#Electronic Underfill Material Market

[electronalytics]

Electronic Underfill Material Market Research Trends Analysis by 2017-2032

The competitive analysis of the Electronic Underfill Material Market offers a comprehensive examination of key market players. It encompasses detailed company profiles, insights into revenue distribution, innovations within their product portfolios, regional market presence, strategic development plans, pricing strategies, identified target markets, and immediate future initiatives of industry leaders. This section serves as a valuable resource for readers to understand the driving forces behind competition and what strategies can set them apart in capturing new target markets.

Market projections and forecasts are underpinned by extensive primary research, further validated through precise secondary research specific to the Electronic Underfill Material Market. Our research analysts have dedicated substantial time and effort to curate essential industry insights from key industry participants, including Original Equipment Manufacturers (OEMs), top-tier suppliers, distributors, and relevant government entities.

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Market Segmentations:

Global Electronic Underfill Material Market: By Company • Henkel • Namics • Nordson Corporation • H.B. Fuller • Epoxy Technology Inc. • Yincae Advanced Material, LLC • Master Bond Inc. • Zymet Inc. • AIM Metals & Alloys LP • Won Chemicals Co. Ltd Global Electronic Underfill Material Market: By Type • Capillary Underfill Material (CUF) • No Flow Underfill Material (NUF) • Molded Underfill Material (MUF) Global Electronic Underfill Material Market: By Application • Flip Chips • Ball Grid Array (BGA) • Chip Scale Packaging (CSP)

Regional Analysis of Global Electronic Underfill Material Market

All the regional segmentation has been studied based on recent and future trends, and the market is forecasted throughout the prediction period. The countries covered in the regional analysis of the Global Electronic Underfill Material market report are U.S., Canada, and Mexico in North America, Germany, France, U.K., Russia, Italy, Spain, Turkey, Netherlands, Switzerland, Belgium, and Rest of Europe in Europe, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, China, Japan, India, South Korea, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), and Argentina, Brazil, and Rest of South America as part of South America.

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Key Report Highlights:

Key Market Participants: The report delves into the major stakeholders in the market, encompassing market players, suppliers of raw materials and equipment, end-users, traders, distributors, and more.

Comprehensive Company Profiles: Detailed company profiles are provided, offering insights into various aspects including production capacity, pricing, revenue, costs, gross margin, sales volume, sales revenue, consumption patterns, growth rates, import-export dynamics, supply chains, future strategic plans, and technological advancements. This comprehensive analysis draws from a dataset spanning 12 years and includes forecasts.

Market Growth Drivers: The report extensively examines the factors contributing to market growth, with a specific focus on elucidating the diverse categories of end-users within the market.

Data Segmentation: The data and information are presented in a structured manner, allowing for easy access by market player, geographical region, product type, application, and more. Furthermore, the report can be tailored to accommodate specific research requirements.

SWOT Analysis: A SWOT analysis of the market is included, offering an insightful evaluation of its Strengths, Weaknesses, Opportunities, and Threats.

Expert Insights: Concluding the report, it features insights and opinions from industry experts, providing valuable perspectives on the market landscape.

Report includes Competitor's Landscape:

➊ Major trends and growth projections by region and country ➋ Key winning strategies followed by the competitors ➌ Who are the key competitors in this industry? ➍ What shall be the potential of this industry over the forecast tenure? ➎ What are the factors propelling the demand for the Electronic Underfill Material? ➏ What are the opportunities that shall aid in significant proliferation of the market growth? ➐ What are the regional and country wise regulations that shall either hamper or boost the demand for Electronic Underfill Material? ➑ How has the covid-19 impacted the growth of the market? ➒ Has the supply chain disruption caused changes in the entire value chain? Customization of the Report:

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[digitrenndsamr]

Underfill Market Growing Demand, Rising Trends and Revenue by 2027

Transparency Market Research delivers key insights for the underfill market in its published report, which includes global industry analysis, size, share, growth, trends, and forecast for 2019–2027. In terms of revenue, the global underfill market is projected to register a CAGR of ~9% during the forecast period.

