#Semiconductor Front-end Equipment Market
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Semiconductor Front-end Equipment Market Prominent Regions, Drivers, and Prospects 2032
Semiconductor front-end equipment refers to the tools and technologies used in the initial stages of semiconductor manufacturing, where raw materials are transformed into semiconductor wafers. This phase includes critical processes such as ion implantation, chemical vapor deposition (CVD), etching, and photolithography. The front-end process is foundational for semiconductor production, as it lays the groundwork for the creation of high-performance devices.
As the demand for advanced semiconductor devices grows, manufacturers are investing in cutting-edge front-end equipment to enhance yield, precision, and scalability. The rapid advancement of technologies such as 5G, AI, and IoT has accelerated the need for innovative front-end solutions that can accommodate increasingly complex chip designs. This evolution is essential for maintaining competitiveness in a fast-paced industry.
The Semiconductor Front-End Equipment Market is witnessing significant growth, driven by advancements in wafer fabrication technologies and increasing demand for integrated circuits. Innovations in processing equipment, including etching and deposition technologies, are enhancing efficiency and precision in semiconductor manufacturing, supporting the development of next-generation devices.
Future Scope
The future of semiconductor front-end equipment is bright, with significant growth anticipated in the coming years. The ongoing transition toward smaller, more efficient devices will drive the demand for advanced front-end solutions capable of supporting these innovations. As semiconductor technology evolves, manufacturers will increasingly focus on developing equipment that can handle advanced materials and fabrication techniques.
Moreover, the rise of emerging technologies, such as quantum computing and neuromorphic chips, will create new opportunities for front-end equipment suppliers. These cutting-edge applications will require specialized equipment capable of addressing unique manufacturing challenges. As industries continue to explore new frontiers in semiconductor technology, the demand for versatile and high-performance front-end solutions will remain strong.
Trends
Key trends influencing the semiconductor front-end equipment market include the growing emphasis on automation and artificial intelligence. Manufacturers are increasingly adopting automated processes to improve efficiency and reduce operational costs. The integration of AI-driven solutions into front-end operations is also enhancing decision-making capabilities, enabling more precise control over manufacturing parameters.
Another significant trend is the development of advanced materials, such as 2D materials and new dielectrics, which require specialized front-end equipment for processing. As the industry explores these new materials, manufacturers must adapt their equipment to accommodate different fabrication techniques and ensure high-quality production.
Application
Semiconductor front-end equipment is utilized in a wide range of applications across various sectors, including consumer electronics, automotive, telecommunications, and industrial electronics. In consumer electronics, front-end processes are critical for producing high-performance chips used in smartphones, tablets, and wearable devices. The need for compact, powerful chips in these products drives continuous innovation in front-end manufacturing.
In the automotive sector, front-end equipment is essential for producing semiconductor devices that support advanced driver-assistance systems (ADAS), electric vehicles, and infotainment systems. As vehicles become more connected and automated, the reliability and performance of semiconductor devices are crucial for ensuring safety and efficiency. The increasing complexity of automotive electronics calls for advanced front-end equipment capable of handling the specific requirements of automotive-grade semiconductors.
In telecommunications, front-end equipment plays a vital role in manufacturing components for network infrastructure, facilitating high-speed data transmission and connectivity. The shift toward 5G technology further amplifies the demand for high-performance front-end solutions that can support the increased data rates and lower latency requirements of modern communication networks. This transition is driving investments in advanced fabrication technologies and equipment that can keep pace with the rapid evolution of the telecommunications landscape.
Furthermore, in industrial electronics, front-end equipment is integral to producing semiconductors used in automation, robotics, and control systems. As industries strive for greater efficiency and productivity through digital transformation, the need for reliable and high-performance semiconductor devices becomes paramount. Advanced front-end manufacturing processes ensure that these devices meet the stringent performance standards required for industrial applications.
Key Points
Refers to the tools and technologies used in the initial stages of semiconductor manufacturing.
Essential for transforming raw materials into high-performance semiconductor wafers.
