#Thin Film Chip Resistor

[futureelectronic1059]

Panasonic's ERA-xV Thin Film Chip Resistors feature a soft terminal and passivated layer. They are manufactured with a gold inner terminal and soft outer terminal that makes them highly reliable and stable when faced with both high temperature and high humidity.

[futureelectronic1527]

https://www.futureelectronics.com/resources/featured-products/panasonic-test-and-measurement-solutions. Panasonic's ERA-xV Thin Film Chip Resistors feature a soft terminal and passivated layer. They are manufactured with a gold inner terminal and soft outer terminal that makes them highly reliable and stable when faced with both high temperature and high humidity. https://youtu.be/exilJ8KBBpU

[martech360]

Semiconductor Chips Explained: Different Types and Their Uses

In today’s fast-paced technological landscape, there is a growing demand for faster and more efficient devices. This need, however, brings a significant challenge: balancing cost and energy consumption while enhancing the performance and functionality of electronic gadgets.

Introduction to Semiconductor Chips

Semiconductor chips are crucial in this regard. The global semiconductor market is projected to reach $687 billion by 2025, showcasing the transformative impact of these chips across various sectors, from computers and smartphones to advanced AI systems and IoT devices. Let's delve deeper into this billion-dollar industry.

What Is A Semiconductor Chip?

A semiconductor chip, also known as an integrated circuit or computer chip, is a small electronic device made from semiconductor materials like silicon. It contains millions or even billions of transistors, which are tiny electronic components capable of processing and storing data.

These chips are the backbone of modern technology, found in a vast array of electronic devices including computers, smartphones, cars, and medical equipment. Manufacturing semiconductor chips involves a complex, multi-step process that includes slicing silicon wafers, printing intricate circuit designs, and adding multiple layers of components and interconnects. Leading companies in the semiconductor industry include Samsung, TSMC, Qualcomm, Marvell, and Intel.

Types of Semiconductor Chips

Memory Chips

Function: Store data and programs in computers and other devices.

Types:

RAM (Random-Access Memory): Provides temporary workspaces.

Flash Memory: Stores information permanently.

ROM (Read-Only Memory) and PROM (Programmable Read-Only Memory): Non-volatile memory.

EPROM (Erasable Programmable Read-Only Memory) and EEPROM (Electrically Erasable Programmable Read-Only Memory): Can be reprogrammed.

Microprocessors

Function: Contain CPUs that power servers, PCs, tablets, and smartphones.

Architectures:

32-bit and 64-bit: Used in PCs and servers.

ARM: Common in mobile devices.

Microcontrollers (8-bit, 16-bit, and 24-bit): Found in toys and vehicles.

Graphics Processing Units (GPUs)

Function: Render graphics for electronic displays, enhancing computer performance by offloading graphics tasks from the CPU.

Applications: Modern video games, cryptocurrency mining.

Commodity Integrated Circuits (CICs)

Function: Perform repetitive tasks in devices like barcode scanners.

Types:

ASICs (Application-Specific Integrated Circuits): Custom-designed for specific tasks.

FPGAs (Field-Programmable Gate Arrays): Customizable after manufacturing.

SoCs (Systems on a Chip): Integrate all components into a single chip, used in smartphones.

Analog Chips

Function: Handle continuously varying signals, used in power supplies and sensors.

Components: Include transistors, inductors, capacitors, and resistors.

Mixed-Circuit Semiconductors

Function: Combine digital and analog technologies, used in devices requiring both types of signals.

Examples: Microcontrollers with ADCs (Analog-to-Digital Converters) and DACs (Digital-to-Analog Converters).

Manufacturing Process of Semiconductor Chips

Semiconductor device fabrication involves several steps to create electronic circuits on a silicon wafer. Here’s an overview:

Wafer Preparation: Silicon ingots are shaped and sliced into thin wafers.

Cleaning and Oxidation: Wafers are cleaned and oxidized to form a silicon dioxide layer.

