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[jessiejamesdeckers]

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[dailytechnologynews]

TechInsights: Apple A13 Bionic has a 98.48 mm2 die size (18,3% larger then A12)

The A13 Bionic has an Apple part number APL1W85. It is a Package on Package (PoP) with both the A13 Application Processor and the Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM, with the same 4GB DRAM capacity as the previous iPhone Xs Max from last year.

Update: The A13 Bionic APL1W85 has the die marks TMKF47. The die size (die seal edge) is 10.67mm x 9.23mm = 98.48 mm2, representing a 18.27% die size increase when compared to the previous A12.

Source: TechInsights

Here's bit of historical data to spot trends (source):

SoC Node Transistors Die size A10 16nm FinFET (TSMC N16+) 3.3 billion 125 mm2 A11 10nm FinFET (TSMC N10) 4.3 billion (+30,3%) 87.7 mm2 (-29,8%) A12 7nm FinFET (TSMC N7) 6.9 billion (+60,5%) 83.27 mm2 (-5,1%) A13 7nm FinFET (TSMC N7P) 8.5 billion (+23,2%) 98,48 mm2 (+18,3%)

The transistor count increased with 23,2%, while the die area increased with only 18,3%. That would suggest that TSMC's N7P process is 4,2% more dense. Of course this varies with the ratio of implemented transistor features (logic, SRAM, etc.).

For comparison, the AMD Matisse die (8-core Zen2), also manufactured on TSMC N7, is 80,8 mm2.

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-----BEGIN RSA PUBLIC KEY----- MIIBCgKCAQEAz2hlMPrZCrCG9g3vK2sNY8HNWzC25yX5ezzhwi9iBeRL9G/ZW65Q 9JNro7DyFzN7itgb3o3iYooa0aG8KBzf7+MfB89lsNI4ggU7SBF0aUcWKwc47cMV 9/hJM2oh1rk5pyCZsJBBpR25Ic5JaIPQnj+QPsY22J5jnGT897sHQ/avmWcwOB+y Wccf4fyYmrV5rWNhTDllmf6OC2LtJO+2O7Kgh4aEoQgw61jVtckTjgWr1XGZ6VKL bfwqUojzHz77RLpbRYDlYYCGBfLXsSGuvRjEo7Le9m9bNaTxvvsX03d+LKD3V4hf WUeigoVUZZn3H+Yyt8G4kj0xt5Z/DYN19wIDAQAB -----END RSA PUBLIC KEY----- -----BEGIN RSA PRIVATE KEY----- MIIEpAIBAAKCAQEAz2hlMPrZCrCG9g3vK2sNY8HNWzC25yX5ezzhwi9iBeRL9G/Z W65Q9JNro7DyFzN7itgb3o3iYooa0aG8KBzf7+MfB89lsNI4ggU7SBF0aUcWKwc4 7cMV9/hJM2oh1rk5pyCZsJBBpR25Ic5JaIPQnj+QPsY22J5jnGT897sHQ/avmWcw OB+yWccf4fyYmrV5rWNhTDllmf6OC2LtJO+2O7Kgh4aEoQgw61jVtckTjgWr1XGZ 6VKLbfwqUojzHz77RLpbRYDlYYCGBfLXsSGuvRjEo7Le9m9bNaTxvvsX03d+LKD3 V4hfWUeigoVUZZn3H+Yyt8G4kj0xt5Z/DYN19wIDAQABAoIBAEH01+EolGbS1khf DATJqVtk4RIzvqZpLBoltUFUYh6vh/v2qa9/Ep2EWAGZHpOEOrBfoxU2F5zwgDDT 9wrmi8w0dMS+Dn+ZioDGeyCi9FsaURFj3ZW2qUDPAzBHevVWt9/O/TDp3wZMGniG qk+DQ49fdVaRIBXo4JJ2hv+cyWWx9XsY68tw4SGuq/oMD7b0UpKk9L9NchQeg0Qo AMpPHPrnnYP7bb80Q7s5ULuZt4B0/uQRPCx8L5dTPEhiFBcgJS1EG+lGLIaaqJ/H kUgEAdD1AW2BbmR6zxDVOYSUU8mX4dmgkX8WIow0sBADp+H7pDXZf5cnY5NphuOt 60Fx5akCgYEA6Qmb+BomXhmleDyVDpoKxN3JNPq0vwWRpaYYKMnQDCK85h6lPiCt ftZZaGxO4PziLJc2Cxv3RhuGBOPEWq+EOlFe8oc2xxCgPk6w1xQPAysbLk43wrKo FCGeu1gTnSGNR5f9f0OC37Of1sqNTA2nCovgISuwjTBSZudiE5cYGasCgYEA49hG EU8i7RyMc53i8Rwk/n/8i/RVVH6glGSc9/3q9vrFpTzn4yHuWAac/NUyRsiOPHgl 0CdaaPZmIiU46gh4wDiIu6bwBYSvf+hKhsEYyhhcm4YG5c0IFB5TmBhKtodedWeE JQip7gWydFy35tz8H0D6io5T1dF2UQts/49dgOUCgYBFU+eDuvvZGNYiXBuYGXnE sZqPWVp2TcjTuAMN92QeiCMcbteIER6sUkaNC1O4GWOMEnwwd+Rrhfqr77rVo8u5 scWGb3V7aVXS04RGqCADOErAzuJF2PKp8oqPf5duMrIeL3hp6QLBXGXb96xriNA+ EfjexWmjx1Fsbb++xj+UOwKBgQCkI9FOdPFXWiLAw/SS+FCaW7+nX4z9gv/SB62h ZnaYGM68HGV9lpsrJRCBgGFo5uC5JWEwVLloNmIbpS8cQqAi8ldmwHvXrd/0yHaw H3npVaWZkPN1J8DzJWnZf16LonflIn7rYxNwWwBVndoKYhbruRcFLEWvGugeuJl8 fl7BFQKBgQDdT6S0CYElm1EWjhOfg/o3vv0l0OOp9qsKhaTjgU4I1gFOO/bsDK6U SgCL+8AlYR6iIlZRCqhMMvZC0diRQmLD+3SAerwRoCGqRjSTC+HxniljwkBklkJL 9Nc/WDBVHdEKF5NTLt4qNLR5GZP7zMGilPeooAPLQ274S46lNPDyiQ== -----END RSA PRIVATE KEY-----