Promising future with growth driven by advanced technologies and miniaturization trends.
Trends include automation, AI integration, and the use of advanced materials.
Applied across consumer electronics, automotive, telecommunications, and industrial electronics sectors.
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Global top 13 companies accounted for 66% of Total Frozen Spring Roll market(qyresearch, 2021)
The table below details the Discrete Manufacturing ERP revenue and market share of major players, from 2016 to 2021. The data for 2021 is an estimate, based on the historical figures and the data we interviewed this year.
Major players in the market are identified through secondary research and their market revenues are determined through primary and secondary research. Secondary research includes the research of the annual financial reports of the top companies; while primary research includes extensive interviews of key opinion leaders and industry experts such as experienced front-line staffs, directors, CEOs and marketing executives. The percentage splits, market shares, growth rates and breakdowns of the product markets are determined through secondary sources and verified through the primary sources.
According to the new market research report “Global Discrete Manufacturing ERP Market Report 2023-2029”, published by QYResearch, the global Discrete Manufacturing ERP market size is projected to reach USD 9.78 billion by 2029, at a CAGR of 10.6% during the forecast period.
Figure. Global Frozen Spring Roll Market Size (US$ Mn), 2018-2029
Figure. Global Frozen Spring Roll Top 13 Players Ranking and Market Share(Based on data of 2021, Continually updated)
The global key manufacturers of Discrete Manufacturing ERP include Visibility, Global Shop Solutions, SYSPRO, ECi Software Solutions, abas Software AG, IFS AB, QAD Inc, Infor, abas Software AG, ECi Software Solutions, etc. In 2021, the global top five players had a share approximately 66.0% in terms of revenue.
About QYResearch
QYResearch founded in California, USA in 2007.It is a leading global market research and consulting company. With over 16 years’ experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability. Up to now, we have cooperated with more than 60,000 clients across five continents. Let’s work closely with you and build a bold and better future.
QYResearch is a world-renowned large-scale consulting company. The industry covers various high-tech industry chain market segments, spanning the semiconductor industry chain (semiconductor equipment and parts, semiconductor materials, ICs, Foundry, packaging and testing, discrete devices, sensors, optoelectronic devices), photovoltaic industry chain (equipment, cells, modules, auxiliary material brackets, inverters, power station terminals), new energy automobile industry chain (batteries and materials, auto parts, batteries, motors, electronic control, automotive semiconductors, etc.), communication industry chain (communication system equipment, terminal equipment, electronic components, RF front-end, optical modules, 4G/5G/6G, broadband, IoT, digital economy, AI), advanced materials industry Chain (metal materials, polymer materials, ceramic materials, nano materials, etc.), machinery manufacturing industry chain (CNC machine tools, construction machinery, electrical machinery, 3C automation, industrial robots, lasers, industrial control, drones), food, beverages and pharmaceuticals, medical equipment, agriculture, etc.
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Front-end and back-end equipment make up the two segments of the semiconductor manufacturing equipment market.
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Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to set a new industry record, reaching $109 billion in 2024, growing 3.4% year-on-year, SEMI announced today in its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON West 2024. Semiconductor manufacturing equipment growth is expected to continue in 2025, with sales forecast to set a new high of $128 billion in 2025, driven by both the front-end and back-end segments.
“The growth in total semiconductor manufacturing equipment sales already underway this year is forecast to be followed by a robust expansion of roughly 17% in 2025,” said Ajit Manocha, SEMI president and CEO. “The global semiconductor industry is demonstrating its strong fundamentals and growth potential supporting the diverse range of disruptive applications emerging from the Artificial Intelligence wave.”
Semiconductor Equipment Sales by Segment
After registering a record $96 billion in sales last year, the wafer fab equipment segment, which includes wafer processing, fab facilities and mask/reticle equipment, is projected to increase 2.8% to $98 billion in 2024. This marks a notable increase from the previously forecasted $93 billion in SEMI’s 2023 Year-End Equipment Forecast. Ongoing strong equipment spending in China and substantial investments in DRAM and HBM, driven by AI computing, drove the upward revision. Looking ahead to 2025, Wafer fab equipment segment sales are projected to expand 14.7%, reaching $113 billion due to increased demand for advanced logic and memory applications.
