#Wafer Cleaning Equipment Market Report

[datastring]

Wafer Cleaning Equipment Market set to hit $26.9 billion by 2035

Industry revenue for Wafer Cleaning Equipment is estimated to rise to $26.9 billion by 2035 from $9.3 billion of 2023. The revenue growth of market players is expected to average at 9.2% annually for the period 2023 to 2035.

Wafer Cleaning Equipment is critical across several key applications including memory, logic, mems and cis. The report unwinds growth & revenue expansion opportunities at Wafer Cleaning Equipment’s Type, Technology and Application including industry revenue forecast.

Industry Leadership and Competitive Landscape

The Wafer Cleaning Equipment market is characterized by intense competition, with a number of leading players such as SCREEN Semiconductor Solutions, Tokyo Electron, Lam Research, Applied Materials, Semes, Entegris, Veeco Instruments, PVA TePla, Akrion Systems, ACM Research, Modutek and MKS Instruments.

The Wafer Cleaning Equipment market is projected to expand substantially, driven by increasing demand for high-precision semiconductor devices and growth of iot and 5g technologies. This growth is expected to be further supported by Industry trends like Advances in Automotive Electronics.

Detailed Analysis - https://datastringconsulting.com/industry-analysis/wafer-cleaning-equipment-market-research-report

Moreover, the key opportunities, such as expansion in emerging markets, development of eco-friendly cleaning solutions and integration of ai in wafer cleaning, are anticipated to create revenue pockets in major demand hubs including U.S., Japan, South Korea, Taiwan and Germany.

Regional Shifts and Evolving Supply Chains

North America and Asia-Pacific are the two most active and leading regions in the market. With challenges like high equipment and maintenance costs, stringent environmental regulations and technical complexity and skill requirement, Wafer Cleaning Equipment market’s supply chain from chemical supplier / equipment manufacturer / service provider to end-user is expected to evolve & expand further; and industry players will make strategic advancement in emerging markets including India, Brazil and France for revenue diversification and TAM expansion.

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[semiconductorsandelectronics]

Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP, Deposition, Wafer Cleaning, Assembly & Packaging, Dicing, Bonding, Metrology, Wafer/IC Testing, Logic, Memory, MPU, Discrete - Global Forecast to 2029

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Transforming Technology: The Role of Semiconductor Manufacturing Equipment

The global semiconductor manufacturing equipment market is set to witness steady growth over the forecast period, driven by the rapid advancement in digital technologies and increasing demand for semiconductors across various industries. According to the report, the market is projected to grow at a compound annual growth rate (CAGR) of approximately 8% from 2022 to 2028. In 2022, the global semiconductor manufacturing equipment market was valued at around USD 95 billion and is expected to reach nearly USD 150 billion by 2028.

What is Semiconductor Manufacturing Equipment?

Semiconductor manufacturing equipment includes machinery and tools essential for producing semiconductor devices, from wafer production to assembly and testing. These devices play a critical role in powering modern electronics, from smartphones and computers to advanced automotive and industrial equipment. The equipment required spans various stages of production, including lithography, etching, cleaning, and packaging.

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Market Dynamics and Growth Drivers

Key factors contributing to the growth of the global semiconductor manufacturing equipment market include:

High Demand for Consumer Electronics: The proliferation of smartphones, computers, and IoT devices has driven the demand for semiconductors, which in turn fuels the need for manufacturing equipment.

Technological Advancements in Semiconductors: Emerging technologies like 5G, artificial intelligence, autonomous vehicles, and cloud computing are increasing the demand for high-performance semiconductors, boosting the market for advanced manufacturing equipment.

Expansion of the Electric Vehicle Market: The growing electric vehicle (EV) market requires specialized semiconductor components, leading to increased investment in semiconductor manufacturing equipment tailored for automotive applications.

Rising Investments in Data Centers: Cloud computing and big data analytics are leading to the expansion of data centers globally. The semiconductor components necessary for these data centers are driving demand for sophisticated manufacturing equipment.

Regional Policies and Investments: Government support and initiatives to bolster domestic semiconductor production, especially in regions like North America, Europe, and Asia-Pacific, are contributing to market growth. Countries are increasingly prioritizing local semiconductor production, creating favorable conditions for equipment manufacturers.

Regional Analysis

Asia-Pacific: Asia-Pacific leads the global market for semiconductor manufacturing equipment, largely due to its significant share of semiconductor production. Countries like China, South Korea, Japan, and Taiwan are home to some of the world's largest semiconductor manufacturers, making the region a critical hub for this equipment.

North America: North America is another key market, bolstered by high investment in semiconductor technology and government initiatives aimed at boosting domestic semiconductor production. The U.S., in particular, is home to several semiconductor manufacturing giants, which rely on advanced equipment to maintain their competitive edge.

Europe: Europe’s semiconductor equipment market is growing, driven by an increasing focus on innovation and research in semiconductor technology. The region is also witnessing rising demand for automotive semiconductors due to its strong automotive industry.

Latin America, Middle East & Africa: Although smaller markets, these regions are witnessing gradual adoption as industries expand digital infrastructure, requiring semiconductors for various applications. This growth is supported by increasing demand for electronics, industrial automation, and digital connectivity.

Competitive Landscape

The semiconductor manufacturing equipment market is characterized by intense competition, with leading companies focusing on technological advancements, partnerships, and geographical expansion to maintain their market position. Key players include:

Applied Materials, Inc.: One of the largest companies in the sector, Applied Materials offers equipment for wafer fabrication and is a significant contributor to industry innovation.

ASML Holding NV: Known for its expertise in photolithography, ASML is a leader in providing equipment for producing advanced semiconductor chips, particularly through extreme ultraviolet (EUV) lithography technology.

Lam Research Corporation: This company is known for its etching and deposition solutions, critical for producing high-performance semiconductor devices.

Tokyo Electron Limited: A leading Japanese player, Tokyo Electron provides a range of semiconductor manufacturing equipment, including for coating, developing, and etching processes.

KLA Corporation: KLA specializes in process control and yield management solutions, offering equipment that helps ensure semiconductor quality and production efficiency.

Report Overview : https://www.infiniumglobalresearch.com/reports/global-semiconductor-manufacturing-equipment-market

Challenges and Opportunities

While the semiconductor manufacturing equipment market offers significant opportunities, it also faces certain challenges:

Supply Chain Disruptions: Global supply chain issues, such as the ongoing semiconductor shortage, could impact equipment availability and delay production timelines.

