#Ceramic disc capacitors

[jvir2nrrry]

https://www.futureelectronics.com/p/passives--capacitors--ceramic-capacitors--multilayer-ceramic-capacitors/lmk316bj476ml-t-taiyo-yuden-1160310

What is a multilayer ceramic, ceramic capacitors, capacitor, capacitors ceramic

1206 47 uF 10 V ±20% Tolerance X5R Multilayer Ceramic Capacitor

[ul2gherty]

https://www.futureelectronics.com/p/passives--capacitors--ceramic-capacitors--multilayer-ceramic-capacitors/cl31x476kqhnnne-samsung-electro-mechanics-4122435

Ceramic disc capacitor, multilayer ceramic chip capacitors, energy storage

CL Series 47µF ±10% Tolerance 6.3V X6S SMT Multilayer Ceramic Capacitors

[knnth2kee]

https://www.futureelectronics.com/p/passives--capacitors--ceramic-capacitors--multilayer-ceramic-capacitors/cc0603krx7r9bb104-yageo-9017302

Capacitor, Multilayer ceramic capacitor applications, electronic components,

0603 0.1 uF 50 V ±10% Tolerance X7R SMT Multilayer Ceramic Capacitor

[miela2und]

https://www.futureelectronics.com/p/passives--capacitors--ceramic-capacitors--multilayer-ceramic-capacitors/cc0603krx7r9bb104-yageo-7145760

High voltage ceramic capacitors, Electrolytic capacitors, capacitance values

0603 0.1 uF 50 V ±10% Tolerance X7R SMT Multilayer Ceramic Capacitor

[drrly2tter]

https://www.futureelectronics.com/p/passives--capacitors--ceramic-capacitors--multilayer-ceramic-capacitors/cc0603krx7r9bb104-yageo-3035896

Data processing, multilayer ceramic capacitor applications, Consumer electronics

0603 0.1 uF 50 V ±10% Tolerance X7R SMT Multilayer Ceramic Capacitor

[crtis2tiin]

https://www.futureelectronics.com/p/passives--capacitors--ceramic-capacitors--multilayer-ceramic-capacitors/grm21br61a476me15l-murata-7072395

What is a capacitor, MLCCs, Electrolytic capacitor, Capacitor Ceramic

0805 47 uF 10 V ±20% Tolerance X5R Multilayer Ceramic Chip Capacitor

[tmmsh2hz]

https://www.futureelectronics.com/p/passives--capacitors--ceramic-capacitors--multilayer-ceramic-capacitors/08055c104kat2a-kyocera-avx-9434473

What is a ceramic capacitor, low ESR capacitor, High voltage ceramic capacitor

0805 100nF 50 V ±10 % Tolerance X7R Surface Mount Multilayer Ceramic Capacitor

[jhn2rmick]

https://www.futureelectronics.com/p/passives--capacitors--film-capacitors/104m06qc100-paktron-capacitors-7486764

Film capacitors application, plastic film caps, Ceramic disc capacitor

Q/QRL Series 600 V 0.1 uF ±20 % Radial Metallized Polyester Quencharc® Capacitor

[tmms2son]

https://www.futureelectronics.com/p/passives--capacitors--ceramic-capacitors--multilayer-ceramic-capacitors/lmk316bj476ml-t-taiyo-yuden-1104083

Capacitors Ceramic, what is a multilayer ceramic, Capacitor arrays

1206 47 uF 10 V ±20% Tolerance X5R Multilayer Ceramic Capacitor

[mrc2c2kinn]

https://www.futureelectronics.com/p/passives--capacitors--ceramic-capacitors--multilayer-ceramic-capacitors/cl31a106kbhnnne-samsung-electro-mechanics-1019921

What is ceramic capacitor, ceramic capacitor, low ESR capacitor, Capacitor array

CL31 Series 10 uF 50 V ±10 % Tolerance X5R SMT Multilayer Ceramic Capacitor

[kvvdin2err]

https://www.futureelectronics.com/p/passives--capacitors--ceramic-capacitors--multilayer-ceramic-capacitors/gcj32er70j476ke01l-murata-5029506

What is a ceramic capacitor, low ESR capacitor, Ceramic capacitor manufacturers 

GCJ Series 1210 47 uF 6.3 V ±10% Tolerance X7R Multilayer Ceramic Capacitor

[edrw2rden]

High voltage ceramic capacitors, Samsung capacitor, capacitor manufacturers

CL31 Series 10 uF 50 V ±10 % Tolerance X5R SMT Multilayer Ceramic Capacitor

[janw2dley]

Ceramic Capacitors, ceramic disc capacitor, Ceramic capacitor voltage

KRM Series 6.7 x 6.1 x 5.3 mm 15 uF 100 V ±10% X7R Monolithic Ceramic Capacitor

[christanworkshop]

DIY: Ghostbusters Belt Gizmo

If you are a Ghostbusters fan, you will know what this Belt Gizmo is. Being a Ghostbusters fan myself, I have always wanted one of this to complete my Ghostbusters costume. First, I tried to find the best photo available of the circuit board and I mirrored it to use as the image for the other side of the circuit board. Printed it out on transparent sticker and stuck it on to stiff cardboard to make it look like a real circuit board.

