#230w

[ktecstore]

Chargeur HP 230W ORIGINAL 19.5V / 11.8A Connecteur 7.4mm x 5.0mm

Puissance de sortie: 230 watts Tension de sortie: 19.5 volts Courant de sortie: 11.8 ampères (11.8A) Connecteur: 7.4mm x 5.0mm

Commander en ligne: https://ktecstore.com/produit/chargeur-hp-230w-original-19-5v-11-8a-connecteur-7-4mm-x-5-0mm/

Voir d'autres modèles de chargeur HP: https://ktecstore.com/produit-categories/chargeur/chargeur-hp/

#ktecstore #Chargeur #HP #hpelitebook #HpLaptop #hppavilion #algerie #algeria #alger #dz

[akku-plus]

Hochwertige 230W Netzteil Ladegeräte für MSI GP76 Leopard 10UG-275US RTX3070 A17-230P1B Netzteil

Unser Website ist Ihre Quelle der hochwertigen MSI GP76 Leopard 10UG-275US RTX3070 Ladegeräte! Jede hochwertige Ersatznetzteil für MSI A17-230P1B von uns wird getestet, um sicherzustellen, dass sie die Leistungsfähigkeit der originalen MSI-Ladegeräte gleicht oder übertrifft und 100% kompatibel mit den originalen Herstellerspezifikationen sind.

Hochwertige 230W Netzteil Ladegeräte für MSI GP76 Leopard 10UG-275US RTX3070 A17-230P1B Netzteil

Technische Daten Passend für Marke:MSI AC Eingang :100-240V 50-60Hz DC Ausgang :20V 11.5A 230W Größe: Garantie:1 Jahr Garantie und 30 Tage Geld zurück Leistung:230W Ersetzt folgende Modelle A17-230P1B Kompatibel zu MSI GE66 Raider 10SGS-058US 10UG-031CA 10UE/RTX3060 MSI GP76 Leopard 10UG-275US RTX3070 100% OEM Kompatibilit��t, internationale Standards Wir nehmen die Sicherheitsanforderungen sehr ernst. Jede hochwertige Ersatznetzteil für MSI A17-230P1B von uns wird getestet, um sicherzustellen, dass sie die Leistungsfähigkeit der originalen Acer-Ladegeräte gleicht oder übertrifft und 100% kompatibel mit den originalen Herstellerspezifikationen sind. Nach Maßgabe der internationalen Standards haben sie eine Reihe von strengen Sicherheitszertifikate wie CE, UL, ROHS, ISO9001/9002 erhalten. Mit Vertrauen einkaufen! Wenn Sie unsere Produkte kaufen, kaufen Sie das Vertrauen! Für alle unseren MSI A17-230P1B Netzteil bieten wir eine vollständige einjährige Garantie und jede Netzteil wird geladen und getestet, bevor sie dem Versand übergeben werden. Wir bieten auch eine 30 Tage Geld-zurück-Garantie, wenn Sie nicht vollständig zufrieden sind. Bevor Sie Auftrag erteilen, stellen Sie bitte sicher, dass die Teilenummer oder Modellnummer Ihrer alten originalen MSI A17-230P1B Ladegeräte wie folgt aufgelistet werden. Kunden kauften auch： A1993 Ladegeräte für Apple Mac Mini A1993 HP8204L3 Ladegeräte für HP HP8204L3 NC-SSC05GNT1 Ladegeräte für Giant NC-SSC05GNT1 Adapter HP8204B Ladegeräte für ActiveCare Medical Catalina ADS-110CL-19-3 Ladegeräte für LG 42LN5204-ZA TV Monitor A5919_FSM Ladegeräte für Samsung BN44-00887D U32J592UQ TV Monitor ADC-18 Ladegeräte für Fujikura FSM-70S FSM-70S+ FSM-80S FSM-70R 1932 Ladegeräte für Microsoft Surface Pro X 7 6 5 4 3 A17-180P4B Ladegeräte für MSI Katana GF66 11UE-088NEU FSP036-RAB Ladegeräte für Fortinet FG-60C FG-60D FG-60E FG-50E FG-30E FG-90D DPS-65VB Ladegeräte für Delta DPS-65VB LPS Charger ADP-085NB Ladegeräte für Sony ADP-085NB A LED Charger GM85-120700-D Ladegeräte für FPS FSP086-12C1401 BC-279 Ladegeräte für Icom F1000 F1000D F2000 F2000D 4 Ladegeräte für DJI Tello Mini RC Drone

[andmaybegayer]

Reading more about inrush current control techniques now, all I knew before this was that you use Negative Temperature Coefficient parts to control it without affecting overall efficiency too much.

I've never had to design a board that drew much power, or didn't just use an off the shelf power supply. Power supply design is black magic so even major companies usually just buy certified open frame units to avoid redoing a ton of regulatory work, it's what's best for everyone. All the appliances at First Job just had a 24V Great Wall open frame units jammed in there, plus consumer 12V supplies for the network gear.

You can do some clever things involving having the NTC take itself out of the loop with a relay and a zener diode if you have really high efficiency targets to hit or you don't want to fry your NTC as the current picks up. I love these kinds of self-contained feedback tricks, they're super handy. And of course there's digital current controllers for high precision applications.

Figure 5 shows the relay circuit for a 1kW power supply. The relay is initially turned off. During power up, the input current flows through a 10Ω/10W cement resistor. Once the power supply is energized, a regulated bias voltage, 12V2, turns on the relay to minimize the power dissipation on the current-limiting circuit during normal operation.

Anyway. Reading specs it looks like there's a systematically higher inrush current in computer PSU's when you connect them to 230V, which is probably just Ohm's Law at work. A lot of supplies with really good 110V inrush limiting have utterly dogshit 230V inrush limiting.

An interesting problem I realize this might cause is that, because most tech reviewers are Americans with 110V, they won't pick this up as often. E.g. the highly recommended SF750 from Corsair has fantastic 120V inrush of ~30A but on 230W it's almost 80A, which would definitely trip a lot of home breakers.