High Capital Investment Requirements: Semiconductor manufacturing equipment is capital-intensive, and smaller firms may face financial barriers to adopting advanced technologies.

Technological Complexity and R&D Costs: Constantly evolving technology requires substantial R&D investments to keep up with industry needs. However, innovations like EUV lithography, 3D stacking, and quantum computing present new growth avenues for the market.

Conclusion

The global semiconductor manufacturing equipment market is poised for steady growth, with a projected CAGR of 8% from 2022 to 2028. As digital transformation accelerates across various sectors, the demand for high-performance semiconductors continues to rise, driving the need for advanced manufacturing equipment. While challenges such as supply chain disruptions and capital intensity exist, the market's potential remains robust, fueled by technological advancements, industry expansion, and regional investments in semiconductor production. By 2028, the market is expected to reach nearly USD 150 billion, cementing its role as a cornerstone in the global technology landscape.

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Semiconductor Tubing Market Forecast & Business Opportunities by 2032

Semiconductor tubing is essential in facilitating the safe transport of gases, chemicals, and fluids used in the production of semiconductor devices. These tubes must meet stringent quality standards, offering high purity, chemical resistance, and durability to support various manufacturing processes, including etching, deposition, and cleaning. The increasing demand for advanced semiconductors across sectors such as electronics, automotive, healthcare, and telecommunications is leading to a rise in the need for robust and reliable tubing solutions in semiconductor fabrication facilities.

The Semiconductor Tubing Market is witnessing significant growth driven by increasing demand for precision components in semiconductor manufacturing processes. Innovations in materials and manufacturing techniques are enhancing the performance and reliability of tubing solutions. Additionally, the expansion of advanced semiconductor technologies, including miniaturization and higher integration levels, is further propelling market opportunities.

Future Scope

With continuous advancements in semiconductor technology, the demand for precision tubing solutions is expected to grow significantly. The rise of next-generation chips, miniaturized devices, and innovations such as 5G, AI, and IoT are creating a need for highly specialized tubing that can handle the complex chemicals and processes involved. As semiconductor fabrication becomes increasingly sophisticated, the future will likely see the development of tubing materials with enhanced chemical compatibility, thermal stability, and improved longevity to meet the evolving needs of the industry.

Trends

Several key trends are shaping the semiconductor tubing sector. The push for miniaturization of semiconductor devices is driving demand for smaller, more precise tubing systems that can operate efficiently in space-constrained environments. Additionally, sustainability and environmental concerns are influencing the development of eco-friendly materials and recycling practices within the production process. The shift toward automation in semiconductor fabrication is also leading to an increased focus on tubing systems that can support highly controlled, contamination-free environments, ensuring greater efficiency and product quality.

Application

Semiconductor tubing is widely used across various stages of semiconductor device production. It facilitates the transport of ultra-high purity chemicals and gases in critical processes like chemical vapor deposition, photolithography, and wafer cleaning. Additionally, these tubes are used in gas delivery systems and fluid handling equipment to ensure contamination-free environments. Tubing is essential in maintaining the integrity and efficiency of semiconductor manufacturing, making it indispensable in cleanroom operations, etching processes, and other applications requiring precise fluid and gas management.

Key Points

Essential for transporting gases and chemicals in semiconductor manufacturing.

High purity, chemical resistance, and durability are key features.

Rising demand driven by the adoption of advanced technologies like 5G and AI.

Trends include miniaturization, sustainability, and automation in production.

Supports critical processes such as etching, deposition, and wafer cleaning.

Read More Details: https://www.snsinsider.com/reports/semiconductor-tubing-market-4531 

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Akash Anand — Head of Business Development & Strategy

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Semiconductor Electroplating Systems (Plating Equipment), Global Top 15 Players, Market Share and Ranking (2023)

Semiconductor Electroplating Systems (Plating Equipment) Market Summary

Electroplating is a processing method that forms a metal film on the surface of metal or non-metal. The purpose of electroplating is to improve corrosion resistance and functionality. Electroplating can be divided into two types according to technology: wet electroplating and dry electroplating. Wet electroplating uses aqueous solution; dry electroplating uses metal evaporation in a vacuum environment, specifically through sputtering, ion implantation, vacuum evaporation and other methods.

Semiconductor electroplating (Plating/ECD) refers to the electroplating of metal ions in the electroplating solution onto the wafer surface to form metal interconnects during the chip manufacturing process. As the chip manufacturing process becomes more and more advanced, the interconnect lines in the chip begin to shift from traditional aluminum materials to copper materials, and semiconductor copper plating equipment is widely used. At present, semiconductor electroplating is not limited to the deposition of copper wires, but also metals such as tin, tin-silver alloys, nickel, and gold, but the deposition of metallic copper still dominates.

Semiconductor electroplating equipment can deposit a layer of dense, no holes, no gaps and other defects on the wafer, and evenly distributed copper, and then equipped with vapor deposition equipment, etching equipment, cleaning equipment, etc., to complete the copper interconnection process. The electroplating process is used to deposit metallized films of metals such as copper, nickel, tin, silver, and gold in three-dimensional through-silicon vias, rewiring, bumps, and other processes.

According to the new market research report "Global Semiconductor Electroplating Systems (Plating Equipment) Market Report 2024-2030", published by QYResearch, the global Semiconductor Electroplating Systems (Plating Equipment) market size is projected to reach USD 855 million by 2030, at a CAGR of 6% during the forecast period.

Figure.  Global Semiconductor Electroplating Systems (Plating Equipment) Market Size (US$ Million), 2019-2030

Figure.   Global Semiconductor Electroplating Systems (Plating Equipment) Top 15 Players Ranking and Market Share (Ranking is based on the revenue of 2023, continually updated)

According to QYResearch Top Players Research Center, the global key manufacturers of Semiconductor Electroplating Systems (Plating Equipment) include Lam Research, Applied Materials, ACM Research, ASMPT, TKC, Besi, ClassOne Technology, TANAKA Precious Metals, RENA Technologies, Ramgraber GmbH, etc. In 2023, the global top 10 players had a share approximately 87.0% in terms of revenue.

Figure.  Semiconductor Electroplating Systems (Plating Equipment), Global Market Size, Split by Product Segment

In terms of product type, currently Fully Automatic is the largest segment, hold a share of 76.4%.The entire process of fully automatic equipment does not require human participation and is fully automated, such as wafer transfer, automatic loading and unloading, etc.