Following two years of contraction caused by challenging macroeconomic conditions and softening semiconductor demand, the back-end equipment segment is anticipated to start its recovery in the second half of 2024. Specifically, sales of semiconductor test equipment are projected to rise 7.4% to $6.7 billion in 2024, while assembly and packaging equipment sales are predicted to increase 10.0% to $4.4 billion in the same year. Furthermore, back-end segment growth is expected to accelerate in 2025, with test equipment sales surging 30.3% and assembly and packaging sales increasing 34.9%. The segments’ growth is supported by the increasing complexity of semiconductor devices for high-performance computing and the expected recovery in demand for automotive, industrial, and consumer electronics end-markets. Additionally, back-end growth is expected to increase over time to process ramping supply from new front-end fabs.
Wafer Fab Equipment (WFE) Sales by Application
The sales of Wafer Fab equipment for foundry and logic applications are expected to show a moderate contraction of 2.9% year-over-year to $57.2 billion in 2024 as a result of softening in demand for mature nodes and higher than expected sales for advanced nodes in the previous year. The segment is forecast to grow 10.3% in 2025 to $63.0 billion, driven by increasing demand for leading-edge technology, the introduction of new device architectures, and increased capacity expansion purchases.
Memory-related capital expenditures are projected to see the most significant increase in 2024 and demonstrate continued growth in 2025. NAND equipment sales are expected to remain relatively stable in 2024, with a 1.5% increase to $9.35 billion, as supply and demand normalize, setting the stage for a 55.5% expansion to $14.6 billion in 2025. Meanwhile, DRAM equipment sales are projected to grow strongly at 24.1% and 12.3% in 2024 and 2025, respectively, supported by surging demand for high-bandwidth memory (HBM) for AI deployment and ongoing technology migration.
Semiconductor Equipment Sales by Region
China, Taiwan and Korea are expected to remain the top three destinations for equipment spending through 2025. China is projected to maintain the top position over the forecast period as the region’s equipment purchases continue to rise. Equipment shipments to China are projected to exceed a record $35 billion in 2024, solidifying its lead over other regions. While equipment spending for some regions is expected to fall in 2024 before rebounding in 2025, China is expected to see a contraction in 2025 following significant investments over the past three years.
The SEMI forecast is based on collective input from top equipment suppliers, the SEMI Worldwide Semiconductor Equipment Market Statistics (WWSEMS) data collection program and the industry-recognized SEMI World Fab Forecast database.
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Future Outlook: Anticipated Surge in PMIC Market Value to US$ 41.2 Billion by 2027
The Power Management Integrated Circuit (PMIC) Market is likely to surge at a vigorous 6.6% CAGR during the assessment period 2022 – 2027 and is anticipated to progress at a CAGR of 6.6% to reach US$ 28.1 Bn in 2022 and US$ 41.2 Bn by 2027.
Rising sales of smart devices across the globe
Growing energy harvesting initiatives
Introduction of compact and high-efficiency PMICs
Ongoing industrial automation and vehicle electrification
The FMI study finds that demand for power management integrated circuit (PMIC) in communication equipment application is projected to grow at a higher rate. In 2019, PMIC application in communication equipment is expected to grow at 8.5% y-o-y. The projected growth can be attributed to buoyancy in the telecommunication industry owing to increasing demand for connectivity and adoption of communication equipment starting from analogue switches to smartphones to communication satellites.
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Personal Electronics Application Registers Leading Revenues
The FMI study finds that demand for power management integrated circuit (PMIC) remains higher in personal electronics devices. In 2018, sales of power management integrated circuit garnered revenues worth over US$ 5.7 billion in 2018 and held 27% of the global PMIC market share. The demand trend in personal electronics application is expected to continue in 2019 at the rate of 6.6% y-o-y.
