical devices.

"The past eighteen months has demonstrated what a semiconductor is and that they are vital to everything we do. This awareness and demand have catalyzed innovation in areas such as automotive and IoT, and this requires a new way of thinking," said Juan Cordovez, Senior Vice President of sales at GF. "At GF, we are shattering the old paradigm of what innovation in semiconductor manufacturing means by delivering differentiated solutions that are more intelligent and intuitive, more connected and secure, more powerful and energy efficient to meet not only the demands of today but also for the future."

At the summit, GF introduced the new solutions, features and platforms for the fast-growing end markets and applications. Highlights include:

Smart, mobile devices: GF announced advanced feature sets for the newest generation of 5G and Wi-Fi 6/6e mobile phones and smart devices.

GF RF-SOI sub 6GHz Solutions include new features so chip designers can provide a stronger 5G connection today with fewer dead zones for more talking, playing, and streaming, and more time on a single charge. GF FDX™-RF Solutions include new features to enable the 5G mmWave generation of devices for more robust connections and more connected experiences. GF Wi-Fi Solutions now include new features for enhanced RF and Power Amplifier functionality so Wi-Fi 6 and 6e chip designers can provide a higher performing, stronger Wi-Fi connection for the newest generation of Wi-Fi-enabled products for more coverage and more connections. GF Display Solutions includes new features that allow display driver IC designers to enable variable refresh on OLED displays to deliver blazing fast refresh rates for more immersive gaming and moderated refresh rates for battery savings while browsing. GF Audio Solutions include new features, as well as a non-volatile memory option, that allow audio amp designers to provide more life-like sound quality with a minimal amount of noise or distortion resulting in crystal clear audio for playback and talk. GF Imaging Solutions now includes new features that allow image sensor designers to enable stacked CMOS image sensors with >200 Mpixels of resolution, high-dynamic range, slow-motion, and lower power for the newest generation of smartphone cameras. Datacenter: GF is extending its silicon photonics manufacturing leadership by announcing a new platform and features for more power and energy efficient. GF Silicon Photonics Solutions are available on GF's new Silicon Photonics 45nm platform which has passed critical technology milestones and is on track for full technology qualification by Q1 2022. The monolithic platform, combining RF CMOS and optical components on the same chip, includes an innovative new feature, the first micro ring resonator (MRR) optical component in 300 mm wafer technology. GF is engaged with leading customers and partners on this new platform. IoT: GF Microdisplay Solutions for IoT include new features that optimize and improve process speed and reduce leakage as well as provide enhanced pixel driver functionality for enabling smaller and lighter augmented reality (AR) glasses that last longer on a single battery charge. GF Microdisplay Solutions are based on the GF 22FDX+ platform which is seeing broad industry acceptance with more than $7.5 billion in design wins worldwide.

Automotive: GF announced the GF 22FDX™ platform is Auto Grade 1 Ready at Fab 1 in Dresden, Germany providing customers with faster time-to-market. GF has announced that it is making $1B investment in Dresden, as well as an additional $5B to expand capacity globally.

[caelumbiancca081862]

Avnet Announces Availability of Otava Tunable Filters and mmWave Switches

Avnet Announces Availability of Otava Tunable Filters and mmWave Switches Avnet is now shipping three ultra linear tunable RF filters and two wideband RF switches from Otava, a fabless mmWave and mixed-signal IC design company best known for developing its OTBF103 millimeter wave beamformer IC. Both the filters and the switches are currently available as small form factor devices, which allows for maximum layout efficiency.

Avnet is also offering Otava’s switch evaluation boards, which enable engineers to quickly assess the device’s performance and simplify prototyping and verification. To showcase the tunable RF filters in frequency-agile sub 6 GHz applications, Avnet is also developing a tunable filters daughter-card that will plug into a ZCU208 or ZCU216 Xilinx Zynq UltraScale+ RFSoC development board.

“Otava’s new tunable filters and mmWave switches will provide designers with more high-performance solutions in the millimeter wave arena, where every component specification can make a difference in the overall system performance.” said Jim Beneke, Vice President of Engineering and Technology, Avnet. “Their compact form factor, low insertion loss, and the wide band coverage allows for adoption in a range of systems including 5G and low Earth orbit (LEO) SATCOM applications.”

“We are extremely excited to announce that Otava’s ultra-wideband switches and tunable filters are now available through Avnet. They will serve as key components that are compatible with many existing platforms, including those in the 5G market,” said Wen Zheng, Co-founder and Vice President of Engineering at Otava. “The superior performance and flexibility of our products simplify architecture and reduce cost in many systems that are in need of refinement, especially in millimeter wave where the slightest enhancements matter.”