Asia Pacific Underfill Market to Register Double Digit Growth over Forecast Period

The Asia Pacific region is a highly lucrative market for players offering underfill material, as it is a noteworthy manufacturing hub. The growing interest in smartphones and automotive MCUs boosts the growth of the underfill market in this region, as the manufacturers of the above mentioned products account for a substantial demand for underfill materials. China is projected to cross US$ 100 Mn by 2021 in the underfill market. This growth can be attributed to the increased support of Chinese Government in the development of the semiconductor industry in the last few years. According to Chinese Semiconductor industry Association (CSIA), high imports of integrated circuit valued over $300 Bn were recorded in 2018. All these factors contribute to the high demand for underfill material over the forecast period of 2019-2027.

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New Entrants to Use Eclectic Approaches in Underfill Market

The microelectronic industry is governed by more complex devices, due to the trending system on chip (SOC) and system in package (SIP). The trends in portable end use market are driving the global underfill material market growth. New companies that strive to penetrate the underfill market are trying to develop processes or materials that guarantee a good output at a reduced cost to establish their presence in the market. If new entrants are well-funded, they can opt for more modern approaches, and try to develop underfill materials and plans that can be used to save overall production cost.

In the flip chip packaging of low-k devices, underfill choice is extremely crucial. Companies are introducing underfill materials that offer better properties for leading edge semiconductors that use low-k inner layer dielectric materials for wafer fabrication. This helps companies to meet the rising demand for underfill material and capture a larger market share. The interference of key suppliers in the underfill market is low, thereby enhancing the scope of growth for small & regional players in the market.

Moreover, being a technology-driven market, the underfill market is expected to be shaped by the recent advancements in the electronic industry. This end-use segment demands underfill products that are compatible with lead-free solder paste material, as a result of the latest trend of sustainability in the electronic industry. Thus, some of the leading manufacturers in the market are offering underfill material products that are compatible with lead free solder paste.

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Underfill Market: Competitive Landscape

TMR has identified some of the key players in the underfill market – Henkel AG & Co. KGaA, Panasonic Corporation, NAMICS Corporation, Nordson Corporation, H.B Fuller, Epoxy Technology Inc., Yincae Advanced Material, LLC, Master Bond Inc., Zymet Inc., AIM Metals & Alloys LP, Won Chemicals Co. Ltd., and Bondline Electronic Adhesives, Inc.

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Manufacturers can leverage the remunerative growth potential offered in the global underfill market. In order to gain the most benefits out of this scenario, key players such as Henkel AG & Co. KGaA and Panasonic Corporation are strengthening their presence in the global underfill market by focusing on collaborations and mergers.

In August 2019, Henkel AG & Co. KGaA partnered with ALPLA to invest more than US$ 130 Mn in infrastructure and equipment for production of new bottle. A few years ago, the company launched a new generation (NCP) underfill material–LOCTITE ECCOBOND NCP to overcome challenges from use of capillary underfill materials in flip chip devices.

In September 2018, Panasonic launched a new underfill product CV5794, which increases the reliability of automotive electronic systems by reinforcing the solder connections between semiconductor packages and printed circuit boards to meet the stringent industry requirements

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[futuremarketinsightsreports]

Electronic Circuit Board Level Underfill Material Market: Global Industry Analysis, Size and Forecast, 2017 to 2027

[komalghare]

Electronic Underfill Material Market: Future Forecast Indicates Impressive Growth Rate until 2026

Electronic Underfill Material Market: Future Forecast Indicates Impressive Growth Rate until 2026

As the competition soars in the Global Electronic Underfill Material Market, an increasing number of companies are looking exclusive insights into the prevailing trends in the market. Acumen Research and Consulting study on the Electronic Underfill Material market, offers in-depth information on the growth drivers and restraints impacting the growth of the market. It studies the potential market…

[ereportsmarket-blog]

Global electronic underfill material Market 2018 By Top Manufacturers, Application, Product Type, Region and Forecast to 2025 Global electronic underfill material market is an extensive study which evaluates, extracts the valuable electronic underfill material market trends and market dynamics.