Figure.  Semiconductor Electroplating Systems (Plating Equipment), Global Market Size, Split by Application Segment

In terms of product application, Back-end Advanced Packaging is the largest application, hold a share of 64%. In addition to the copper interconnection process, electroplating technology is also used in advanced packaging processes such as Bumping, RDL, and TSV. The core of TSV technology is to drill holes on the wafer and fill the through-silicon vias with copper plating, thereby achieving wafer interconnection and stacking, and improving chip integration and performance without further reducing chip line width. Compared with the copper interconnection process in chip manufacturing, TSV electroplating is larger in size, usually requires longer deposition time, higher electroplating rate and multiple process steps, and the cost of copper interconnection electroplating solution and additives accounts for a higher proportion of the total cost of TSV process.

Figure.  Semiconductor Electroplating Systems (Plating Equipment), Global Market Size, Split by Region (Production)

Figure.  Semiconductor Electroplating Systems (Plating Equipment), Global Market Size, Split by Region

Market Drivers:

1. The growing demand in the semiconductor industry is the prerequisite for the rapid growth of the semiconductor packaging equipment market: Stimulated by the demand for emerging application terminals such as the Internet of Things, cloud computing, big data, and new energy vehicles, the global semiconductor market has resumed its growth trend. As the world's largest semiconductor consumer market, China's demand for semiconductors continues to be strong, driving the growth in demand for semiconductor packaging equipment business.

2. Advanced packaging technologies: such as Fan-out, SiP, 3D, WLP, flip-chip, chip stacking layer packaging, etc., promote the upgrading of equipment to meet the needs of smaller, more efficient, and higher performance.

3. Downstream market demand: Increased demand for smartphones, automobiles, Internet of Things, data centers, artificial intelligence, 5G, cloud computing, edge computing, and smart devices will drive semiconductor usage and packaging equipment demand.

Trend:

1. Continuous growth: With the rapid development and expansion of the market in IoT, automotive electronics, artificial intelligence and other fields, the global packaging and testing industry continues to grow, and so will the semiconductor Plating machine as packaging equipment.

2. Further development of advanced packaging equipment: The bottleneck stage of Moore's Law has been reached, and the industry cannot continue to be driven by reducing the transistor size alone, which requires more advanced packaging technologies to reduce the package size and thus further save the space behind the IC package. Currently, advanced packaging mainly refers to DFN, QFN, Flip-Chip, WLCSP, and SiP. At present, although traditional packaging still occupies the majority of the packaging market, advanced packaging is gradually increasing its market application proportion with its unique advantages. The market share of semiconductor molding systems used for advanced packaging will also increase year by year, and market demand for equipment will promote the further development of advanced packaging equipment.

3. More intelligent: The current mainstream semiconductor Plating equipment in the market already has a strong level of automation and certain intelligent functions. In the future, as technology continues to develop and labor costs increase, semiconductor Plating equipment will become more intelligent, and its capabilities of self-perception, self-maintenance and automatic adaptation will be further improved to adapt to production needs.

4. AI + Equipment: The integration of AI and big data technologies will optimize the control strategy of the electroplating process, automatically adjust process parameters through real-time data analysis, improve production efficiency and product quality, reduce defective product rates, and realize intelligent and adaptive production.

About The Authors

Jiashi Dong

Lead Author

Email: dongjiashi@qyresearch.com

QYResearch Nanning Branch Analyst, as a member of the QYResearch Semiconductor Equipment and Materials Department, his main research areas include automotive electronics, semiconductor equipment, materials and thermally conductive powders. Some subdivided research topics include automotive diodes, automotive inductors, automotive lidar, radio frequency power supplies, plastic sealing machines, high-purity non-ferrous metals, battery materials, precursors, electroplating equipment, thermal conductive ball aluminum, semiconductor chemical plating solutions, semiconductor coating devices, etc. At the same time, he is also engaged in the development of market segment reports and participates in the writing of customized projects.

About QYResearch

QYResearch founded in California, USA in 2007.It is a leading global market research and consulting company. With over 17 years’ experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability. Up to now, we have cooperated with more than 60,000 clients across five continents. Let’s work closely with you and build a bold and better future.

QYResearch is a world-renowned large-scale consulting company. The industry covers various high-tech industry chain market segments, spanning the semiconductor industry chain (semiconductor equipment and parts, semiconductor materials, ICs, Foundry, packaging and testing, discrete devices, sensors, optoelectronic devices), photovoltaic industry chain (equipment, cells, modules, auxiliary material brackets, inverters, power station terminals), new energy automobile industry chain (batteries and materials, auto parts, batteries, motors, electronic control, automotive semiconductors, etc.), communication industry chain (communication system equipment, terminal equipment, electronic components, RF front-end, optical modules, 4G/5G/6G, broadband, IoT, digital economy, AI), advanced materials industry Chain (metal materials, polymer materials, ceramic materials, nano materials, etc.), machinery manufacturing industry chain (CNC machine tools, construction machinery, electrical machinery, 3C automation, industrial robots, lasers, industrial control, drones), food, beverages and pharmaceuticals, medical equipment, agriculture, etc.

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Semiconductor Manufacturing Equipment Market Size, Cost Structure, Market Status and Forecasts to 2030

Global Semiconductor Manufacturing Equipment Market Size, Share, Trend, Growth and Global Opportunity Analysis and Industry Forecast, 2023-2030.

Overview

The Global Semiconductor Manufacturing Equipment Market  is likely to exhibit steady growth over the forecast period, according to the latest report on Qualiket Research.

Diving compressors are machines that can either fill tanks with breathing gas or supply divers directly via an umbilical. These devices, which can be portable or permanently installed, are powered by electric or gas motors. A diving compressor's main component is typically an air compressor, though it may also include a variety of filters. This is because breathing gas must be exceptionally pure, with no major pollution from carbon monoxide, lubricating oil, or water. A mixing board, which is commonly found in diving compressors, is used to introduce various gasses such as nitrogen or helium to make the Semiconductor Manufacturing Equipment work.

Key Players:

Advantest Corporation

 Applied Materials Inc.

 ASML Holdings N.V

 KLA Corporation

 Lam Research Corporation

 Onto Innovation Inc.

 Plasma-Therm LLC

 SCREEN Holdings Co. Ltd.

