#Semiconductor Wafer Polishing and Grinding Equipment Market trends

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Semiconductor Wafer Polishing and Grinding Equipment Market: Trends and Insights

Market Overview

The Semiconductor Wafer Polishing and Grinding Equipment Market is expected to register a CAGR of 4.1% during the forecast period. The global semiconductor wafer polishing and grinding equipment market has been witnessing steady growth, driven by the rising demand for miniaturized electronic devices and advanced semiconductor fabrication technologies. The increasing adoption of System-on-Chip (SoC), microelectromechanical systems (MEMS), and advanced packaging techniques has further propelled market expansion.

Key Market Drivers

Surging Demand for Consumer Electronics – The proliferation of smartphones, laptops, smart devices, and IoT-connected appliances fuels the need for high-performance semiconductors.

Growth in AI and 5G Technologies – AI-driven applications and the widespread deployment of 5G networks demand sophisticated semiconductor chips, boosting the need for precision wafer processing.

Advancements in Semiconductor Manufacturing – The shift towards 3D ICs, FinFET technology, and smaller node sizes (7nm, 5nm, and beyond) has necessitated advanced wafer grinding and polishing techniques.

Rising Demand for Automotive Electronics – The increasing use of semiconductor-based sensors, processors, and controllers in electric vehicles (EVs) and autonomous vehicles contributes to market growth.

Increase in Foundry Investments – Leading semiconductor manufacturers such as TSMC, Samsung, and Intel are heavily investing in new fabrication plants, further driving the demand for wafer processing equipment.

Market Segmentation

The market is segmented based on equipment type, wafer size, application, and geography.

1. By Equipment Type

Wafer Grinding Equipment – Used for thinning wafers to the desired thickness for different applications.

Wafer Polishing Equipment – Ensures smooth surfaces and removes defects to improve wafer quality.

CMP (Chemical Mechanical Polishing) Equipment – Provides a hybrid polishing approach for high-precision semiconductor processing.

2. By Wafer Size

150mm Wafers

200mm Wafers

300mm Wafers (Dominant segment) – Most advanced semiconductor production relies on larger wafer sizes to improve yield and efficiency.

3. By Application

Memory & Logic ICs – Used in computing and data storage applications.

Power Devices – Essential for energy-efficient systems in electric vehicles and renewable energy applications.

MEMS & Sensors – Integral to industrial automation, healthcare, and smart consumer electronics.

Optoelectronics – Widely used in LED, laser, and photonic applications.

4. By Geography

North America – Leading due to strong semiconductor industry players like Intel, AMD, and Qualcomm.

Asia-Pacific (Largest Market) – Driven by semiconductor giants in Taiwan, South Korea, and China.

Europe – Growing demand for automotive and industrial semiconductor applications.

Rest of the World – Emerging semiconductor manufacturing hubs in the Middle East and Latin America.

Industry Challenges

Despite strong growth, the industry faces several challenges:

High Capital Investment – The cost of wafer polishing and grinding equipment is significant, impacting smaller semiconductor manufacturers.

Technological Complexity – Achieving ultra-thin wafers without defects requires advanced and precise equipment.

Supply Chain Disruptions – Semiconductor shortages and geopolitical factors affect the availability of raw materials and machinery components.

Stringent Regulatory Standards – Environmental regulations around chemical usage in polishing and grinding processes require manufacturers to adopt sustainable practices.

Market Trends and Innovations

Automation & AI Integration – Adoption of AI-driven predictive maintenance and automation in wafer processing to enhance efficiency.

Sustainable Manufacturing – Development of eco-friendly CMP slurries and water-recycling systems to reduce environmental impact.

Hybrid Processing Techniques – Combination of CMP and mechanical polishing to improve wafer uniformity and precision.

Emergence of 450mm Wafers – Although still in development, larger wafer sizes could revolutionize semiconductor production.

Future Outlook

The semiconductor wafer polishing and grinding equipment market is poised for sustained growth, driven by ongoing technological advancements and the increasing need for high-performance semiconductors. With strong investments in semiconductor fabrication plants and growing demand for AI, 5G, and automotive electronics, manufacturers are expected to prioritize innovation in wafer processing solutions.

Companies investing in automation, sustainable practices, and precision technologies will likely gain a competitive edge in this evolving industry. The future of semiconductor manufacturing will depend on how efficiently companies can scale up production while maintaining wafer quality and sustainability.