[electronalytics]

Electronic Underfill Material Market

[reportsandmarkets]

New report shares details about the Electronic Underfill Material Market, Forecast to 2022

New report shares details about the Electronic Underfill Material Market, Forecast to 2022

Geographically, this report split Asia-Pacific into several key Regions, with sales (K MT), revenue (Million USD), market share and growth rate of Electronic Underfill Material for these regions, from 2012 to 2022 (forecast), including China Japan South Korea Taiwan India Southeast Asia Australia

Asia-Pacific Electronic Underfill Material marketcompetition by top manufacturers/players, with…

[marketinsightshare]

Acrylic Adhesives in Electronics Market Forecast to Reach $5.1 Billion by 2026

Acrylic Adhesives in Electronics Market is forecast to reach $5.1 billion by 2026, after growing at a CAGR of 6.8% during 2021-2026. For bonding to bare metals, composites and a vast range of thermoplastic materials, acrylic-based structural adhesives offer world-class performance. Acrylic adhesives are the best alternative for electronics due to the combination of excellent cure kinetics at room temperature and reduced need for surface preparation. Cyanoacrylate glue are used for wire tacking with epoxies and light-curable acrylics. Modifiers that improve flexibility and act as strengthening agents are used in the formulation of methacrylate adhesives. The overall tensile strength of the MMA adhesive, as well as its resistance to peeling and impact damage, are considerably improved by these modifiers. The largest formulation technology segment, in terms of both value and volume, is water-based adhesives. In mature markets including North America and Europe, the growing need for VOC-free adhesives has given rise to the use of water-based acrylic adhesives.

COVID-19 Impact:

Before the COVID-19 pandemic, a modest growth rate in the electronics market was witnessed globally. After the pandemic, the global electronics industry has faced a dual impact. The production facilities of the electronics parts have been halted owing to the logistics slowdown and unavailability of the workforce across the globe. Overall consumer technology sales has remained down in 2020 due to the broad economic impact on many customers. The impact on the electronics industry has impacted the acrylic adhesives growth due to downturn in production of electronics.

Request for Sample Report  @ https://www.industryarc.com/pdfdownload.php?id=502860

Report Price: $ 4500 (Single User License)

Acrylic Adhesives in Electronics Market Segment Analysis - By Type

Electrically Conductive Adhesives held the largest share of 37% in the Acrylic Adhesives in Electronics market in 2020. Miniaturization of electronic circuits can lead to heat accumulation problems which, if their maximum operating temperature is exceeded, can cause premature failure of electronic components. Thermally conductive adhesive can be used to provide suitable heat sinks with a heat conductive path, clamping transistors, diodes or other power devices to ensure that such a heat buildup does not occur. To make high viscosity adhesives that are highly thermally conductive, metallic and non-metallic powders are blended into the adhesive formulation. Epoxy, silicone and acrylics are formulated into the most common thermally conductive systems.

Acrylic Adhesives in Electronics Market Segment Analysis - By Application

Printed Circuit Board has been the primary market for Acrylic Adhesives in Electronics in 2020 growing at a CAGR 12.5% of during forecast period of 2021-2026. The continuing trend towards PCB (printed circuit board) miniaturization poses the challenge of ensuring that contacts and components continue to function reliably, despite their ever-decreasing scale. Therefore, many soldered joints on PCBs are being replaced with electrically conductive adhesives that are more flexible. As glob tops, coatings or underfills for chips, adhesives are added to PCBs to protect sensitive components. For these applications, Panacol provides a broad range of adhesives that meet the different requirements of the industry. According to Japan Electronics and Information Technology Industries Association (JEITA), global electronics and information technology industries is estimated to increase 7% year on year in 2021 to record $3,175.6 billion. On the basis of higher demand for solution services and electronic components and devices, positive growth is expected to continue as nations across the world are using remote information technology to improve remote and contactless connectivity in an attempt to stop the spread of COVID-19. The growth in the electronics industry will fuel the consumption and demand of PCB.

Acrylic Adhesives in Electronics Market Segment Analysis - Geography

APAC dominated the Acrylic Adhesives in Electronics market with a share of more than 45% in 2020, followed by North America and Europe. Japan is one of the mature markets for electronics industry. Global production by Japanese electronics and IT companies is projected to decrease by 5% year-on-year to ¥35,200 billion ($329.89 billion) in 2020 due to decreased exports resulting from the decrease in car and smartphone sales induced by restrictions on mobility and leaving the home according to Japan Electronics and Information Technology Industries Association (JEITA). However, due to the higher demand associated with digital transformation (DX) as a new source of value creation, including automated and increasingly sophisticated data use, positive growth should return in 2021, up 3 percent to ¥ 36,300 billion ($340.20 billion). The optoelectronics and sensors segment should continue to benefit from growing semiconductor content across electronic systems used in automotive, electricity networks, building and factory automation, and others, but it is far from adequate to counter adverse trends in volumes and prices in other segments.

Acrylic Adhesives in Electronics Market Drivers

Miniaturization of Electronic Components will augment the market growth.  

