#PCB for Semiconductor

[electronalytics]

PCB for Semiconductor Market Analysis, Dynamics, Players, Type, Applications, Trends, Regional Segmented, Growth Opportunities, Supply and Demand, Outlook & Forecast till 2033

The competitive analysis of the PCB for Semiconductor Market offers a comprehensive examination of key market players. It encompasses detailed company profiles, insights into revenue distribution, innovations within their product portfolios, regional market presence, strategic development plans, pricing strategies, identified target markets, and immediate future initiatives of industry leaders. This section serves as a valuable resource for readers to understand the driving forces behind competition and what strategies can set them apart in capturing new target markets.

Market projections and forecasts are underpinned by extensive primary research, further validated through precise secondary research specific to the PCB for Semiconductor Market. Our research analysts have dedicated substantial time and effort to curate essential industry insights from key industry participants, including Original Equipment Manufacturers (OEMs), top-tier suppliers, distributors, and relevant government entities.

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Market Segmentations:

Global PCB for Semiconductor Market: By Company • TTM Technologies • Sumitomo Denko • Daeduck Group • Zhen Ding Group • Unimicron • DSBJ • Millennium Circuits Limited • Tripod • IBIDEN CO • MEIKO ELECTRONICS Co Global PCB for Semiconductor Market: By Type • Rigid PCB • Flexible PCB Global PCB for Semiconductor Market: By Application • Load Board • Probe Card • Burn-In Board

Regional Analysis of Global PCB for Semiconductor Market

All the regional segmentation has been studied based on recent and future trends, and the market is forecasted throughout the prediction period. The countries covered in the regional analysis of the Global PCB for Semiconductor market report are U.S., Canada, and Mexico in North America, Germany, France, U.K., Russia, Italy, Spain, Turkey, Netherlands, Switzerland, Belgium, and Rest of Europe in Europe, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, China, Japan, India, South Korea, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), and Argentina, Brazil, and Rest of South America as part of South America.

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[enterprisewired]

Broadcom CEO Highlights Major Shift in AI-Chip Market Dynamics

Category: News

Source: finance.yahoo.com

  

Broadcom CEO Hock Tan states that Broadcom’s rapid ascent in the AI technology sector continues to gain momentum, with its market capitalization surpassing $1 trillion. The company’s exceptional performance in 2024, including a 118% rise in stock value driven by advancements in artificial intelligence, positions it as one of the standout players of the year. However, according to Broadcom CEO Hock Tan, the AI-chip market could soon undergo a significant transformation, potentially benefiting Broadcom as demand shifts toward more specialized silicon chips.

The Rise of Custom AI Chips

During Broadcom’s Q4 2024 earnings call, Tan outlined a significant revenue projection for the company’s AI operations over the next three years. The CEO forecasted AI and AI networking revenues to grow to a range of $60 billion to $90 billion by 2027— a remarkable jump from last year’s estimate of $15 billion to $20 billion.

This growth is primarily attributed to rising demand for custom silicon chips, particularly eXtreme Processing Units (XPUs), which are emerging as a strong alternative to Nvidia’s general-purpose GPUs (Graphic Processing Units). While GPUs are known for their versatility and robust software ecosystems, XPUs are highly specialized chips designed for specific high-computing tasks, particularly in AI and machine learning applications.

Broadcom CEO Hock Tan revealed that XPUs are gaining an edge because of their tailored functionality, offering more efficiency for companies with hyperscale computing needs. These specialized chips are being embraced by tech giants such as Amazon Web Services, Google Cloud, and Microsoft Azure, who use custom AI accelerators for their platforms. Tan also mentioned that Broadcom is collaborating with two additional hyperscalers and is in the advanced stages of developing next-generation AI XPUs for them.

Can XPUs Challenge Nvidia’s Dominance?

The shift toward custom silicon chips raises questions about whether Nvidia’s stronghold on the AI chip market could be at risk. Nvidia’s GPUs have been central to the growth of AI over the past two years, powering large language models and other cutting-edge technologies. Until now, no company has successfully rivaled Nvidia’s GPU processing power and efficiency.

However, the rising adoption of XPUs signals a potential turning point. Tech companies operating on their own custom software layers increasingly prefer specialized chips like XPUs because these chips are built to optimize performance within specific systems. This allows for greater efficiency when running AI workloads tailored to a company’s unique software infrastructure.

Despite this trend, industry experts suggest that the AI-chip market is not a zero-sum game. Instead, the growing demand for both GPUs and XPUs is likely to create new opportunities for companies like Broadcom and Nvidia alike.