[nerendus]

I think I've finally figured out the issue with my computer.

The chargers that I have always used (and the one the computer came with) is 230W, and for the first few years that I've had it where I wasn't using it to game, it worked completely fine, but once I started running games on it, the charger started to act up.

So whilst my computer can 100% handle these games, the chargers cannot—as it is always my charger overheating, and not my computer, and suspiciously, it always overheats during video games. So I think what I need to do is upgrade to something of higher wattage. I can't even begin to know what I should be looking for in that field, but so far, that's the best theory I got.

[hemenlikit]

https://www.hemenlikit.com/smok-g-priv-3-kit-230w-elektronik-sigara-antalya/

[74swatch-blog]

Power-Grid. North landers maybe at a better shape from our neighbors power grid. Cheaper e bills. We can't place a generator at our flat cos. 110W. Step up transformer at sgp side to 230W. Electric Dreams at 110W imports and apparatus in the long run.

[ecig-canada-zone-ultimate]

SMOK Morph 3 Mod is constructed from a zinc alloy and wrapped in leather-based. Powered by twin 18650 batteries, the unit has a max output of 230W for improved efficiency and future time. The Morph3 matches as much as a 33mm tank flush, any larger and it'll overhang. On its face is a big 0.96-inch display screen supporting VW & TC modes. Options: Mod Measurement: 46 x 33.8 x 88mm Output Mode: VW/TC Energy Vary: 5W-230W(VW), 10W-230W(TC) Output Voltage: 1.0V-8.2V Charging Voltage: 5V±0.2V Charging Present: Max 2.0A Battery: Twin 18650 batteries (not included) Resistance Vary: 0.1ohm-2.5ohm(VW), 0.05ohm-2.0ohm(TC) Temperature Vary: 200F-600F/100C-315C 0.96-inch TFT Display screen Kind-C Port It Contains: 1x SMOK Morph 3 Mod 1x Kind-C Cable 1x Person Guide Directions

[speakerparts42-blog]

SP7R Sharpy Lights

ATI Pro Technologies brand is more precisely into research and development of pro audio & lighting products. As a premier supplier, wholesaler, and importer of SP7R Sharpy Lights are compact yet powerful moving head fixtures renowned for their precision optics and intense beam effects. Featuring a 230W discharge lamp and motorized focus, they offer vibrant colors and sharp beams, ideal for concerts, theaters, and events requiring dynamic lighting displays with exceptional control and versatility.

[govindhtech]

AMD Radeon RX 6700 XT: Dive Deep into Its RDNA 2 Design

AMD RX 6700 XT

This powerful AMD Radeon RX 6700 XT graphics card delivers smooth gameplay at high frame rates, especially at 1440p. Let’s examine its features and characteristics.

Interior Design and Architecture

Compared to its predecessor, the AMD Radeon RX 6700 XT uses AMD’s RDNA 2 architecture. With hardware ray tracing for realistic lighting effects in games, this architecture offers more efficient compute units and improved performance.

Crucial Details

RDNA 2 Architecture

The RDNA 2 Architecture offers notable enhancements in performance compared to earlier generations.

40 Compute Units

With 40 compute units, you may play demanding games with powerful processing capability.

AMD Radeon RX 6700 XT 12gb gddr6

Offers plenty of space for quick data transfer and textures with high resolution.

Infinity Cache

AMD’s cutting-edge cache technology, Infinity Cache, lowers latency and improves performance, particularly at higher resolutions.

Boost Clock

For high frame rates, up to 2620 MHz (depending on the model).

Display Outputs

HDMI and DisplayPort for attaching to a display.

Power Consumption

230W is the typical board power (TBP).

AMD RX 6700 XT Driver

The AMD Radeon RX 6700 XT runs recent games at 1440p with high settings smoothly. Some games can run at 4K resolution, although settings may need to be adjusted. It performs well in several games vs Nvidia’s RTX 3070.

AMD Radeon graphics RX 6700 XT

AMD FidelityFX Super Resolution

Increase game frames

AMD FidelityFX Super Resolution (FSR) boosts framerates in approved games and delivers excellent high-quality, high-performance gaming on almost any machine.

AMD FSR 3 Available

Super resolution temporal upscaling, sophisticated frame generation, and built-in latency reduction technologies in AMD FidelityFX Super Resolution 3 deliver enormous and responsive framerates in supported games.

AMD FSR 3 Game Responsiveness

Built-in latency reduction makes compatible games responsive even with frame generation.

FSR2 AMD

Ray tracing is best with AMD FSR 2 and Radeon RX 7900 Series GPUs. AMD FSR 2 next-level temporal upscaling technology improves image quality and framerates in supported games across a variety of products and platforms.

Everyone plays maximum huge performance growth in compatible games, FSR enhances performance with raytracing and high framerates.

Graphics at High Quality

Edit quality modes to balance fidelity and performance. In some games, new “Native AA” mode improves image quality over native resolution with TAA.

Responsive Gameplay

Frame generation with FSR incorporates latency reduction and FPS upscaling for more responsive gaming.

OSS Technology

AMD cross-platform solution works with AMD and other products and allows developers to easily integrate for game uptake.

Games that enable hardware-accelerated ray tracing have realistic lighting effects.

Software for AMD Radeon

On models that are compatible, this package of capabilities allows for performance optimization, overclocking, and driver updates.

Benefits

Superb 1440p output

Good competitor for Nvidia’s RTX 3070 in a variety of games

Future-proofing with 12GB of GDDR6 memory for fidelityFX Higher

Resolution for more efficient frame rates

Ray tracing support for hardware

Negative

The continuous lack of chips may limit availability.

More energy-intensive than some rival cards

At 4K resolution, some games may not have the best performance.

Who Should Get AMD Radeon RX 6700 XT?

PC gamers that value high frame rates at 1440p may consider the AMD Radeon RX 6700 XT. With select titles supported at 4K, it provides outstanding performance in contemporary games. Further features that make it a well-rounded choice for aficionados are hardware ray tracing and FidelityFX Super Resolution.

