#Hot Air Reflow Market Size

[businesresearch-blog]

Hot Air Reflow Market Analysis by Global Demands, Product Types and Scope to 2025

January 25, 2019:   Global Hot Air Reflow Market is expected to rise at a moderate CAGR in the forthcoming period. A hot air reflow is a multipurpose soldering device with a combination of soldering station, hot air rework and a DC power supply. These functions can be performed simultaneously or independently resulting into occupying a less area with efficient energy output. Technically, hot air reflow corrects polarized parts, tombstone parts, and cold joints and eliminates defective parts that happen to go unnoticed during the manufacturing process. Further, hot air reflow station is also useful to adjoin missing components and jumpers.

Other uses of hot air reflow include reduction of heat shrink onto wires, recovering electronic components from old circuit boards. On a commercial level, the market for hot air reflow station is gaining a positive traction and also accounting for a significant market position. Driving factors responsible for the growth hot air reflow market includes rise in manufacture of circuit boards that demand soldering accuracy. Also, hot air reflow fixes the errors after manufacture of PCBs which again is considered important from manufacturing point of view, thus adding to the market growth for hot air reflow components.

Request a Sample Copy of This Report @ https://www.millioninsights.com/industry-reports/hot-air-reflow-market/request-sample

Based on segmentation by type, the hot air reflow industry includes 7 zone reflow system, 10 zone reflow system and 12 zone reflow system. Based on segmentation by application, the hot air reflow market includes medical electronics, consumer electronics and automotive electronics.

Geographically, hot air reflow market spans North America, Latin America, Europe, Asia-Pacific, Middle-East and Africa. APAC market is expected to gain a positive traction in the forthcoming period due to soldering demands in industrial sector. North America and Europe market is also expected to gain a significant share in the global market. MEA regions are anticipated to grow at a higher CAGR in the forthcoming period due to the rise in construction activities and heavy presence of industrial and manufacturing sector and also demand for printed circuit boards. The key players in the hot air reflow market include HELLER, ERSA, BTU, JT, Dongguan Pengyi Electronics, Leadsamt and Shenzhen.

View Full Report with TOC @ https://www.millioninsights.com/industry-reports/hot-air-reflow-market

Market Segment:

The major manufacturers covered in this report

HELLER

ERSA

BTU

JT

Dongguan Pengyi Electronics

ShenZhen Leadsmt

Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering

North America

Europe

China

Japan

Southeast Asia

India

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into

7 Zone Reflow System

10 Zone Reflow System

12 Zone Reflow System

On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including

Medical Electronics

Consumer Electronics

Automotive Electronics

Other

Table of Contents

1 Hot Air Reflow Market Overview

2 Global Hot Air Reflow Market Competition by Manufacturers

3 Global Hot Air Reflow Capacity, Production, Revenue (Value) by Region (2013-2018)

4 Global Hot Air Reflow Supply (Production), Consumption, Export, Import by Region (2013-2018)

5 Global Hot Air Reflow Production, Revenue (Value), Price Trend by Type

6 Global Hot Air Reflow Market Analysis by Application

7 Global Hot Air Reflow Manufacturers Profiles/Analysis

8 Hot Air Reflow Manufacturing Cost Analysis

9 Industrial Chain, Sourcing Strategy and Downstream Buyers

10 Marketing Strategy Analysis, Distributors/Traders

11 Market Effect Factors Analysis

12 Global Hot Air Reflow Market Forecast (2018-2025)

The key points of this report are:

To analyze and study the global Hot Air Reflow capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);

Focuses on the key Hot Air Reflow manufacturers, to study the capacity, production, value, market share and development plans in future.

To identify significant trends and factors driving or inhibiting the market growth.

To analyze the opportunities in the market for stakeholders by identifying the high growth segments.

To strategically analyze each submarket with respect to individual growth trend and their contribution to the market

Key Stakeholders

Hot Air Reflow Manufacturers

Hot Air Reflow Distributors/Traders/Wholesalers

Hot Air Reflow Subcomponent Manufacturers

Industry Association

Downstream Vendors

For More Details Visit @ million insights

[shrikrisharathod]

Hot Air Reflow Market Outlook Highlights Major Opportunities Likely to Steer Demand During Forecast Period | Key Players like HELLER, ERSA, BTU, JT

The new report, "Global Hot Air Reflow Market "provides an overview of the recent factors that enable the growth of the global industry. According to the report, recent innovations have several growth opportunities for not only new market entrants, but also dominant companies. Global Market Research Reports provide information on market trends, competitive environments, market analysis, cost structure, capacity, revenue, gross revenue, business distribution, and forecasts 2025.

Top key players involved in this are: HELLER, ERSA, BTU, JT, Dongguan Pengyi Electronics, ShenZhen Leadsmt.

Request for Sample PDF Copy @t: https://introspectivemarketresearch.com/request-samples.php?_id=11&_sid=752

Global Hot Air Reflow Market gives a prognosis to comprehensively describe the market and to describe very nice growth over the next few years. This report provides an in-depth analysis of current and future market forecasts around the world. This report is designed to help readers in the region who are expected to grow the fastest during the forecast period. Along with this, this compilation is intended to help readers thoroughly analyze the recent trends, competitive environments in the global market during the forecast period.

By region: APAC, EMEA, North America, Latin America, Europe.

Industry Segmentation: Medical Electronics, Consumer Electronics, Automotive Electronics

The report clearly shows that the Hot Air Reflow industry has grown significantly. Based on an in-depth assessment of the industry. The analysis provided in this report reveals key sectors and strong insights that can help you determine new strategies that have a strong presence in the industry. In conclusion, analysts who value unbiased information about stakeholders, investors, product managers, marketing executives, supply, demand, and future forecasts value the report.

 This report analyzes the factors affecting the Hot Air Reflow Market in terms of supply and demand and further assesses the market dynamics affecting the market during the forecast period e.g. drivers, restraints, opportunities and future trends. The report also provides Porter's five forces analysis of global scenarios.

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 The Scope of this Global Hot Air Reflow Market Report:

1. Hot Air Reflow analysis predicts the representation of this market, supply and demand, capacity, detailed investigations, etc.

2. Even the report, along with the international series, conducts an in-depth study of rules, policies and current policy.

3. In addition, additional factors are mentioned: imports, arrangement of commodity prices for the market, supply and demand of industry products, major manufacturers.

4. The report starts with Hot Air Reflow market statistics and moves to important points, with dependent markets categorized by market trend by application.

5. Applications of market may also be assessed based on their performances.

6. Other market attributes, such as future aspects, limitations and growth for all departments.

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[mokotechnologyltd]

Guide on SMD PCB stencil

SMD components growing a higher density and components on the circuit board. The PCB stencil soldering process does not affect using a soldering wave, even in a reflow oven or using vapor phase soldering. The possible tin solder is loosened in the form of a paste using a stencil and squeegee. The components are then listed on the solder paste. The adhesive force of the paste prevents it from falling off. Heavier components are usually Glued to it.

SMD Assembly

MOKO Technology Provides comprehensive services for assembling surface-mounted (SMD) components and components for push-through assembly (THT). Our production facility is technologically flexible, we take on the assembly of various components from the SMD components of size 0201 to the integrated circuits with QFP and BGA & uBGA housings in excellent quality with a lot of experience. Our typical series size is between 1 and 1000 pieces, the normal order period is 5 to 10 days.

Create solder paste PCB stencil

9 Step:

Step 1: Material and preparation

Step 2: Prepare the PCB layout and determine dimensions

Step 3: Create Gerber files

Step 4: Open Gerber file for conversion

Step 5: Export Gerber to SVG file

Step 6: Cutting software

Step 7: Change The size of the design

Step 8: Prepare transparency and machine

Step 9: Cut your stencil

Use a Cricut cutting machine and Sure-Cuts-A-Lot software to create usable solder paste stencils for electronic prototyping purposes.