Market Synergy Between GPUs and XPUs

Experts believe the rising demand for XPUs does not necessarily threaten Nvidia’s position. The growing reliance on specialized silicon chips is seen as complementary rather than competitive to the GPU market. This dynamic creates a reinforcing cycle, where demand for one type of chip supports the other.

Specialized chips such as XPUs are ideal for systems running custom AI software, making them highly efficient for targeted applications. On the other hand, Nvidia’s GPUs remain vital for more generalized AI operations due to their versatility and integration into widely used software ecosystems.

Broadcom’s success with custom silicon chips highlights the expanding opportunities in the AI chip market. While Nvidia continues to dominate the GPU segment, Broadcom’s rise indicates that there is ample room for both players to thrive.

A Growing Market for Both Technologies

The AI revolution has created a surge in demand for high-performance computing chips, and Broadcom’s strong Q4 earnings demonstrate its growing foothold in this evolving market. Custom chips like XPUs cater to hyperscalers and other companies with unique AI requirements, while Nvidia’s GPUs remain the backbone for many AI systems requiring general-purpose processors.

Looking ahead, the increasing need for AI accelerators and high-efficiency chips points to significant growth for both Broadcom and Nvidia. As AI technology continues to advance, the demand for both types of processors will drive innovation and expansion across the semiconductor industry.

Broadcom CEO Hock Tan highlights that Broadcom’s future plans, including the development of next-generation XPUs, signal a growing preference for specialized solutions. However, Nvidia’s established dominance in GPUs ensures that it remains a key player in the broader AI market. The synergy between these two technologies highlights the dynamic opportunities within the AI-chip industry, setting the stage for further advancements in the years to come.

[tritonmarketresearch]

Growth Forecast of Printed Circuit Board Market for 2024-2032

A printed circuit board (PCB) is a flat board made of insulating material, often fiberglass, that supports and connects electronic components using conductive pathways etched from copper sheets. From smartphones and computers to industrial machinery and medical equipment, PCBs are now the essential components in the modern electronics industry. Accordingly, our research predicts that the Global Printed Circuit Board Market is likely to grow with a CAGR of 5.04% in the forecast period 2024-2032. As the need for advanced technologies surges, so does the demand for printed circuit boards that are efficient, reliable, and innovative.

Explore in detail about this market in our FREE sample

Printed Circuit Board Market: Innovative & Smart PCB Production

Traditional PCB manufacturing processes can be resource-intensive and generate significant waste, particularly in terms of hazardous chemicals like lead and volatile organic compounds (VOCs). In response, printed circuit board manufacturers are now exploring biodegradable materials, eco-friendly inks, and energy-efficient production methods.

Let us take a look at some interesting examples of key market players in this industry.

Biodegradable PCBs Using Natural Fibers

Companies, such as Jiva Materials in the UK, are pioneering the use of biodegradable materials in PCB production. They have developed a product called Soluboard, which replaces the traditional fiberglass substrate with natural fibers that break down in water. Soluboard is not only biodegradable but also lowers carbon emissions during production.

As per its press release, Infineon incorporates recyclable PCBs from Jiva Materials in its demo and evaluation boards to reduce electronic waste and lower its carbon footprint. Furthermore, switching from FR-4 PCB materials to Soluboard could cut carbon emissions by 60%. This change would save approximately 10.5 kg of carbon and 620 g of plastic per square meter of PCB.

Thus, by switching to biodegradable substrates, manufacturers can significantly reduce the environmental footprint of PCBs, making electronics more sustainable from the outset.

IoT-Optimized PCBs in Smart Homes

Linx Technologies, a developer of wireless IoT products, has created smart PCBs optimized for smart home applications. These PCBs feature integrated wireless modules (such as Wi-Fi, Bluetooth, and Zigbee) that allow devices like smart thermostats, lighting systems, and security cameras to communicate within a home ecosystem.

The company also partnered with a leading smart thermostat manufacturer to design a PCB that integrates multiple communication protocols, enabling the thermostat to adapt and respond to changing environmental conditions and user preferences.

Smart Agricultural PCBs for Precision Farming

As agriculture becomes more data-driven, John Deere has introduced smart PCB solutions within its precision farming equipment. These PCBs incorporate sensors and GPS modules that collect and transmit data on soil moisture, nutrient levels, and crop health. The collected data helps optimize farming practices by providing actionable insights to farmers. In one case study, John Deere implemented smart PCBs in its autonomous tractors and harvesting equipment.