The longstanding movement toward miniaturization of electronic components has resulted in more use of adhesives for fastening. In the military, manufacturing, and commercial fields, miniaturized electronic devices have had a major effect. As miniaturized electronic components have been used, so have the PCBs used to attach them. In powerful processors, advances in advanced system-on-chip (SoC) modules, lower passives, and higher transistor density have made it possible to put more components in a smaller region. In addition, this has enabled higher functionality for newer devices that would previously require multiple boards in a single package or multiple devices linked together. There is no indication of the ending of this trend, which constantly forces designers to come up with new ways to cram more components into a smaller space.

R&D and growing Consumption of Consumer Electronics will drive the demand for Acrylic Adhesives in Electronics.

In some advanced electronic assembly applications, continuing advances in adhesive technology have allowed adhesives to replace solder. With the growing laws, businesses are increasingly moving away from tin soldering to the use of electrically conductive adhesives. Overall, the demand for electrically conductive adhesives is expected to increase with the growing consumption of consumer electronics, thereby increasing the consumption of acrylic adhesives for electronics over the forecast period.

Inquiry Before Buying @ https://www.industryarc.com/reports/request-quote?id=502860

Acrylic Adhesives in Electronics Market Challenges

Fluctuation in Raw Material Prices and high R&D cost can restrict the market growth.

The bottlenecks in the market's upward climb are Methacrylate acid and acrylic acid prices volatility and stringent environmental and safety regulations. In addition, R&D costs are comparatively higher than in other sectors and strict certifications by OEMs and component manufacturers prevent the industry from realizing its optimum potential.

Decline in growth of end use industry can restrict the market.

In recent times the Electronics industry has faced many serious challenges which has impacted its growth. Factors such as lack of innovation and delayed adoption, informal processes or insufficient rigor and consistency in process execution, weak project monitoring and little cross-functional cooperation have severely impacted. These factors has restrained the electronics industry growth.

Acrylic Adhesives in Electronics Market Landscape

Technology launches, acquisitions and R&D activities are key strategies adopted by players in the Acrylic Adhesives in Electronics market. Major players in the Acrylic Adhesives in Electronics market are Akzo Nobel NV, Allnex Netherlands B.V., BASF SE, Belami Fine Chemicals Pvt. Ltd., ALTANA, Henkel AG & Company, 3M Company, Dymax, Hitachi Chemical, Jowat SE and Others.

Acquisitions/Technology Launches/ Product Launches  

In June 2020, Permabond launched UV639 High Performance Acrylic Bonder. PERMABOND UV639 UV-curing adhesive is a new acrylic bonder, or “acrylic adhesive” in the sense that it is ideally suited to bonding acrylic as well as polycarbonate and other difficult to bond plastics like PET-G.

Key Takeaways

Asia-Pacific dominates the Acrylic Adhesives in Electronics market owing to matured electronics industry especially among South East Asian countries.

Demand for environmental benefits, such as reduced emissions of volatile organic compounds (VOC) and aesthetic bonding solutions for different substrates, is expected to further drive acrylic adhesive in electronics market.

The market drivers and restraints have been assessed to understand their impact over the forecast period.

The report further identifies the key opportunities for growth while also detailing the key challenges and possible threats.

The other key areas of focus include the various applications and end use industry in PVC Additives market and their specific segmented revenue.

Related Reports

A.Electronic Adhesives Market

https://www.industryarc.com/Report/11648/electronic-adhesives-market.html

B.Acrylic Adhesives Market

https://www.industryarc.com/Report/15328/acrylic-adhesives-market.html

For more Chemicals and Materials Market reports, please click here

[marketwire]

Acrylic Adhesives in Electronics Market Forecast to Reach $5.1 Billion by 2026

Acrylic Adhesives in Electronics Market is forecast to reach $5.1 billion by 2026, after growing at a CAGR of 6.8% during 2021-2026. For bonding to bare metals, composites and a vast range of thermoplastic materials, acrylic-based structural adhesives offer world-class performance. Acrylic adhesives are the best alternative for electronics due to the combination of excellent cure kinetics at room temperature and reduced need for surface preparation. Cyanoacrylate glue are used for wire tacking with epoxies and light-curable acrylics. Modifiers that improve flexibility and act as strengthening agents are used in the formulation of methacrylate adhesives. The overall tensile strength of the MMA adhesive, as well as its resistance to peeling and impact damage, are considerably improved by these modifiers. The largest formulation technology segment, in terms of both value and volume, is water-based adhesives. In mature markets including North America and Europe, the growing need for VOC-free adhesives has given rise to the use of water-based acrylic adhesives.