Conclusion

The semiconductor wafer polishing and grinding equipment market is an integral part of the rapidly expanding semiconductor industry. As demand for smaller, more efficient, and powerful semiconductor chips continues to grow, advancements in wafer processing technology will play a crucial role in shaping the future of electronics. By addressing industry challenges and leveraging cutting-edge innovations, market players can capitalize on the tremendous growth opportunities in this sector. For a detailed overview and more insights, you can refer to the full market research report by Mordor Intelligence. https://www.mordorintelligence.com/industry-reports/semiconductor-wafer-polishing-and-grinding-equipment-market

[peeterdbmr]

Wafer is a thin piece of a semiconductor which is usually made of crystalline silicon which is mainly used as a base for the silicon based photovoltaic cell and to fabricate electronic integrated circuits. Today, thin wafers are more in demand as electronics are getting smaller and smaller with time. Grinding machine as the name suggest is a machine which is used for grinder.

[abhigmi]

Semiconductor Manufacturing Equipment Market to Observe Rugged Expansion at a Top CAGR by 2027

The semiconductor manufacturing equipment market is anticipated to record notable growth by 2027 on account of soaring adoption of electric vehicles worldwide. In addition, increasing prevalence of IoT devices is set to drive market expansion over the forecast period.

Semiconductor manufacturing equipment refers to equipment that are typically used to produce semiconductor devices. Booming consumer demand for higher performing semiconductors has stimulated constant improvements in the technology employed in the products. Moreover, increasing focus on R&D activities to develop high-quality semiconductor manufacturing equipment to match the fast-paced progress in chip technology has fostered product outlook in recent years.

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Furthermore, industry players are employing lucrative strategies to gain a competitive edge in the market, which has positively impacted the overall business landscape. For instance, in September 2021, Applied Materials, Inc., a key software, services, and equipment manufacturer for semiconductor devices, launched its novel products namely, the VIISta 900 3D hot ion implant system and the Mirra Durum CMP system.

The VIISta 900 injects ions while minimizing the damage caused to the lattice structure, thereby providing 40 times lesser resistivity as compared to a room temperature implant. Meanwhile, the Mirra Durum CMP system combines cleaning, polishing, drying, and material removal measurement in a single system to produce consistent wafers with the finest quality surfaces. Both products have been designed to assist silicon carbide (SiC) chipmakers in achieving 200mm production.

In another instance, in November 2020, ASML, a leading manufacturer of chipmaking equipment, completed the acquisition of Berliner Glas Group, a major manufacturing technology provider that specializes in optical systems. The deal enabled ASML to broaden its product portfolio and production capacity significantly.

The semiconductor manufacturing equipment market has been segmented on the basis of supply chain process, product, dimension, and region. With respect to product, the market has further been categorized into back-end equipment (test equipment, wafer manufacturing equipment, assembly & packaging equipment, and others) and front-end equipment (water surface conditioning equipment, lithography, polishing & grinding, and others).

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Under back-end equipment, the assembly & packaging equipment segment is projected to amass substantial gains by 2027, progressing at a CAGR of approximately 7.0% over the forecast timeframe. Mounting demand for advanced packaging-based chipsets in consumer electronics products and connected devices is likely to bolster segmental growth over 2021-2027.

From the regional point of view, the LAMEA semiconductor manufacturing equipment market is expected to register around 6.0% CAGR through the analysis period to reach a sizable valuation by the end of 2027. Rising number of government initiatives supporting the development of the semiconductor manufacturing industry across LAMEA is estimated to boost regional market expansion over the following years.

Table of Contents (ToC) of the report:

Chapter 1   Methodology and Scope

1.1    Scope & definition

1.2    Methodology & forecast

1.3    Data Sources

1.3.1    Primary

1.3.2    Secondary

Chapter 2   Executive Summary

2.1    Semiconductor manufacturing equipment market 3600 synopsis, 2016 - 2027

2.1.1    Business trends

2.1.2    Regional trends

2.1.3    Product trends

2.1.4    Dimension trends

2.1.5    Supply chain process

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Semiconductor Manufacturing Industry Research Report - Global Forecast to 2030

Global Semiconductor Production Equipment Market - Overview

The semiconductor production equipment market is garnering substantial traction across the globe. The market growth is attributed to rapid industrialization and economic growth.  Besides, large technological advances in telemetry solutions and semiconductor products push the growth of the market.  Information and communication industries worldwide are creating a significant demand for semiconductor production equipment.  Moreover, rising usages of chips in smart meters, plug-in electric vehicles, solar panels, wind turbines, and others accelerate the market demand.

In its recent analysis, Market Research Future (MRFR) asserts that the global Semiconductor Production Equipment Market valuation is poised to reach approx. USD 63 BN by 2023, growing approximately at 7% CAGR during the assessment period (2017-2023). The rising trend of additive manufacturing (AM), 3D printing, and computer-controlled processes boosts market growth.

Semiconductors have transformed the patterns of generation, distribution, and consumption of energy across the industries. Additive manufacturing has changed the supply chain from the production of parts to higher performance using subtractive methods. Hence, innovative designs enable agile supply chains to adopt Industry 4.0 principles. Additionally, increasing R&D investments to develop new metal alloys designs and technologies.