Next, I had to create the graphics to replicate the various chips and components. These were also printed on transparent sticker and stuck on to cardboard. I used transparent stickers because they give a glossy look that made it look like plastic. Metal wires were attached to the "circuit board" where the white chips are then glued on top, to make it look like the "legs" of the chip.

For the ceramic disc capacitors, I stuck the stickers on to round discs I cut from a thin orange foam sheet. These were hot glued to the circuit board. Transistors and resistors were also attached. Hot glue were used in place of real solder. You can then just use a silver market to color these hot glue to make it look like real solder.

The Nixie tubes are harder to replicate. I thought long and hard about this and came out with a simple method. I designed the Nixie tube wire mesh and number design graphic and printed it on transparent sticker. These were then stuck in to transparent plastic tubes I cut from the body of a ball point pen. Finally, some aluminium sticker are used to complete the look.

Next, we wire some LEDs and glue some fake wires together and stuff it into the Nixie tube.

Now we can mount the Nixie tubes. The "rack" that the Nixie tubes were mounted on was made out of stiff cardboard. It was just a quick hack. I should probably redo this with a 3D printed part eventually.

With that completed, we can wire in the switch and battery holder. The switch is hot glued under the Nixie tube rack and the batter holder just slots into the space under the Nixie tubes.

Another detail is the caps above the Nixie tubes. Again, another quick hack.

Lastly, I also attached an old telephone cord and some random circuit board that I mounted a belt clip behind it.

That's it, the belt gizmo is done! What do you think?

[semiconductor-hub]

Isostatic Pressing Market Strategies and Resources to Grow Your Company, 2032

Isostatic pressing is a highly effective manufacturing process used to shape and densify materials, such as metals and ceramics, through uniform pressure application. This technique is particularly valuable in producing complex geometries with high density and minimal porosity. By ensuring that pressure is applied uniformly from all directions, isostatic pressing enhances the mechanical properties of materials, making it a preferred choice in industries like aerospace, automotive, and electronics.

The isostatic pressing process can be categorized into two main types: hot isostatic pressing (HIP) and cold isostatic pressing (CIP). HIP involves heating the material during the pressing process, which promotes densification and improves material properties, while CIP is performed at room temperature. Both methods are crucial for achieving high-quality components that meet the demanding specifications of various applications.

The Isostatic Pressing Market is on the rise due to its applications in producing high-density materials across various industries, including aerospace, automotive, and electronics. The demand for advanced manufacturing techniques that ensure uniform pressure distribution is driving innovations in isostatic pressing technologies, leading to improved material properties and performance.

Future Scope

The future of isostatic pressing is promising, as advancements in materials science and manufacturing technologies continue to evolve. The demand for high-performance components with intricate designs is expected to drive the adoption of isostatic pressing across various sectors. Innovations in automation and process control will further enhance efficiency and precision, making isostatic pressing a cornerstone of advanced manufacturing practices.

As industries strive for more sustainable and efficient manufacturing processes, isostatic pressing is well-positioned to meet these needs. The ability to produce components with minimal waste and high yield makes it an attractive option for manufacturers looking to reduce their environmental footprint. Additionally, the ongoing development of new materials, including advanced ceramics and composites, will expand the range of applications for isostatic pressing.

Trends

Current trends in isostatic pressing include the integration of additive manufacturing techniques, enabling the production of complex shapes that were previously challenging to achieve. This hybrid approach allows manufacturers to combine the benefits of additive and subtractive manufacturing, resulting in improved design flexibility and reduced lead times.

There is also an increasing focus on sustainable practices, with efforts to optimize material usage and minimize waste during the pressing process. Manufacturers are exploring ways to recycle and repurpose materials, further enhancing the sustainability of isostatic pressing. Additionally, advancements in simulation and modeling technologies are improving process design and outcomes, allowing for more precise control over the pressing parameters.

Application

Isostatic pressing is widely used across various sectors, including aerospace for producing lightweight, high-strength components, automotive for manufacturing parts with stringent quality requirements, and electronics for creating high-performance substrates and capacitors. Its ability to produce dense, high-quality materials makes it indispensable in applications that demand superior mechanical properties.

In aerospace applications, isostatic pressing is used to manufacture components such as turbine blades and structural elements that require exceptional strength-to-weight ratios. In the automotive industry, it plays a critical role in producing high-performance components, such as brake discs and engine parts, that must withstand extreme conditions. In electronics, isostatic pressing is essential for creating substrates used in advanced circuit boards and capacitors, ensuring reliable performance in electronic devices.

Key Points

Effective for shaping and densifying materials through uniform pressure.

Increasing demand for high-performance components drives adoption.

Trends include integration with additive manufacturing and sustainable practices.

Applied in aerospace, automotive, and electronics sectors.

Read More Details: https://www.snsinsider.com/reports/isostatic-pressing-market-4528 

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Akash Anand — Head of Business Development & Strategy

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