COVID-19 Impact:

Before the COVID-19 pandemic, a modest growth rate in the electronics market was witnessed globally. After the pandemic, the global electronics industry has faced a dual impact. The production facilities of the electronics parts have been halted owing to the logistics slowdown and unavailability of the workforce across the globe. Overall consumer technology sales has remained down in 2020 due to the broad economic impact on many customers. The impact on the electronics industry has impacted the acrylic adhesives growth due to downturn in production of electronics.

Request for Sample Report  @ https://www.industryarc.com/pdfdownload.php?id=502860

Report Price: $ 4500 (Single User License)

Acrylic Adhesives in Electronics Market Segment Analysis - By Type

Electrically Conductive Adhesives held the largest share of 37% in the Acrylic Adhesives in Electronics market in 2020. Miniaturization of electronic circuits can lead to heat accumulation problems which, if their maximum operating temperature is exceeded, can cause premature failure of electronic components. Thermally conductive adhesive can be used to provide suitable heat sinks with a heat conductive path, clamping transistors, diodes or other power devices to ensure that such a heat buildup does not occur. To make high viscosity adhesives that are highly thermally conductive, metallic and non-metallic powders are blended into the adhesive formulation. Epoxy, silicone and acrylics are formulated into the most common thermally conductive systems.

Acrylic Adhesives in Electronics Market Segment Analysis - By Application

Printed Circuit Board has been the primary market for Acrylic Adhesives in Electronics in 2020 growing at a CAGR 12.5% of during forecast period of 2021-2026. The continuing trend towards PCB (printed circuit board) miniaturization poses the challenge of ensuring that contacts and components continue to function reliably, despite their ever-decreasing scale. Therefore, many soldered joints on PCBs are being replaced with electrically conductive adhesives that are more flexible. As glob tops, coatings or underfills for chips, adhesives are added to PCBs to protect sensitive components. For these applications, Panacol provides a broad range of adhesives that meet the different requirements of the industry. According to Japan Electronics and Information Technology Industries Association (JEITA), global electronics and information technology industries is estimated to increase 7% year on year in 2021 to record $3,175.6 billion. On the basis of higher demand for solution services and electronic components and devices, positive growth is expected to continue as nations across the world are using remote information technology to improve remote and contactless connectivity in an attempt to stop the spread of COVID-19. The growth in the electronics industry will fuel the consumption and demand of PCB.

Acrylic Adhesives in Electronics Market Segment Analysis - Geography

APAC dominated the Acrylic Adhesives in Electronics market with a share of more than 45% in 2020, followed by North America and Europe. Japan is one of the mature markets for electronics industry. Global production by Japanese electronics and IT companies is projected to decrease by 5% year-on-year to ¥35,200 billion ($329.89 billion) in 2020 due to decreased exports resulting from the decrease in car and smartphone sales induced by restrictions on mobility and leaving the home according to Japan Electronics and Information Technology Industries Association (JEITA). However, due to the higher demand associated with digital transformation (DX) as a new source of value creation, including automated and increasingly sophisticated data use, positive growth should return in 2021, up 3 percent to ¥ 36,300 billion ($340.20 billion). The optoelectronics and sensors segment should continue to benefit from growing semiconductor content across electronic systems used in automotive, electricity networks, building and factory automation, and others, but it is far from adequate to counter adverse trends in volumes and prices in other segments.

Acrylic Adhesives in Electronics Market Drivers

Miniaturization of Electronic Components will augment the market growth.  

The longstanding movement toward miniaturization of electronic components has resulted in more use of adhesives for fastening. In the military, manufacturing, and commercial fields, miniaturized electronic devices have had a major effect. As miniaturized electronic components have been used, so have the PCBs used to attach them. In powerful processors, advances in advanced system-on-chip (SoC) modules, lower passives, and higher transistor density have made it possible to put more components in a smaller region. In addition, this has enabled higher functionality for newer devices that would previously require multiple boards in a single package or multiple devices linked together. There is no indication of the ending of this trend, which constantly forces designers to come up with new ways to cram more components into a smaller space.

R&D and growing Consumption of Consumer Electronics will drive the demand for Acrylic Adhesives in Electronics.