The quality and precision of the stencils obtained are good enough, size 0805 and TQFP (0.8 mm pitch) electronic component prototype.

This Instructable on a tutorial I originally wrote based on solder paste stencils.

I would not recommend purchasing a Cricut just to create solder paste stencils. However, if you have a friend or relative who owns one, or at a Cricut store or at the flea market, then buying Sure-Cuts-A-Lot software will turn a Cricut into a very useful device. Functionality then becomes something like a low-end vinyl/craft cutter like its Craft Robo.

Step 1: Material and preparation for PCB stencil

Materials

– Cricut machine – Sure-Cuts-A-Lot software – Gerber viewer software – Transparencies for overhead projectors that you can buy at any office supply store – A Windows XP / Vista computer

Preparation

Your Cricut must have a specific firmware version. You can update/downgrade the firmware by downloading Cricut Design Studio and following the instructions under Help to update the firmware. See the Sure-Cuts-A-Lot FAQ for more information.

Step 2: Prepare the PCB layout and determine dimensions

It can take some trial and error to create decent solder paste PCB stencils is not very precise. It cuts rounded edges and ignores shapes smaller than about 18mil (0.46mm) by 50mil (1.27mm). That said, you should make sure that all of your component pads are large than these. To make sure a pad still has enough solder paste area, make the pad more. The KiCAD EDA Suite PCB layout program has the ability to change all one footprint pads at a time. Solder has this amazing property that connects to metal parts when reflow finds. As long as your PCB has precise solder resist, solder metal pieces will be found to link. So don’t be too concerned about pads (basically say +/- 20%).

You need the exact dimensions of your PCB template for later. Use your PCB layout software distance tool to determine the distance between the outermost component pads. Not the size of the PCB, but the distance between outermost pad edges. In the example below, the PCB has a width of 2.3 “, but the edge to edge pad distance is 2.142”.

You can measure distances by selecting drawings from the layer pull-down menu and clicking the Dimensions button in the right tool menu. It’s the fourth button from the bottom.

Step 3: Creating Gerber files

Draw your PCB layout using the Gerber solder paste stencil.

When using KiCAD, choose Draw from the File menu. In the plot window, select SoldP_Cmp for the solder paste component layer and click the Plot button.

Step 4: Open Gerber file for conversion

Open the file in Gerber Gerber Viewer. Select Open Layer (s) from the File menu.

Step 5: Export Gerber to SVG file

Then export the file in SVG format. Select Export, then SVG … from the File menu.

Step 6: Cutting software

Create solder paste stencils with Cricut Import the SVG file into Sure-Cuts-A-Lot by choosing Import SVG … from the File menu.

Step 7: Resize the design

Create solder paste stencils with Cricut Click Keep Proportions in the Properties window and set the stencil’s width to the value previously noted.

Step 8: prepare transparency and machine

Create solder paste stencils with Cricut Take a sheet of transparency film and cut it to the size of the Cricut cutting mat. Tack the cut transparency into the cutting mat. Place the cutting mat in the machine and press the insert paper button.

Set the Cricut’s thrust washer up, the speed wheel will turn to High or Medium, and the cutting blade depth to 5 or 6. Detailed instructions can be found in the Cricut manual. You will find some trial-and-error needed. Speed ​​and pressure can change the accuracy of the cuts, and greater cutting knife depth speeds up how quickly you need to replace the cutting mat.

Step 9: Cut your PCB stencil

Create solder paste stencils with Cricut Go to cut the design. Choose Cut Design from the Cutter menu.

SMD solder paste PCB stencil

SMD stencil at MOKO Technology – everything from a single source! Reduce your process costs and use the service around our PCB production. We can easily and conveniently provide you with the corresponding SMD stencil to match your PCB order – to you or your assembly partner.

SMD PCB stencils from MOKO Technology – simple, practical, inexpensive! Regardless of whether laser-cut SMD stencils, adhesive stencils or stencils for clamping systems. This means you have lower process costs and time for other important tasks.

Using the latest technology, MOKO Technology is able to cover all of our customers’ usual requirements and will manufacture your SMD stencils to measure. We offer the following specifications:

• Formats up to 760 x 600 mm • Depending on the format, up to 2,000 pads included • Material thicknesses between 50 and 500 µm • Electropolishing • Nano sealing • Edge protection • Aluminum frame • Step stencils

With our production preparation, we take over the complete data check of your SMD stencil as well as the handling of the paste data. The entire MOKO team looks forward to your inquiry and is happy to be there for you personally!

PCB Stencil printer and the dispenser

While our automatic stencil printers enable a homogeneous, high-precision paste application, paste application by means of a dispenser can be a cost-effective solution for smaller series (from the components of the housing size 0603 to the integrated circuits with SOP housing).

Another advantage of the stencil printer is that several smaller circuit board stencils can have space on one stencil board by using the maximum printing area of ​​420×445 mm, whereby a further cost reduction is achieved.

SMD assembly

The SMD assembly is carried out by Pick & Place placement machines from Panasonic and Samsung in a full vision system. An important advantage of the Pick & Place system is the extraordinary flexibility with regard to component packaging. The integrated circuit can come in rod magazines, (tube), belts (reel), trays (tray), the automated assembly can be solved in any case.

Accuracy: 50μm PCB size: 50mm x 40mm – 420mm x 390mm

Soldering SMD

After equipping the SMD, high-quality soldering takes place in a forced convection reflow oven from HELLER with 7 heating zones or a vapor phase soldering system, which can be used to produce a wide range of temperature profiles in accordance with today’s expectations.

SMD repair

The visual inspection and repair of the solder joints using microscopes are carried out by employees with years of experience. Precise, accurate repairs are made possible by the component-adjustable rework stations from ERSA with adjustable temperature and numerous accessories and LEISTER hot air devices.

Final test according to IPC-A-610

A visual 100% final inspection of all of our products is carried out via the intermediate tests and the microscope tests after the SMD has been fitted to ensure high quality. The final inspection is carried out by the certified IPC-A-610 specialists.

[greatpcb]

Why China Govt. Awarded GreatPCB As A Best PCB Manufacturer Company

With the advancement of technology the global circuitry production scenario has encountered some paradigm shifts. Introduced as an alternative of wire wrap technology PCB has turned in to the backbone of modern circuitry. Thus choosing for PCB manufacturers should be stringent and strict. And when you are looking for the best PCB manufacturers across China with a global outreach then who else other than GreatPCB can be your pick.

Factors to see while choosing PCB manufacturers

In case you are sceptical or overwhelmed with number of PCB manufacturers China has available here’s a brief guide on how and whom to choose.

·         Range of expertise

Knowing the range of expertise of the company you are hiring plays an extremely crucial role. Thus before hiring PCB manufacturers China has check whether the company expertise in rigid or flex PCB boards or whether they provide both single and turnkey solutions, or just one of them. And don’t forget to run a check on their range of materials substrates offered.

·         Client base

A global client base is always important. Leading companies have a global outreach across the world.

·         Services

When you are looking for a global exposure do run a check on various services and capabilities of the company. Make sure that the company has proper policies for inventory, warehousing, shipping assembly etc. and other related services.

·         Quality

Certification, licensing and stringent quality control mechanism is absolutely necessary for developing your prototype. Have a detailed check over the certifications and licensing of the company you hire. Also check their standard tests for maintaining quality benchmarks.

