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atsthermal · 5 years ago

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Industry Developments: Thermal Management Solutions for IGBT Modules

Power electronics devices are vital for the efficient generation, conversion, transmission and distribution of electric power. Power technologies are being used to improve energy efficiency, reliability, and control. Some experts expect that one day all electrical power will flow through a power semiconductor device at least once. [1]

Fig. 1. An IGBT module with rated current of 1,200 A and max voltage of 3,300 V. [2]

Among the more widely adapted high-voltage, high-power devices are IGBT. An IGBT (insulated gate bipolar transistor) is a solid-state switch that allows power to flow in the ‘On’ state and stops power flow when it is in the ‘Off’ state.

More specifically, an IGBT works by applying voltage to a semiconductor component, changing its properties to block or create an electrical path. An IGBT combines an insulated gate input and bipolar output to provide a reliable power switch for medium frequency (5-50 kHz) and high voltage (200-2,000 V) applications. [3]

Large IGBT modules typically consist of many devices in parallel and can have very high current-handling capabilities in the order of hundreds of amperes with blocking voltages of 6,500 V. These IGBT can control loads of hundreds of kilowatts. [4]

Among the many areas where IGBT are used in high power applications are:Electric and hybrid-electric vehicles; Battery chargers and charging stations; Electric buses, trams, and trolleys; Appliance motor drives; Switch and uninterruptible power supplies; Power factor correction converters; Traction motor controls; Solar and wind power inverters; Induction heating; and Medical diagnostic devices.

Thermal Management Needs and Solutions

IGBT generate significant heat and can be affected by excess thermal energy. Using air cooling techniques, e.g. heat sinks, for high-power dissipating IGBT can be impractical because of the large sizes the sinks require to manage the high volumes of heat.

Liquid cooling provides heat transfer coefficients several orders of magnitude higher than convection cooling, thus enabling much higher power densities and more compact module and inverter solutions.

While there is sometimes a reluctance to use liquid cooling in the power electronics industry, it is essential to meet many of today’s IGBT thermal management needs. The automotive industry has been using liquid cooling for internal combustion engines for more than a century and the idea of using liquid cooling for power electronics in an automotive application is now considered a non-issue. [5]

Liquid cooling methods for IGBT include cold plates, heat pipes, turbulators and vapor cooling loops.

Cold Plates

Cold plates provide localized cooling of power electronics by transferring heat from the device to a liquid that flows to a remote heat exchanger and dissipates into either the ambient or to another liquid in a secondary cooling system. Compared to air cooling, liquid cold plates provide more efficient performance and enable major reductions in the volume and weight of power electronics systems.

Fig. 2. Cold Plates are used to keep chip temperatures lower inside modular IGBT component packages. (Advanced Thermal Solutions, Inc.) [6]

High switching frequencies and voltages result in IGBT dissipating higher power at the die level. Thus, the goal for cooling IGBT with cold plates is typically to get the lowest semiconductor temperature possible, as well as a minimum temperature gradient from one module to the next. They provide efficient heat transfer between the cold plate contact area and the IGBT base plate.

Uniquely manufactured IGBT cold plates from Advanced Thermal Solutions, Inc. (ATS) feature a higher performance mini-channel design. For example, the CP-1000 model cold plate, at a flow rate of 4 L/min, can transfer 1 kW of heat at 5°C temperature difference between the cold plate base and the inlet fluid temperature.

Fig. 3. A superior quality, vacuum-brazed cold plate from Mersen. [7]

Mersen S.A. provides vacuum-brazed cold plates specially dedicated to the needs of industrial drives. The vacuum–brazing technology insures metal-to-metal, flux-free joints ensuring leak-free, high-performance results. [7]

Fig. 4. IGBT-cooling base plates are available with multiple metal substrates and with low cost fin and pin features. [8]

Base plates (without liquids) are also available for IGBT cooling. One supplier is Wolverine MicroCool. Wolverine’s base plates provide efficient heat transfer in part because of their patented Micro Deformation Technology (MDT), which enables a wide variety of fin, pin and micro-channel geometries in a low-cost process. Because of this technology, the base plates have a very low pressure drop without compromising thermal conductivity. [8]

Turbulators

A turbulator is a cooler assembly designed to ensure all chips in a series of IGBT modules are cooled equally and efficiently. The concept enables tailored cooling, if hot spots need extra attention, and is accomplished by designing the liquid cooling channels individually.

The Mentor ShowerPower plastic part (pictured below in blue) has several cooling cells in the ‘X’ and ‘Y’ directions and needs a manifold structure on the backside of the plastic part. This ensures that each cooling cell receives water at the same temperature. [9]

Fig. 5. The turbulator concept ensures that all chips a series of IGBT modules are cooled equally. [9]

Turbulator designs like the ShowerPower provide many benefits. By homogeneously cooling flat IGBT baseplates and modules, they eliminate temperature gradients to allow the paralleling of many power chips.