The cost and accessibility

At launch, the AMD Radeon RX 6700 XT had a $479 MSRP (Manufacturer’s Suggested Retail Price). That being said, the real selling price may differ based on the retailer and model because of persistent shortages of chips and market price variations.

To sum up

For 1440p gamers, the AMD Radeon RX 6700 XT is appealing. Strong performance, new features, and competitive with Nvidia. The RX 6700 XT is unquestionably a card to take into consideration if you’re searching for a strong one to enjoy fluid gameplay at high frame rates, while taking into account the state of the market and probable supply issues.

FAQS

What resolution is the RX 6700 XT best suited for?

The AMD Radeon RX 6700 XT renders 1440p games smoothly and quickly at high settings in most recent games.

Does the RX 6700 XT support ray tracing?

Ray tracing hardware is not included in the AMD Radeon RX 6700 XT. Some ray tracing functions may work better on Nvidia cards with RT cores than on software emulation.

How does AMD FidelityFX Super Resolution (FSR) impact performance?

Upscaling technology FSR improves game performance. It boosts performance by rendering the game at a reduced resolution and upscale it to your native resolution with little visual quality loss.

Read more on govindhtech

[ktecstore]

Chargeur HP 230W ORIGINAL 19.5V / 11.8A Connecteur 7.4mm x 5.0mm

Le chargeur HP 230W original est un adaptateur secteur conçu pour alimenter les ordinateurs portables HP compatibles avec cette puissance et cette connectique spécifique. Voici une description détaillée de ses caractéristiques :

Puissance de sortie : Le chargeur délivre une puissance de sortie de 230 watts, ce qui en fait un adaptateur secteur extrêmement puissant conçu pour alimenter les ordinateurs portables HP qui ont des besoins énergétiques élevés. Il est particulièrement adapté aux ordinateurs portables de jeu ou aux stations de travail.

Tension de sortie : Il fournit une tension de sortie de 19,5 volts, ce qui est la tension standard pour la plupart des ordinateurs portables HP compatibles avec ce chargeur.

Courant de sortie : Le courant de sortie est de 11,8 ampères (A), ce qui permet une recharge rapide et efficace de la batterie de l'ordinateur portable.

Connecteur : Le chargeur est équipé d'un connecteur de 7,4 mm x 5,0 mm. Cette taille de connecteur est spécifiquement conçue pour se connecter aux ordinateurs portables HP compatibles avec cette configuration de connecteur.

Original : Il s'agit d'un chargeur HP original, ce qui signifie qu'il est fabriqué par HP lui-même ou par un fabricant agréé. Les chargeurs originaux sont généralement de meilleure qualité et plus fiables que les chargeurs génériques.

Le chargeur HP 230W original est conçu pour alimenter efficacement les ordinateurs portables HP compatibles avec cette connectique spécifique. Sa puissance élevée en fait un choix idéal pour les ordinateurs portables hautes performances. Assurez-vous de vérifier la compatibilité avec votre modèle spécifique d'ordinateur portable HP avant d'acheter le chargeur pour vous assurer qu'il convient à votre appareil.

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[perlina-hitechcircuits]

Ceramic PCB Manufacturing--Hitechpcba

Ceramic PCB board is also called ceramic substrate or ceramic circuit board, ceramic copper coated plate, ceramic substrate refers to the copper foil directly bonded to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate or other ceramic substrate surface (single or double) on the special process board. The ultrathin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft brazing and high adhesion strength, and can be etched into a variety of graphics like PCB board, with great current-carrying capacity. Therefore, Ceramic PCB board has become the basic material of high power electronic circuit structure technology and interconnection technology.

Ceramic PCB Manufacturing & Assembly – One-stop service The ceramic substrate (ceramic PCB) refers to a special process board in which a copper foil is directly bonded to a surface of an alumina (Al2O3 ) or aluminum nitride (AlN) ceramic substrate (single or double-sided) at a high temperature. The ultra-thin composite substrate produced has excellent electrical insulation properties, high thermal conductivity, excellent solderability, and high adhesion strength, and can etch various patterns like a PCB board, and has a large current carrying current ability.

The advantages and disadvantages of Ceramic PCB

(1) Ceramic PCB board has very good thermal conductivity and insulation performance. Ceramic PCB board is made of ceramic substrate, ceramic substrate itself has very good insulation and thermal conductivity, thermal conductivity of 25~230w, insulation resistivity is 10 minus 14 square, visible insulation performance is very good.

(2) The dielectric constant of ceramic PCB board is very low, the dielectric loss is small, has very good high frequency performance, the dielectric loss of alumina ceramic PCB board is less than 0.0003@1MHz, the dielectric loss of aluminum nitride ceramic PCB board is less than 0.0005@1MHz. Low dielectric loss, high frequency performance, is widely used in the field of high frequency communication.

(3) Ceramic PCB bonding force is strong, using bonding technology, copper foil will not fall off.

(4) Ceramic PCB has large on-board flow, 100A current continuously passes through 1mm0.3mm thick copper body, and the temperature rises about 17℃; when 100A current continuously passes through the 2mm0.3mm thick copper body, the temperature rises only about 5℃.

(5) Ceramic PCB board is with high temperature resistance, corrosion resistance, environmental protection, can work in a very complex environment, long-term high frequency, long service life.

Disadvantages: fragile, scrap rate is high, this is one of the main short comings of ceramic PCB board, which leads to the production of a small area of the circuit board, the general size is less than 120mm, special custom 200mm,230mm, the general price is more expensive, the board cost is higher. In addition, because ceramic PCB board is made of ceramic material, it does not have better toughness like FR4 board, so it can make more than one meter long and wide. Another point is that the price is expensive, the requirements of electronic products are more and more rules, ceramic circuit boards are still used in some relatively high-end products, low-end products will not be used.