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Semiconductor products have transformed the process of generation, distribution, and consumption of energy. Additive manufacturing allows the transformation of the supply chain from production of parts manufactured by subtractive methods, to higher performance, innovative designs that enable agile supply chains to adopt Industry 4.0 principles. Additionally, increasing investments to develop new metal alloys designs and technologies

Increasing uptake of GaAs technology in Field Effect Transistors (FET) and integrated circuits (ICs) for high velocity and high electric field applications pushes the growth of the market. On the other hand, the high manufacturing cost of semiconductor production equipment is a significant factor projected to impede market growth. Nevertheless, growing usages of semiconductor equipment in power amplifiers for transmitting high-speed signals, ultra-high radio frequency, and fast electronic switching applications would support the market growth throughout the forecast period.

Semiconductor Production Equipment Market – Segments

The report is segmented into four dynamics;

By Equipment Type    : Front-End Equipment, Backend Equipment, and others.

By Products               : Dicing Machine, Probing Machines, Sliced Wafer Demounting, Cleaning Machine, Wafer Edge Grinding Machine, Polish Grinders, and others.

By Dimension             : 2D, 5D, 3D, and others.

By Regions                             :  North America, Europe, APAC and the Rest-of-the-World.

Global Semiconductor Production Equipment Market – Regional Analysis

North America dominates the global semiconductor production equipment market. The market growth attributes to the due to the presence of notable industry players producing the chips and technological advances required to manufacture semiconductor products. Besides, the proliferation of semiconductor production equipment in the region drives the growth of the market.

Moreover, the rising usages of photovoltaic, optoelectronic, and wireless communication devices boost the demand in the semiconductor manufacturing equipment market. The North American semiconductor production equipment market is projected to retain its dominance throughout the estimated period.

Europe is another lucrative market for semiconductor production equipment. The market growth is driven by the spurring growth in the solar cells, automotive, electronics, and aerospace & defense sectors. Additionally, the need for a safe, reliable, and clean energy source in various countries influences the regional market's growth, driving the solar cell industry. Germany and the UK are well-established semiconductor production equipment markets in the region. The European semiconductor production equipment market is expected to witness rapid growth in the upcoming period.

The semiconductor production equipment market in the Asia Pacific demonstrates steady growth. Factors such as the rising numbers of smartphone users and the increasing demand for technological advances in gadgets such as computers, laptops, and smartphones foster regional market growth. Besides, the proliferating electronics sector in the region creates substantial market demand. Moreover, rising government support and funding by industry players promote the usages of semiconductor production equipment.

China, Japan, South Korea, and India have emerged as key markets for semiconductor production equipment in the region, growing at an impressive CAGR. Companies in the APAC take an interest in producing semiconductor production equipment to meet the changing customer demand. Cumulatively, these factors drive the growth of the regional market. The APAC semiconductor production equipment market is expected to demonstrate moderate growth during the forecast period.

Semiconductor Production Equipment Market - Competitive Landscape

Highly competitive, the global semiconductor production equipment market appears fragmented due to the presence of many players. To gain a larger competitive advantage, players incorporate strategic initiatives such as mergers & acquisitions, expansion, collaboration, and product/ technology launch.

These players invest substantially to transform the consumer and business landscape. Also, industry players make substantial R&D investments in developing the product and

technology. To widen their reach t customers, they offer discount offers, such as the end of season sale offerings.

Major Players:

Players leading the semiconductor production equipment market include Micron Technology Inc. (US), Qualcomm Technologies, Inc. (US), Intel Corporation (US), AlsilMaterial (US), Applied Materials Inc. (US), Atecom Technology Co., Ltd (Taiwan), LAM RESEARCH Corporation (US), Tokyo Electron Limited (Japan), KLA-Tencor Corporation (US), Teradyne Inc. (US), Screen Holdings Co., Ltd (Japan), Samsung Group (South Korea), and ASML Holdings NV (Netherlands), among others.

Industry/ Innovation/Related News

August 05, 2020 ---- Lam Research Corporation (the US), a leading semiconductor product company, announced signing a strategic agreement with a US-based metal additive manufacturing (AM) solution provider - VELO3D Inc. (the US) to use metal AM applications for the production of semiconductor capital equipment.

The joint development agreement includes collaboration on novel materials and designs in metal additive manufacturing (AM)/3D printing applications for the semiconductor sector. LAM also plans to increase the volume of parts produced by AM over the next five years.

Lam Research engages in the design, manufacture, marketing, and service of semiconductor processing equipment used to fabricate integrated circuits. It leverages additive manufacturing as a driver of the innovation that enables its customers to build faster, robust, and more power-efficient electronic devices for everyday use.

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Semiconductor Production Equipment Market 2021 Analysis, Research Depth Study and Forecast 2023

Market Research Future published a research report on “Semiconductor Production Equipment Market Research Report - Global Forecast 2023” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.