Direct Liquid Cooling

Unlike cold plates, whose metal enclosures contact the base of an IGBT with a TIM (thermal interface material) in between, the concept of direct liquid cooling puts the liquid in contact with integral fins on IGBT base.

By arranging the fins in a high-density configuration directly beneath the power chip, which is a heat-generating body, the capacity for heat dissipation between the fins and the cooling liquid is increased. The result is that the thermal resistance between the power chip and the cooling liquid is reduced by approximately 30% compared to that of the conventional structure. [10]

Fig. 6. Cross-sectional comparison of conventional cold plate structure and direct liquid cooling structure. [10]

Vapor Cooling

Evaporative cooling technology increases power densities for high power electronics by more than two times according to Parker, which provides a two-phase evaporative liquid cooling system. The technology uses a noncorrosive, non-conductive fluid which vaporizes and cools hot surfaces on contact. [11]

The system uses a small pump to deliver just enough coolant to the evaporator – usually a series of one or more cold plates optimized to acquire the heat from the device(s). In so doing, the two-phase coolant begins to vaporize, maintaining a cool uniform temperature on the surface of the device. The vaporized coolant is then pumped to a heat exchanger where it rejects the heat to the ambient and condenses back into a liquid, completing the cycle.

Figure 7: High=-performance two-phase evaporative cooling allows twice the density of high-power electronics. [11]

Integrating the high-heat removal of two-phase technology with the reliability of low-flow liquid pumping, Parker’s system is highly modular (hot swappable) and scalable. The cooling process continuously cycles the refrigerant within a sealed, closed-loop system to cool a wide range of systems, including power electronics, motors, transformers, and high-efficiency. It simplifies the plumbing and reduces the overall weight, giving it an excellent thermal performance/cost ratio.

Heat Pipes

Another IGBT cooling method is based on standard heat pipes. A series of pipes are embedded in a metal plate under the power semiconductor and extend from the plate to a remote fin stack. Heat from the semiconductor is absorbed by the heat pipes and transported to the fins, which are cooled by natural or forced (fan) convection.

An example of this system is Therma-Charge from Aavid Thermacore. In this system, the IGBT are mounted on both sides of the plate. [12]

Fig. 8. Heat pipes embedded in the plate carry heat to an air-cooled fin section. [12]

References 1. EPE and ECPE “Position paper on Energy Efficiency – the role of Power Electronics,” Summary of results from European Workshop on Energy Efficiency – the role of Power Electronics, Brussels, Belgium, Feb 2007 2. https://en.wikipedia.org/wiki/Insulated-gate_bipolar_transistor 3. On Electronics, https://www.onsemi.com/pub/Collateral/HBD871-D.PDF 4. Future Electronics, http://www.futureelectronics.com/en/transistors/igbt-transistor.aspx 5. Mentor Graphics, https://www.mentor.com/products/mechanical/engineering-edge/volume4/issue1/showerpower-turbulator-keeps-IGBT-cool 6. Advanced Thermal Solutions, Inc. (ATS), https://www.qats.com/Products/Liquid-Cooling/Cold-Plates 7. Mersen, http://ep-us.mersen.com/us/products/catalog/line/vacuum-brazed-cold-plates-3-igbt-1064x624mm/ 8. Wolverine MicroCool, https://www.microcooling.com/our-products/base-plate-products/igbt-base-plate-products/ 9. Mentor Graphics, https://www.mentor.com/products/mechanical/engineering-edge/volume4/issue1/showerpower-turbulator-keeps-IGBT-cool 10. Fuji Electric, http://www.fujielectric.com/company/tech/pdf/58-02/FER-58-2-055-2012.pdf 11. Parker, https://www.parker.com/literature/CIC%20Group/Precision%20Cooling/New %20literature/Two_Phase_Evaporative_Precision_Cooling_Systems.pdf 12. Aavid Thermacore, http://www.thermacore.com/applications/power-electronics-cooling.aspx

For more information about Advanced Thermal Solutions, Inc. (ATS) products and thermal management consulting and design services, visit www.qats.com or contact ATS at 781.769.2800 or [email protected].