·         Flexibility and quick responses

A design is not equivalent to the final product and this is especially true in case of tailoring prototypes. So make sure that the company has flexibility in changing of specifications when and where needed.

GreatPCB: The best manufacturers

There are many PCB manufacturers in the fastest growing economy of the globe. But the Chinese government has bestowed the honour of being the best only to GreatPCB because of their age old experience, revolutionary technology, innovative designs and most importantly uncompromising quality standards for all batches.

Here’s a glimpse on the world of GreatPCB which truly acclaims them to be leading PCB Manufacturers.

The experience of serving of 12 years and handling over 2000 clients in various domains across the world

The complete services starting from the design planning to assembly, warehousing, shipping of prototypes GreatPCB handles it all with great expertise

Stringent quality benchmarks with all suppliers IQC standard certified.

Entourage of state-of-the-art machines including

ü  Dedicated design stations to design PCB boards for any complexity level

ü  Specialised equipment for PCB cutting and sizing

ü  Special SMT machines

ü  Wet Hal lead free machines with hot air reflowing especially used in soldering.

ü  Specific machines for testing IC, and other components testing along with sub assembly testing

Along with these highlighted ones, GreatPCB has round-the-clock customer service along with absolute flexibility and rates as per market standards to provide you with best in class prototypes in minimal timespan. So hurry and get in touch with the acclaimed manufacturers today!

 Blog resource: https://greatpcbsmt.blogspot.com/2019/09/why-china-govt-awarded-greatpcb-as-best-PCB-Manufacturer-Company.html

[millionmarketresarch-blog]

Hot Air Reflow Market Statistic, Ongoing Trends, Applications, Business Strategy and Forecast to 2025

22th October 2018: This Report Studies the Global Hot Air Reflow Market size, industry status and forecast, competition landscape and growth opportunity. This Research Report categorizes the Global Hot Air Reflow Industry by Companies, Region, Application, Type and end-use Industry.

Global Hot Air Reflow Market is expected to rise at a moderate CAGR in the forthcoming period. A hot air reflow is a multipurpose soldering device with a combination of soldering station, hot air rework and a DC power supply. These functions can be performed simultaneously or independently resulting into occupying a less area with efficient energy output. Technically, hot air reflow corrects polarized parts, tombstone parts, and cold joints and eliminates defective parts that happen to go unnoticed during the manufacturing process. Further, hot air reflow station is also useful to adjoin missing components and jumpers.

Browse Full Research Report @ https://www.millioninsights.com/industry-reports/hot-air-reflow-market  

Other uses of hot air reflow include reduction of heat shrink onto wires, recovering electronic components from old circuit boards. On a commercial level, the market for hot air reflow station is gaining a positive traction and also accounting for a significant market position. Driving factors responsible for the growth hot air reflow market includes rise in manufacture of circuit boards that demand soldering accuracy. Also, hot air reflow fixes the errors after manufacture of PCBs which again is considered important from manufacturing point of view, thus adding to the market growth for hot air reflow components.

Based on segmentation by type, the hot air reflow industry includes 7 zone reflow system, 10 zone reflow system and 12 zone reflow system. Based on segmentation by application, the hot air reflow market includes medical electronics, consumer electronics and automotive electronics.

Geographically, hot air reflow market spans North America, Latin America, Europe, Asia-Pacific, Middle-East and Africa. APAC market is expected to gain a positive traction in the forthcoming period due to soldering demands in industrial sector. North America and Europe market is also expected to gain a significant share in the global market. MEA regions are anticipated to grow at a higher CAGR in the forthcoming period due to the rise in construction activities and heavy presence of industrial and manufacturing sector and also demand for printed circuit boards. The key players in the hot air reflow market include HELLER, ERSA, BTU, JT, Dongguan Pengyi Electronics, Leadsamt and Shenzhen.  

Get a Sample Copy of This Report @ https://www.millioninsights.com/industry-reports/hot-air-reflow-market/request-sample    

[sophiajhon-blog]