Market Overview:

The semiconductor production equipment market is growing rapidly. The market increase attributes to rapid industrialization and economic growth worldwide. Besides, vast technological advances in telemetry solutions and semiconductor products drive the development of the market.  The information and communications industries have a massive demand for semiconductor production equipment. These equipment offer higher performance chips delivered from equipment suppliers.

Moreover, rising usages of chips in plug-in electric vehicles, smart meters, solar panels, wind turbines, and sensors, escalate market growth. According to Market Research Future (MRFR), the global Semiconductor Production Equipment Market is expected to reach approximately USD 63 BN by 2023, growing at 7% CAGR during the forecast period (2017-2023). The proliferation of additive manufacturing (AM) or additive layer manufacturing method, 3D printing, and computer-controlled processes boost the market growth.

Semiconductor products have transformed the process of generation, distribution, and consumption of energy. Additive manufacturing allows the transformation of the supply chain from production of parts manufactured by subtractive methods, to higher performance, innovative designs that enable agile supply chains to adopt Industry 4.0 principles. Additionally, increasing investments to develop new metal alloys designs and technologies

Increasing uptake of GaAs technology in Field Effect Transistors (FET) and integrated circuits (ICs) for high velocity and high electric field applications pushes the growth of the market. On the other hand, the high manufacturing cost of semiconductor production equipment is a significant factor projected to impede market growth. Nevertheless, growing usages of semiconductor equipment in power amplifiers for transmitting high-speed signals, ultra-high radio frequency, and fast electronic switching applications would support the market growth throughout the forecast period.

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Segmentation

The global semiconductor production market has been segmented based on type, products, and dimension. By type, the market has been segmented into front-end equipment, backend equipment, and others. By products, the market has been segmented into dicing machine, wafer manufacturers, sliced wafer demounting, cleaning machine, wafer edge grinding machine, polish grinders, probing machines, and others. By dimension, the market has been segmented into 2D, 2.5D, 3D, and others.

Key Players

The prominent players in the Semiconductor Production Equipment Market are – Qualcomm Technologies, Inc. (US), Micron Technology Inc. (US), Intel Corporation (US), Applied Materials Inc. (US), AlsilMaterial (US), Atecom Technology Co., Ltd (Taiwan), Tokyo Electron Limited (Japan), LAM RESEARCH Corporation (US), KLA-Tencor Corporation (US), Screen Holdings Co., Ltd (Japan), Teradyne Inc. (US), ASML Holdings N.V.  (Netherlands), and Samsung Group (South Korea) among others.

Regional Analysis

The global semiconductor production equipment market spans across the regions of North America, Europe, Asia Pacific, and the Rest of the World. North America is the largest market for semiconductor production equipment followed by Europe. Asia Pacific is an emerging market semiconductor production equipment and is led by the economies of China, India, and Japan.

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Semiconductor Production Equipment Market - Competitive Landscape

Highly competitive, the global semiconductor production equipment market appears fragmented due to the presence of many players. To gain a larger competitive advantage, players incorporate strategic initiatives such as mergers & acquisitions, expansion, collaboration, and product/ technology launch.

These players invest substantially to transform the consumer and business landscape. Also, industry players make substantial R&D investments in developing the product and

technology. To widen their reach t customers, they offer discount offers, such as the end of season sale offerings.

About Us:

Market Research Future (MRFR) is an esteemed company with a reputation of serving clients across domains of information technology (IT), healthcare, and chemicals. Our analysts undertake painstaking primary and secondary research to provide a seamless report with a 360 degree perspective. Data is compared against reputed organizations, trustworthy databases, and international surveys for producing impeccable reports backed with graphical and statistical information.

We at MRFR provide syndicated and customized reports to clients as per their liking. Our consulting services are aimed at eliminating business risks and driving the bottomline margins of our clients. The hands-on experience of analysts and capability of performing astute research through interviews, surveys, and polls are a statement of our prowess. We constantly monitor the market for any fluctuations and update our reports on a regular basis.

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Silicon Wafer Reclaim Market - Anticipated To Witness High Growth In The Near Future

Silicon wafer reclaim is a wafer that is processed, stripped, polished, cleaned, and reprocessed for various applications such as for the manufacturing of solar cells, integrated circuits, and more. Furthermore, it is a process that converts used wafer into a functioning good quality wafer known as test wafer at a much cheaper cost. With the help of silicon wafer reclaim, companies can prominently reduce the cost of purchasing new wafers. Silicon reclaim wafers are thinner in size as compared to unused wafers and generally offer the same performance as an unused or virgin test wafer. Basically, a silicon wafer reclaim process begins with sorting, inspection, and evaluation for the prevention of metallic contamination in the reclaim process. Furthermore, through the stripping process, the metallic films on the wafer are removed. This is followed by another process known as grinding process, which is used to remove the additional metallic films from the silicon wafer. Prior to the packaging, a silicon wafer is finally cleaned, inspected, and certified. Cleaning of the silicon wafer is done for the reduction of metallic level.