A plethora of personal electronics devices and their rising adoption rate in the wake of increasing millennial population, expansion of middle class and increased purchase capacity are factors responsible for the increasing demand for power management integrated circuit (PMIC) in personal electronics application. In addition, manufacturers in the consumer electronics industry highly utilize PMIC to optimize energy consumption in compact devices.
Industrial application of power management integrated circuit (PMIC) registered second highest revenues and accounted for over one-fifth of the market revenues in 2018. Demand for power management integrated circuit (PMIC) in an automotive sector closely follows revenues in industrial application.
PMIC Marketplace Moderately Consolidated
Leading players in the power management integrated circuit (PMIC) marketplace share considerable revenues. Texas Instruments, STMicroelectronics, NXP Semiconductors N.V., ON Semiconductor Corporation and Analog Devices, Inc. are prominent market players, of which ON Semiconductor is the front runner.
Small and mid-sized players are leveraging strategies such as introduction of low-priced products to establish a stronghold in the domestic market. Increasing revenues of these players are eating into the shares of prominent PMIC market players.
APEJ Revenues Continue to Surge
The FMI study finds that APEJ continues to register leading position in the power management integrated circuit (PMIC) market. In 2018, over two-fifth of the PMIC market revenues were accounted for APEJ region, of which over 67% share was registered from China and India.
The region presents significant growth of the end-user industries of the power management integrated circuit (PMIC) market, thereby garnering leading revenues.
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The FMI study finds that North America continues to register the second leading position in the power management integrated circuit (PMIC) market. In 2018, over one-fourth of the PMIC market revenues were accounted for the North America region, of which over 81% share was registered from the U.S.
Across the globe, increasing energy harvesting initiatives and their penetration in the semiconductor industry has generated lucrative opportunities for power management integrated circuit (PMIC) market. As the global demand for electricity rises and the world enters the era of IoT and digitalization, demand for power management integrated circuit (PMIC) is set to rise in the coming years.
Power Management Integrated Circuit (PMIC) Market Survey by Category By Application:
Automotive
Communication Equipment
Enterprise Systems
Industrial
Personal Electronics
Region:
North America
Latin America
APEJ
Japan
Eastern Europe
Western Europe
Middle East & Africa (MEA)
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Overview of Singapore's Top Manufacturing Industry Players.
Introduction:
Singapore is widely recognized as a global manufacturing hub, with its strategic location, cutting-edge infrastructure, and business-friendly environment attracting some of the world's leading companies. In this blog section, we will provide an overview of Singapore's top manufacturing industry players, shedding light on their contributions to the nation's economy and their respective areas of expertise.
1. Singapore Manufacturing Federation (SMF):
As the national body representing the manufacturing industry in Singapore, the Singapore Manufacturing Federation (SMF) plays a pivotal role in promoting the interests of manufacturers while driving innovation and productivity. With more than 3,000 members comprising both multinational corporations and small-to-medium-sized enterprises, SMF serves as an influential platform for networking, business collaboration, and knowledge exchange.
2. Electronics Manufacturing:
The electronics manufacturing sector is a significant player in Singapore's manufacturer landscape, contributing significantly to the nation's export revenue. Renowned global companies such as Dell, Hewlett Packard Enterprise, and Flextronics have established a strong presence in Singapore, leveraging the country's advanced infrastructure and skilled workforce.
Furthermore, Singapore is also home to several local electronics manufacturing companies that have made their mark. One such prominent player is Venture Corporation Limited, a leading global provider of technology and manufacturing services. Known for its expertise in complex electronic products and life sciences instruments, Venture Corporation has remained at the forefront of the industry.
3. Precision Engineering:
Singapore's precision engineering sector is another pillar of the manufacturing industry in the country. With a focus on producing high-precision components and tools, the precision engineering companies here have gained global recognition for their advanced capabilities. One notable player is UMS Holdings Limited, a manufacturer of high-precision front-end semiconductor components. UMS Holdings has built a reputation for excellence, supplying critical components to major semiconductor equipment makers worldwide.
