#United States Radiation-Hardened Electronics Market forecast

[aarunresearcher]

The United States radiation-hardened electronics market size reached US$ 458.3 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 615.5 Million by 2032, exhibiting a growth rate (CAGR) of 3.23% during 2024-2032.

[marketinsightshare]

Radiation Hardened Mcu Market Size to Grow at a CAGR of 3.5% During the Forecast Period 2021-2026

The Radiation Hardened MCU Market is expected to experience exponential growth over the next few growth from $1.4 Billion, in 2020 to $1.7 Billion in 2026 growing at a CAGR of 3.5% during 2021 to 2026. Radiation Hardened MCU was launched to benefit the space industry. The first ARM serial peripheral interface based microcontrollers that combine the benefits of commercial-off-the-shelf (COTS) technology with space-qualified versions that have scalable levels of radiation performance. The growing adoption of radiation hardened microcontrollers for space applications including remote terminal units, controller area network, digital mixed-signal devices, propulsion system control, power control, mechanisms control and other applications such as critical avionics in flight systems, nuclear and medical products, military and defense applications are set to create opportunities for the growth of rad-hard MCU market

Radiation Hardened MCU Market Segment Analysis- By Type

By Type, the market is segmented into Custom Made and Commercial-Off-The-Shelf. Commercial-off-The-Shelf had dominated the Radiation Hardened MCU market and is analysed to grow at a CAGR of 7.9% during the forecast period 2020-2025. Commercial off-the-shelf based MCUs are widely being deployed in other industries which are offering reliable performance for applications ranging from launch vehicles to satellite constellations and space stations. COTS are packaged solutions that are then adapted to meet the needs of the purchasing organization rather than commissioning custom-made solutions. COTS use has been increased across various end-user industries, as these products can provide significant savings in procurement, production, and maintenance. For instance, in January 2020 Microchip Technology announced the launch of COTS-based radiation hardened MCU in order to scale space applications. This leads to the combination of low cost and major ecosystem benefits of Commercial Off - the-Shelf (COTS) technology with space-qualified models of scalable radiation performance level. The COTS products used onboard the Mars Rover (a motor vehicle that moves across the surface of the planet Mars upon arrival) included the system's UHF modem from Motorola in Scottsdale, Arizona, and its radar altimeter, developed by the Honeywell Solid State Electronics Center in Plymouth, Minn., which acquired the Martian surface around 32 seconds before landing. These COTS-based MCU are particularly being adopted in NewSpace solutions to meet the budgetary requirements while at the same time providing sufficient radiation tolerance when compared to non-radiation-hardened products.

Request for Sample Report  @ https://www.industryarc.com/pdfdownload.php?id=19604

Report Price: $4500 (Single User License)

Radiation Hardened MCU Market Segment Analysis- By End Users

By End User, the Radiation Hardened MCU market is segmented Aerospace, Military & Defense, Nuclear, Space, Consumer Electronics, Medical, Others. Consumer Electronics sector is witnessing the major growth from $2.7 million in 2019 to $5.6 million in 2020 and it is expected to grow at a CAGR of 10.4% during forecast period. With the high deployment of consumer electronics in space and aerospace sectors particularly for communication, these devices have increasingly been required to be radiation tolerant or radiation hardened. With increased focus on improving the reliability of radiation hardened equipment in space missions by NASA and ESA this segment will witness high growth driven by adoption from these agencies. ESA’s Hera mission for instance has focused on improving the ability of computers used aboard this mission to withstand harsh radiation exposure for a prolonged period. Apart from this, the usage of radiation hardened electronics including MCU for consumer electronics in Aerospace and military sectors are also witnessing high demand. Moreover, the need for radiation resistance cameras and radiation tolerant surveillance cameras for nuclear industry are also highly boosting the consumer electronics industry. However, the cost sensitivities and space requirements of this sector will largely lead to demand for COTS and microcontrollers, especially non radiation-hardened versions, over Radiation-hardened MCU.