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APAC to Become a Hub for PCB Manufacturing

The Asia-Pacific region is set to witness remarkable growth in PCB manufacturing due to its expanding consumer electronics and automotive industries, growing semiconductor market, and favorable government policies supporting tech infrastructure. The Asia-Pacific Printed Circuit Board Market is expected to witness the fastest growth at a CAGR of 5.64% during the forecast period.

Here’s how countries are influencing this growth:

Taiwan remains at the forefront of advanced PCB manufacturing, particularly in the high-density interconnect (HDI) and substrate-like PCB (SLP) markets. Taiwanese printed circuit board companies like Unimicron and Nan Ya PCB dominate the market, holding a significant share of the global IC substrate sector. In fact, California-based Bloom Energy has signed an agreement with Unimicron to install up to 10 MW of fuel cells at its Taiwan plants, with the installations set to be completed by 2026. These investments position the country as a key supplier for global tech giants like Apple and NVIDIA, demonstrating its pivotal role in the market’s future growth.

In addition to this, BPL launched a new PCB production unit in Bengaluru, India (June 2024), backed by a ₹20 crore investment to support commercial production of double-sided and multi-layer PCBs. Amber Enterprises recently announced plans to invest ₹2,000 crore in establishing a printed circuit board (PCB) manufacturing facility in India to meet both domestic and export demands. These efforts reflect India’s growing commitment to expanding PCB manufacturing capacity and contributing to the region’s PCB market potential.

Similarly, the South Korean government unveiled a $19 billion support package aimed at bolstering the country’s tech sector, specifically focusing on enhancing semiconductor and PCB manufacturing capabilities. This package supports companies like Samsung Electronics and SK Hynix, encouraging investments in advanced manufacturing and R&D to maintain their edge in high-performance PCBs for the electronics and automotive sectors.

Together, these countries, along with other regions like Europe and North America, are strengthening their PCB manufacturing capabilities through strategic investments, international collaborations, and technology development, ensuring their positions in the PCB Industry. Thus, the ongoing innovations and developments in this market indicate a promising future where advanced technologies and sustainable practices merge to meet global demand.

Grab a Quick Read to Get a Comprehensive Analysis of this Market

FAQs:

Q.1) How does a printed circuit board work?

Answer: A printed circuit board (PCB) is a rigid structure with embedded metal traces and planes that form electrical circuitry. Components are soldered onto metal pads connected to the circuitry, enabling interconnection.

Q.2) How are tracks made on a printed circuit board?

Answer: Chemical etching separates copper into conductive tracks, connection pads, vias for layer transitions, and features like solid conductive areas for electromagnetic shielding.

[smbomcom]

LGA Packaging: Superior Performance

LGA packaging, also known as Land Grid Array Package, is a widely used and important form of electronic component packaging. It features a design where pins are located on the bottom of the chip package, making contact with solder points on the PCB.

Superior Performance

This modern connection method ensures outstanding performance and reliability for various applications in high-performance electronic devices. Unlike traditional pin-type packages, LGA packaging offers flexibility in design, saving PCB space and enhancing component integration. Additionally, its compact size enables high-density pin layouts, resulting in better signal transmission and data processing speeds.

Know more, just click Smbom's News

[materialsscienceandengineering]

The Composition of E-Waste

Electronic waste, also known as e-waste, is made up of a wide variety of different materials. The category of waste can include everything from toys and consumer electronics to medical equipment to telecommunications equipment, all of which have differing amounts of nearly every type of common materials (plastics/polymers, glass, metals, ceramics, semiconductors, etc.). By weight, iron, plastics, aluminum, and copper make up the majority of many e-waste materials. Looking at value, though, precious and scarce metals make up most of the cost (such as gold, silver, and palladium, or selenium, tantalum, and germanium).

Beyond that, many forms of electronic waste contain toxic or hazardous chemical such as arsenic, lead, mercury, or chromium:

Batteries and cathode ray tubes often contain lead

Mercury can be found in thermostats and sensors, in gas discharge lamps and many printed circuit boards (PCBs)

Liquid crystal displays and printer inks and toners should be treated separately and chlorofluorocarbons, hydrochlorofluorocarbons, and hydrofluorocarbons can be found in electronics such as refrigerators with insulating foams

To give an example for all these facts, let's look at mobile/cell phones:

Phones are said to contain ~40 different elements

Of the most common materials by weight, phones are ~43% plastic, 7% iron, 3% aluminum, and 13% copper

Looking at precious metals, phones are ~3000ppm silver, 320ppm gold, and 120ppm palladium (approximated as over 90% of the value of the phone in terms of raw materials)

Rare earth metals can be found in many places in a phone, include the screen, circuitry, and speakers. Vibrating cell phones are usually thanks to neodymium, dysprosium, and/or praseodymium.