 Teradyne Inc.

 Tokyo Electron Limited

Toshiba Corporation

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Market Segmentation

The Global Semiconductor Manufacturing Equipment Market is segmented into Front-end Equipment, Product. By Front-end Equipment such Lithography, Wafer Surface Conditioning, Deposition, Cleaning, Others. Further, market is segmented into By Product such as Memory, Foundry, Logic, MPU, Discrete, Others.

Regional Analysis

Global Semiconductor Manufacturing Equipment Market is segmented into five regions such as North America, Latin America, Europe, Asia Pacific, and Middle East & Africa. Asia Pacific dominated the Semiconductor Manufacturing Equipment market. The semiconductor manufacturing equipment market in Asia is driven by the development of semiconductor devices in Asian economies such as China, Japan, South Korea, and Taiwan. The consumer electronics market is centered on APAC, which is served by various fabrication sites in the region. China, Japan, South Korea, and Taiwan have the most fabrication plants in the world. Favorable economic conditions and low labor costs in APAC are the primary drivers of this market's large share.

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Wafer Processing Equipment In-Depth Profiling With Key Players and Recent Developments, Forecast Period: 2021-2031

Wafer Processing Equipment Market Research, 2031

The global wafer processing equipment market size was $8.5 billion in 2021, and is projected to reach $14.4 billion by 2031, growing at a CAGR of 5.3% from 2022 to 2031. The global wafer processing equipment market is expected to grow rapidly in the coming years. Wafer, also known as substrate, is a thin slice of semiconductor, such as a crystalline silicon germanium and gallium arsenide. A semiconductor is a material with moderate electricity conducting properties. It also has properties such as variable resistance, easy current flow in one direction than the other, and sensitivity to light and heat. These properties make it useful for amplification, switching, and energy conservation. The semiconductors first need to be converted into thin wafers, which can be used in fabrication of integrated circuits, in photovoltaics, to manufacture solar cells. Thus, the importance of wafer in microelecronic devices is the key driver in the growth of the market. Wafers are extensively used in computers, smartphones, laptops, and even in microelectronic devices such as sensors, which ensure the rapid growth of the market throughout the forecast period.

These equipment are used to convert semiconductors such as crystalline silicon germanium, and gallium arsenide into thin round slices, which can be used as a substrate for microelectronic devices. The process includes activities such as formation, texturing, cleaning, dicing and etching. The texturing of wafers is done as per the application of the wafer. For instance, rough textures are created on wafers to be used for solar cells. The increasing use of electronics, has exponentially raised the demand for wafers, which ensures substantial growth of the wafer processing equipment industry throughout the forecast period.

On the basis of process, in 2021 the etch micron segment dominated the wafer processing equipment market, in terms of revenue, and the mass metrology segment is expected to witness growth at the highest CAGR during the forecast period. As per application, in 2021, the dicing segment led the wafer processing equipment market, and the cleaning segment is expected to exhibit highest CAGR in the near future. By end user, the computer segment led the market in 2021, in terms of revenue and the industrial segment is anticipated to register highest CAGR during the forecast period. Region wise, Asia-Pacific garnered the highest revenue in 2021; and is anticipated to register highest CAGR during the forecast period.

COMPETITION ANALYSIS

The major players having significant wafer processing equipment market share profiled in the report are Applied Materials, Inc, DISCO , Hitachi Kokusai Linear, KLA Corporation, Lam Research Corporation, Motorola Solutions, Inc. , Nikon Corporation, Plasma-Therm, SPTS Technologies Ltd. and Tokyo Electron Limited. Major companies in the market have adopted product launch, partnership, business expansion, and acquisition as their key developmental strategies to offer better products and services to customers in the wafer processing equipment market.

Full Report With TOC:-https://www.alliedmarketresearch.com/wafer-processing-equipment-market-A13549

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Wafer Bonding Equipment Market Size, Emerging Trends, Technological Advancements, and Business Strategies 2023-2029

The global Wafer Bonding Equipment market was valued at US$ 316.7 million in 2022 and is projected to reach US$ 461 million by 2029, at a CAGR of 5.5% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

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Wafer bonding equipment is a type of semiconductor processing equipment used to bond two or more wafers together to form a single structure. This process is typically used to create complex semiconductor devices that require multiple layers or different materials.

Wafer bonding can be achieved through various techniques, including thermal compression bonding, adhesive bonding, and direct bonding. The choice of bonding technique depends on the materials being bonded, the required bonding strength, and the desired level of precision.

The equipment used for wafer bonding typically includes a bonding chamber or tool, which provides a controlled environment for the bonding process. The bonding surfaces of the wafers are carefully cleaned and prepared to ensure a strong and uniform bond. The wafers are then aligned and brought into contact with each other under controlled pressure and temperature conditions.

Wafer bonding equipment is commonly used in the manufacturing of advanced semiconductor devices such as micro-electro-mechanical systems (MEMS), power devices, and sensors. The bonding process enables the creation of highly integrated devices with multiple functionalities and improved performance characteristics.

This report aims to provide a comprehensive presentation of the global market for Wafer Bonding Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Bonding Equipment.

This report contains market size and forecasts of Wafer Bonding Equipment in global, including the following market information: Global Wafer Bonding Equipment Market Revenue, 2018-2023, 2024-2029, ($ millions) Global Wafer Bonding Equipment Market Sales, 2018-2023, 2024-2029, (Units) Global top five Wafer Bonding Equipment companies in 2022 (%)

Global key players of wafer bonding equipment include EV Group, SUSS MicroTec, Tokyo Electron, etc. Asia-Pacific is the largest producer of wafer bonding equipment, holds a share over 60%, followed by Europe, and North America. In terms of product, fully automatic is the largest segment, with a share over 80%. And in terms of application, the largest segment is MEMS, with a share about 40%.