“Modern RF applications ranging from SDR and 5G to SATCOM, EW and more demand components with low insertion loss and small form factors,” says Mike Dunne, Precision RF Product Manager at Samtec. “The combination of Otava’s new low insertion loss RF filters and switches and Samtec’s Precision RF interconnect offers RF engineers and system designers high-performance components that optimize the entire RF signal path. Otava’s family of OTSW10x and OTFLx01 evaluation boards feature the latest Samtec 2.4 mm edge-mount compression connectors and launch optimizations.”

Tunable Filters

Otava’s family of tunable filters covers multiple frequency bands for a range of different applications from 2.5 to 40 GHz. These highly integrated tunable designs eliminate the need for multiple fixed frequency filters, which frees up valuable real estate for system implementation. The OTFL101 covers 2.5-7.5 GHz, the OTFL201 covers 14-24 GHz and the OTFL301 covers 24-40 GHz. View details on Avnet.

Each filter evaluation board consists of the following:

one tunable filter two RF connectors a microcontroller an option for external control Switches

Otava’s single pole double throw (SPDT) switches offer exceptional insertion loss performance and linearity from DC to 40 GHz in a compact footprint. The OTSW100 is 2.546 x 2.161 mm, while the OTSW101 is 1.634 x 1.637 mm. The switch evaluation boards offer a simple way to assess the device's performance. View details on Avnet.

Each switch evaluation board consists of the following:

the switch IC three 2.4 mm connectors for the RFIO two ±2.5 V control lines through a header

[ansteypoint1799]

Metanoia and NXP Collaborate to Develop Integrated 5G NR Sub-6 GHz Platform

Metanoia and NXP Collaborate to Develop  Integrated 5G NR Sub-6 GHz Platform Metanoia Communications ("Metanoia") is collaborating with NXP Semiconductors to develop a new 5G NR Sub-6GHz demonstration/development platform (Reference Platform) that combines innovative technologies from both companies.

The new Reference Platform leverages NXP's high performance Layerscape family of multicore processors and 5G NR programmable baseband processors and Metanoia's recently announced 5G NR Sub-6Ghz RF IC (MT3812). The Reference Platform will facilitate and considerably reduce the customers' design cycle by building a 5G Sub-6GHz solution addressing all 5G market segments ­– from a single FWA CPE to low or high density 5G Remote Radio Units (RRUs), and to highly integrated Small-Cells.

Targeting the high volume, highly popular mid-band (3.3 GHz – 4.2 GHz (n77), the complete 5G NR Reference Platform enables the development of Software Defined Radio (SDR) solutions with support for i) L1 PHY implementations, ii) a wide range of DPD/CFR performance, iii) networking offload for timing, parsing and Quality of Service (QoS), iv) offload for eCPRI C/U- and S-Plane including virtualized and containerized L2 applications. Evaluating lower and higher frequency bands, supported by the Metanoia MT3812, will also be possible by by-passing appropriate RF front end components, like a Power Amplifier and Low Noise Amplifier on the Reference Platform.

"The collaboration between NXP and Metanoia demonstrates the advanced capabilities of the Layerscape Access programmable solution platform and underscores our commitment to furthering our ecosystem-based strategy for faster, time-to-market solution enablement," commented Tareq Bustami, Senior Vice President and General Manager, Network Edge at NXP Semiconductors. "NXP offers a comprehensive 5G NR solutions portfolio that, with the help of our partners, is accelerating the development and deployment of 5G infrastructure networks around the world."

"Partnering with NXP to offer a highly optimized development platform to our customers that includes our MT3812 RF IC and demonstrating that our chips, put together, can meet the 3GPP and the ORAN performance requirements is critical to our customers," commented Didier Boivin, Executive Vice President at Metanoia. "A desire to create a high level of trust in our technologies is what drove NXP and Metanoia to work together on this combined Reference Platform."

Metanoia's MT3812 is a cost-effective Sub-6 GHz TDD 2x2 RF transceiver with a tiny 9x9 mm QFN68 footprint, which supports 200 MHz Bandwidth in Transmit and Receive modes, and 400 MHz in DPD mode. It is a highly integrated multi-band programmable and self-calibrated product supporting three of the most popular bands: 2.5 GHz – 3.0 GHz (n90), 3.3 GHz – 4.2 GHz (n77), and 4.2 GHz – 5.0 GHz (n79). MT3812 is designed to interface with any I/Q baseband chip and includes distinguishing features such as high dynamic range on its low noise receive chains and high linearity and low noise floor on its transmit chains.