Phone batteries are typically lithium-ion but older phones especially can have nickel-metal-hydride or nickel-cadmium batteries

The plastic casing is typically polycarbonate and/or acrylonitrile butadiene styrene

Chargers are mostly copper and plastic, but can contain flame retardants that can include gold, cadmium, or bromine

Sources/Further Reading: (Image source - 2018 article) (2014 article) (2013 article) (ACS) (CompoundChem) (WEForum)

[submalevolentgrace]

i know it' not this reductively simple, but i'm trying to sorta hone in on why i feel so untrusting of modern technology....

an analogue clock can be made by a clockmaker, by a person, with metals and tools. the metals have to come from somewhere and the tools need to be made, but that can be done by other people.

a digital clock has to be made by corporations. it needs ICs and PCBs, transistors and semiconductors, layers of phosphors and rare earth metals deposited in layers so thin your eyes can't see them, assembled together and reflow soldered by machines that are themselves too complex to be built by a person, down and down for layers. sure if you wanna pedantically miss the point i could buy the parts and solder them together myself, i can program a microcontroller, but none of that tech gets into my hands without being made by strata of corporations, and all harm they cause by squeezing enough blood from the proverbial stone in order to do it at shareholder-pleasing profit.

analogue clocks are made by people, digital clocks are made by corporations... and while supply chains cling to the crumbling cliff of the modern global world, the kids don't know how to read the analogue clock we have sitting on the bench.

[adafruit]

PCB of the Day! The VCNL4200 has long-ranging vision 🔍🤖🛠️

The VCNL4200 proximity sensor https://www.digikey.com/en/products/detail/vishay-semiconductor-opto-division/VCNL4200/7394601 , which we found on last weeks The Great Search ---

can detect motion up to 1.5 meters away, and has an I2C interface that makes it an excellent match for a Stemma QT board prototype. Which is what we've got here! Note the IR LED requires an external P FET to drive it!

[zhangkris]

Walk-in environmental test chamber: The perfect solution for your experimental needs!

JOEO walk in environmental chamber is used to test full-size solar panels or other large products Performance tomeet IEC 61215, 61646, UL-1703 and similar test requirements, Widely used in industries such as electronic products, PCBs, semiconductors, automobiles, aerospace, etc

[24marketresearch]

Latin America Microelectronics Liquid Filter Market Outlook and Forecast 2025-2032

Microelectronics liquid filters are specialized filtration systems designed to maintain ultra-high purity levels in electronic manufacturing processes. These filters play a critical role in removing particulate contaminants, dissolved gases, and microbial impurities that can impact the performance and reliability of microelectronic components. They are used in semiconductor fabrication, PCB manufacturing, and electronics assembly, ensuring consistent production quality and operational efficiency.

Market Size

The Latin America Microelectronics Liquid Filter Market was valued at US$ 238 million in 2024 and is projected to reach US$ 345 million by 2030, reflecting a CAGR of 6.4% during the forecast period of 2024-2030. The increasing demand for electronic devices, coupled with advancements in semiconductor manufacturing, is driving the adoption of advanced filtration solutions.

[equiptest]

The Essential Guide to Switch Probes for Precision Testing

In today’s fast-paced electronics manufacturing industry, precision and reliability are key factors in achieving high-quality testing results. One crucial component that ensures accurate and efficient testing is the switch probes. At Equip-Test, we specialize in cutting-edge test solutions, including high-performance switch probes designed to enhance testing accuracy and efficiency.

What Are Switch Probes?

Switch probes are specialized test probes used in electrical and functional testing processes. They serve as a dual-function component, providing both electrical contact and switching capabilities within a test setup. These probes detect open circuits, short circuits, or missing components by making and breaking electrical connections during testing.

Why Use Switch Probes?

Switch probes play a vital role in improving test reliability and efficiency. Here’s why they are an essential component in automated testing:

Enhanced Accuracy – Detect faulty components and incomplete solder joints with high precision.

Improved Testing Efficiency – Reduce test time by automating circuit verification.

Versatility – Suitable for ICT (In-Circuit Testing), functional testing, and semiconductor applications.

Durability – Designed for high-cycle applications, ensuring long-lasting performance.

Applications of Switch Probes

Switch probes are widely used in PCB testing, semiconductor manufacturing, and automotive electronics testing. Their ability to provide fast and reliable detection of connectivity issues makes them indispensable in ensuring the quality of electronic products.