Photolithography: Circuit patterns are transferred onto wafers using UV light and photoresist.

Etching: Unwanted material is removed based on the photoresist pattern.

Doping: Ions are implanted to alter electrical properties.

Deposition: Thin films of materials are deposited using CVD or PVD techniques.

Annealing: Wafers are heated to activate dopants and repair damage.

Testing and Packaging: Finished wafers are tested, diced into individual chips, and packaged for protection.

Conclusion

Semiconductor chips are fundamental to the functionality of nearly every electronic device we use today. They have revolutionized technology by enabling faster, smaller, and more powerful devices. While the semiconductor industry has fueled job creation and economic growth, it also faces challenges related to sustainability and environmental impact. As we continue to push the boundaries of innovation, ethical practices are essential to ensure semiconductors remain vital to our modern world and shape our future.

[suvsystemltd]

Different types of chip resistors

Here are the types of Chip resistors

Thin Film Resistors: These are made by depositing a thin resistive film on a ceramic substrate. They offer high precision and stability, suitable for precise applications.

Thick Film Resistors: Unlike thin film resistors, thick film resistors have a thicker resistive layer. They are cost-effective and widely used in general-purpose applications.

Metal Film Resistors: These resistors have a metal film deposited on a ceramic rod. They provide better stability and accuracy compared to carbon film resistors.

Carbon Film Resistors: In carbon film resistors, a thin film of carbon is deposited onto a ceramic rod. They are inexpensive and commonly used in consumer electronics.

Metal Oxide Resistors: Metal oxide resistors are made by depositing a metal oxide film on a ceramic substrate. They offer high power handling capabilities and stability at high temperatures.

Wirewound Resistors: These resistors consist of a wire wound around a ceramic or fiberglass core. They provide high precision and are suitable for high-power applications.

Network Resistors: These are combinations of multiple resistors in a single package. They offer convenience in circuit design by providing multiple resistance values in one component.

[futureelectronic1059]

ERA-xV Thin Film Chip Resistors from Panasonic

https://www.futureelectronics.com/resources/featured-products/panasonic-test-and-measurement-solutions. Panasonic's ERA-xV Thin Film Chip Resistors feature a soft terminal and passivated layer. They are manufactured with a gold inner terminal and soft outer terminal that makes them highly reliable and stable when faced with both high temperature and high humidity. https://youtu.be/exilJ8KBBpU

[lanshengic]

The latest chip industry information collected by Lansheng Technology

1. Infineon: Power device inventory pressure is high

The Aurix TC2XX series of automotive MCUs are booming in the market recently, and some models are hard to find. Demand for power devices has been sluggish recently, and inventory pressure is extremely high, but high-voltage MOS continues to be in short supply. The delivery period of the TLE series is maintained at about 50 weeks. The popularity and price of TLE8082ESXUMA1 suddenly rose in April.

2. #Vishay: Significant drop in demand

Vishay's near-term demand is mainly for components with long and volatile lead times, such as thin-film resistors, MOSFETs, and optocouplers. After February, inquiries for shortages dropped a lot, and so did customer acceptance.

Given that Vishay will join this year's CMSE, they may want to expand more in the field of military and space electronics. For future markets, it is recommended to seek more PPV opportunities.

3. #Lattice: LFXP2 series delivery ahead of schedule

The demand for Lattice is sluggish this month, the current inventory level is under pressure, the market price has dropped significantly, and the prices of many conventional models have returned to normal levels, such as: LCMX02-640HC-4TG100C/LCMX03LF-2100C-5BG256C/LCMX03LF-2100C-5BG256C, etc. The delivery period of LFXP2 series is about 12-16 weeks earlier than the previous 52-week delivery period, and other series have not seen significant improvement. However, it can be foreseen that shortening the delivery period of other series is only a matter of time.

Lansheng Technology Limited (https://www.lanshengic.com/) is a global distributor of electronic components that has been established for more than 10 years, headquartered in Shenzhen China, who mainly focuses on electronic spot stocks.