With over 15 years of experience in the electronic industry we are committed to producing custom ceramic PCBs that meet up with the various electronic devices at hand. 

[hugolikit]

SMOK Nfix Pod 700mAh 25W Pod Mod Antalya ili ve ilçelerinde hızlı kargo ve indirimli fiyat ile gönderim sağlıyoruz hemen sipariş verin.

www.hugolikit.net/smok-nfix-pod-700mah-25w-pod-mod-antalya/

[nerendus]

Buying a cheap 230W charger and just...hoping that all these problems I'm currently facing are due to me having bought a poorly timed dud charger. Because if not...that means it's the charging port, and if that's the issue, I am quite literally fucked when it comes to writing.

[hoaile8688]

Yếu tố nào khiến máy hút bụi Tineco Floor One S7 Pro được yêu thích ?

Tineco đi đầu trong lĩnh vực máy hút bụi kết hợp với chức năng đông thời. Đã cho ra đời nhiều dong sản phẩm khác nhau, và phiên bản mới nhất là Tineco S7 Pro khắc phụ nhược điểm của Model cũ, cũng như nâng cấp công nghệ - tính năng tân tiến hơn, mang đến cho người dùng trải nghiệm hoàn hảo hơn.

Cùng khám những yếu tố giúp máy hút bụi Tineco S7 được yêu thích trong phần dưới đây:

Nhỏ gọn, nhẹ nhàng di chuyển với thiết kế tối ưu

Tông màu chủ đạo đen trắng tinh tế

Chiều cao thân máy hút bụi Tineco Floor One S7 Pro vừa phải, tay cầm thiết kế xoay linh hoạt để thuận tiện hơn cho quá trình làm sạch các khu vực khó tiếp cận dưới bàn ghế.

Thiết kế chổi lăn tràn viền 2 bên, làm sạch cạnh tường siêu sạch

Đảm bảo luôn lau nhà bằng nước sạch với thiết kế bình chứa nước bẩn và sach tách rời nhau. Tương ứng với dung tích 0.7 - 0.8L

Lau nhà với tốc độ khủng 450 vòng/ phút, liên tục vắt nước bẩn.

Khả năng chuyển đổi nước thành nước điện phân lau chùi nhà cửa đảm bảo sạch sẽ, ngắn chặn vi sinh vật.

Sau khi lau xong không để lại vệt nước, bảo vệ sàn nhà không bị xơ xước.

Linh hoạt tùy chỉnh với 4 chế độ khác nhau

Điểm đặc biệt của máy hút bụi Tineco Floor One S7 Pro nằm ở hệ thống đẩy Smoothpower - Bước đột phá mới của nhà Tineco, đã được cấp bằng sáng chế. Hỗ trợ người dùng di chuyển nhẹ nhàng.

Màn hình LCD sắc nét, hình tròn với phần đồ họa trực quan, có hướng dẫn rõ ràng.

Khả năng nhận diện chính xác bủi bận, mảnh vụn, vết bẩn nhờ công nghệ thông minh iloop. Có thể phân biệt kích thước (to/nhỏ) trạng thái (khô/ướt)

Với 1 lần sạc đầy (khoảng 5 - 6 tiếng), máy hút bụi Tineco Floor One S7 Pro có thể kéo dài thời gian sử dụng lên đến 40 phút.

Thống số kỹ thuật tóm tắt

Tên sản phẩm: Máy hút bụi Tineco FLOOR ONE S7 Pro

Công suất 230W

Kích thước: 10,43 x 10,24 x 43,7 inch

Trọng lượng: 10kg

Độ ồn: 78dB

Hệ thống tự đẩy Smooth Power

Tự làm sạch kỹ lưỡng để bảo trì dễ dàng

Cảm biến thông minh iLoop

Làm sạch cạnh tăng cường hai mặt

Hệ thống dòng nước áp suất cân bằng

Pin máy hút bụi Tineco S7 Pro sử dụng: Lithium Ion

Hoạt động lên đến 40 phút

Thời gian sạc từ 5 - 6 tiếng

Phương pháp điều khiển Thông qua ứng dụng

4 chế độ Auto Mode, Ultra Mode, Suction Mode, Max Mode

Bình chứa nước sạch 0.85 L

Bình chứa nước bẩn 0.72 L

Phụ kiện đi kèm: Dụng cụ vệ sinh uốn cong, Con lăn bàn chải phụ, - Dung dịch vệ sinh 500ml*, 1Bộ lọc siêu khô, Bộ chuyển đổi, Đế sạc

Màn hình hiển thị: LCD 3.6 inch

Thương hiệu: Tineco

Đến Giga Digital mua máy hút bụi máy hút bụi Tineco FLOOR ONE S7 Pro

GIGA MALL L4-35, Tầng 4, GIGAMALL, 240-242 Phạm Văn Đồng, TP.Thủ Đức, TP.HCM 0931.892.033 "Chuyên robot hút bụi, nồi cơm & sản phẩm Tineco"

ECOVACS FLAGSHIP STORE Tầng 1 - 55 Thái Hà, Đống Đa, Hà Nội 0358.071.170

GIGA DIGITAL THÁI HÀ - HN Tầng 2 - 55 Thái Hà, Đống Đa, Hà Nội 0358.071.170

GIGA DIGITAL PHAN VĂN HỚN – Q12 – HCM 55 Minh Phụng, Tân Thới Nhất, Q12 (Cạnh chung cư Prosper Plaza) 0965.499.920

GIGA DIGITAL NAM ĐỊNH 81 Lê Hồng Phong, TP.Nam Định 0862.171.170

GIGA DIGITAL ĐÀ NẴNG 35 Chu Mạnh Trinh, TP. Đà nẵng 0931.114.707

GIGA DIGITAL HẢI PHÒNG 23 – BS1 Khu Đô thị PG, An Đồng, An Dương, TP Hải Phòng 0985.682.088

Liên hệ Đối tác & Đại lý 0966.933.737

[hitechpcba]

What is Ceramic PCB?