Radiation Hardened Market Segment Analysis- Geography

North America is the largest market and APAC is set to witness fast growth for radiation hardened MCU witha attributed to the rise in commercial space industry and foreign direct investment (FDI) into the aerospace manufacturing industry. The rise in airplane reliability requirements in recent years has been compelled by the Federal Aviation Administration (FAA), which boosts worldwide confidence in the safety of aircraft and aircraft parts produced in the U.S. This has led to increased preference for Radiation Hardened MCU. In September 2019, the government has announced to fund $21.5 billion to NASA for its research and development activities. As NASA has plans to develop spacecraft beam in orbit, and satellites. This has driven the research into innovations in aerospace safety and reliability, particularly for electronics.

Radiation Hardened MCU Market Drivers

The need for radiation hardened device for Low-Earth-Orbit will drive the radiation hardened MCU market:

In recent years, the small-scale spacecraft industry has become an increasingly large part of the space industry. As these small spacecrafts grow in capability and designers prepare beyond Low Earth Orbit (LEO) for longer missions and use, they need more sophisticated technologies beyond what is normally available in current space-qualified product lines. The radiation hardened MCU are combined with COTS which provides the ability to be implemented in harsh conditions of space. Moreover, the need for revolutionized technology for longer missions and for benefits such as Full wafer lot traceability, space screening and qualification will fuel the need for radiation hardened MCUs. The new generations of high-performance communications and reconnaissance orbiting satellites are using some of the most advanced radiation hardened MCU and with the requirement for GEO and MEO satellites, there is a rising need for highly reliable electronics. Additionally, over the last decade governments and public entities have played a driving role in space research and services. The emerging technologies, new operating models and innovative concepts can accelerate the space sector. Despite the rising requirements for MEO and GEO applications, LEO space applications will remain the largest market throughout the forecast period.

The growing innovations in radiation hardened electronics:

Rad Hard by Design (RHBD) is a technique which offers modern and cutting-edge integrated circuits. Through RHBD technique the fabrication of radiation-hardened circuits is commercially possible. RHBD offers space-ready cutting-edge products, terminating a decades-old trend of relying on ICs that were one or more generations behind the best-in-class devices. Researchers at Arizona State University have developed a new design technique for RHBD designs that addresses shortcomings of current RHBD techniques. Reverse Body Bias is a technique that introduces an alternative path for leakage to follow rather than leaving it to disrupt any logic. The new design technique utilizes proven hardening techniques while offering lower power consumption and smaller circuits. The adoption of these design techniques in new generation Radiation Hardened MCU will drive the technological innovations forward

Inquiry Before Buying @ https://www.industryarc.com/reports/request-quote?id=19604

Radiation Hardened MCU Market Challenges

High cost of Commercial Off-The- Shelf (COTS) MCUs hamper the growth of radiation hardened MCU:

COTS are significantly being used as they are easy-to-use cost less than other radiation hardened MCU. They also provide very attractive solution which incurs low cost while implementation which leads to the rising use of COTS that will lead to hamper the growth of radiation hardened MCU. Moreover, the expensive radiation hardened MCU are highly being replace by COTS devices, though they are time consuming. Thus, the high installation of COTS Radiation tolerant will hinder the use of radiation hardened MCUs for New Space industry further obstructing the market growth. Additionally, budget cuts has also become one of key factor that is forming a negative impact on the radiation hardened MCU market, as this has led to the decline of major space programs and associated new technology developments which may led to the downfall of the radiation hardened MCU market. Further, the budget cuts are pressuring radiation-hardened designers to maintain quality while cutting costs. This will impact the businesses of radiation-hardened integrated circuit or electronic components manufacturers.

Radiation Hardened MCU Market Landscape

Product launches, acquisitions, and R&D activities are key strategies adopted by players in the Radiation Hardened MCU Market. The key players in the Radiation Hardened MCU Market include Texas Instruments, Vorago technologies, Microchip Technology, Inc., Renesas Electronics, Honeywell International, Inc., ST Microelectronics, Infenion Technology, Tower Semiconductors, BAE Systems, Cobham PLC.