Equip-Test: Your Trusted Partner for High-Performance Test Solutions

At Equip-Test, we offer a range of advanced switch probes designed to meet the demands of modern electronics testing. Our solutions provide high precision, durability, and reliability, helping manufacturers streamline their testing processes and improve product quality.

Whether you need customized solutions or standardized test probes, our team is ready to assist you in finding the perfect fit for your testing requirements.

Explore our switch probe solutions today!

Visit Equip-Test to learn more about our innovative testing technologies.

[reportprime1]

Vibration Test Equipment Market Size is Expected to Reach USD 1079.94 Million in 2030

Vibration Test Equipment Market is expected to grow from USD 776.58 Million in 2024 to USD 1079.94 Million by 2030, at a CAGR of 5.65% during the forecast period.

The vibration test equipment market has witnessed steady growth in recent years, driven by its indispensable role in ensuring the durability, reliability, and performance of products across various industries. Vibration test equipment is used to simulate real-world conditions that products may encounter during transportation, operation, or storage, making it a crucial component in product development and quality assurance processes. This market has gained momentum due to increasing demand from sectors such as automotive, aerospace, electronics, and defense, where product reliability is paramount.

One of the primary factors propelling the vibration test equipment market is the growing emphasis on product safety and quality. Industries like automotive and aerospace require rigorous testing to comply with strict regulatory standards and ensure passenger safety. In these sectors, vibration test equipment is used to evaluate components like engines, chassis, and avionics systems, identifying potential vulnerabilities before products reach the market. Similarly, the electronics industry relies on vibration testing to verify the durability of components such as printed circuit boards (PCBs) and batteries, particularly as the demand for compact, high-performance devices continues to rise.

For More Insights into the Market, Request a Sample of this Report https://www.reportprime.com/enquiry/sample-report/7161

Technological advancements in vibration test equipment have significantly enhanced its capabilities, contributing to market growth. Modern systems are equipped with advanced features such as digital control systems, real-time data acquisition, and high-frequency testing capabilities. These advancements enable more precise testing, reduced downtime, and enhanced efficiency, making them highly attractive to end-users. Additionally, the integration of automation and IoT technologies in vibration test equipment has streamlined testing processes, allowing for remote monitoring and analysis, which is particularly beneficial in large-scale manufacturing environments.

The automotive industry remains one of the largest end-users of vibration test equipment, driven by the increasing complexity of vehicles and the rise of electric and autonomous cars. As manufacturers strive to meet stringent safety standards and deliver superior performance, vibration testing has become integral to the design and validation of automotive components. The shift toward electric vehicles (EVs) has further amplified the need for vibration testing, as components like batteries and electric drivetrains must undergo rigorous evaluation to ensure their reliability under various operating conditions.

In the aerospace and defense sectors, vibration test equipment is critical for testing components and systems exposed to extreme conditions during operation. Aircraft engines, control systems, and satellites are subjected to vibration testing to identify weaknesses and ensure their ability to withstand harsh environments. The growing demand for space exploration and satellite-based applications has further fueled the adoption of advanced vibration test equipment in these industries.

The electronics and semiconductor industry also represents a significant segment of the vibration test equipment market. With the rapid evolution of technology and increasing consumer expectations for durable and reliable products, manufacturers are investing heavily in testing solutions. Portable devices, wearable electronics, and IoT-enabled gadgets undergo extensive vibration testing to ensure they can endure everyday usage and environmental stresses.

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Market Segmentations

· By Type: Electrodynamic Vibration Systems, Permanent Magnet Vibration Systems

· By Applications: Automotive, Aerospace, Military & Defense, Consumer Electronics, Education & Research, Others

Top Key Market Players

Hottinger Brüel & Kjær (HBK), Unholtz-Dickie Corp., Su Shi Testing Group, MTS Systems Corporation, IMV Corporation, Data Physics Corporation, EMIC corporation, Thermotron Industries, Sentek Dynamics, TIRA GmbH, DONGLING Technologies, ETS Solutions, Sdyn, MB Dynamics, Vibration Research, Spectral Dynamics, Inc., Tarang Kinetics.

Regionally, the vibration test equipment market has seen substantial growth in North America and Europe, driven by the strong presence of key industries such as automotive, aerospace, and defense. These regions have a well-established regulatory framework that mandates rigorous product testing, further boosting market demand. Asia-Pacific, however, is emerging as a high-growth region due to the expansion of manufacturing activities, particularly in countries like China, Japan, and India. The region’s booming automotive and electronics sectors, combined with increasing investments in infrastructure development, are key drivers of market growth.