Industrial Oven Market Outlook and Growth Forecasted By 2023

A new market research report on the Global Industrial Oven market has introduced by KD Market Insights. The report is dedicated to in-depth industry analysis of the global Industrial Oven market. The Global Industrial Oven analysis is broken down on different segmentation levels including Market By Product, By Process, By Heating Medium, By End-user Industry. An Industrial Oven plays a strategic role in multiple high-tech industries such as electronics and chemicals, and others It is used to cure exotic materials in the laboratory so that ultra-light and super-strong materials can be processed, bake sand cores in the foundry to develop modern castings, mass-produce delightful pastries at commercial bakeries, preheat metals and other materials for anti-corrosion coatings, and function as diffusion furnaces for semiconductors used in computers. Get Report Sample Copy @ https://www.kdmarketinsights.com/sample/3543 The Global Industrial Ovens Market was valued at $8,469 million in 2016, and is projected to reach $12,897 million in 2023, growing at a CAGR of 6.2%. The food production & processing segment generated the highest revenue in 2016 and is projected to continue to dominate the market throughout the analysis period. Industrial batch ovens are generally used for drying/heating/baking/roasting/curing/ageing of chemicals, pharmaceuticals, food products, PVC, plastics, dyes, paints, painted equipment, PCB, paper pulp, compound, tobacco, abrasives, powder coating, asbestos, footwear, and various other products. These industrial ovens are provided with vertical hot air or cross air flow system to maintain a uniform temperature. Heat is generated by means of electric, infrared heaters, steam, thermic fluid, oil or gas fired system, and other sources. The global industrial ovens market is segmented on the basis of product, process, heating medium, end-user industry, and geography. Based on product, the market is classified into curing, baking, drying, and reflow ovens. On the basis of process, it is bifurcated into batch and continuous. Depending on heating medium, the market is categorized into electric heat, fuel- & gas-fired, infrared heaters, and others. The end-user industries analyzed in this study are food production & processing, chemical processing, electricals & electronics, automotive & aerospace, pharmaceuticals, and others. Geographically, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA. The major players profiled in the report are as follows: - ASC Process Systems - Harper International - Eastman manufacturing ltd. - Rowan Technologies - Wisconsin Oven Corporation. - JPW Ovens & Furnaces - Davron Technologies - Grieve Corporation - JLS Ovens - Steelman Industries, Inc. KEY BENEFITS FOR STAKEHOLDERS - The study provides an in-depth analysis of the industrial ovens market with current and future trends to elucidate the imminent investment pockets in the market. - It presents information regarding key drivers, restraints, and opportunities with impact analysis. - Porter's Five Forces model analysis of the industry illustrates the potency of the buyers and suppliers. - Market player positioning in the report provides a clear understanding of the position of leading companies. KEY MARKET SEGMENTS By Product - Curing Ovens - Baking Ovens - Drying Ovens - Reflow Ovens - Others By Process - Batch - Continuous By Heating Medium - Electric Heat - Fuel- & Gas-fired - Infrared Heaters - Others By End-user Industry - Food Production & Processing - Chemical Processing - Electricals & Electronics - Automotive & Aerospace - Pharmaceuticals - Others By Geography - North America - - U.S. - - Canada - - Mexico - Europe - - Germany - - Spain - - UK - - Italy - - France - - Rest of Europe - Asia-Pacific - - China - - India - - Japan - - South Korea - - Rest of Asia-Pacific - LAMEA - - Brazil - - Turkey - - South Africa - - Rest of LAMEA OTHER KEY PLAYERS* - Ali S.p.A - Duke Manufacturing Co. Inc. - The Middleby Corporation - Alto-Shaam, Inc. - Edward Don & Company - Fujimak Corporation - Avantco Equipment - Hobart Corporation Access Complete Research Report with TOC @ https://www.kdmarketinsights.com/product/industrial-oven-market-amr Table of Content CHAPTER 1 INTRODUCTION 1.1. REPORT DESCRIPTION 1.2. KEY BENEFITS 1.3. KEY MARKET SEGMENTS 1.4. RESEARCH METHODOLOGY 1.4.1. Secondary research 1.4.2. Primary research 1.4.3. Analyst tools and models CHAPTER 2 EXECUTIVE SUMMARY 2.1. CXO PERSPECTIVE CHAPTER 3 MARKET OVERVIEW 3.1. MARKET DEFINITION AND SCOPE 3.2. KEY FINDINGS 3.2.1. Top investment pockets 3.2.2. Top impacting factors 3.2.3. Top winning strategies 3.3. PORTERS FIVE FORCES ANALYSIS 3.4. MARKET PLAYERS POSITIONING 3.5. MARKET DYNAMICS 3.5.1. Drivers 3.5.1.1. Rapid industrialization in emerging economies of the world 3.5.1.2. Increasing inclination towards use of industrial oven over industrial furnaces 3.5.1.3. High demand for continuous line industrial ovens 3.5.2. Restraint 3.5.2.1. High energy consumption coupled with high initial cost 3.5.3. Opportunity 3.5.3.1. Continuous technological advancements CHAPTER 4 INDUSTRIAL OVEN MARKET, BY PRODUCT 4.1. OVERVIEW 4.1.1. Market size and forecast 4.2. CURING OVEN 4.2.1. Key market trends, growth factors, and opportunities 4.2.2. Market size and forecas, by region 4.2.3. Market size and forecas, by country 4.3. BAKING OVENS 4.3.1. Key market trends, growth factors, and opportunities 4.2.2. Market size and forecas, by region 4.2.2. Market size and forecas, by country 4.4. DRYING OVENS 4.4.1. Key market trends, growth factors, and opportunities 4.2.2. Market size and forecas, by region 4.2.2. Market size and forecas, by country 4.5. REFLOW OVENS 4.5.1. Key market trends, growth factors, and opportunities 4.2.2. Market size and forecas, by region 4.2.2. Market size and forecas, by country 4.6. OTHERS 4.6.1. Key market trends, growth factors, and opportunities 4.2.2. Market size and forecas, by region 4.2.2. Market size and forecas, by country CHAPTER 5 INDUSTRIAL OVEN MARKET, BY PROCESS 5.1. OVERVIEW 5.1.1. Market size and forecast 5.2. BATCH PROCESS 5.2.1. Key market trends, growth factors, and opportunities 5.2.2. Market size and forecas, by region 5.2.2. Market size and forecas, by country 5.3. CONTINUOUS 5.3.1. Key market trends, growth factors, and opportunities 5.2.2. Market size and forecas, by region 5.2.2. Market size and forecas, by country CHAPTER 6 INDUSTRIAL OVEN MARKET, BY HEATING MEDIUM 6.1. OVERVIEW 6.1.1. Market size and forecast 6.2. ELECTRIC HEAT 6.2.1. Key market trends, growth factors, and opportunities 6.2.2. Market size and forecas, by region 6.2.2. Market size and forecas, by country 6.3. FUEL- & GAS-FIRED 6.3.1. Key market trends, growth factors, and opportunities 6.3.2. Market size and forecas, by region 6.3.2. Market size and forecas, by country 6.4. INFRARED HEATERS 6.4.1. Key market trends, growth factors, and opportunities 6.4.2. Market size and forecas, by region 6.4.2. Market size and forecas, by country 6.5. OTHERS 6.5.1. Key market trends, growth factors, and opportunities 6.5.2. Market size and forecas, by region 6.5.2. Market size and forecas, by country CHAPTER 7 INDUSTRIAL OVEN MARKET, BY END-USER INDUSTRY 7.1. OVERVIEW 7.1.1. Market size and forecast 7.2. FOOD PRODUCTION & PROCESSING 7.2.1. Key market trends, growth factors, and opportunities 7.2.2. Market size and forecas, by region 7.2.2. Market size and forecas, by country 7.3. CHEMICAL PROCESSING 7.3.1. Key market trends, growth factors, and opportunities 7.3.2. Market size and forecas, by region 7.3.2. Market size and forecas, by country 7.4. ELECTRICAL & ELECTRONICS 7.4.1. Key market trends, growth factors, and opportunities 7.4.2. Market size and forecas, by region 7.4.2. Market size and forecas, by country 7.5. AUTOMOTIVE & AEROSPACE 7.5.1. Key market trends, growth factors, and opportunities 7.5.2. Market size and forecas, by region 7.5.2. Market size and forecas, by country 7.6. PHARMACEUTICALS 7.6.1. Key market trends, growth factors, and opportunities 7.6.2. Market size and forecas, by region 7.6.2. Market size and forecas, by country 7.7. OTHERS 7.7.1. Key market trends, growth factors, and opportunities 7.7.2. Market size and forecas, by region 7.7.2. Market size and forecas, by country CHAPTER 8 INDUSTRIAL OVEN MARKET, BY GEOGRAPHY 8.1. OVERVIEW 8.1.1. Market size and forecast 8.2. NORTH AMERICA 8.2.1. Key market trends, growth factors, and opportunities 8.2.2. Market size and forecast 8.2.2.1. U.S. 8.2.2.2. Canada 8.2.2.3. Mexico 8.3. EUROPE 8.3.1. Key market trends, growth factors, and opportunities 8.3.2. Market size and forecast 8.3.2.1. Germany 8.3.2.2. Spain 8.3.2.3. UK 8.3.2.4. Italy 8.3.2.5. France 8.3.2.6. Rest of Europe 8.4. ASIA-PACIFIC 8.4.1. Key market trends, growth factors, and opportunities 8.4.2. Market size and forecast 8.4.2.1. China 8.4.2.2. India 8.4.2.3. Japan 8.4.2.4. South Korea 8.4.2.5. Rest of Asia-Pacific 8.5. LAMEA 8.5.1. Key market trends, growth factors, and opportunities 8.5.2. Market size and forecast Continue @... Check for Discount @ https://www.kdmarketinsights.com/discount/3543 About Us: KD Market Insights offers a comprehensive database of syndicated research studies, customized reports, and consulting services. These reports are created to help in making smart, instant and crucial decisions based on extensive and in-depth quantitative information, supported by extensive analysis and industry insights. Our dedicated in-house team ensures the reports satisfy the requirement of the client. We aim at providing value service to our clients. Our reports are backed by extensive industry coverage and is made sure to give importance to the specific needs of our clients. The main idea is to enable our clients to make an informed decision, by keeping them and ourselves up to date with the latest trends in the market. Contact Us: KD Market Insights 150 State Street, Albany, New York, USA 12207 +1 (518) 300-1215 Email: sales@kdmarketinsights.com Website: www.kdmarketinsights.com https://marketreserachtab.blogspot.com/ http://kdmarketinsights.blogspot.com/

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Global Industrial Oven Market is Expected to Thrive at a CAGR of 6.2% Forecast until 2023