From antenna-to-processor, NXP offers a robust portfolio of technologies for accelerating 5G deployments that deliver best-of-class performance and security for infrastructure, industrial, and automotive applications. This includes the company's Airfast family of RF power solutions, Layerscape Access LA1200 family of software defined baseband processors for mmWave and sub-6GHz integrated small cell, DU, RU, and CPE, and its Layerscape family of multicore processors for wireless data links, fixed wireless access, and small cell devices.

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Renesas Introduces Two New Dual-Polarization 5G mmWave Beamformer ICs

Renesas Introduces Two New Dual-Polarization 5G mmWave Beamformer ICs Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has expanded its 5G beamformer IC family with two new dual-polarization mmWave devices optimized for 2x2 antenna architecture for 5G and broadband wireless applications with best-in-class performance in the n257, n258, and n261 bands. The highly integrated F5288 and F5268 transmitter/receiver (8T8R) chipsets sit on a small 5.1 x 5.1mm BGA package and feature the industry’s highest Tx output power capability in silicon – delivering more than 15.5 dBm linear output power per channel. With this combination, Renesas enables cost-efficient radio design with extended signal reach for wireless infrastructure applications including wide-area, small cell and macro base stations, as well as CPE, fixed wireless access (FWA) access points, and various other applications.

The new F5288 and F5268 ICs use the unique Dynamic Array Power (DAP) technology to enable high-efficiency operation at linear output power levels programmable from 10 dBm up to 16 dBm. This makes the third-generation ICs ideal for use in mobile and fixed wireless applications with a wide range of output power requirements. This flexibility allows communications customers to reduce design times by repurposing their antenna array designs across different applications.

“Adequate signal range – or lack thereof – remains the biggest challenge as the industry shifts to 5G mmWave technologies for both urban and suburban mobile and fixed wireless networks,” said Naveen Yanduru, Vice President of RF Communications Product Division at Renesas. “Renesas’ new beamformer ICs are a game changer for this evolving market, offering small, integrated beamforming solutions with high output power that enable communications customers to implement cost-effective base station and FWA designs for long-range wireless applications.”

About the F5288 and F5268 5G mmWave Beamforming ICs

Renesas’ third-generation mmWave beamformer ICs address all the beamforming capabilities required by 5G systems while achieving the highest linear RF output power in any silicon technology with high efficiency.

The ICs’ dual-polarization 8-channel architecture provides a highly symmetric and very low loss antenna routing network to improve overall antenna efficiency and reduce board costs. The exposed die package allows for more efficient thermal management at the board with improved heat dissipation through the back of the IC. In addition, Renesas designed the package pin map to simplify board design and reduce design risks. Lower complexity PCB design with minimum layer counts results in reduced board costs and faster time to market.

The F5288 and F5268 ICs also feature several of Renesas’ state-of-the-art technologies to enhance array-level performance. Dynamic Array Power technology allows for a graceful scaling of output power with high efficiency. ArraySense technology with comprehensive on-chip sensor network allows users to monitor IC performance in array operation and apply critical corrections real-time. RapidBeam advanced digital control technology enables simultaneous synchronous and asynchronous control of several beamformer ICs to achieve extremely fast beam steering operations.

Additional features include:

26.5 GHz – 29.5 GHz (F5288) and 24.25 GHz – 27.5 GHz (F5268) operation Advanced temperature compensation techniques to minimize RF performance degradation with varying temperatures State-of-the-art phase and gain control including 360° phase control range with true 6-bit resolution and up to 31.5dB gain control with 0.5dB steps Improved Rx linearity modes to provide additional flexibility for the receiver lineup Rx noise figures as low as ~4.5dB at room temperature and under 5.5dB at temperatures up to 95°C To further simplify system design, customers can leverage Renesas’ new Base Station Antenna Front End Winning Combination, which features the new F5288 and F5268 beamformer ICs along with the company’s F5728 up/down converters, 8V97003 wideband mmWave synthesizer, and a variety of Renesas PMIC devices. Renesas offers over 250 Winning Combinations featuring complementary analog, power, timing devices, and embedded processing to provide an easy-to-use architecture, simplify the design process, and significantly reduce design risk for customers in a wide variety of applications.