We surveyed the Wafer Bonding Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Wafer Bonding Equipment Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units) Global Wafer Bonding Equipment Market Segment Percentages, by Type, 2022 (%)

Fully Automatic

Semi Automatic

Global Wafer Bonding Equipment Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units) Global Wafer Bonding Equipment Market Segment Percentages, by Application, 2022 (%)

MEMS

Advanced Packaging

CIS

Others

Global Wafer-Bonding Equipment Market, by Wafer Size, 2018-2023, 2024-2029 ($ Millions) & (Units) Global Wafer-Bonding Equipment Market Segment Percentages, by Wafer Size, 2022 (%)

4 Inch

6 Inch

8 Inch

12 Inch

Others

Global Wafer-Bonding Equipment Market, by End-User, 2018-2023, 2024-2029 ($ Millions) & (Units) Global Wafer-Bonding Equipment Market Segment Percentages, by End-User, 2022 (%)

Integrated Device Manufacturers (IDMs)

Foundries

Global Wafer-Bonding Equipment Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units) Global Wafer-Bonding Equipment Market Segment Percentages, By Region and Country, 2022 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa​​​​​​​

Competitor Analysis

The report also provides analysis of leading market participants including: Key companies Wafer-Bonding Equipment revenues in global market, 2018-2023 (Estimated), ($ millions) Key companies Wafer-Bonding Equipment revenues share in global market, 2022 (%) Key companies Wafer-Bonding Equipment sales in global market, 2018-2023 (Estimated), (Units) Key companies Wafer-Bonding Equipment sales share in global market, 2022 (%)

Further, the report presents profiles of competitors in the market, key players include:

EV Group

SUSS MicroTec

Tokyo Electron

Applied Microengineering

Nidec Machinetool

Ayumi Industry

Shanghai Micro Electronics

U-Precision Tech

Hutem

Canon

Bondtech

TAZMO

TOK​​​​​​​​​​​​​​​​​​​​​​​​​​​​

Kulicke & Soffa

Market Drivers:

Growing demand for advanced semiconductor devices: The increasing demand for advanced semiconductor devices such as MEMS, power devices, and sensors is driving the growth of the wafer bonding equipment market. Wafer bonding enables the creation of complex devices with multiple layers and improved performance characteristics, which are essential for a wide range of applications.

Technological advancements in wafer bonding techniques: The development of new wafer bonding techniques such as plasma activation bonding, anodic bonding, and hybrid bonding is driving the growth of the wafer bonding equipment market. These techniques offer higher bonding strength, improved precision, and lower processing temperatures, which are essential for the manufacturing of advanced semiconductor devices.

Growing demand for 3D ICs and TSVs: The increasing demand for 3D integrated circuits (ICs) and through-silicon vias (TSVs) is driving the growth of the wafer bonding equipment market. Wafer bonding is a key process in the manufacturing of 3D ICs and TSVs, which offer higher performance, reduced form factor, and lower power consumption.

Rising demand for consumer electronics: The growing demand for consumer electronics such as smartphones, tablets, and wearable devices is driving the growth of the wafer-bonding equipment market. Wafer bonding is a critical process in the manufacturing of these devices, which require complex semiconductor structures and high-performance components.

Increasing investment in semiconductor manufacturing: The increasing investment in semiconductor manufacturing by governments and private companies is driving the growth of the wafer bonding equipment market. This investment is aimed at increasing the production capacity and improving the efficiency of semiconductor manufacturing, which requires advanced wafer-bonding equipment.

Get Full Report @ https://semiconductorinsight.com/report/wafer-bonding-equipment-market/

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Semiconductor Wafer Cleaning Equipment Market Global Industry Analysis, Size, Share, Growth, Trends,

The global Semiconductor Wafer Cleaning Equipment market is estimated to attain a valuation of USD 7.28 bn by the end of 2027, states a study by Transparency Market Research (TMR). Besides, the report notes that the market is prognosticated to expand at a CAGR of 7.7% during the forecast period, 2019-2027.

The key objective of the TMR report is to offer a complete assessment of the global market including major leading stakeholders of the Semiconductor Wafer Cleaning Equipment industry. The current and historical status of the market together with forecasted market size and trends are demonstrated in the assessment in simple manner. In addition, the report delivers data on the volume, share, revenue, production, and sales in the market.

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The report by TMR is the end-product of a study performed using different methodologies including the PESTEL, PORTER, and SWOT analysis. The study with the help of these models shed light on the key financial considerations that players in the Semiconductor Wafer Cleaning Equipment market need to focus on identifying competition and formulate their marketing strategies for both consumer and industrial markets. The report leverages a wide spectrum of research methods including surveys, interviews, and social media listening to analyze consumer behaviors in its entirety.

Semiconductor Wafer Cleaning Equipment Market: Industry Trends and Value Chain

The study on the Semiconductor Wafer Cleaning Equipment market presents a granular assessment of the macroeconomic and microeconomic factors that have shaped the industry dynamics. An in-depth focus on industry value chain help companies find out effective and pertinent trends that define customer value creation in the market. The analysis presents a data-driven and industry-validated frameworks for understanding the role of government regulations and financial and monetary policies. The analysts offer a deep-dive into the how these factors will shape the value delivery network for companies and firms operating in the market.

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Semiconductor Wafer Cleaning Equipment Market: Branding Strategies and Competitive Strategies

Some of the key questions scrutinized in the study are:

What are some of the recent brand building activities of key players undertaken to create customer value in the Semiconductor Wafer Cleaning Equipment market?

Which companies are expanding litany of products with the aim to diversify product portfolio?

Which companies have drifted away from their core competencies and how have those impacted the strategic landscape of the Semiconductor Wafer Cleaning Equipment market?

Which companies have expanded their horizons by engaging in long-term societal considerations?

Which firms have bucked the pandemic trend and what frameworks they adopted to stay resilient?

What are the marketing programs for some of the recent product launches?

The list of key players operating in the Semiconductor Wafer Cleaning Equipment market includes following names:

Modutek Corporation (The U.S.),SCREEN Holdings Co., Ltd. (Japan),Speedline Technologies, Inc. (The U.S.),Lam Research Corporation (The U.S.),Falcon Process Systems (The U.S.),ONBoard Solutions Pty Ltd. (Australia),Cleaning Technologies Group (The U.S.),AP&S International GmbH (Germany), Tokyo Electron Limited (Japan)

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Semiconductor Wafer Cleaning Equipment Market: Assessment of Avenues and Revenue Potential in Key Geographies

Some of the key aspects that the study analyzes and sheds light are:

Which regions are witnessing rise in investments in the supply chain networks?

Which countries seems to have benefitted from recent import and export policies?

Which regions have witnessed decline in consumer demand due to economic and political upheavals?

Which are some the key geographies that are likely to emerge as lucrative markets?

Which regions are expected to lose shares due to pricing pressures?

Which regions leading players are expected to expand their footprints in the near future?