A Comprehensive research study conducted by KD Market Insights on "Industrial Oven Market by Product (Curing, Baking Drying, Reflow, and Others), Process (Batch and Continuous), Heating Medium (Electric Heat, Fuel- & Gas-fired, Infrared Heating, and Others), and End-user Industry (Food Production & Processing, Chemical Processing, Electricals & Electronics, Automotive & Aerospace, Pharmaceuticals, and Others) - Global Opportunity Analysis and Industry Forecast, 2017-2023 " report offers extensive and highly detailed historical, current and future market trends in the global and regional/market. The Industrial Oven Market report includes market size, growth drivers, barriers, opportunities, trends and other information which helps to find new opportunities in this market for the growth of the business through new technologies and developments. An Industrial Oven plays a strategic role in multiple high-tech industries such as electronics and chemicals, and others It is used to cure exotic materials in the laboratory so that ultra-light and super-strong materials can be processed, bake sand cores in the foundry to develop modern castings, mass-produce delightful pastries at commercial bakeries, preheat metals and other materials for anti-corrosion coatings, and function as diffusion furnaces for semiconductors used in computers. The Global Industrial Ovens Market was valued at $8,469 million in 2016, and is projected to reach $12,897 million in 2023, growing at a CAGR of 6.2%. The food production & processing segment generated the highest revenue in 2016 and is projected to continue to dominate the market throughout the analysis period. Request for Sample @ https://www.kdmarketinsights.com/sample/3543 Industrial batch ovens are generally used for drying/heating/baking/roasting/curing/ageing of chemicals, pharmaceuticals, food products, PVC, plastics, dyes, paints, painted equipment, PCB, paper pulp, compound, tobacco, abrasives, powder coating, asbestos, footwear, and various other products. These industrial ovens are provided with vertical hot air or cross air flow system to maintain a uniform temperature. Heat is generated by means of electric, infrared heaters, steam, thermic fluid, oil or gas fired system, and other sources. The global industrial ovens market is segmented on the basis of product, process, heating medium, end-user industry, and geography. Based on product, the market is classified into curing, baking, drying, and reflow ovens. On the basis of process, it is bifurcated into batch and continuous. Depending on heating medium, the market is categorized into electric heat, fuel- & gas-fired, infrared heaters, and others. The end-user industries analyzed in this study are food production & processing, chemical processing, electricals & electronics, automotive & aerospace, pharmaceuticals, and others. Geographically, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA. The major players profiled in the report are as follows: - ASC Process Systems - Harper International - Eastman manufacturing ltd. - Rowan Technologies - Wisconsin Oven Corporation. - JPW Ovens & Furnaces - Davron Technologies - Grieve Corporation - JLS Ovens - Steelman Industries, Inc. KEY BENEFITS FOR STAKEHOLDERS - The study provides an in-depth analysis of the industrial ovens market with current and future trends to elucidate the imminent investment pockets in the market. - It presents information regarding key drivers, restraints, and opportunities with impact analysis. - Porters Five Forces model analysis of the industry illustrates the potency of the buyers and suppliers. - Market player positioning in the report provides a clear understanding of the position of leading companies. KEY MARKET SEGMENTS: By Product - Curing Ovens - Baking Ovens - Drying Ovens - Reflow Ovens - Others By Process - Batch - Continuous By Heating Medium - Electric Heat - Fuel- & Gas-fired - Infrared Heaters - Others By End-user Industry - Food Production & Processing - Chemical Processing - Electricals & Electronics - Automotive & Aerospace - Pharmaceuticals - Others By Geography - North America - - U.S. - - Canada - - Mexico - Europe - - Germany - - Spain - - UK - - Italy - - France - - Rest of Europe - Asia-Pacific - - China - - India - - Japan - - South Korea - - Rest of Asia-Pacific - LAMEA - - Brazil - - Turkey - - South Africa - - Rest of LAMEA Browse Full Report with TOC @ https://www.kdmarketinsights.com/product/industrial-oven-market-amr Table of Contents: CHAPTER 1 INTRODUCTION 1.1. REPORT DESCRIPTION 1.2. KEY BENEFITS 1.3. KEY MARKET SEGMENTS 1.4. RESEARCH METHODOLOGY 1.4.1. Secondary research 1.4.2. Primary research 1.4.3. Analyst tools and models CHAPTER 2 EXECUTIVE SUMMARY 2.1. CXO PERSPECTIVE CHAPTER 3 MARKET OVERVIEW 3.1. MARKET DEFINITION AND SCOPE 3.2. KEY FINDINGS 3.2.1. Top investment pockets 3.2.2. Top impacting factors 3.2.3. Top winning strategies 3.3. PORTERS FIVE FORCES ANALYSIS 3.4. MARKET PLAYERS POSITIONING 3.5. MARKET DYNAMICS 3.5.1. Drivers 3.5.1.1. Rapid industrialization in emerging economies of the world 3.5.1.2. Increasing inclination towards use of industrial oven over industrial furnaces 3.5.1.3. High demand for continuous line industrial ovens 3.5.2. Restraint 3.5.2.1. High energy consumption coupled with high initial cost 3.5.3. Opportunity 3.5.3.1. Continuous technological advancements CHAPTER 4 INDUSTRIAL OVEN MARKET, BY PRODUCT 4.1. OVERVIEW 4.1.1. Market size and forecast 4.2. CURING OVEN 4.2.1. Key market trends, growth factors, and opportunities 4.2.2. Market size and forecas, by region 4.2.3. Market size and forecas, by country 4.3. BAKING OVENS 4.3.1. Key market trends, growth factors, and opportunities 4.3.2. Market size and forecas, by region 4.3.3. Market size and forecas, by country 4.4. DRYING OVENS 4.4.1. Key market trends, growth factors, and opportunities 4.4.2. Market size and forecas, by region 4.4.3. Market size and forecas, by country 4.5. REFLOW OVENS 4.5.1. Key market trends, growth factors, and opportunities 4.5.2. Market size and forecas, by region 4.5.3. Market size and forecas, by country 4.6. OTHERS 4.6.1. Key market trends, growth factors, and opportunities 4.6.2. Market size and forecas, by region 4.6.3. Market size and forecas, by country Continue… Check for Discount @ https://www.kdmarketinsights.com/discount/3543 About Us: KD Market Insights offers a comprehensive database of syndicated research studies, customized reports, and consulting services. These reports are created to help in making smart, instant and crucial decisions based on extensive and in-depth quantitative information, supported by extensive analysis and industry insights. Our dedicated in-house team ensures the reports satisfy the requirement of the client. We aim at providing value service to our clients. Our reports are backed by extensive industry coverage and is made sure to give importance to the specific needs of our clients. The main idea is to enable our clients to make an informed decision, by keeping them and ourselves up to date with the latest trends in the market. Contact Us: KD Market Insights 150 State Street, Albany, New York, USA 12207 +1 (518) 300-1215 Email: sales@kdmarketinsights.com Website: www.kdmarketinsights.com  

[electronicproductdevelopment]

New Post has been published on Quality, Manufacturing & Product Development in China

New Post has been published on http://quality-manufacturing.org/electronic-prototype-fabrication/

Electronic Prototype Fabrication. Part 2: How to make electronic PCBA prototype

In a previous post (Electronic Prototype Fabrication. Part 1: Why making electronic PCB prototype is useful) I explained why electronic prototyping is an important step in the product development process of an electronic product.

In this blog post you will learn how PCB and PCBA prototypes are made during the electronic product development phase. Normally, this phase comes once the electronic engineering is achieved. So, at this point we can consider PCB Schematic is completed, PCB Layout has been drawn and verified, Bill of Material is stabilized, Gerber files including layer, component positioning and drilling have been generated.

What are the different steps of making electronic prototype and how do we handle them

Below is a general scheme of the processes involved in creating electronic pcb prototypes. You can see there are quite a few steps and most of them got their dose of risks of failure. Astonihly, but in order to remain competitive, in 2017 we are stilling making PCB prototype by hand.

1./ Blank PCB prototype procurement

For recall, a PCB (also called "blank PCB") is a Printed Circuit Board which doesn't host any electronic component yet. By opposition, a PCBA also called Printed Circuit Board Assembly is a PCB on which electronics components have been soldered/assembled.