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iPhone 11 Pro Max皇帝版BOM曝光：都用了哪些元件 成本幾何

訪問:

蘋果在線商店(中國)

SoC方面，Techinsights拆解的這款iPhone 11 Pro Max內部的蘋果A13處理器的編號為APL1W85。 A13處理器和三星K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM的封裝通過PoP封裝在了一起。 A13處理器的尺寸（模具密封邊緣）為10.67mm x 9.23mm = 98.48 mm²。作為對比，A12處理器的面積為9.89×8.42=83.27平方毫米，因此A13面積增大了18.27%。

基帶方面，採用英特爾PMB9960，可能是XMM7660調製解調器。據英特爾稱，XMM7660是其滿足3GPP Release 14的第六代LTE調製解調器。它在下行鏈路（Cat 19）中支持高達1.6 Gbps的速度，在上行鏈路中支持高達150 Mbps的速度。相比之下，前代Apple iPhone Xs Max採用了Intel PMB9955 XMM7560調製解調器分別只能支持1Gbps的下行速度以及225Mbps的上行速度。

以下是Techinsights所分析的物料清單：

射頻收發器採用英特爾PMB5765，用於與英特爾基帶芯片的RF收發器。

Nand Flash 存儲：採用了東芝的 512 GB NAND閃存模塊。

Wi-Fi / BT模組：採用村田339S00647 模組。

NFC：採用恩智浦新的SN200 NFC＆SE模塊，與去年iPhone Xs / Xs Max / XR中使用的SN100不同。

PMIC: Intel PMB6840, Apple 343S00355 (APL1092)，這應該是蘋果自己設計的用於A13仿生處理器的主PMIC

DC/DC：Apple 338S00510，德州儀器 TPS61280

電池充電管理：STMicroelectronics STB601，德州儀器SN2611A0

顯示電源管理：Samsung S2DOS23

音頻IC：Apple / Cirrus Logic 338S00509音頻編解碼器和三片338S00411音頻放大器。

Envelope Tracker：採用 Qorvo QM81013

射頻前端：Avago（Broadcom）AFEM-8100前端模塊，Skyworks SKY78221-17前端模塊，Skyworks SKY78223-17前端模塊，Skyworks SKY13797-19 PAM等

無線充電：採用意法半導���的STPMB0芯片，很有可能是無線充電接收器IC，而在之前的iPhone中採用的是Broadcom芯片。

相機：索尼仍然是iPhone 11 Pro Max四款視覺攝像頭的供應商。意法半導體(STMicroelectronics)已連續第三年，將其全球快門紅外(shutter IR)相機芯片作為iPhone基於結構化光的FaceID系統的探測器。

其他：STMicroelectronics ST33G1M2 MCU，恩智浦CBTL1612A1顯示端口多路復用器，賽普拉斯CYPD2104 USB Type-C端口控制器。

總體而言：iPhone 11 Pro Max（512GB版本）的B​​OM物料成本為490.5美元，約合人民幣3493元，不到其國行版定價12699元的1/3。

需要指出的是，物料成本指的是各個元件的成本，沒有算上運營以及研發之類的成本。

.(tagsToTranslate)Apple iPhone(t)iPhone 11 Pro Max皇帝版BOM曝光：都用了哪些元件 成本幾何(t)kknews.xyz

from iPhone 11 Pro Max皇帝版BOM曝光：都用了哪些元件 成本幾何 via KKNEWS

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