In some advanced electronic assembly applications, continuing advances in adhesive technology have allowed adhesives to replace solder. With the growing laws, businesses are increasingly moving away from tin soldering to the use of electrically conductive adhesives. Overall, the demand for electrically conductive adhesives is expected to increase with the growing consumption of consumer electronics, thereby increasing the consumption of acrylic adhesives for electronics over the forecast period.

Inquiry Before Buying @ https://www.industryarc.com/reports/request-quote?id=502860

Acrylic Adhesives in Electronics Market Challenges

Fluctuation in Raw Material Prices and high R&D cost can restrict the market growth.

The bottlenecks in the market's upward climb are Methacrylate acid and acrylic acid prices volatility and stringent environmental and safety regulations. In addition, R&D costs are comparatively higher than in other sectors and strict certifications by OEMs and component manufacturers prevent the industry from realizing its optimum potential.

Decline in growth of end use industry can restrict the market.

In recent times the Electronics industry has faced many serious challenges which has impacted its growth. Factors such as lack of innovation and delayed adoption, informal processes or insufficient rigor and consistency in process execution, weak project monitoring and little cross-functional cooperation have severely impacted. These factors has restrained the electronics industry growth.

Acrylic Adhesives in Electronics Market Landscape

Technology launches, acquisitions and R&D activities are key strategies adopted by players in the Acrylic Adhesives in Electronics market. Major players in the Acrylic Adhesives in Electronics market are Akzo Nobel NV, Allnex Netherlands B.V., BASF SE, Belami Fine Chemicals Pvt. Ltd., ALTANA, Henkel AG & Company, 3M Company, Dymax, Hitachi Chemical, Jowat SE and Others.

Acquisitions/Technology Launches/ Product Launches  

In June 2020, Permabond launched UV639 High Performance Acrylic Bonder. PERMABOND UV639 UV-curing adhesive is a new acrylic bonder, or “acrylic adhesive” in the sense that it is ideally suited to bonding acrylic as well as polycarbonate and other difficult to bond plastics like PET-G.

Key Takeaways

Asia-Pacific dominates the Acrylic Adhesives in Electronics market owing to matured electronics industry especially among South East Asian countries.

Demand for environmental benefits, such as reduced emissions of volatile organic compounds (VOC) and aesthetic bonding solutions for different substrates, is expected to further drive acrylic adhesive in electronics market.

The market drivers and restraints have been assessed to understand their impact over the forecast period.

The report further identifies the key opportunities for growth while also detailing the key challenges and possible threats.

The other key areas of focus include the various applications and end use industry in PVC Additives market and their specific segmented revenue.

Related Reports

A.Electronic Adhesives Market

https://www.industryarc.com/Report/11648/electronic-adhesives-market.html

B.Acrylic Adhesives Market

https://www.industryarc.com/Report/15328/acrylic-adhesives-market.html

For more Chemicals and Materials Market reports, please click here

[industryarcmarketresearch]

Acrylic Adhesives in Electronics Market Forecast to Reach $5.1 Billion by 2026 IndustryARC

Acrylic Adhesives in Electronics Market is forecast to reach $5.1 billion by 2026, after growing at a CAGR of 6.8% during 2021-2026. For bonding to bare metals, composites and a vast range of thermoplastic materials, acrylic-based structural adhesives offer world-class performance. Acrylic adhesives are the best alternative for electronics due to the combination of excellent cure kinetics at room temperature and reduced need for surface preparation. Cyanoacrylate glue are used for wire tacking with epoxies and light-curable acrylics. Modifiers that improve flexibility and act as strengthening agents are used in the formulation of methacrylate adhesives. The overall tensile strength of the MMA adhesive, as well as its resistance to peeling and impact damage, are considerably improved by these modifiers. The largest formulation technology segment, in terms of both value and volume, is water-based adhesives. In mature markets including North America and Europe, the growing need for VOC-free adhesives has given rise to the use of water-based acrylic adhesives.

COVID-19 Impact:

Before the COVID-19 pandemic, a modest growth rate in the electronics market was witnessed globally. After the pandemic, the global electronics industry has faced a dual impact. The production facilities of the electronics parts have been halted owing to the logistics slowdown and unavailability of the workforce across the globe. Overall consumer technology sales has remained down in 2020 due to the broad economic impact on many customers. The impact on the electronics industry has impacted the acrylic adhesives growth due to downturn in production of electronics.