What are some the sustainability trends impacting the logistics and supply chain dynamics in the Semiconductor Wafer Cleaning Equipment market?

What are some of the demographic and economic environments that create new demand in developing economies?

How are changing government regulations shaping business strategies and practices?

About Us Transparency Market Research

Transparency Market Research, a global market research company registered at Wilmington, Delaware, United States, provides custom research and consulting services. The firm scrutinizes factors shaping the dynamics of demand in various markets. The insights and perspectives on the markets evaluate opportunities in various segments. The opportunities in the segments based on source, application, demographics, sales channel, and end-use are analysed, which will determine growth in the markets over the next decade.

Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insights for thousands of decision-makers, made possible by experienced teams of Analysts, Researchers, and Consultants. The proprietary data sources and various tools & techniques we use always reflect the latest trends and information. With a broad research and analysis capability, Transparency Market Research employs rigorous primary and secondary research techniques in all of its business reports.

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[semiconductorsandelectronics]

Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP, Deposition, Wafer Cleaning, Assembly & Packaging, Dicing, Bonding, Metrology, Wafer/IC Testing, Logic, Memory, MPU, Discrete - Global Forecast to 2029

[abhigmi]

Compressed Air Treatment Equipment Market Predicted to Witness Steady Growth by 2030

The global compressed air treatment equipment market is anticipated to register commendable growth, owing to increased efficiency of air compressors through improvements to the equipment lifecycle.

Energy cost is a crucial factor when upgrading an air compressor. These costs account for more than 75% of the compressor's overall life-cycle cost (LCC). Air audits for measuring the total input power are thus essential for the evaluation of the benefits of a new compressor.

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Furthermore, air compressors can be upgraded through the integration of IoT capabilities, and enhancements in controller features. These enhancements result in improved uptime, inputs for maximized operational settings apart from 24x7 remote monitoring, and insights for enhancement in energy efficiency, stimulating market demand.

The compressed air treatment equipment market is bifurcated in terms of product, application, end-user, and region.

Concerning the product, the others segment is expected to depict a CAGR of over 4% over the forecast period. This growth can be accredited to the growing adoption of drain traps, purifiers, and condensate treatment equipment.

In terms of application, the plant air/shop air segment will be worth more than USD 2 billion by 2030. The plant air/shop air is an essential component of the compressed air treatment equipment as it replaces the necessity for purchasing a separate compressor and reduces the overall capital and operating expenses.

Based on end-user, the food & beverage segment is expected to record a CAGR of over 6% through 2030. Air compressors are used in the foods & beverages sector for transporting products across the supply line, handling products, and fluid pumps. These systems filter compressed air for producing nitrogen, thereby meeting all safety regulations for its adoption in the process of food packaging.

The steel segment is anticipated to exhibit a CAGR of more than 6% through 2030. Dry compressed air is crucial in steel manufacturing factories for various purposes such as conveying, molding, welding, coolant supply, feeding metal sheets, ash handling, and controlling carbon content, which may accelerate segmental progress.

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The compressed air treatment equipment market from the electronics segment is expected to depict over 7% CAGR through 2030. This growth can be credited to the increased usage of compressed air in the electronics sector. Air compressor is used by power pneumatic machines for polishing & removing chemical deposits, component conveying, direct production, cleaning PC boards, and for assembling memory chips, circuit boards, LCD panels, and wafers.

Regionally, the Middle East & Africa segment is anticipated to be worth USD 400 million by 2030. The region has witnessed the development of large-scale petrochemical & chemical plants, which have contributed significantly to industry growth. Furthermore, surging development in the healthcare sector will stimulate regional industry growth over the forecasted timeframe.

Table of Contents (ToC) of the report:

Chapter 1   Methodology and Scope

1.1    Methodology

1.2    Base estimation & working

1.2.1    North America

1.2.2    Europe

1.2.3    Asia Pacific

1.2.4    Latin America

1.2.5    Middle East & Africa

1.3    Forecast calculation

1.3.1    COVID-19 impact calculations on industry forecast

1.4    Data sources

1.4.1    Primary

1.4.2    Secondary

1.4.2.1   Paid sources

1.4.2.2   Public sources

Chapter 2   Executive Summary

2.1    Compressed Air Treatment Equipment market 360? synopsis, 2018 – 2030

2.1.1    Business trends

2.1.2    Product trends

2.1.3    Application trends

2.1.4    End-user trends

2.1.5    Regional trends

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HVAC & Construction Research Reports

Air Compressor Market

Window and Door Frame Market

Remodeling Market

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[schaeffersresearch]

Earnings expected from Goodyear Tire & Rubber and DraftKings

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How Much Is The Dicing Tapes Industry Worth?

Transparency Market Research delivers key insights on the dicing tapes market in its published report, which include global industry analysis, size, share, growth, trends, and forecasts for 2019–2027. In terms of revenue, the global dicing tapes market is projected to expand at a CAGR of ~6% during the forecast period, due to several factors, about which, TMR offers detailed insights and forecasts in the dicing tapes market report.

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Dicing Tapes Market: An Overview

The demand for printed circuit boards, integrate circuits (ICs) and other electronic components is high. This can be attributed to end users who consume high-performance compact circuits for various electronic gadgets. Dicing tape finds application in the electronics industry for fixing a piece of work during the dicing process, in the manufacturing of semiconductors & other electronics equipment. This, in turn, is increasing the need for dicing tape across the world. This tape finds application in a wide variety of applications, including silicon and GaAs semiconductors, encapsulated package substrates, glass, ceramics, and crystals. Dicing tape is crucial for the full-cut dicing of wafers to improve die quality.

Dicing Tapes Market: Application in Glass Wafers to Provide High Accuracy Cutting

Technological advancements and high demand for aesthetically thin electronic products have led to the reduction in wafer thickness. Wafer processing companies prefer materials with high adhesive strength for the dicing process and UV curable tapes. For delicate wafers, it is essential to eliminate negative charges during back-grinding and dicing processes. Currently, common applications of UV dicing tape and non-UV dicing tape are in ICs, EMC package substrates, QFN (quad flat no-leads) & PCBs (printed circuit boards), Si wafers, ceramics, glass, lenses, and others.

Glass wafers find application in bio ID devices, cell phone cameras, CCD & IR camera windows, and IR cut-off filters, which is increasing at a significant rate. Dicing tape is used during glass wafer dicing processes to reduce damage, shorten process time, and provide high accuracy cutting. Therefore, the dicing tapes market is expected to witness outstanding growth during the forecast period.