Ceramic PCB board is also called ceramic substrate, ceramic circuit board, ceramic copper coated plate, ceramic substrate refers to the copper foil directly bonded to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate or other ceramic substrate surface (single or double) on the special process board. 

The ceramic pcb can be described as an organic binder and ceramic powder that conducts heat. The thermal conductivity at which this PCB is prepared is between 9 to 20W/m.

To explain further, ceramic PCBs are printed circuit boards, with ceramic as its base material. This base material is highly thermally conductive like aluminum nitride, alumina, and beryllium oxide. These are very effective in the transfer of heat from hot spots and then dissipating this heat over the entire surface.

Asides from this, the fabrication of ceramic PCB is done with the LAM technology. This technology is a laser quick activation metallization type. Therefore, ceramic PCBs are highly versatile and can easily substitute the whole traditional PCBs. This PCB will achieve this with even more enhanced performance and involving less complicated construction.

1. The difference between ceramic substrate and pcb board

Ceramic substrate is that we say ceramic circuit board, ceramic pcb and printed circuit board have the same circuit interconnection, through hole conduction characteristics. So what are the differences between ceramic substrate and pcb board?

(1)The thermal conductivity of PCB board and ceramic substrate is different

Ceramic substrate is made of ceramic substrate, that is, the medium is ceramic material, including alumina ceramic base, aluminum nitride ceramic base, silicon nitride ceramic base, ceramic heat dissipation performance is very good, the thermal conductivity of ceramic substrate from 25w to 230w, different ceramic medium thermal conductivity is different. The thermal conductivity of alumina ceramic substrate is 25w~30w, the thermal conductivity of aluminum nitride ceramic substrate is above 170w, and the thermal conductivity of silicon nitride ceramic substrate is 80w~90w. Then pcb board is usually the use of medium is fr4 or metal substrate, thermal conductivity is less than 3w, and the gap is too large compared with ceramic substrate, especially the need for high heat dissipation performance of the product field, ceramic substrate has become a very popular medium material.

2. Ceramic substrate and pcb board insulation is different

Ceramic substrate is generally line layer - ceramic base - line layer structure, ceramic substrate insulation is very good, is also determined by the ceramic material itself, no need to add insulation layer. pcb board needs to add an insulating layer to play a mobile insulation role, but the insulation effect is far less than ceramic substrate.

(3)The heat dissipation structure of ceramic substrate is different from that of pcb board

The heat dissipation structure of the ceramic substrate is the structure of the circuit layer - ceramic base - circuit board layer. Because there is no insulating layer in the middle, the heat of the device is transferred directly from the ceramic base to the circuit layer and the heat dissipation is out, the heat dissipation is fast and the effect is good. pcb board is the need for heat from the medium layer - insulation layer - line layer, separated by an insulation layer at the same time, the dielectric layer itself of the thermal conductivity is poor, then add heat conduction adhesive, heat conduction effect is still not improved, often can not achieve the purpose of rapid heat dissipation device. In particular, some high-power devices need to use ceramic substrate as a cooling substrate in the product field where the heat dissipation and temperature change is relatively large.

(4)Ceramic substrate and pcb board application is different

Ceramic substrate and pcb board application is different, mainly the performance of the two is different, ceramic substrate is used in high thermal conductivity, high heat dissipation, high insulation, product field, such as high power LED lighting, high power module, high-frequency communication, track power supply; Ordinary pcb board is used in some more extensive, heat dissipation, insulation and other requirements are not strict, used in private commercial commodities.

(5) The price of ceramic substrate is different from that of pcb board

The material and performance of ceramic substrate and pcb board are different, and the final decision is that their prices are different. The board of ceramic substrate is very high and the production cost is high.

Ceramic substrate has outstanding advantages, but the ceramic substrate is fragile and has a high scrap rate, which requires a high level of production technology. However, you can't make a circuit board with the size of more than one meter like ordinary pcb boards. Hitech Circuits has more than 10 years of experience in the ceramic circuit board industry, and many universities and R & D institutions are in cooperation, welcome to inquiry.

2.Ceramic substrate and high-frequency plate difference

The material is different. The ceramic substrate is made of aluminum oxide or aluminum nitride, and the high frequency plate is made of Rogers, Yaron, PTFE, etc., with low dielectric constant and high frequency communication speed.

Performance is different. Ceramic substrate is widely used in refrigeration and systems, high power modules, automotive electronics and other fields. High frequency board is mainly used in high frequency communication field, aviation, high-end consumer electronics and so on. High-frequency communication field involves heat dissipation requirements, usually need to be combined with the ceramic base and high frequency plate, such as high frequency ceramic pcb.

1. Application of ceramic substrate

Ceramic substrates are used in led chips to achieve better thermal conductivity. In addition, ceramic substrate is also used to make ceramic chips in the following electronic devices:

　　◆High power semiconductor module

　　◆Semiconductor cooler, electronic heater; Power control circuit, power mixing circuit

◆Intelligent power module; High frequency switching power supply, solid state relay

◆Automotive electronics, aerospace and military electronics components

　　◆Solar panel module; Telecommunications private exchange, receiving system; Laser and other industrial electronics

Application of ceramic substrate in third generation semiconductor

The mainstream power devices represented by MOSFET, IGBT and transistor occupy a place in their own frequency and power supply segments. Due to the comprehensive excellent performance of IGBT, it has replaced GTR, become the inverter, UPS, frequency converter, motor drive, high-power switching power supply, especially now the hot electric vehicle, high-speed rail and other power electronic devices in the mainstream devices.

Application of alumina ceramic substrate in electronic power field

In the field of power electronics, such as power switching power supply, electric drive, etc., dielectric ceramic substrate is needed to achieve better thermal conductivity, prevent current burn out and short circuit.

Application of alumina ceramic co-fired plate in lithium battery industry

With the recommendation of artificial intelligence and environmental protection, the automobile industry has also launched electric cars, mainly through battery storage. Lithium batteries made of ceramic substrate can achieve better current and heat dissipation functions, promoting the market demand for new energy vehicles.