Acquisitions/Technology Launches/Partnerships

In September 2019, Artificial intelligence (AI) and neural networks are becoming a key factor in developing safer, smart and eco-friendly cars. In order to support AI-driven solutions with its future automotive microcontrollers, Infineon Technologies AG (has started a collaboration with Synopsys, Inc.

In April 2019, Infineon & XAIN made R&D partnership with Infineon Technologies. In its first MVP, XAIN demonstrated how the features of Infineon’s powerful AURIX microcontrollers can be leveraged to program and enact usage control of physical functions and fine-grained access control to data streams.

Key Takeaways

The rise in airplane reliability requirements in recent years has been compelled by the Federal Aviation Administration (FAA) is analysed to significantly drive the radiation hardened MCU market during the forecast period 2021-2026.

North America region has the major share owing to the growing developments, the government of this region has announced several funding’s, initiatives for the development of these sectors.

The developments in the medical devices and the need for Medical imaging technology has enabled the design and production of radiation-hard devices using standard MCU for monitoring blood pressure level and for usage in x-ray cargo scanners, with an order of magnitude improvement in radiation tolerance will lead to the demand for radiation hardened MCUs.

Related Reports:

A. Radiation Hardened ICs Market

https://www.industryarc.com/Report/18286/radiation-hardened-ics-market.html

B. Radiation Hardened Electronic Devices and Components Market

https://www.industryarc.com/Report/168/radiation-hardened-electronic-device-market-analysis-and-forecast.html

For more Electronics related reports, please click here

[marketwire]

Radiation Hardened Mcu Market Size to Grow at a CAGR of 3.5% During the Forecast Period 2021-2026

The Radiation Hardened MCU Market is expected to experience exponential growth over the next few growth from $1.4 Billion, in 2020 to $1.7 Billion in 2026 growing at a CAGR of 3.5% during 2021 to 2026. Radiation Hardened MCU was launched to benefit the space industry. The first ARM serial peripheral interface based microcontrollers that combine the benefits of commercial-off-the-shelf (COTS) technology with space-qualified versions that have scalable levels of radiation performance. The growing adoption of radiation hardened microcontrollers for space applications including remote terminal units, controller area network, digital mixed-signal devices, propulsion system control, power control, mechanisms control and other applications such as critical avionics in flight systems, nuclear and medical products, military and defense applications are set to create opportunities for the growth of rad-hard MCU market

Radiation Hardened MCU Market Segment Analysis- By Type

By Type, the market is segmented into Custom Made and Commercial-Off-The-Shelf. Commercial-off-The-Shelf had dominated the Radiation Hardened MCU market and is analysed to grow at a CAGR of 7.9% during the forecast period 2020-2025. Commercial off-the-shelf based MCUs are widely being deployed in other industries which are offering reliable performance for applications ranging from launch vehicles to satellite constellations and space stations. COTS are packaged solutions that are then adapted to meet the needs of the purchasing organization rather than commissioning custom-made solutions. COTS use has been increased across various end-user industries, as these products can provide significant savings in procurement, production, and maintenance. For instance, in January 2020 Microchip Technology announced the launch of COTS-based radiation hardened MCU in order to scale space applications. This leads to the combination of low cost and major ecosystem benefits of Commercial Off - the-Shelf (COTS) technology with space-qualified models of scalable radiation performance level. The COTS products used onboard the Mars Rover (a motor vehicle that moves across the surface of the planet Mars upon arrival) included the system's UHF modem from Motorola in Scottsdale, Arizona, and its radar altimeter, developed by the Honeywell Solid State Electronics Center in Plymouth, Minn., which acquired the Martian surface around 32 seconds before landing. These COTS-based MCU are particularly being adopted in NewSpace solutions to meet the budgetary requirements while at the same time providing sufficient radiation tolerance when compared to non-radiation-hardened products.