This part of the process for prototype is made the same way than for manufacturing. One of the main difference is that manufacturer will try to panalize as much as possible several design of several customers on the same plate so they can optimize their costs in terms of plate allocation.

To perform this step, heavy equipment are required: several chemical bath, CNC drilling machines, CNC cutting machines, silk screen machine etc.. It uses as input the Gerber files generated by an EDA software such as Altium, Orcad Allegro, Kicad or Eagle to feed a full chain of machine creating blank PCB.

I personnaly have a database of several PCB manufacturers I have audited myself because I don't use the same PCB manufacturer for different projects. Indeed, some PCB prototype manufacturers may be capable and competitive to make 2 layers PCB but can have difficulties to process 4 or more layers with reliability. This is particulary true when it comes to high quality PCB requiring physical adjustments such as impedance matching.

Obviously, if PCB prototype quality is not proper, then your electronic pcb prototype might not work properly either. Normally, a serious supplier would make some track testing using some flying probe to verify the tracks on the PCB. If they don't do it, you might risk to receive some PCB with defects: you will solder your components and your board will not work properly. You will spend hours and hours finding out why and finally you will realize that problems comes from manufacturing. Quite frustrating !!!

2./ Electronic components procurement

It may sounds easy to do. You might think: "buy component? I can do, this like going to shopping !". In reality, it can become not that easy at all depending on how the bill of material has been established by the pcb architect and the pcb hardware engineer.

Indeed, if the hardware engineer selected components which are difficult to supply because the components is rare on the market or just outdated, then it can become a nightmare to success to find the components at decent price on the market to populate your PCB and to respect the bill of material. In some case, the components might need to be imported specifically or might need to be subsituted by another equivalent one (I recommend to avoid this, but if it is necessary then the people in charge of sourcing and procurement should ask for validation to the hardware engineer).

Another problem you may face is to buy sample components to a vendor who can also supply bigger quantities later for manufacturing with reliability, so that you can get consistency on your supply chain for your components. I see quite a lot of people who buy components in the electronic market in Shenzhen (Hua Qian Bei) to small shops. They go here and there so find some vendors selling components and buy some samples to make their prototype. Later when they want to mass produce, they have either difficulties to find another vendor more reliable for production to match exactly the same components or they need to rely on the small shop they used. Quite often the small shop will not disclose who is the real manufacturer of the component, hence you loose control on the supply chain and the shop can change the manufacturer behind your back without you know it, putting your production at risk.

Hence, when you buy components, even for sample, I recommend to buy them for reliable sources. For example, you can use Arrow or Element 14, those are big components distributor and they don't substitute components behind your back.

I recommend to be very organized when performing components procurement because it can quickly become terrible to manage: when you got a bill of material with 100 different component references you need to make sure you got all of them and you need to make sure you don't mix them (yes you can because sometimes components are not marked) !

I personnaly use some zip lock plastic bags on which I ad some sticker with component part number and I never put components of those bag unless I need to solder them.

3./ Assembling components on blank PCB

A./ Solder paste deposit

Now you got your components and your blank PCB in hand, you then need to solder components on pcb so they can connect with each other and realize your circuit which then you will test. If you are on SMD type configuration then it means your component will be soldered on pads and not trough hole. It means some soldering material should be placed and melt between components and PCB. So the question is how to place properly solder paste on pad properly (not too much, not too less).

Well here there are differents technics, some people do this by hand and it is very difficult. The best solution is to use what we call a laser net: this is typically a frame with a layer of aluminum being cut with a laser exactly to keep some opening on the surface of the pads. In short, it creates a canvas where the solder paste will be placed only on the pad. This frame can be placed on an automatic machine, but for prototype we mostly use manual one because we make very low quantity of prototype (usually no more than 5 pieces).

I can tell you the first time I tried to make a PCBA prototype I have attempted to use a hand solder, components and normal tin solder wire and it didn't work at all because components are so small that it is extremly difficult to perform a clean soldering this way. I don't mention either that soldering component with having pads below the components make impossible to solder a comopnent on a pcb with using a solder paste material.

Since then, I have my own manual laser net apparatus which I use to deposit solder paste on PCB. It gives me some ease to put exactly the necessary solder paste quantity on the right area of the PCB.

B./ Components placement

Now that you have your solder paste placed on the pcb pads you will need to place components exactly at the location of the pads so it can solder properly. This part is the most complicated part of making electronic pcb prototype. Why ? Simply because today components are so small that you can not even catch them with a tool. Now imagine you have 100 references on your bill of material, and each references got 2 components each. This is around 200 components to place on your PCB, and most of them got size around less than a millimeter length.

There are two ways to achieve this:

Pick and Place machine or mini pick and place machine: it makes automatic placement. This can be costly because machine need to be set and ready for making only 5 pieces prototype, so the settup cost outweight the product cost. However, if the pick and place is of good brand, it should be able to place all the components properly at the right location.

Manually: I usually do it this way. It can be quick for small PCB with few references and if components are not too small. I use a microscope to do this. Methodically and patiently I pick components one by one from zip lock bag reference by reference with a tool. I get my bill of material and I get my component placement scheme with me on the side of the microscope and I place components on their pad manually and very gently (because if you hit the PCB then all components you have already placed may move and then you need to restart it all over again !!). I do this for all components until the last one is place (of course you can do this only on one face at the time)

C./ Soldering

This can be considered the easiest part but actually it also got some risks here. There are different way to solder components on PCB:

Reflow oven: this is what is used in manufaturing process. Typically an oven blowing some hot air in a controlled way will make the solder paste to melt, so components can be soldered on PCB. Those oven are usually not cheap but they are usually (if used properly) the most reliable way to solder components on PCB, reason why you find them in all serious PCBA manufacturer/assemblers

UV oven: this is another type of oven using UV to heat up the environment around PCB. There are a few companies selling this, and I almost purchased some but I read so many bad comments about it that I decided it would not worth it (I particularly read that it is difficult to control the temperature and quite often the board and the component get completly burnt, not to mention I read it smells extremly bad and doesn't perform well)

Hot air reworking station: This is whay I mostly use. This is a very basic tool blowing some hot air on a pipe and it allows to decide where to blow air, when and how (at which temperature) whil still having a visual on what is done. A good way to see what is done is to check the color of the tin.solder paste. Normally it will change aspect and color when it melt and solidify. A drawback of the hot air device is it blow air, so there is a risk to move components out of their pads when you blow on them. A solution to avoid this is to reduce the air flow and to blow vertically so the force made on the component is normal to the PCB plan and it limits the chance to move components.

Hot plate: This is another device I use time to time solder component when the PCB got components on only one side: I place the PCB with solder paste and components on the hot plate and I just wait. With thermal diffusion the solder paste melt and components solder by themselves on the PCB

If everything goes well, you should get an assembled PCB made properly already, however I recommend to make a quick inspection of the PCB first visually to verify there is no soldering issue, then using microscope to review some particular part and risky area of the PCB (particularly around legs of IC)

[mokotechnologyltd]

Difference between wave soldering & reflow soldering

Modern electronic products have increased efficiency, lightweight, and high speed. Therefore, each manufacturing step should also embrace such traits and that includes the manufacturing of PCBs. Soldering like wave soldering and reflow soldering play an important role in determining the performance of an electronic product, it is high-speed and accurate, which meets the demands of cost-effectiveness and mass production.

Reflow soldering and wave soldering are leading soldering technologies for making PCB assembly. We use them to ensure premium quality electronic products. However, some people confuse them with each other and the difference between them seems vague. We will take a brief look at wave soldering and reflow soldering in this article. We will also try to highlight their main differences.