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The increasing cost of silicon wafers, their rising demand for the manufacturing of chips or micro-chips used in electronic devices, and increasing application of silicon wafers to diagnose the process conditions and status of the equipment used in semiconductor manufacturing processes is expected to boost the global silicon wafer reclaim market. Silicon is a vital and high quality material used in the manufacturing of semiconductors. Reclaiming the wafers is an economical program that high volume manufacturers of chips undertake to increase the significance of silicon substrates previously used. Due to the steep cost of superior quality silicon and its consumption in huge volumes by various industries, large number of semiconductor facilities monitor and optimize their manufacturing equipment and processes with the help of reclaimed wafers.

Complexity of the silicon wafer reclaim process that includes sorting, stripping, lapping, polishing, and inspecting could restrain the growth of the silicon wafer reclaim market. For instance, during the inspection stage prior to fabrication, the wafers are sorted on the basis of thickness. Typically a certain amount of defect levels needs to be maintained. Any error in measuring the defect levels can hamper the entire fabrication process, as it is used for troubleshooting equipment used for the process of fabrication. However, the increasing technological investment by well-established players to simplify the reclaiming process is expected to overcome this complexity.

The silicon wafer reclaim market can be segmented on the basis of product type, application, and regions. On the basis of product type, the market can be segmented into 150mm, 200mm, 300mm, and others. On the basis of application, the market can be segmented into solar powered cells, integrated circuits, and others.

Geographically the silicon wafer reclaim market is segmented into North America, Europe, Asia Pacific, Middle East & Africa, and South America. North America and Europe are expected to lead due to technological advancements, growing demand for low cost silicon wafer for the semiconductor industry, and presence of well-established players in the silicon wafer reclaim market across countries such as the U.S. and Canada. However, continuously growing industrialization in China and the “Make in India” initiative to set up semiconductor wafer plants in India is expected to drive the silicon wafer reclaim market at a significant pace.

Some of the key players in the silicon wafer reclaim market are MicroTech Systems, Inc., Phoenix Silicon International Corporation, RS Technologies Co., Ltd., Shinryo Corporation, Silicon Materials, Inc., Silicon Valley Microelectronics, Inc., Pure Wafer, Noel Technologies, Inc., NOVA Electronic Materials, LLC., Optim Wafer Services, Silicon Quest, NanoSILICON, Inc., and many more.

The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

The study is a source of reliable data on:

Market segments and sub-segments

Market trends and dynamics

Supply and demand

Market size

Current trends/opportunities/challenges

Competitive landscape

Technological breakthroughs

Value chain and stakeholder analysis

The regional analysis covers:

North America (U.S. and Canada)

Latin America (Mexico, Brazil, Peru, Chile, and others)

Western Europe (Germany, U.K., France, Spain, Italy, Nordic countries, Belgium, Netherlands, and Luxembourg)

Eastern Europe (Poland and Russia)

Asia Pacific (China, India, Japan, ASEAN, Australia, and New Zealand)

Middle East and Africa (GCC, Southern Africa, and North Africa)

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The report has been compiled through extensive primary research (through interviews, surveys, and observations of seasoned analysts) and secondary research (which entails reputable paid sources, trade journals, and industry body databases). The report also features a complete qualitative and quantitative assessment by analyzing data gathered from industry analysts and market participants across key points in the industry’s value chain.

A separate analysis of prevailing trends in the parent market, macro- and micro-economic indicators, and regulations and mandates is included under the purview of the study. By doing so, the report projects the attractiveness of each major segment over the forecast period.

Highlights of the report:

A complete backdrop analysis, which includes an assessment of the parent market

Important changes in market dynamics

Market segmentation up to the second or third level

Historical, current, and projected size of the market from the standpoint of both value and volume

Reporting and evaluation of recent industry developments

Market shares and strategies of key players

Emerging niche segments and regional markets

An objective assessment of the trajectory of the market

Recommendations to companies for strengthening their foothold in the market

[bunnyroy]

New Report on Global Semiconductor Wafer Polishing And Grinding Equipment Industry 2017 at Market Research Nest

MarketResearchNest.com adds “Global Semiconductor Wafer Polishing And Grinding Equipment Market 2017-2021” new report to its research database. The report spread across 105 pages with table and figures in it.

  Research analysts forecast the global semiconductor wafer polishing and grinding equipment market to grow at a CAGR of 7.10% during the period 2017-2021.