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theshadowytastemakerstuden-blog1 · 6 years ago

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Thermal Conductive Grease Market to Benefit from Increased Global Uptake of 2017 – 2026

Thermal conductive grease is a compound that is typically electrically insulating and thermally conducting, i.e. the heat transfer can occur through such compounds. These are most commonly employed as an interface material between the source of heat and heat sinks. Thermal conductive grease is known by several alternative names such as heat paste, thermal compound, thermal interface material (TIM), heat sink compound, thermal paste, or thermal gel. The basic function of thermal conductive grease is to remove air spaces or gaps from the interface area, which play the role of thermal insulators, and facilitate maximize heat transfer. Request to view sample of this report at: https://www.transparencymarketresearch.com/sample/sample.php?flag=B&rep_id=42725 Thermal conductive greases do not provide mechanical strength to the bonding between heat sink and source of heat, unlike thermal adhesives. External mechanical mechanisms that creates the pressure between the two are required in order to spread the thermal conductive grease onto the heat source. Thermal conductive grease comprise a polymerizable liquid matrix and thermally conductive filler. Thermally conductive fillers also are typically electrically insulating. Most commonly used matrix materials include silicone, acrylates, epoxies, urethanes, solvent-based systems, and hot-melt adhesives, while aluminum oxide, aluminum nitride, zinc oxide, and boron nitride are commonly used fillers. Among these fillers, usage of aluminum nitride is increasing. Electronic surfaces are never smooth. Microscopic blemishes are present on any surface, which reduce the heat flow and increase contact resistance. These gaps or roughness of the surface inhibit effective heat transfer, which can potentially lead to device failure. TIMs that have low flowing properties can leave voids, which inhibit heat transfer. Thermal conductive grease, however, completely fills the micro-gaps (due to matrix composition). This ensures the vital parts of a component are protected from the flow of heat. Key attributes that ensure good performance of thermally conductive grease are its thermal conductivity and resistance, bond line thickness, processing ability, and re-workability. Thermally conductive grease is applied in a wide array of industrial applications including power components and supplies, broadcasting equipment, ignition modules, computer equipments, audio amplifiers, power resistors, semi-conductor mounting devices, transistor diodes, thermal joints, and ballast heat transfer mediums. Thermally conductive grease is available in varying grades or compositions as different product lines, depending on the end application and conductivity of the grease. The different compositions and features of thermally conductive greases is due to its utilization in applications ranging from the simplest to the most demanding thermal requirements. Based on type, the market for thermally conductive greases can be divided into silicone-based grease and non-silicone-based grease. Based on end-user industry, the market can be classified into automotive, electricals & electronics, energy & power, telecommunications & IT, and others (including medical & office equipments). In terms of geography, the thermal conductive grease market can be segmented into Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. On the global level, in terms of both value as well as volume, in 2016, Asia Pacific led the thermal conductive grease market. Demand for thermal conductive grease from different end-use industries primarily in China, India, Japan, and South Korea is a major factor driving the thermal conductive grease market in Asia Pacific. The automotive industry is a major application segment of the market in the region, which is expanding at a rapid pace. This, in turn, is boosting the demand for thermal conductive grease. Moreover, the region is a major hub for the production of electricals and electronics, which also fuels the demand for thermal conductive grease in the region. Key players operating in the thermal conductive grease market include 3M, Dow Corning Corporation, Parker Hannifin Corp, Laird Technologies, ACC Silicones Ltd (A CHT Group company), LORD Corporation, Wacker Chemie AG, and PolySi Technologies Inc. The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

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talkherald · 6 years ago

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Global Polymer Based Thermal Interface Materials (TIM) Market Share (2018-23): Laird Technologies, Honeywell, Henkel and Dow Corning

The analysis supplies a holistic summary of this global Polymer Based Thermal Interface Materials (TIM) market with the assistance of application sections and geographic regions Latin America, Asia-Pacific, The Middle East and Africa, Europe and North America that regulate the industry now.

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assetsstock-blog · 7 years ago

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Global Thermal Interface Material (TIM) Market 2018 Perspective- LairdTech, Aavid Thermalloy, Dow Corning and Henkel

The research report investigate major market deliberation of Global Thermal Interface Material (TIM) Market after performing different intellectual and extensive analysis on Thermal Interface Material (TIM) industry. To gain better vision, insights, assets of the Thermal Interface Material (TIM) market segments, the report helps key vendors, Thermal Interface Material (TIM) manufacturersand…

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dailyassesment · 7 years ago

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Global Polymer Based Thermal Interface Materials (TIM) Market Insights by 2023: Henkel, Laird Technologies, Honeywell and 3M

Global Polymer Based Thermal Interface Materials (TIM) market 2018 research report is a solitary device that gives an inside and out analysis of various Polymer Based Thermal Interface Materials (TIM) market bits of knowledge, openings, security approaches and political methods for making solid conclusions. The Polymer Based Thermal Interface Materials (TIM) market CAGR rate may increment by huge…

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reportagestuff · 7 years ago

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Polymer Based Thermal Interface Materials (TIM) Market Global Trends Forecast by 2023: Laird Technologies, Henkel, 3M and Honeywell

Polymer Based Thermal Interface Materials (TIM) market report entitles with an in-depth analysis towards the competitive market, which involves the market shares and company outline of the major competitors functioning in the Polymer Based Thermal Interface Materials (TIM) market. The market offers detailed summarization of products, various technologies applied in the Polymer Based Thermal…