Wave Soldering

We use wave soldering for combining PCB and electronic components through a liquid wave. The liquid is actually dissolved tin and the wave is formed via motor agitation. We use a wave soldering machine for this purpose.

Development History

Transistor was invented in 1946 by John Bardeen, Walter Brattain, and William Shockley at Bell Laboratories. This reduced the size of the electronic components. Some years later, lamination and etching were developed and this paved the way for a soldering technique that we could use at the production level.

Electronic components were mostly through-hole and it becomes impractical to solder them individually by using a soldering gun. There was a need for applying solder to the entire board at once. Hence wave soldering was developed which allowed for running over the entire board with a wave of solder paste.

The Process

Wave soldering involves four steps and we will look at them one by one.

      1. Flux spraying

Soldering performance mainly depends on the cleanliness of the metal surface. It also depends on the functions of the solder flux. It plays a vital role in seamless soldering operations. Major functions of solder flux are,

• Eliminating oxides from the metal surfaces of component pins and boards.

• Stopping secondary oxidation of circuit boards during the thermal process.

• Reducing surface tension of the solder paste.

• Proper transmitting of the required heat.

      2. Pre-heating

PCBs travel through a heat tunnel in a pallet along a chain which is similar to a conveyor belt. It is necessary for activating the flux and carrying out pre-heating.

      3. Wave soldering

When the temperature continues to rise, solder paste melts to become liquid. This results in a wave of solder which travels throughout the board and allows components to solidly bond with the board.

       4. Cooling

The wave soldering profile is conformed to the temperature curve. The curve starts to plummet after the temperature reaches its peak in the wave soldering stage. This is known as the "cooling zone." We can successfully assemble the board after cooling it to room temperature.

Governing Parameters

Time and temperature play an important role in the performance of wave soldering. A professional wave soldering machine is necessary for reaching the required time and temperature. Additionally, the skills and experience of the workers are also important and it can play a major role in determining the quality of wave soldering.

If we perform wave soldering at low temperatures then the flux won’t melt and hence it will not activate. It will lose its ability to react and dissolve dirt & oxides on the metal surface. We also need to consider other parameters such as wave contact time, and speed of band carrier, etc.

Application

We use wave soldering in DIP (Dual Inline Packaging), SMT (Surface Mount Technology), and THT (Through Hole Technology). However, we mostly use it in SMT.

Reflow Soldering

In reflow soldering, components are first temporarily stuck to the pads on circuit boards. Then they are permanently glued together by hot air or other methods of thermal conduction and radiation. Reflow soldering is relatively easier to perform and even a novice can perform it easily on a small scale. Reflow soldering requires a reflow soldering machine which we often call a reflow soldering oven.

Soldering Process

As mentioned earlier, electrical components are temporarily attached to the contact pads before the soldering actually commences. This includes two steps. In the first step, solder paste is precisely applied to each pad via a solder paste stencil. In the second step, we use to pick and place machines for placing the components on the pads. Actual reflow soldering doesn’t start until the completion of these preparations.

The actual soldering process has four steps which we are about to discuss.

Pre-heating

Pre-heating is very important if you want to manufacture premium quality PCBs. It has two major purposes during reflow soldering.

It allows PCB assembly to easily reach the required temperature and achieve the necessary thermal profiling.

Pre-heating pushes out volatile solvent within the solder paste and helps in completely expelling them. If we don't perform it correctly then it will affect the soldering quality.

Thermal Soak

Reflow soldering also depends on the flux which is contained in the solder paste. Hence, the temperature has to rise significantly so that the flux may activate. Otherwise, the flux won’t play an active role in the reflow soldering process.

Reflow Soldering

This step involves the peak temperature of the whole process. Peak temperature allows the melting and reflowing of the solder paste. Temperature control is very important in the reflow soldering process. If the temperature is very low then it can stop the solder paste from reflowing while if the temperature is very high then it may damage the board or SMT components.

For instance, BGAs have a lot of solder balls that melt during the reflow soldering. If we don’t achieve the optimal soldering temperature than these balls may melt unevenly and BGAs may suffer from rework.

Cooling

When we achieve the peak temperature, the temperature curve will start falling. Cooling leads to solidification of the solder paste and parts are permanently fixed to their contact pads on the board.

Application

We can use reflow soldering in both THT and SMT assemblies but we mainly use it in SMT assemblies. If we are to use reflow soldering on THT assemblies then we will have to rely on PIP (Pin in Paste). We will first use the solder paste to fill the holes on the boards and then we will plug the component pins into the holes. Some of the solder paste will come out from the other side of the board. Finally, we will implement reflow soldering to complete the process.

Wave Soldering vs. Reflow Soldering

We can never ignore the difference between reflow soldering and wave soldering because it is important when you are selecting the PCBA services. A soldering modification tends to make drastic changes in the entire assembly manufacturing process. These include manufacturing cost, time to market, efficiency, and gains, etc.

Soldering Process

The main difference between reflow soldering and wave soldering in terms of the manufacturing process is the flux spraying step. Wave soldering involves this step while the reflow soldering doesn’t. We use flux for promoting the soldering process. It helps by playing a protective role by eliminating the surface tension and reducing the surface tension. Flux only works when we activate it which we can only achieve by intensive time and temperature control. In reflow soldering, flux is present in the solder paste. Therefore, we need to appropriately arrange and achieve the required flux content.

Selection Standard

Generally, wave soldering works best for DIP and THT while reflow soldering is ideal for SMT assemblies. However, a circuit board rarely contains only through-hole components or surface mounted devices. That is why we often have to use a mixture of SMT, THT, and DIP. When it comes to mixed assemblies, we first carry out SMT and then focus on DIP or THT. This is because the temperature of reflow soldering is much higher than the one in wave soldering. If we don't follow this sequence then the solder paste might melt again. This can lead to well-soldered components to fall from the board or suffer from defects.

Production Capacity

We use wave soldering mainly for mass production. It helps in manufacturing a large number of printed circuit boards in a relatively small amount of time.

On the other hand, we use reflow soldering when we have to manufacture a small number of printed circuit boards. We avail of this technique when we don't have very tight time constraints.

MOKO Smart is the best smart device solution you can ever come across. We have a large manufacturing setup for making PCBs which has the capacity to perform both the wave soldering and reflow soldering. On top of that, we have a large production capacity so we can easily perform any mix of soldering techniques for bulk orders. If you are looking for a reliable resource for performing soldering on your PCBs then feel free to contact us. We are hoping to hear from you soon!