  About Semiconductor Wafer…

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Semiconductor Capital Equipment Market Global Opportunity Analysis and Industry Forecast 2026

Semiconductor capital equipment industry comprises of manufacturers and market machines, which are involved in the production of electronic devices. Front end process include silicon wafer fabrication such photolithography, deposition, ion implantation, cleaning, etching, back grinding, and chemical & mechanical polishing. Thus, it includes all the process from manufacturing till testing of the semiconductor equipment. The innovation and growth in use of portable digital devices such as smart wearable, display panels, smartphones, and tablets influence the semiconductor capital equipment market. The development of chemical mechanical planarization for altering the thickness of wafer is the need of current scenario.

The key players covered in the semiconductor capital equipment industry are Applied Materials, Inc., Concurrent Design, Inc., EV Group, ASML Holding, Hitachi High-Technologies, Lam Research Corporation, Tokyo Electron Limited, Advantest, AMEC, and ACCRETECH – Tokyo Seimitsu.

The factors including innovation and development of smart and portable devices, increase in digitalization in various industrial verticals and application of IoT in the digital electronic devices. The increase in adoption of digital electronic devices in various verticals such as for data handling in data centers, panel displays in manufacturing and process industries and rise in use of smart wearables in consumer electronics have increased the production of electronic devices which requires semiconductor components integrated in a compact architecture. This requires advance processing like etching, ion implantation, wafer back grinding, chemical vaporization, polishing for offering proficiency in the manufacturing of semiconductor component.

Further, the use of technologies like AI-machine learning, IoT in the manufacturing of semiconductor devices and components which uses robotics arms and digitally fed data to operate and process wafers on the assembly line. The technological growth boosts the semiconductor capital equipment market growth.

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However, the fluctuating cost of copper and silicon that act as raw material to the semiconductor component act as major restraint to the growth of the semiconductor capital equipment market. In addition, the high initial cost of setup and installation due to limited manufacturers of manufacturing machines and setup impact the market of semiconductor capital equipment negatively. Further, the trade war between U.S.-China has impacted the semiconductor industry. In future, the construction of smart cities would require smart sensors, smart display panel devices and various other digital electronics which would boost the semiconductor capital equipment market growth.

The semiconductor capital equipment market is segmented on the basis of type, application, industrial vertical, and region. On the basis of type, it is classified into assembly equipment, automated test equipment, and wafer level manufacturing equipment. On the basis of application, it is divided into Wafer Processing, Surface Conditioning, Chemical Mechanical Planarization, Chemical Vapor Deposition and Assembly and Packaging Equipment. On the basis of industrial vertical, it is categorized into electronics, medical and healthcare, automotive, IT and telecommunication. On the basis of region, it is studied across North America, Europe, Asia-Pacific, and LAMEA.    

KEY BENEFITS FOR STAKEHOLDERS

This study includes the analytical depiction of the global semiconductor capital equipment market along with the current trends and future estimations to determine the imminent investment pockets.

The report presents information regarding the key drivers, restraints, and opportunities.

The semiconductor capital equipment market is quantitatively analyzed from 2019 to 2026 to highlight the financial competency of the industry.

Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the industry.

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Dicing Blades Market Industry Analysis, Trend and Growth, 2019-2027

Dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process involves scribing and breaking, mechanical sawing with a dicing saw, or laser cutting. All methods are typically automated to ensure precision and accuracy. Dicing blades are expendable tools used with dicing and cutting saws to groove, cut, and dice silicon, compound semiconductors, glass, ceramics, crystals, and almost any other material.

Dicing Blades Market – Competitive Landscape

DISCO Corporation

Founded in 1937, DISCO Corporation has its headquarters in Tokyo, Japan. The company has established itself in designing, manufacturing, and distributing a wide-ranging product variety of precision grinding, cutting, and polishing machines such as surface planers, dicing saws, grinders, laser saws, polishers, die separators, wafer mounters, and waterjet saws. The company also provides precision processing tools such as grinding wheels, dicing blades, and dry polishing wheels. It has offices in Europe, North America, and Asia. In 2015, DISCO Corporation introduced the DAD3660, a dual spindle automatic dicing saw with support for workpieces as large as 360 mm x 360mm. The company also introduced a unique Laser Lift-off optimal for high brightness vertical structured LED manufacturing.

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Kulicke & Soffa Industries, Inc.

Incorporated in 1951, Kulicke & Soffa Industries, Inc. is based in Singapore. The company specializes in designing, manufacturing, and distributing tools to assemble semiconductor devices and capital equipment. These products include Advanced Packaging (Flip-Chip), Advanced Packaging (TCB), Advanced Packaging (Hybrid), Ball Bonder, Die Attach, Electronics Assembly, Lithography, Wafer Level Bonder, Wedge Bonder, Consumables, Capillaries, Dicing Blades, and Wedge Bond Consumables. The company provides its products and services to automotive, consumer, data processing, industrial, and communication industry. It has presence in China, Germany, Israel, Japan, Malaysia, Netherlands, Philippines, Switzerland, South Korea, Taiwan, Thailand, and the U.S.