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peopleexclusive-blog · 7 years ago

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Polymer Based Thermal Interface Materials (TIM) Market Globally 2017: Honeywell, Laird Technologies, 3M and Henkel

The report describes the composition of the global Polymer Based Thermal Interface Materials (TIM) market by segmenting it on the basis of various factors such as product type, manufacturers, application, end use and regions. In this Polymer Based Thermal Interface Materials (TIM) report, every single segment is studied thoroughly and presented in the clear and precise manner. The key drivers and…

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registrardailyreports-blog · 7 years ago

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Global Polymer Based Thermal Interface Materials (TIM) Market Overview 2017- ShinEtsu, Henkel, Laird Technologies, SEMIKRON, 3M and Dow Corning

Global Polymer Based Thermal Interface Materials (TIM) market offers a valuable tool to assess the latest Polymer Based Thermal Interface Materials (TIM) market statistics and market scenario. The report presents the strategies and research methodology followed to clarify the Polymer Based Thermal Interface Materials (TIM) industry aspects. This report analyses the dynamic world Polymer Based…

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publicistreport · 8 years ago

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Global Polymer Based Thermal Interface Materials (TIM) Market-Boom New Materials, Aochuan, Honeywell, ShinEtsu

2017-2022 Global Polymer Based Thermal Interface Materials (TIM) Market Report

The report titled “Global Polymer Based Thermal Interface Materials (TIM) Market” gives a proper understanding of global Polymer Based Thermal Interface Materials (TIM) industry. Furthermore it also cover-up forecast and analysis for Polymer Based Thermal Interface Materials (TIM) market on the global and regional…

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#Global Polymer Based Thermal Interface Materials (TIM) Market

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theshadowytastemakerstuden-blog1 · 6 years ago

Text

Thermal Conductive Grease Market to Benefit from Increased Global Uptake of 2017 – 202

Request to view sample of this report at: https://www.transparencymarketresearch.com/sample/sample.php?flag=B&rep_id=42725

Thermal conductive greases do not provide mechanical strength to the bonding between heat sink and source of heat, unlike thermal adhesives. External mechanical mechanisms that creates the pressure between the two are required in order to spread the thermal conductive grease onto the heat source. Thermal conductive grease comprise a polymerizable liquid matrix and thermally conductive filler. Thermally conductive fillers also are typically electrically insulating. Most commonly used matrix materials include silicone, acrylates, epoxies, urethanes, solvent-based systems, and hot-melt adhesives, while aluminum oxide, aluminum nitride, zinc oxide, and boron nitride are commonly used fillers. Among these fillers, usage of aluminum nitride is increasing.

Electronic surfaces are never smooth. Microscopic blemishes are present on any surface, which reduce the heat flow and increase contact resistance. These gaps or roughness of the surface inhibit effective heat transfer, which can potentially lead to device failure. TIMs that have low flowing properties can leave voids, which inhibit heat transfer. Thermal conductive grease, however, completely fills the micro-gaps (due to matrix composition). This ensures the vital parts of a component are protected from the flow of heat.

Key attributes that ensure good performance of thermally conductive grease are its thermal conductivity and resistance, bond line thickness, processing ability, and re-workability. Thermally conductive grease is applied in a wide array of industrial applications including power components and supplies, broadcasting equipment, ignition modules, computer equipments, audio amplifiers, power resistors, semi-conductor mounting devices, transistor diodes, thermal joints, and ballast heat transfer mediums.

Thermally conductive grease is available in varying grades or compositions as different product lines, depending on the end application and conductivity of the grease. The different compositions and features of thermally conductive greases is due to its utilization in applications ranging from the simplest to the most demanding thermal requirements.

Based on type, the market for thermally conductive greases can be divided into silicone-based grease and non-silicone-based grease. Based on end-user industry, the market can be classified into automotive, electricals & electronics, energy & power, telecommunications & IT, and others (including medical & office equipments).

In terms of geography, the thermal conductive grease market can be segmented into Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. On the global level, in terms of both value as well as volume, in 2016, Asia Pacific led the thermal conductive grease market. Demand for thermal conductive grease from different end-use industries primarily in China, India, Japan, and South Korea is a major factor driving the thermal conductive grease market in Asia Pacific. The automotive industry is a major application segment of the market in the region, which is expanding at a rapid pace. This, in turn, is boosting the demand for thermal conductive grease. Moreover, the region is a major hub for the production of electricals and electronics, which also fuels the demand for thermal conductive grease in the region.

Key players operating in the thermal conductive grease market include 3M, Dow Corning Corporation, Parker Hannifin Corp, Laird Technologies, ACC Silicones Ltd (A CHT Group company), LORD Corporation, Wacker Chemie AG, and PolySi Technologies Inc.

The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

0 notes