[sophiajhon-blog]

Industrial Oven Market Outlook and Growth Forecasted By 2023

A new market research report on the Global Industrial Oven market has introduced by KD Market Insights. The report is dedicated to in-depth industry analysis of the global Industrial Oven market. The Global Industrial Oven analysis is broken down on different segmentation levels including Market By Product, By Process, By Heating Medium, By End-user Industry. The Global Industrial Ovens Market was valued at $8,469 million in 2016, and is projected to reach $12,897 million in 2023, growing at a CAGR of 6.2%. The food production & processing segment generated the highest revenue in 2016 and is projected to continue to dominate the market throughout the analysis period. Get Report Sample Copy @ https://www.kdmarketinsights.com/sample/3543 Industrial batch ovens are generally used for drying/heating/baking/roasting/curing/ageing of chemicals, pharmaceuticals, food products, PVC, plastics, dyes, paints, painted equipment, PCB, paper pulp, compound, tobacco, abrasives, powder coating, asbestos, footwear, and various other products. These industrial ovens are provided with vertical hot air or cross air flow system to maintain a uniform temperature. Heat is generated by means of electric, infrared heaters, steam, thermic fluid, oil or gas fired system, and other sources. The global industrial ovens market is segmented on the basis of product, process, heating medium, end-user industry, and geography. Based on product, the market is classified into curing, baking, drying, and reflow ovens. On the basis of process, it is bifurcated into batch and continuous. Depending on heating medium, the market is categorized into electric heat, fuel- & gas-fired, infrared heaters, and others. The end-user industries analyzed in this study are food production & processing, chemical processing, electricals & electronics, automotive & aerospace, pharmaceuticals, and others. Geographically, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA. The major players profiled in the report are as follows: - ASC Process Systems - Harper International - Eastman manufacturing ltd. - Rowan Technologies - Wisconsin Oven Corporation. - JPW Ovens & Furnaces - Davron Technologies - Grieve Corporation - JLS Ovens - Steelman Industries, Inc. KEY BENEFITS FOR STAKEHOLDERS - The study provides an in-depth analysis of the industrial ovens market with current and future trends to elucidate the imminent investment pockets in the market. - It presents information regarding key drivers, restraints, and opportunities with impact analysis. - Porter's Five Forces model analysis of the industry illustrates the potency of the buyers and suppliers. - Market player positioning in the report provides a clear understanding of the position of leading companies. KEY MARKET SEGMENTS By Product - Curing Ovens - Baking Ovens - Drying Ovens - Reflow Ovens - Others By Process - Batch - Continuous By Heating Medium - Electric Heat - Fuel- & Gas-fired - Infrared Heaters - Others By End-user Industry - Food Production & Processing - Chemical Processing - Electricals & Electronics - Automotive & Aerospace - Pharmaceuticals - Others By Geography - North America - - U.S. - - Canada - - Mexico - Europe - - Germany - - Spain - - UK - - Italy - - France - - Rest of Europe - Asia-Pacific - - China - - India - - Japan - - South Korea - - Rest of Asia-Pacific - LAMEA - - Brazil - - Turkey - - South Africa - - Rest of LAMEA OTHER KEY PLAYERS - Ali S.p.A - Duke Manufacturing Co. Inc. - The Middleby Corporation - Alto-Shaam, Inc. - Edward Don & Company - Fujimak Corporation - Avantco Equipment - Hobart Corporation Access Complete Research Report with TOC @ https://www.kdmarketinsights.com/product/industrial-oven-market-amr Table of Content CHAPTER 1 INTRODUCTION 1.1. REPORT DESCRIPTION 1.2. KEY BENEFITS 1.3. KEY MARKET SEGMENTS 1.4. RESEARCH METHODOLOGY 1.4.1. Secondary research 1.4.2. Primary research 1.4.3. Analyst tools and models CHAPTER 2 EXECUTIVE SUMMARY 2.1. CXO PERSPECTIVE CHAPTER 3 MARKET OVERVIEW 3.1. MARKET DEFINITION AND SCOPE 3.2. KEY FINDINGS 3.2.1. Top investment pockets 3.2.2. Top impacting factors 3.2.3. Top winning strategies 3.3. PORTERS FIVE FORCES ANALYSIS 3.4. MARKET PLAYERS POSITIONING 3.5. MARKET DYNAMICS 3.5.1. Drivers 3.5.1.1. Rapid industrialization in emerging economies of the world 3.5.1.2. Increasing inclination towards use of industrial oven over industrial furnaces 3.5.1.3. High demand for continuous line industrial ovens 3.5.2. Restraint 3.5.2.1. High energy consumption coupled with high initial cost 3.5.3. Opportunity 3.5.3.1. Continuous technological advancements CHAPTER 4 INDUSTRIAL OVEN MARKET, BY PRODUCT 4.1. OVERVIEW 4.1.1. Market size and forecast 4.2. CURING OVEN 4.2.1. Key market trends, growth factors, and opportunities 4.2.2. Market size and forecas, by region 4.2.3. Market size and forecas, by country 4.3. BAKING OVENS 4.3.1. Key market trends, growth factors, and opportunities 4.2.2. Market size and forecas, by region 4.2.2. Market size and forecas, by country 4.4. DRYING OVENS 4.4.1. Key market trends, growth factors, and opportunities 4.2.2. Market size and forecas, by region 4.2.2. Market size and forecas, by country 4.5. REFLOW OVENS 4.5.1. Key market trends, growth factors, and opportunities 4.2.2. Market size and forecas, by region 4.2.2. Market size and forecas, by country 4.6. OTHERS 4.6.1. Key market trends, growth factors, and opportunities 4.2.2. Market size and forecas, by region 4.2.2. Market size and forecas, by country CHAPTER 5 INDUSTRIAL OVEN MARKET, BY PROCESS 5.1. OVERVIEW 5.1.1. Market size and forecast 5.2. BATCH PROCESS 5.2.1. Key market trends, growth factors, and opportunities 5.2.2. Market size and forecas, by region 5.2.2. Market size and forecas, by country 5.3. CONTINUOUS 5.3.1. Key market trends, growth factors, and opportunities 5.2.2. Market size and forecas, by region 5.2.2. Market size and forecas, by country CHAPTER 6 INDUSTRIAL OVEN MARKET, BY HEATING MEDIUM 6.1. OVERVIEW 6.1.1. Market size and forecast 6.2. ELECTRIC HEAT 6.2.1. Key market trends, growth factors, and opportunities 6.2.2. Market size and forecas, by region 6.2.2. Market size and forecas, by country 6.3. FUEL- & GAS-FIRED 6.3.1. Key market trends, growth factors, and opportunities 6.3.2. Market size and forecas, by region 6.3.2. Market size and forecas, by country 6.4. INFRARED HEATERS 6.4.1. Key market trends, growth factors, and opportunities 6.4.2. Market size and forecas, by region 6.4.2. Market size and forecas, by country 6.5. OTHERS 6.5.1. Key market trends, growth factors, and opportunities 6.5.2. Market size and forecas, by region 6.5.2. Market size and forecas, by country CHAPTER 7 INDUSTRIAL OVEN MARKET, BY END-USER INDUSTRY 7.1. OVERVIEW 7.1.1. Market size and forecast 7.2. FOOD PRODUCTION & PROCESSING 7.2.1. Key market trends, growth factors, and opportunities 7.2.2. Market size and forecas, by region 7.2.2. Market size and forecas, by country 7.3. CHEMICAL PROCESSING 7.3.1. Key market trends, growth factors, and opportunities 7.3.2. Market size and forecas, by region 7.3.2. Market size and forecas, by country 7.4. ELECTRICAL & ELECTRONICS 7.4.1. Key market trends, growth factors, and opportunities 7.4.2. Market size and forecas, by region 7.4.2. Market size and forecas, by country 7.5. AUTOMOTIVE & AEROSPACE 7.5.1. Key market trends, growth factors, and opportunities 7.5.2. Market size and forecas, by region 7.5.2. Market size and forecas, by country 7.6. PHARMACEUTICALS 7.6.1. Key market trends, growth factors, and opportunities 7.6.2. Market size and forecas, by region 7.6.2. Market size and forecas, by country 7.7. OTHERS 7.7.1. Key market trends, growth factors, and opportunities 7.7.2. Market size and forecas, by region 7.7.2. Market size and forecas, by country Continue @... Check for Discount @ https://www.kdmarketinsights.com/discount/3543 About Us: KD Market Insights offers a comprehensive database of syndicated research studies, customized reports, and consulting services. These reports are created to help in making smart, instant and crucial decisions based on extensive and in-depth quantitative information, supported by extensive analysis and industry insights. Our dedicated in-house team ensures the reports satisfy the requirement of the client. 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