Ceiba Technologies

Ceiba Technologies is based in Chandler, Arizona, the U.S., and has experience of over 25 years. The company is engaged in designing and manufacturing precision required applications such as dicing and slicing of soft to hard materials of different elements and different type that are used in hard disk drives, semiconductors, and optical applications. The company offers hubless and hub style blades. The hubless style blades provide different bond ranging, types, from electroformed, resin, metal (sintered), and vitrified.

Major companies active in the global dicing blades market includes Ceiba Technologies, ADT – Advanced Dicing Technologies, UKAM Industrial Superhard Tools, DISCO Corporation, Kulicke & Soffa Industries, Inc., Nippon Pulse Motor Taiwan, S.Diamond Industry Co., Ltd, Kinik Company, Industrial Tools, Inc., Hamamatsu Photonics K.K., Loadpoint, and BE Maschinenmesser GmbH & Co. KG. The market is highly competitive and consolidated due to the presence of established vendors all across the world. Key players are focusing on raising their productivity to expand their topographical reach and increase their customer base. Manufacturers are focusing on quality, price, technology upgrade, and brands to compete with their peers to gain significant market share in the dicing blades market.

Dicing Blades Market – Dynamics

Growing Market in the Asia Pacific Region

Currently, rising adoption of dicing blades in Asia Pacific is anticipated to surge the growth of the market and the region is expected to continue its dominance during the forecast years. In addition, China is one of the major consumers of dicing blades globally in the last few years and is projected to hold its position throughout the forecast years 2019 to 2027. Apart from China, Korea, Japan, and the U.S. are likely to increase investment in the dicing blades market.

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Semiconductor Production Equipment Market 2021 Developments and Forecast 2023

Market Research Future published a research report on “Semiconductor Production Equipment Market Research Report - Global Forecast 2023” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.

Market Overview:

The global semiconductor production equipment market has been evaluated as a growing market and is expected to capture a CAGR of 7% reaching USD 63 Billion over the forecast period of 2017-2023, asserts Market Research Future (MRFR) in a detailed research report. The market growth is driven by demand from various industries such as automotive, and consumer electronics. There has been an exponential growth in the Semiconductor Production Equipment Market due to inflated demand for semiconductor production equipment for application in diverse industries. Semiconductor production equipment experiences high demand from the automotive sector which boosts the growth of the market. In the automotive industry, semiconductors are used for the production of memory and image sensors and are also being used in the Driver assistance Systems technology. Moreover, semiconductor production equipment is used in the production of various consumer electronics such as home appliances, tablets, smartphones, flat-panel televisions, and others. A broad array of electronic products, including smartphones rely on semiconductors to offer increased performance and to keep up with the latest technologies. Thus, growth in the consumer electronics industry and rapidly expanding other end-use industries drive the growth of the global semiconductor production equipment market. Major trends taking place in the semiconductor production equipment market such as copper for metalization and low-k (k = dielectric constant) dielectrics will further help the market expand over the forecast period. However, continual improvements in semiconductor device performance and regulations mandating doubling of chip density approximately every 18 months has become a bottleneck for the growth of the global semiconductor production equipment market.

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Segmentation

The global semiconductor production market has been segmented based on type, products, and dimension. By type, the market has been segmented into front-end equipment, backend equipment, and others. By products, the market has been segmented into dicing machine, wafer manufacturers, sliced wafer demounting, cleaning machine, wafer edge grinding machine, polish grinders, probing machines, and others. By dimension, the market has been segmented into 2D, 2.5D, 3D, and others.

Key Players

The prominent players in the Semiconductor Production Equipment Market are – Qualcomm Technologies, Inc. (US), Micron Technology Inc. (US), Intel Corporation (US), Applied Materials Inc. (US), AlsilMaterial (US), Atecom Technology Co., Ltd (Taiwan), Tokyo Electron Limited (Japan), LAM RESEARCH Corporation (US), KLA-Tencor Corporation (US), Screen Holdings Co., Ltd (Japan), Teradyne Inc. (US), ASML Holdings N.V.  (Netherlands), and Samsung Group (South Korea) among others.

Regional Analysis

The global semiconductor production equipment market spans across the regions of North America, Europe, Asia Pacific, and the Rest of the World. North America is the largest market for semiconductor production equipment followed by Europe. Asia Pacific is an emerging market semiconductor production equipment and is led by the economies of China, India, and Japan.

Industry Updates

In September 2018, Intel announced that it would be pushing the production of the 14nm chip to Taiwan Semiconductor Manufacturing Company (TSMC) since it is unable to keep up with the demand. Intel intends to outsource the production of its entry-level H310 and other 300 series desktop processors to TSMC so that it can concentrate on its high-margin products.