2. Advantages of ceramic substrate

A. The thermal expansion coefficient of ceramic substrate is close to that of silicon chip, which can save Mo sheet of transition layer, save labor, save material and reduce cost;

B. Reduce the welding layer, reduce the thermal resistance, reduce the cavity;

C. Under the same load flow, the wire width of copper foil 0.3mm thick is only 10% of that of ordinary printed circuit board;

D. Excellent thermal conductivity, so that the chip packaging is very compact, so that the power density is greatly increased, improve the reliability of the system and device;

E. Ultra-thin (0.25mm) ceramic substrate can replace BeO, without environmental toxicity problems;

F. Large load capacity, 100A current continuously through 1mm wide 0.3mm thick copper body, temperature rise about 17℃; With 100A current continuously passing through a 2mm wide 0.3mm thick copper body, the temperature rise is only about 5℃.

G. Low thermal resistance, 10×10mm ceramic substrate 'thermal resistance of 0.63mm thickness of ceramic substrate is 0.31K/W, 0.38mm thickness of ceramic substrate is 0.19K/W, 0.25mm thickness of ceramic substrate is 0.14K/W.

H. High insulation and high pressure resistance to ensure personal safety and equipment protection.

I. New packaging and assembly methods can be realized, so that the product is highly integrated and the size is reduced.

3. Ceramic substrate technology

At present, the common types of ceramic heat dissipation substrate include HTCC, LTCC, DBC and DPC. DBC and DPC for the domestic in recent years to develop mature, and energy production of professional technology, DBC is the use of high temperature heating Al2O3 and Cu plate combination, its technical bottleneck is not easy to solve the problem of micro-pores between Al2O3 and Cu plate, which makes the mass production energy and yield of the product by the greater challenge. DPC technology is the use of direct copper plating technology, Cu deposition on the Al2O3 substrate, its process combined with the material and film technology, its product is the most commonly used ceramic cooling substrate in recent years. However, its material control and process technology integration ability requirements are high, which makes the technical threshold of entering the DPC industry and stable production is relatively high.

(1) HTCC (High-Temperature Co-fired Ceramic)

The manufacturing process of HTCC is very similar to that of LTCC. The main difference is that the ceramic powder of HTCC is not added with glass material. Therefore, the ceramic powder of HTCC must be dried and hardened into embryonic form at a high temperature of 1300~1600℃. Due to its high co-firing temperature, the choice of metal conductor materials is limited, its main materials for high melting point but poor conductivity tungsten, molybdenum, manganese... Such as metal, and finally laminated sintering molding.

(2) LTCC (Low-Temperature Co-fired Ceramic)

LTCC is also known as low-temperature co-fired multilayer ceramic substrate. In this technology, inorganic aluminum oxide powder and about 30%~50% glass material are combined with organic binder to make it evenly mixed into mud slurry. Then, the slurry is scraped into sheets with a scraper, and then through a drying process, the sheet slurry is formed into a thin piece of raw blank. As the transmission of signals at all levels

For the internal lines of LTCC, the screen printing technology is used to fill holes and print lines on the raw embryos, and the internal and external electrodes can be used respectively of silver, copper, gold and other metals. Finally, the layers are stacked and sintered in the sintering furnace at 850~900℃.

(3) Direct Bonded Copper (DBC)

Direct copper coating technology is the use of copper oxygen eutectic liquid directly on the ceramic coating, the basic principle is to introduce an appropriate amount of oxygen between copper and ceramic before or during the coating process, in the range of 1065℃~1083℃, copper and oxygen form Cu-O eutectic liquid, DBC technology uses the eutectic solution to chemically react with the ceramic substrate to form CuAlO2 or CuAl2O4 phase on the one hand, and to infiltrate the copper foil to realize the combination of the ceramic substrate and copper plate on the other hand.

（4） DPC (Direct Plate Copper)

DPC is also known as direct copper-plated substrate. Take DPC substrate process as an example: First of all, the ceramic substrate is pre-treated and cleaned, and the ceramic substrate is sputtered on the ceramic substrate and combined with the copper composite layer by using the vacuum coating technology of thin film manufacturing. Then the circuit is made by the re-exposure, development, etching and film removal process with the yellow light microshadow photoresistance. Finally, the thickness of the circuit is increased by electroplating/electroless plating deposition, and the metallized circuit is made after the photoresistance is removed.

3. Production process of ceramic substrate

1. Drilling

Ceramic substrate is generally used by laser punching, compared with the traditional punching technology, laser punching technology has the advantages of high precision, fast speed, high efficiency, large-scale mass punching, suitable for the vast majority of hard and soft materials, no loss to tools, in line with the printed circuit board high density interconnection, fine development.

Through the laser drilling process of ceramic substrate has high bonding force of ceramic and metal, no falling off, foaming phenomenon, to achieve the effect of growth together, high surface smoothness, roughness in 0.1μm ~ 0.3μm, laser drilling aperture in 0.15mm-0.5mm, even can reach 0.06mm.

2、Copper-clad　　

Copper coating refers to the area without wiring on the circuit board covered with copper foil, connected with the ground wire, in order to increase the ground wire area, reduce the loop area, reduce voltage drop, improve power efficiency and anti-interference ability. Copper coating can not only reduce the ground impedance, but also reduce the cross-sectional area of the loop and enhance the mirror loop of the signal. Therefore, the copper coating process plays a very key role in the ceramic substrate PCB process, incomplete, truncated mirror loop or incorrect position of the copper layer often lead to new interference, have a negative impact on the use of the board.

3. Etching

Ceramic substrates also need to be etched, with the circuit pattern pre-coated with a lead-tin resist layer, and then chemically etched away the unprotected, non-conductive copper to form the circuit. Etching is divided into inner layer etching and outer layer etching, inner layer etching using acid etching, with wet film or dry film as corrosion resistance; The outer etching is alkaline etching with tin and lead as resist.