Acrylic Adhesives in Electronics Market Segment Analysis - By Type

Electrically Conductive Adhesives held the largest share of 37% in the Acrylic Adhesives in Electronics market in 2020. Miniaturization of electronic circuits can lead to heat accumulation problems which, if their maximum operating temperature is exceeded, can cause premature failure of electronic components. Thermally conductive adhesive can be used to provide suitable heat sinks with a heat conductive path, clamping transistors, diodes or other power devices to ensure that such a heat buildup does not occur. To make high viscosity adhesives that are highly thermally conductive, metallic and non-metallic powders are blended into the adhesive formulation. Epoxy, silicone and acrylics are formulated into the most common thermally conductive systems.

Request for Sample Report  @ https://www.industryarc.com/pdfdownload.php?id=502860

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Acrylic Adhesives in Electronics Market Segment Analysis - By Application

Printed Circuit Board has been the primary market for Acrylic Adhesives in Electronics in 2020 growing at a CAGR 12.5% of during forecast period of 2021-2026. The continuing trend towards PCB (printed circuit board) miniaturization poses the challenge of ensuring that contacts and components continue to function reliably, despite their ever-decreasing scale. Therefore, many soldered joints on PCBs are being replaced with electrically conductive adhesives that are more flexible. As glob tops, coatings or underfills for chips, adhesives are added to PCBs to protect sensitive components. For these applications, Panacol provides a broad range of adhesives that meet the different requirements of the industry. According to Japan Electronics and Information Technology Industries Association (JEITA), global electronics and information technology industries is estimated to increase 7% year on year in 2021 to record $3,175.6 billion. On the basis of higher demand for solution services and electronic components and devices, positive growth is expected to continue as nations across the world are using remote information technology to improve remote and contactless connectivity in an attempt to stop the spread of COVID-19. The growth in the electronics industry will fuel the consumption and demand of PCB.

Acrylic Adhesives in Electronics Market Segment Analysis - Geography

APAC dominated the Acrylic Adhesives in Electronics market with a share of more than 45% in 2020, followed by North America and Europe. Japan is one of the mature markets for electronics industry. Global production by Japanese electronics and IT companies is projected to decrease by 5% year-on-year to ¥35,200 billion ($329.89 billion) in 2020 due to decreased exports resulting from the decrease in car and smartphone sales induced by restrictions on mobility and leaving the home according to Japan Electronics and Information Technology Industries Association (JEITA). However, due to the higher demand associated with digital transformation (DX) as a new source of value creation, including automated and increasingly sophisticated data use, positive growth should return in 2021, up 3 percent to ¥ 36,300 billion ($340.20 billion). The optoelectronics and sensors segment should continue to benefit from growing semiconductor content across electronic systems used in automotive, electricity networks, building and factory automation, and others, but it is far from adequate to counter adverse trends in volumes and prices in other segments.

Acrylic Adhesives in Electronics Market Drivers

Miniaturization of Electronic Components will augment the market growth.  

The longstanding movement toward miniaturization of electronic components has resulted in more use of adhesives for fastening. In the military, manufacturing, and commercial fields, miniaturized electronic devices have had a major effect. As miniaturized electronic components have been used, so have the PCBs used to attach them. In powerful processors, advances in advanced system-on-chip (SoC) modules, lower passives, and higher transistor density have made it possible to put more components in a smaller region. In addition, this has enabled higher functionality for newer devices that would previously require multiple boards in a single package or multiple devices linked together. There is no indication of the ending of this trend, which constantly forces designers to come up with new ways to cram more components into a smaller space.

R&D and growing Consumption of Consumer Electronics will drive the demand for Acrylic Adhesives in Electronics.

In some advanced electronic assembly applications, continuing advances in adhesive technology have allowed adhesives to replace solder. With the growing laws, businesses are increasingly moving away from tin soldering to the use of electrically conductive adhesives. Overall, the demand for electrically conductive adhesives is expected to increase with the growing consumption of consumer electronics, thereby increasing the consumption of acrylic adhesives for electronics over the forecast period.

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Acrylic Adhesives in Electronics Market Challenges

Fluctuation in Raw Material Prices and high R&D cost can restrict the market growth.

The bottlenecks in the market's upward climb are Methacrylate acid and acrylic acid prices volatility and stringent environmental and safety regulations. In addition, R&D costs are comparatively higher than in other sectors and strict certifications by OEMs and component manufacturers prevent the industry from realizing its optimum potential.