High Sales Accompanied by Outstanding Growth Opportunities in Asia Pacific

Manufacturers of dicing tape have a strong market presence in China, Taiwan, and Japan. However, these players are expected to expand their presence in other regions too, such as Europe and the Americas, due to the presence of developed manufacturing industries in these regions. With a budding electronics consumables industry, along with advanced technology, China is anticipated to remain at the top in the dicing tapes market.

Tier 1 manufacturers operating in the industrial electronics industry have sited a sharp increase in demand from South Korea, China, and Taiwan. This will further fuel the growth of the dicing tapes market, globally. Moreover, the size of chips or ICS in electronic devices has reduced due to technological advancements. This is escalating the demand for dicing tape among IC manufacturers. Increasing demand for electronic durables is expected to boost the demand for semiconductors. Wafer dicing tape that is backed with PVC material and synthetic acrylic adhesives has high tear strength and elongation as compared to other tapes. Manufacturers of UV dicing tape are continuously developing new materials with enhanced properties such as high adhesion levels and easy peel-off for clean removal. For instance, raw material suppliers such as Henkel Corporation developed acrylic adhesive materials that decrease rapidly on exposure to UV light.

Global Dicing Tapes Market: Competition Landscape

Key company profiles of major participants in the dicing tapes market are incorporated in the report to analyze the recent key developments, product offerings, financials, and strategies adopted to survive in the market. Manufacturers in the dicing tapes market are extending their scope of products and increasing the number of manufacturing facilities.

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Some of the key players operating in the global dicing tapes market are Nitto Denko Corp, Mitsui Chemicals Inc., Sumitomo Bakelite Co. Ltd., AI Technology, Inc., LINTEC Corporation, Denka Company Limited, Ultron Systems, Inc., Pantech Tape Co. Ltd., QES GROUP BERHAD, Nippon Pulse Motor Taiwan, Loadpoint Limited., Daest Coating India Pvt. Ltd., Shenzhen Xinst Technology Co. Ltd, and Solar Plus Company.

Global Dicing Tapes Market: Classification

Dicing Tapes Market by Product

UV     Curable Dicing Type

Non-UV     Curable Dicing Type

Dicing Tapes Market by Backing Material

Polyvinyl     Chloride

PET

Polyolefin

Others     (EVA, etc.)

Dicing Tapes Market by Thickness

Below     85 Microns

85-125     Microns

126-150     Microns

Above     150 Microns

Dicing Tapes Market by Coating

Single-sided

Double-sided

Dicing Tapes Market by Application

Wafer     Dicing

Package     Dicing

Others     (Glass, Ceramics)

Dicing Tapes Market by Region

North     America

Latin     America

Europe

Asia     Pacific

Middle     East & Africa

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About Us

Transparency Market Research is a global market intelligence company, providing global business information reports and services. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insight for thousands of decision makers. Our experienced team of Analysts, Researchers, and Consultants, use proprietary data sources and various tools and techniques to gather, and analyse information. Now avail flexible Research Subscriptions, and access Research multi-format through downloadable databooks, infographics, charts, interactive playbook for data visualization and full reports through MarketNgage, the unified market intelligence engine. Sign Up for a 7 day free trial!

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[spookysaladchaos]

Global Top 5 Companies Accounted for 71% of total Semiconductor Electroplating Systems (Plating Equipment) market (QYResearch, 2021)

Semiconductor electroplating refers to the electroplating of metal ions in the electroplating solution onto the wafer surface to form metal interconnects during the chip manufacturing process. As the chip manufacturing process becomes more and more advanced, the interconnect lines in the chip begin to shift from traditional aluminum materials to copper materials, and semiconductor copper plating equipment is widely used. At present, semiconductor electroplating is not limited to the deposition of copper wires, but also metals such as tin, tin-silver alloys, nickel, and gold, but the deposition of metallic copper still dominates.

Semiconductor electroplating equipment can deposit a layer of dense, no holes, no gaps and other defects on the wafer, and evenly distributed copper, and then equipped with vapor deposition equipment, etching equipment, cleaning equipment, etc., to complete the copper interconnection process. The electroplating process is used to deposit metallized films of metals such as copper, nickel, tin, silver, and gold in three-dimensional through-silicon vias, rewiring, bumps, and other processes.

According to the new market research report “Global Semiconductor Electroplating Systems (Plating Equipment) Market Report 2023-2029”, published by QYResearch, the global Semiconductor Electroplating Systems (Plating Equipment) market size is projected to reach USD 0.87 billion by 2029, at a CAGR of 7.5% during the forecast period.

Figure.   Global Semiconductor Electroplating Systems (Plating Equipment) Market Size (US$ Million), 2018-2029

Figure.   Global Semiconductor Electroplating Systems (Plating Equipment) Top 14 Players Ranking and Market Share (Ranking is based on the revenue of 2022, continually updated)

The global key manufacturers of Semiconductor Electroplating Systems (Plating Equipment) include Lam Research, Applied Materials, ASM Pacific Technology, ACM Research, EBARA, Hitachi, TKC, Besi (Meco), ClassOne Technology, Ramgraber GmbH, etc. In 2022, the global top five players had a share approximately 71.0% in terms of revenue.

About QYResearch

QYResearch founded in California, USA in 2007.It is a leading global market research and consulting company. With over 16 years’ experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability. Up to now, we have cooperated with more than 60,000 clients across five continents. Let’s work closely with you and build a bold and better future.

QYResearch is a world-renowned large-scale consulting company. The industry covers various high-tech industry chain market segments, spanning the semiconductor industry chain (semiconductor equipment and parts, semiconductor materials, ICs, Foundry, packaging and testing, discrete devices, sensors, optoelectronic devices), photovoltaic industry chain (equipment, cells, modules, auxiliary material brackets, inverters, power station terminals), new energy automobile industry chain (batteries and materials, auto parts, batteries, motors, electronic control, automotive semiconductors, etc.), communication industry chain (communication system equipment, terminal equipment, electronic components, RF front-end, optical modules, 4G/5G/6G, broadband, IoT, digital economy, AI), advanced materials industry Chain (metal materials, polymer materials, ceramic materials, nano materials, etc.), machinery manufacturing industry chain (CNC machine tools, construction machinery, electrical machinery, 3C automation, industrial robots, lasers, industrial control, drones), food, beverages and pharmaceuticals, medical equipment, agriculture, etc.