There are many kinds of manufacturing process of ceramic products in circuit board factory. It is said that there are more than 30 kinds of manufacturing processes, such as dry pressing, grouting, extrusion, injection, casting and isostatic pressing. Because the electronic ceramic substrate is a "flat" type, the shape is not complicated, the manufacturing process of dry forming and processing is simple and the cost is low, so most of them use dry pressing forming method. The manufacturing process of dry press PCB electronic ceramics mainly includes blank forming, blank sintering and finishing, forming circuit on the substrate.

1. Green manufacturing of ceramic substrate (forming)

Use high purity alumina (content ≥95% Al2O3) powder (different particle sizes are required depending on the purpose and manufacturing method. For example, from a few illiterates to tens of microns) and additives (mainly adhesives, dispersants, etc.). Form a "paste" or processed material.

(1) Dry pressing of ceramic substrate to produce green parts (or "green").

Dry pressing billet is the use of high purity alumina (electronic ceramics with alumina content greater than 92%, most of the use of 99%) powder (dry pressing particles shall not exceed 60μm, for extrusion, rolling, injection and other powder particles should be controlled within 1μm) add the appropriate amount of plasticizer and binder, mixed evenly after dry pressing billet. At present, the offspring of square or round pieces can reach 0.50mm, or even ≤0.3mm (depending on plate size). Dry pressed billets can be processed before sintering, such as dimensioning and drilling. Machining, but be careful to compensate for the size shrinkage caused by sintering (magnify the size of the shrinkage).

(2) Production of green billet by ceramic substrate spreading method.

Flow glue liquid (aluminum oxide powder + solvent + dispersant + adhesive + plasticizer mixed evenly + screening) manufacturing + flow casting (in the flow casting machine glue on metal or heat-resistant polyester belt) + drying + trimming (can also be other processing) + degreasing + sintering and other processes. It can realize automation and scale production.

2. Sintering and finishing of green billet after sintering. The raw parts of ceramic substrate often need to be "sintered" and finished after sintering.

(1) Sintering of raw ceramic substrate.

Ceramic billet "sintering" refers to the process of "sintering", the billet (volume) in the cavity, air, impurities and organic matter such as dry pressure removal, so that its volatilization, combustion, extrusion, and removal of alumina particles. Achieve close contact or combined growth process, so after sintering of ceramic green billet, there will be weight loss, size shrinkage, shape deformation, compressive strength increase and porosity reduction and other changes.

The sintering methods of ceramic billet are as follows: ① atmospheric sintering, non-pressure sintering will bring large deformation; ② pressure (hot pressing) sintering, pressure sintering, can get good flat products is the most commonly used method; ③ Hot isostatic sintering is the use of high pressure hot gas sintering. Its characteristic products are finished at the same temperature and pressure. All kinds of performance balance, the cost is relatively high. In the added value of products, or aerospace, national defense and military products in the use of this sintering method, such as the military field of mirrors, nuclear fuel, barrel and other products. The sintering temperature of dry pressed alumina green billets is mostly between 1200℃ and 1600℃ (depending on composition and flux).

(2) Finishing of ceramic substrate after sintering (cooked) blank.

Most sintered ceramic billets require finishing. The purpose is: ① to obtain a flat surface. In the process of high temperature sintering of green billet, due to the imbalance of particle distribution, voids, impurities and organic matter in the green billet, it will cause deformation, unevenness or excessive roughness and difference. These defects can be solved by surface finishing; ② Obtain high finish surface, such as specular reflection, or improve lubricity (wear resistance).

Surface polishing treatment is to use polishing materials (such as silicon carbide, B4C) or diamond sand paste to gradually polish the surface from coarse to fine abrasive. Generally speaking, the use of AlO powder or diamond paste ≤1μm, or laser or ultrasonic processing to achieve.

(3) strong (steel) treatment.

After surface polishing, in order to improve the mechanical strength (such as bending strength, etc.), electronic ray vacuum coating, sputtering vacuum coating, chemical vapor evaporation and other methods can be used to plating a layer of silicon compound film, through 1200℃ ~ 1600℃ heat treatment, can significantly improve the mechanical strength of ceramic parts!

3. Form a conductive pattern (circuit) on the substrate

To process conductive graphics (circuits) on ceramic substrates, it is necessary to manufacture copper-coated ceramic substrates first, and then to manufacture ceramic printed circuit boards according to PCB technology.

(1) Forming a copper-covered ceramic substrate. There are currently two methods of forming copper-coated ceramic substrates.

① Laminating method. It is formed by hot pressing one side of oxidized copper foil and alumina ceramic substrate. That is, the ceramic surface is treated (such as laser, plasma, etc.), get activated or rough surface, and then according to the "copper foil + heat-resistant binder layer + ceramic + heat-resistant binder layer + copper foil" laminate together, after 1020℃ ~ 1060℃ sintering, the formation of double-sided copper coated ceramic laminate. ② Electroplating method. After plasma treatment, the ceramic substrate is "sputtered titanium film + sputtered nickel film + sputtered copper film", and then conventional electroplating copper to the required copper thickness, that is, the formation of double-sided copper-coated ceramic substrate.

(2) Single and double sided ceramic PCB board manufacturing. According to traditional PCB manufacturing techniques, single - and double-sided copper-coated ceramic substrates are used.

(3) ceramic multilayer plate manufacturing.

① In single and double panels repeatedly coated insulation layer (alumina), sintering, wiring, sintering to form PCB multilayer board, or the use of casting manufacturing technology to complete. ② Ceramic multilayer plate is manufactured by casting method. The raw tape is formed on the casting machine, then drilling, plugging (conductive glue, etc.), printing (conductive circuit, etc.), cutting, laminating, isostatic pressing to form ceramic multilayer plate. Hitech Circuits has more than 10 years of experience in manufacturing ceramic substrates, so feel free to consult them if you need to know more technical questions.