Request for Sample Report  @ https://www.industryarc.com/pdfdownload.php?id=19604

Report Price: $4500 (Single User License)

Radiation Hardened MCU Market Segment Analysis- By End Users

By End User, the Radiation Hardened MCU market is segmented Aerospace, Military & Defense, Nuclear, Space, Consumer Electronics, Medical, Others. Consumer Electronics sector is witnessing the major growth from $2.7 million in 2019 to $5.6 million in 2020 and it is expected to grow at a CAGR of 10.4% during forecast period. With the high deployment of consumer electronics in space and aerospace sectors particularly for communication, these devices have increasingly been required to be radiation tolerant or radiation hardened. With increased focus on improving the reliability of radiation hardened equipment in space missions by NASA and ESA this segment will witness high growth driven by adoption from these agencies. ESA’s Hera mission for instance has focused on improving the ability of computers used aboard this mission to withstand harsh radiation exposure for a prolonged period. Apart from this, the usage of radiation hardened electronics including MCU for consumer electronics in Aerospace and military sectors are also witnessing high demand. Moreover, the need for radiation resistance cameras and radiation tolerant surveillance cameras for nuclear industry are also highly boosting the consumer electronics industry. However, the cost sensitivities and space requirements of this sector will largely lead to demand for COTS and microcontrollers, especially non radiation-hardened versions, over Radiation-hardened MCU.

Radiation Hardened Market Segment Analysis- Geography

North America is the largest market and APAC is set to witness fast growth for radiation hardened MCU witha attributed to the rise in commercial space industry and foreign direct investment (FDI) into the aerospace manufacturing industry. The rise in airplane reliability requirements in recent years has been compelled by the Federal Aviation Administration (FAA), which boosts worldwide confidence in the safety of aircraft and aircraft parts produced in the U.S. This has led to increased preference for Radiation Hardened MCU. In September 2019, the government has announced to fund $21.5 billion to NASA for its research and development activities. As NASA has plans to develop spacecraft beam in orbit, and satellites. This has driven the research into innovations in aerospace safety and reliability, particularly for electronics.

Radiation Hardened MCU Market Drivers

The need for radiation hardened device for Low-Earth-Orbit will drive the radiation hardened MCU market:

In recent years, the small-scale spacecraft industry has become an increasingly large part of the space industry. As these small spacecrafts grow in capability and designers prepare beyond Low Earth Orbit (LEO) for longer missions and use, they need more sophisticated technologies beyond what is normally available in current space-qualified product lines. The radiation hardened MCU are combined with COTS which provides the ability to be implemented in harsh conditions of space. Moreover, the need for revolutionized technology for longer missions and for benefits such as Full wafer lot traceability, space screening and qualification will fuel the need for radiation hardened MCUs. The new generations of high-performance communications and reconnaissance orbiting satellites are using some of the most advanced radiation hardened MCU and with the requirement for GEO and MEO satellites, there is a rising need for highly reliable electronics. Additionally, over the last decade governments and public entities have played a driving role in space research and services. The emerging technologies, new operating models and innovative concepts can accelerate the space sector. Despite the rising requirements for MEO and GEO applications, LEO space applications will remain the largest market throughout the forecast period.

The growing innovations in radiation hardened electronics:

Rad Hard by Design (RHBD) is a technique which offers modern and cutting-edge integrated circuits. Through RHBD technique the fabrication of radiation-hardened circuits is commercially possible. RHBD offers space-ready cutting-edge products, terminating a decades-old trend of relying on ICs that were one or more generations behind the best-in-class devices. Researchers at Arizona State University have developed a new design technique for RHBD designs that addresses shortcomings of current RHBD techniques. Reverse Body Bias is a technique that introduces an alternative path for leakage to follow rather than leaving it to disrupt any logic. The new design technique utilizes proven hardening techniques while offering lower power consumption and smaller circuits. The adoption of these design techniques in new generation Radiation Hardened MCU will drive the technological innovations forward