For more information, please contact the following e-mail address:

Email: global@qyresearch.com

Website: https://www.qyresearch.com

[technologyreportaanalyis]

Semiconductor Manufacturing Industry Research Report - Global Forecast to 2030

Global Semiconductor Production Equipment Market - Overview

The semiconductor production equipment market is garnering substantial traction across the globe. The market growth is attributed to rapid industrialization and economic growth.  Besides, large technological advances in telemetry solutions and semiconductor products push the growth of the market.  Information and communication industries worldwide are creating a significant demand for semiconductor production equipment.  Moreover, rising usages of chips in smart meters, plug-in electric vehicles, solar panels, wind turbines, and others accelerate the market demand.

In its recent analysis, Market Research Future (MRFR) asserts that the global Semiconductor Production Equipment Market valuation is poised to reach approx. USD 63 BN by 2023, growing approximately at 7% CAGR during the assessment period (2017-2023). The rising trend of additive manufacturing (AM), 3D printing, and computer-controlled processes boosts market growth.

Semiconductors have transformed the patterns of generation, distribution, and consumption of energy across the industries. Additive manufacturing has changed the supply chain from the production of parts to higher performance using subtractive methods. Hence, innovative designs enable agile supply chains to adopt Industry 4.0 principles. Additionally, increasing R&D investments to develop new metal alloys designs and technologies.

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Semiconductor products have transformed the process of generation, distribution, and consumption of energy. Additive manufacturing allows the transformation of the supply chain from production of parts manufactured by subtractive methods, to higher performance, innovative designs that enable agile supply chains to adopt Industry 4.0 principles. Additionally, increasing investments to develop new metal alloys designs and technologies

Increasing uptake of GaAs technology in Field Effect Transistors (FET) and integrated circuits (ICs) for high velocity and high electric field applications pushes the growth of the market. On the other hand, the high manufacturing cost of semiconductor production equipment is a significant factor projected to impede market growth. Nevertheless, growing usages of semiconductor equipment in power amplifiers for transmitting high-speed signals, ultra-high radio frequency, and fast electronic switching applications would support the market growth throughout the forecast period.

Semiconductor Production Equipment Market – Segments

The report is segmented into four dynamics;

By Equipment Type    : Front-End Equipment, Backend Equipment, and others.

By Products               : Dicing Machine, Probing Machines, Sliced Wafer Demounting, Cleaning Machine, Wafer Edge Grinding Machine, Polish Grinders, and others.

By Dimension             : 2D, 5D, 3D, and others.

By Regions                             :  North America, Europe, APAC and the Rest-of-the-World.

Global Semiconductor Production Equipment Market – Regional Analysis

North America dominates the global semiconductor production equipment market. The market growth attributes to the due to the presence of notable industry players producing the chips and technological advances required to manufacture semiconductor products. Besides, the proliferation of semiconductor production equipment in the region drives the growth of the market.

Moreover, the rising usages of photovoltaic, optoelectronic, and wireless communication devices boost the demand in the semiconductor manufacturing equipment market. The North American semiconductor production equipment market is projected to retain its dominance throughout the estimated period.

Europe is another lucrative market for semiconductor production equipment. The market growth is driven by the spurring growth in the solar cells, automotive, electronics, and aerospace & defense sectors. Additionally, the need for a safe, reliable, and clean energy source in various countries influences the regional market's growth, driving the solar cell industry. Germany and the UK are well-established semiconductor production equipment markets in the region. The European semiconductor production equipment market is expected to witness rapid growth in the upcoming period.

The semiconductor production equipment market in the Asia Pacific demonstrates steady growth. Factors such as the rising numbers of smartphone users and the increasing demand for technological advances in gadgets such as computers, laptops, and smartphones foster regional market growth. Besides, the proliferating electronics sector in the region creates substantial market demand. Moreover, rising government support and funding by industry players promote the usages of semiconductor production equipment.

China, Japan, South Korea, and India have emerged as key markets for semiconductor production equipment in the region, growing at an impressive CAGR. Companies in the APAC take an interest in producing semiconductor production equipment to meet the changing customer demand. Cumulatively, these factors drive the growth of the regional market. The APAC semiconductor production equipment market is expected to demonstrate moderate growth during the forecast period.

Semiconductor Production Equipment Market - Competitive Landscape

Highly competitive, the global semiconductor production equipment market appears fragmented due to the presence of many players. To gain a larger competitive advantage, players incorporate strategic initiatives such as mergers & acquisitions, expansion, collaboration, and product/ technology launch.

These players invest substantially to transform the consumer and business landscape. Also, industry players make substantial R&D investments in developing the product and

technology. To widen their reach t customers, they offer discount offers, such as the end of season sale offerings.

Major Players:

Players leading the semiconductor production equipment market include Micron Technology Inc. (US), Qualcomm Technologies, Inc. (US), Intel Corporation (US), AlsilMaterial (US), Applied Materials Inc. (US), Atecom Technology Co., Ltd (Taiwan), LAM RESEARCH Corporation (US), Tokyo Electron Limited (Japan), KLA-Tencor Corporation (US), Teradyne Inc. (US), Screen Holdings Co., Ltd (Japan), Samsung Group (South Korea), and ASML Holdings NV (Netherlands), among others.

Industry/ Innovation/Related News

August 05, 2020 ---- Lam Research Corporation (the US), a leading semiconductor product company, announced signing a strategic agreement with a US-based metal additive manufacturing (AM) solution provider - VELO3D Inc. (the US) to use metal AM applications for the production of semiconductor capital equipment.

The joint development agreement includes collaboration on novel materials and designs in metal additive manufacturing (AM)/3D printing applications for the semiconductor sector. LAM also plans to increase the volume of parts produced by AM over the next five years.

Lam Research engages in the design, manufacture, marketing, and service of semiconductor processing equipment used to fabricate integrated circuits. It leverages additive manufacturing as a driver of the innovation that enables its customers to build faster, robust, and more power-efficient electronic devices for everyday use.

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MRFR team have supreme objective to provide the optimum quality market research and intelligence services to our clients. Our market research studies by products, services, technologies, applications, end users, and market players for global, regional, and country level market segments, enable our clients to see more, know more, and do more, which help to answer all their most important questions.

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