Decline in growth of end use industry can restrict the market.

In recent times the Electronics industry has faced many serious challenges which has impacted its growth. Factors such as lack of innovation and delayed adoption, informal processes or insufficient rigor and consistency in process execution, weak project monitoring and little cross-functional cooperation have severely impacted. These factors has restrained the electronics industry growth.

Acrylic Adhesives in Electronics Market Landscape

Technology launches, acquisitions and R&D activities are key strategies adopted by players in the Acrylic Adhesives in Electronics market. Major players in the Acrylic Adhesives in Electronics market are Akzo Nobel NV, Allnex Netherlands B.V., BASF SE, Belami Fine Chemicals Pvt. Ltd., ALTANA, Henkel AG & Company, 3M Company, Dymax, Hitachi Chemical, Jowat SE and Others.

Acquisitions/Technology Launches/ Product Launches  

In June 2020, Permabond launched UV639 High Performance Acrylic Bonder. PERMABOND UV639 UV-curing adhesive is a new acrylic bonder, or “acrylic adhesive” in the sense that it is ideally suited to bonding acrylic as well as polycarbonate and other difficult to bond plastics like PET-G.

Key Takeaways

Asia-Pacific dominates the Acrylic Adhesives in Electronics market owing to matured electronics industry especially among South East Asian countries.

Demand for environmental benefits, such as reduced emissions of volatile organic compounds (VOC) and aesthetic bonding solutions for different substrates, is expected to further drive acrylic adhesive in electronics market.

The market drivers and restraints have been assessed to understand their impact over the forecast period.

The report further identifies the key opportunities for growth while also detailing the key challenges and possible threats.

The other key areas of focus include the various applications and end use industry in PVC Additives market and their specific segmented revenue.

Related Reports

A.Electronic Adhesives Market

https://www.industryarc.com/Report/11648/electronic-adhesives-market.html

B.Acrylic Adhesives Market

https://www.industryarc.com/Report/15328/acrylic-adhesives-market.html

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[latestanalysis]

Global Underfill Adhesives Market Size, Share, Growth Applications, Key Restraints, Market Dynamics, Forecast till 2027

Global Underfill Adhesives Market

The underfill adhesives are mainly used for semiconductor packaging which distributes the mechanical stress at the joint which happens due to the modification in the thermal expansion factors. These are classified into two types such as Single Component Underfill Adhesives, and Two-Component Underfill Adhesives. These are widely used in various applications such as Ball Grid Arrays, Chip Scale Packaging, and Land Grid Arrays.

Market Drivers

The global underfill adhesives market is expected to witness sustained growth over the forecast period. The continuous technological advancements in electronic industry will propel the global underfill adhesives market. Also, the increase in focus of manufacturers on next-generation, high reliability electronic applications will positively influence the market growth. In addition to that, the increase in demand for underfill adhesives in several packaging techniques which include ball grid arrays, chip scale packaging, and land grid arrays is expected to drive the global underfill adhesives market growth during this forecast period. Moreover, the rise in research and development to develop fast curing underfill which provide essential interconnect protection from vibration, shock, and drop. In addition to that, leading key players are collaborating with online distribution platforms to raise the uptake of underfill materials.

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Market Restraints

The fluctuation in the cost of underfill adhesives is major restraint is expected to hamper the global underfill adhesives market growth over the forecast period.

Market Segmentation

The Global Underfill Adhesives Market is segmented into type, application, and region

On the basis of type, the global underfill adhesives market is segmented into type Single Component Underfill Adhesives, and Two-Component Underfill Adhesives.

On the basis of application, the global underfill adhesives market is segmented into Ball Grid Arrays, Chip Scale Packaging, and Land Grid Arrays.

On the basis of region, the global underfill adhesives market is segmented into five regions such as North America, Latin America, Europe, Asia Pacific, and Middle East & Africa.

Market Key Players

Various key players are discussed in global underfill adhesives market are Henkel, Panacol, Darbond Technology, Master Bond, AI Technology, Lord Corporation, Epoxy International, Buhnen,, and H.B. Fuller.

Market Taxonomy

By Type

Single Component Underfill Adhesives

Two-Component Underfill Adhesives

By Application

Ball Grid Arrays

Chip Scale Packaging

Land Grid Arrays

By Region

North America

Latin America

Europe

Asia Pacific

Middle East & Africa

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