Inquiry Before Buying @ https://www.industryarc.com/reports/request-quote?id=19604

Radiation Hardened MCU Market Challenges

High cost of Commercial Off-The- Shelf (COTS) MCUs hamper the growth of radiation hardened MCU:

COTS are significantly being used as they are easy-to-use cost less than other radiation hardened MCU. They also provide very attractive solution which incurs low cost while implementation which leads to the rising use of COTS that will lead to hamper the growth of radiation hardened MCU. Moreover, the expensive radiation hardened MCU are highly being replace by COTS devices, though they are time consuming. Thus, the high installation of COTS Radiation tolerant will hinder the use of radiation hardened MCUs for New Space industry further obstructing the market growth. Additionally, budget cuts has also become one of key factor that is forming a negative impact on the radiation hardened MCU market, as this has led to the decline of major space programs and associated new technology developments which may led to the downfall of the radiation hardened MCU market. Further, the budget cuts are pressuring radiation-hardened designers to maintain quality while cutting costs. This will impact the businesses of radiation-hardened integrated circuit or electronic components manufacturers.

Radiation Hardened MCU Market Landscape

Product launches, acquisitions, and R&D activities are key strategies adopted by players in the Radiation Hardened MCU Market. The key players in the Radiation Hardened MCU Market include Texas Instruments, Vorago technologies, Microchip Technology, Inc., Renesas Electronics, Honeywell International, Inc., ST Microelectronics, Infenion Technology, Tower Semiconductors, BAE Systems, Cobham PLC.

Acquisitions/Technology Launches/Partnerships

In September 2019, Artificial intelligence (AI) and neural networks are becoming a key factor in developing safer, smart and eco-friendly cars. In order to support AI-driven solutions with its future automotive microcontrollers, Infineon Technologies AG (has started a collaboration with Synopsys, Inc.

In April 2019, Infineon & XAIN made R&D partnership with Infineon Technologies. In its first MVP, XAIN demonstrated how the features of Infineon’s powerful AURIX microcontrollers can be leveraged to program and enact usage control of physical functions and fine-grained access control to data streams.

Key Takeaways

The rise in airplane reliability requirements in recent years has been compelled by the Federal Aviation Administration (FAA) is analysed to significantly drive the radiation hardened MCU market during the forecast period 2021-2026.

North America region has the major share owing to the growing developments, the government of this region has announced several funding’s, initiatives for the development of these sectors.

The developments in the medical devices and the need for Medical imaging technology has enabled the design and production of radiation-hard devices using standard MCU for monitoring blood pressure level and for usage in x-ray cargo scanners, with an order of magnitude improvement in radiation tolerance will lead to the demand for radiation hardened MCUs.

Related Reports:

A. Radiation Hardened ICs Market

https://www.industryarc.com/Report/18286/radiation-hardened-ics-market.html

B. Radiation Hardened Electronic Devices and Components Market

https://www.industryarc.com/Report/168/radiation-hardened-electronic-device-market-analysis-and-forecast.html

For more Electronics related reports, please click here

[crispyobjecttiger]

Radiation-Hardened Electronics Market Status and Trend Analysis 2017-2026 (COVID-19 Version)

Radiation-Hardened Electronics Market Status and Trend Analysis 2017-2026 (COVID-19 Version)/caption]

Due to the pandemic, we have included a special section on the Impact of COVID 19 on the Radiation-Hardened Electronics Market Status and Trend Analysis 2017-2026 (COVID-19 Version) 2020-2026 which would mention How the Covid-19 is Affecting the Industry, Market Trends and Potential Opportunities in the COVID-19 Landscape, Key Regions and Proposal for Radiation-Hardened Electronics Market Status and Trend Analysis 2017-2026 (COVID-19 Version) Players to battle Covid-19 Impact.