In August 2018, Micron Technology, Inc., announced an investment of USD 3 Billion in its semiconductor manufacturing plant in Manassas, Virginia. The investment will not only support Micron's leadership in the rapidly growing market but will also help in the creation of 1,100 jobs by the end of 2023.

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TABLE OF CONTENTS

LIST OF FIGURES

Figure 1 Research Methodology

Figure 2 Semiconductor Production Equipment Market: By Type (%)

Figure 3 Semiconductor Production Equipment Market: By Products (%)

Figure 4 Semiconductor Production Equipment Market: By Dimension (%)

Figure 5 Semiconductor Production Equipment Market: By Region (%)

Figure 6 North America Semiconductor Production Equipment Market, By Type (%)

Figure 7 North America Semiconductor Production Equipment Market, By Products (%)

Figure 8 North America Semiconductor Production Equipment Market, By Dimension (%)

Figure 9 North America Semiconductor Production Equipment Market, By Region (%)

Figure 10 Europe Semiconductor Production Equipment Market, By Type (%)

Figure 11 Europe Semiconductor Production Equipment Market, By Products (%)

Figure 12 Europe Semiconductor Production Equipment Market, By Dimension (%)

Figure 13 Europe Semiconductor Production Equipment Market, By Region (%)

Figure 14 Asia-Pacific Semiconductor Production Equipment Market, By Type (%)

Continued…

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SEmiconductor Wafer Polishing and Grinding Equipment Market Trends, Key Players, Overview, Competitive Breakdown And Regional Forecast By 2026 | TOKYO SEIMITSU CO., LTD, Logomatic GmbH, Komatsu NTC

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Semiconductor Capital Equipment Market is Expected To Witness Lucrative Growth Till 2026

Semiconductor capital equipment industry comprises of manufacturers and market machines, which are involved in the production of electronic devices. Front end process include silicon wafer fabrication such photolithography, deposition, ion implantation, cleaning, etching, back grinding, and chemical & mechanical polishing. Thus, it includes all the process from manufacturing till testing of the semiconductor equipment. The innovation and growth in use of portable digital devices such as smart wearable, display panels, smartphones, and tablets influence the semiconductor capital equipment market. The development of chemical mechanical planarization for altering the thickness of wafer is the need of current scenario.

The key players covered in the semiconductor capital equipment industry are Applied Materials, Inc., Concurrent Design, Inc., EV Group, ASML Holding, Hitachi High-Technologies, Lam Research Corporation, Tokyo Electron Limited, Advantest, AMEC, and ACCRETECH – Tokyo Seimitsu.

The factors including innovation and development of smart and portable devices, increase in digitalization in various industrial verticals and application of IoT in the digital electronic devices. The increase in adoption of digital electronic devices in various verticals such as for data handling in data centers, panel displays in manufacturing and process industries and rise in use of smart wearables in consumer electronics have increased the production of electronic devices which requires semiconductor components integrated in a compact architecture. This requires advance processing like etching, ion implantation, wafer back grinding, chemical vaporization, polishing for offering proficiency in the manufacturing of semiconductor component.

Further, the use of technologies like AI-machine learning, IoT in the manufacturing of semiconductor devices and components which uses robotics arms and digitally fed data to operate and process wafers on the assembly line. The technological growth boosts the semiconductor capital equipment market growth.

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However, the fluctuating cost of copper and silicon that act as raw material to the semiconductor component act as major restraint to the growth of the semiconductor capital equipment market. In addition, the high initial cost of setup and installation due to limited manufacturers of manufacturing machines and setup impact the market of semiconductor capital equipment negatively. Further, the trade war between U.S.-China has impacted the semiconductor industry. In future, the construction of smart cities would require smart sensors, smart display panel devices and various other digital electronics which would boost the semiconductor capital equipment market growth.

The semiconductor capital equipment market is segmented on the basis of type, application, industrial vertical, and region. On the basis of type, it is classified into assembly equipment, automated test equipment, and wafer level manufacturing equipment. On the basis of application, it is divided into Wafer Processing, Surface Conditioning, Chemical Mechanical Planarization, Chemical Vapor Deposition and Assembly and Packaging Equipment. On the basis of industrial vertical, it is categorized into electronics, medical and healthcare, automotive, IT and telecommunication. On the basis of region, it is studied across North America, Europe, Asia-Pacific, and LAMEA.    

KEY BENEFITS FOR STAKEHOLDERS

This study includes the analytical depiction of the global semiconductor capital equipment market along with the current trends and future estimations to determine the imminent investment pockets.

The report presents information regarding the key drivers, restraints, and opportunities.

The semiconductor capital equipment market is quantitatively analyzed from 2019 to 2026 to highlight the financial competency of the industry.

Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the industry.

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