[mytechbug]

Lenovo Legion Slim 5i Gen 8: A perfect gaming Laptop for your unique setup

In recent times, laptops have been the primary source of technology that provides its users with the best experience that was only available through PCs in the old times. Now, the laptop does the same work as the PC does. One of the recent developments is in gaming devices as gaming is one of the fantastic experiences nowadays, so brands are working on providing their users with new advanced technology to use as a gaming set and experience the thrill of a new level. Lenovo Legion series of gaming laptops is one such example, which is making advancements with time and offers the best gaming experience. They recently released their Lenovo Legion Slim 5i Gen 8, a budget-friendly, slim, portable gaming laptop with perfect performance. You will not mind having it in your possession, and you will surely love how effectively it works in an amazingly minimal price range. Specifications of Lenovo Legion Slim 5i Gen 8 Specifications Details Manufacturer Lenovo Price $979.99 Weight 2.4kg Colour Storm Grey Network Wi-Fi 6E, Bluetooth 5.1 Processor 13th Generation Intel®Core™5i-13500H Processor 13th Generation Intel®Core™5i-13500H Processor Graphics NVIDIA®GeForce RTX™ 4050 6GB GDDR6 NVIDIA®GeForce RTX™ 4060 8GB GDDR6 NVIDIA®GeForce RTX™ 4070 8GB GDDR6 Display 16inch, 6:10 aspect ratio, IPS, up to 2560 x 1600 (QHD+), 500nits Speaker Dual 2W stereo GPU Up to NVIDIA RTX 4070 Laptop Camera 1080p, privacy shutter Ports Two USB-C 3.2 (Gen 2) Two USB-A 3.2 (Gen 2) RJ45 Ethernet HDMI 2.1 SD card reader Memory 32 GB5200MHz Storage Up to 1TB PCIe SSD Gen4 Battery 80WHr (up to 5 hours) Keyboard 1.5mm Warranty One year What is in the Lenovo Legion Slim 5i Gen 8 box? Lenovo Legion Slim 5i Gen 8 comes in perfect packaging, and the box contains Legion Slim 5i Gen 8 (16’’ intel) 170W or 230W slim adapter Internal battery User guide Design and Built Quality of Lenovo Legion Slim 5i Gen 8 Lenovo Legion Slim 5i Gen 8 gives off a perfect throttled look with a  grey metallic shade and sleek design. It weighs 2.3kg, which makes it a lightweight, portable device, and it is just 19.7mm thin, which gives it a decent slimming feature. It does not make it a less sturdy product, but the Lenovo Legion Slim 5i Gen 8 guarantees toughness and compact state even if it suffers a blow. It is a perfect mixture of balance and sleek design. It has a powerful processing system with a heavy graphic card for the smooth running of games. 1080p camera, along with a private shutter and 3.5mm stereo setup, further enhance the device's vision and sound system. Keyboard The keyboard, irrespective of its modern, sleek design, consists of a numpad and full-sized arrowhead keys, which makes us wonder about its brilliant craftsmanship. The RGB keyboard has a smooth 1.5mm distance between the keys, making a gamer readily press the buttons without any fear. Systems like fan controls and other overclocking controls can be adjusted to your needs, making it a solid product for the users. We can say that the Legion Slim 5i Gen 8 has undergone many changes from its predecessors. The exhaust system is modified, and the plastic exterior is sturdier than before; the grille system on the laptop's base is protected by rubber, making it cool down quickly. Overall, the design is perfect for use. Display of Lenovo Legion Slim 5i Gen 8 Lenovo Legion Slim 5i Gen 8 has a 16-inch screen display with a QHD+ version, giving off a solid and perfect colour display. The Dolby Vision further enhances the colour display along with a 300-nit setup. The TUV low blue light is also available to protect your eyes from rigorous gaming. The 240Hz refresh rate makes it a gorgeous product with a perfect display system. Performance of Lenovo Legion Slim 5i Gen 8 One of the prominent features that makes the Lenovo Legion Slim 5i Gen 8 is its perfect smooth performance. In the past, gaming laptops were prone to slow down their performance when games were being played for a long time, but this time, Legion Slim 5i Gen 8 tried its best to come up with a system that will not mask it is efficiency even if games are played for quite a long time. They have done this, and they were successful in it. The processing system, even the GPU and the SSD, runs in a smooth running performance. The battery life was also sturdy, and I noted that the system did not overheat. This makes it a solid product for your gaming experience. The 13th Intel core processor works beyond thought and gives your games a perfect balance of stream and power. Pros and Cons of Lenovo Legion Slim 5i Gen 8 Pros Cons Affordable Fairly long in size Perfect gaming experience No USB-4 port No lagged performance Good cooling system Sturdy and sleek built Perfect keyboard layout with numspad and full arrow keys Should you buy the Lenovo Legion Slim 5i Gen 8? Yes, you should buy it if you are into gaming laptops and want a gaming experience that is out of the world. The amazing sleek design, perfect throttled performance, and long battery life make it one of the best gaming laptops in the market. I suggest you buy it; you can customise your choice of internal memory, graphic card, and several other options available on the Lenovo official website. You just have to choose your options, and that is all. The box will be delivered to your doorstep. What else do you need? Final thoughts Lenovo Legion Slim 5i Gen 8 has been one of the most reputed gaming laptops in the market. Changes have been made from the previous generation, and this Gen 8 has a perfect sturdy build, a slim design, and lightweight portability. The Nvidia GeForce GTX graphic chip enhances the performance, and the internal is no less than 64GB. The battery life is extended to five hours, and you can experience real-world colours with Dolby Vision. Overall, this product is nothing short of appraisals; you can buy it without a second thought. FAQs Q: Is the audio system up to the mark in the Lenovo Legion Slim 5i Gen 8? Yes, the Legion Slim 5i Gen 8 uses a 3.5mm stereo boost system that gives off a perfect sound system for your gaming experience. Q: What makes the Lenovo Legion Slim 5i Gen8 different from the previous laptops? The perfect cooling system, along with no overheating capacity and no fuzzy vision, makes it an advanced product, irrespective of its predecessor. Read the full article