Radiation-Hardened Electronics Market Status and Trend Analysis 2017-2026 (COVID-19 Version) 2020-2026The

Radiation-Hardened Electronics Market Status and Trend Analysis 2017-2026 (COVID-19 Version) 2020-2026

report is one of the most comprehensive and important data about business strategies, qualitative and quantitative analysis of Global Market. It offers detailed research and analysis of key aspects of the Radiation-Hardened Electronics Market Status and Trend Analysis 2017-2026 (COVID-19 Version). The market analysts authoring this report have provided in-depth information on leading growth drivers, restraints, challenges, trends, and opportunities to offer a complete analysis of the Radiation-Hardened Electronics Market Status and Trend Analysis 2017-2026 (COVID-19 Version).

Top Leading players covered in the Radiation-Hardened Electronics Market Status and Trend Analysis 2017-2026 (COVID-19 Version) report : Honeywell international Inc Linear Technology BAE Systems Atmel Corporation STMicroelectronics Xilinx Inc Maxwell Technologies Intersil Americas LLC Texas Instruments Incorporated Microsemi Corporation​​​​​​​​​​​ and More...

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Market Segment by Type covers: Logic Application?Specific Integrated Circuit Memory Field-Programmable Gate Array

Market Segment by Application covers: Nuclear Power Plant Space Defense & Aerospace

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Regions Covered in the Global Radiation-Hardened Electronics Market Status and Trend Analysis 2017-2026 (COVID-19 Version):

• The Middle East and Africa (GCC Countries and Egypt)

• North America (the United States, Mexico, and Canada)

• South America (Brazil etc.)

• Europe (Turkey, Germany, Russia UK, Italy, France, etc.)

• Asia-Pacific (Vietnam, China, Malaysia, Japan, Philippines, Korea, Thailand, India, Indonesia, and Australia)

Years Considered to Estimate the Radiation-Hardened Electronics Market Status and Trend Analysis 2017-2026 (COVID-19 Version) Size:

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Base Year: 2019

Estimated Year: 2020

Forecast Year: 2020-2026

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[captainvileshmodiworld-blog]

Global Radiation Processing Market 2019 | Manufacturers In-Depth Analysis Report to 2024

The latest trending report Global Radiation Processing Market 2019-2024 added by DecisionDatabases.com

Radiation Processing is widely used for industrial applications such as surface curing, crosslinking of wires and cables and sterilization/ decontamination of pharmaceutical products. The energy of the electron beam determines the type of applications. This is due to the penetration power of the electron that is limited by the energy.

The global Radiation Processing market is valued at xx million USD in 2018 and is expected to reach xx million USD by the end of 2024, growing at a CAGR of xx% between 2019 and 2024.

This report studies the Radiation Processing market status and outlook of Global and major regions, from angles of players, countries, product types and end industries; this report analyzes the top players in global market, and splits the Radiation Processing market by product type and applications/end industries.

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Market Segment by Companies, this report covers

 IBA

 WASIK ASSOCIATES

 Jiangsu Dasheng Electron Accelerator

 Iotron

 VIVIRAD GROUP

 Sterigenics

 Steris

 EL Point

Market Segment by Regions, regional analysis covers 

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia and Italy)

Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

South America (Brazil, Argentina, Colombia)

Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers

 Radioisotope

 Electronic Accelerator

Market Segment by Applications, can be divided into

 Medical & Food Industry

 Industrial

 Scientific Research

 Other

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There are 14 Chapters to deeply display the global Radiation Processing market.

1 Radiation Processing Market Overview

2 Manufacturers Profiles

3 Global Radiation Processing Market Competition, by Players

4 Global Radiation Processing Market Size by Regions

5 North America Radiation Processing Revenue by Countries

6 Europe Radiation Processing Revenue by Countries

7 Asia-Pacific Radiation Processing Revenue by Countries

8 South America Radiation Processing Revenue by Countries

9 Middle East and Africa Revenue Radiation Processing by Countries

10 Global Radiation Processing Market Segment by Type

11 Global Radiation Processing Market Segment by Application

12 Global Radiation Processing Market Size Forecast (2019-2024)

13 Research Findings and Conclusion

14 Appendix

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Other Reports by DecisionDatabases.com:

Global Radiation-Hardened Electronics Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

Global Radiation Detector Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

Global Radiation Curable Coatings Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

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[steve-daniel]

Radiation-Hardened Electronic Components Market Share, Growth, Trends and Forecast to 2025 : Market Growth Insight

“The Radiation-Hardened Electronic Components market report is a complete research on the current state of the Radiation-Hardened Electronic Components market with a focus on the regional market. This report presents the global Radiation-Hardened Electronic Components market size (value, production, and consumption), splits the breakdown (data status 2013-2018 and forecast to ‘2025’), by manufacturers, region, type, and application. This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter’s Five Forces Analysis.

This research is helpful for all the players operating in the market, including the well-established players and the new entrants. This intelligent study provides the definition, description, and the overall forecasts of the global market, considering the market segments and sub-segments, which includes the product types, technologies, end-users, industry verticals, and the key geographies. Moreover, the report also provides an in-depth analysis of some of the significant factors such as driving forces, challenges, and threats that will shape the future of the market. In addition, the report also includes the lucrative opportunities in the micro markets for all the participants to invest in the global Radiation-Hardened Electronic Components market. Besides, the report describes the product offerings and the competitive analysis of the major players operating in the market.

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The report also presents the market competitive landscape and a corresponding detailed analysis of the major vendor/key players in the market.

The key players covered in this report: 

The major manufacturers covered in this report Honeywell International BAE Systems Analog Devices Texas Instruments Atmel Renesas Electronics STMicroelectronics Microsemi Xilinx Cobham VPT Data Device Corporation (DDC) Intersil Maxwell Technologies

Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering North America Europe China Japan Southeast Asia India

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into Silicon Silicon Carbide Gallium Nitride Others

On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including Aerospace and Defense Medical Consumer Electronics Industrial Others

Radiation hardening is a technique of making electronics and semiconductors devices resistant to damage caused by radiation. These devices are primarily used in high altitude applications where radiation could damage functioning of electronic components. Geographically, North America is the largest market for radiation hardened electronics market. Europe is the second largest global market followed by Asia-Pacific.

This report studies the global Radiation-Hardened Electronic Components market status and forecast, categorizes the global Radiation-Hardened Electronic Components market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in United States, Europe, China, Japan, South Korea and Taiwan and other regions.

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The prime objective of this Radiation-Hardened Electronic Components research report is to define the size of the different segments and the geographies as well as to forecast the trends that are likely to gain traction in the following couple of years. This market research report has been designed to incorporate both the qualitative and quantitative aspects of the industry within each of the regions.

The scope of this report centers on key market analyses, market drivers & challenges, and competitive analysis & trends. Research report examines each market and its applications, regulatory scenario, technological innovations, Radiation-Hardened Electronic Components market projections, market sizes, and shares. Moreover, the Radiation-Hardened Electronic Components market report examines the most recent trends, pipeline products and developments in the Radiation-Hardened Electronic Components market. Complete profiles of leading organizations in the market are also mentioned in this report.

Radiation-Hardened Electronic Components market report highlights: 1. The Radiation-Hardened Electronic Components research report provides a detailed survey of the current and future industry trends so as to identify the investment analysis. 2. The industry forecasts, using estimated market values have been mentioned, till ‘2025’. 3. The Radiation-Hardened Electronic Components Market dynamics such as the drivers, restraints, threats, opportunities, and industry-specific challenges 4. Key industry trends across all the market segments and sub-segments, geographies, and nations. 5. Key developments and strategies determined in the market. 6. Detailed profiling of the leading competitors and the entrant market players. 7. Growth prospects among the emerging nations throughout the forecast period. 8. The Radiation-Hardened Electronic Components Market opportunities and recommendations for new investments.

In the end, It includes the methodical description of the various factors such as the market growth and a detailed information about the different company’s revenue, growth, technological developments, production, and the various other strategic developments.

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Thus, the Radiation-Hardened Electronic Components Market Report serves as a valuable material for all industry competitors and individuals having a keen interest in Radiation-Hardened Electronic Components Market study.

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UV-cured Resins Market to Witness Comprehensive Growth by 2025

Ultraviolet light is a portion of the light spectrum with the wavelength ranging from 200 nm to 400 nm (nanometers). Curing is cross-linking of polymer chains for hardening and toughening of the polymer material by activation of additives. Thermally cured materials use high energy and emit VOCs. UV-cured resins are polymerized materials that are cured in an exceptionally short time by the energy radiated from ultraviolet irradiation devices. Oligomers and liquid monomers are blended with a minimal amount of photo-initiators and then subjected to the ultraviolet energy. This cures/dries the product quickly. In UV curing, there are no environmental pollutants and there is no solvent to evaporate. Hence, there is no air pollution, no loss of volume, and no loss of coating thickness. The properties of UV-cured resins include excellent curing speed, high adhesiveness, resistance to moisture, good elasticity, resistance to heat, and good surface curing property. Also, they require low temperature. The UV curing process has advantages such as energy saving, need for less space, reduced amount of waste, and high productivity. These are the key factors anticipated to drive the UV-cured resins market during the forecast period.

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The market for UV-cured resins can be segmented in terms of application, chemical, geography, and end-user industry. Based on chemical, the UV-cured resins market has been divided into polyester, epoxy, and acrylic/alkydic resins. Polyester resins are commonly available and inexpensive. Epoxy resins are slightly costlier than polyesters but they have better curing property, less shrinkage, and good adhesion. Acrylic/alkydic resins are of varied compositions. Not all acrylic resins are used as UV-cured resins. The epoxy resins segment is expected to hold a major share of the market during the forecast period, due to better features of these resins.

Based on application, the UV-cured resins market has been segregated into coatings, inks, and adhesives. UV-cured adhesives are resistant to heat and corrosion and they are crucial to the automotive industry. Based on end-user, the UV-cured resins market has been divided into automotive, electronics, graphic arts, glass, and plastic decorating. Growth in the automotive industry is expected to drive the UV-cured resins market in the near future. Based on geography, the UV-cured resins market has been divided into Asia Pacific, Europe, North America, and Latin America. Strict environmental regulations imposed on the conventional methods emitting greenhouse gases is the key driving factor for the markets in North America and Europe. Growth of the automotive industry in Asia Pacific is anticipated to fuel the market in the region in the near future. Rapid industrialization, technological advancements, and growth of the electronics industry in the region are other factors likely to augment the market in Asia Pacific during the forecast period.

Key players operating in the global UV-cured resins market are Allnex, Royal DSM N.V., Alberdingk Boley GmbH, Covestro AG, BASF SE, Nippon Gohsei, Wanhua Chemical Group Co. Ltd., Jiangsu Sanmu Group Corporation, Dymax Corporation, Eternal Chemical Co., Hitachi Chemical Company Ltd., IGM Resins, Miwon Specialty Chemical Co. Ltd., and Sartomer Arkema Group.

Resins provided by Allnex are marketed in Europe, North America, Asia Pacific, and Latin America. The company has more than 10 research centers operating throughout the world for finding coatings solutions for industries such as automotive, packaging, inks, and industrial plastics. NIPPON GOHSEI sells the UV-cured resins by the trade name SHIKOHTM. It has developed various types of resins that can be used for inks, coatings, and adhesives.

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Investments in research and development, mergers and acquisitions, and aggressive marketing are strategies implemented by companies to increase their share in the global UV-cured resins market. High cost of initial investment, limited usage, and unappealing price in the competitive market are likely to be barriers for growth of the global UV-cured resins market in the next few years.

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The United States radiation-hardened electronics market size reached US$ 458.3 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 615.5 Million by 2032, exhibiting a growth rate (CAGR) of 3.23% during 2024-2032.