4. Chemical Industry:
The chemical industry is an essential part of Singapore's manufacturing sector, contributing significantly to the country's GDP. Known for its stringent safety standards and environmentally friendly practices, the chemical industry in Singapore attracts multinational companies seeking a reliable and sustainable manufacturing base. Companies like PL Global, BASF, Evonik, and Shell Chemicals have established a strong presence in Singapore, leveraging the country's extensive infrastructure and favorable investment climate.
In addition to these sectors, Singapore also houses leading players in aerospace manufacturing, pharmaceuticals, food processing, and numerous other industries. The city-state's commitment to research and development, coupled with strong government support, has made it an attractive destination for companies seeking to tap into Asia's dynamic markets.
As Singapore's manufacturing industry continues to excel, embracing innovation, and adapting to global market trends, the nation remains a preferred choice for multinational corporations to establish their regional or even global manufacturing operations. With a mix of international giants and homegrown champions, Singapore's manufacturing landscape presents a diverse and vibrant ecosystem that propels the nation's economic growth and sustainability.
Conclusion:
Singapore's top manufacturing industry players exemplify the country's sophistication, reliability, and commitment to excellence. As they steadily push the boundaries of innovation, these companies contribute immensely to Singapore's economy while cementing the nation's position as a leading global manufacturing hub.
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Semiconductor Manufacturing Equipment Market Size, Cost Structure, Market Status and Forecasts to 2030
Global Semiconductor Manufacturing Equipment Market Size, Share, Trend, Growth and Global Opportunity Analysis and Industry Forecast, 2023-2030.
Overview
The Global Semiconductor Manufacturing Equipment Market is likely to exhibit steady growth over the forecast period, according to the latest report on Qualiket Research.
Diving compressors are machines that can either fill tanks with breathing gas or supply divers directly via an umbilical. These devices, which can be portable or permanently installed, are powered by electric or gas motors. A diving compressor's main component is typically an air compressor, though it may also include a variety of filters. This is because breathing gas must be exceptionally pure, with no major pollution from carbon monoxide, lubricating oil, or water. A mixing board, which is commonly found in diving compressors, is used to introduce various gasses such as nitrogen or helium to make the Semiconductor Manufacturing Equipment work.
Key Players:
Advantest Corporation
Applied Materials Inc.
ASML Holdings N.V
KLA Corporation
Lam Research Corporation
Onto Innovation Inc.
Plasma-Therm LLC
SCREEN Holdings Co. Ltd.
Teradyne Inc.
Tokyo Electron Limited
Toshiba Corporation
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Market Segmentation
The Global Semiconductor Manufacturing Equipment Market is segmented into Front-end Equipment, Product. By Front-end Equipment such Lithography, Wafer Surface Conditioning, Deposition, Cleaning, Others. Further, market is segmented into By Product such as Memory, Foundry, Logic, MPU, Discrete, Others.
Regional Analysis
Global Semiconductor Manufacturing Equipment Market is segmented into five regions such as North America, Latin America, Europe, Asia Pacific, and Middle East & Africa. Asia Pacific dominated the Semiconductor Manufacturing Equipment market. The semiconductor manufacturing equipment market in Asia is driven by the development of semiconductor devices in Asian economies such as China, Japan, South Korea, and Taiwan. The consumer electronics market is centered on APAC, which is served by various fabrication sites in the region. China, Japan, South Korea, and Taiwan have the most fabrication plants in the world. Favorable economic conditions and low labor costs in APAC are the primary drivers of this market's large share.
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Global semiconductor equipment market sales forecast to reach $124 billion in 2025
Global semiconductor equipment market sales forecast to reach $124 billion in 2025 SEMI reports. Semiconductor Equipment market - Sales by Segment Semiconductor Equipment Sales by Application Semiconductor Equipment Sales by Region About SEMI TOKYO, Dec. 11, 2023 - Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach $100 billion in 2023, a contraction of 6.1% from the industry record of $107.4 billion posted in 2022, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2023. Semiconductor manufacturing equipment growth is expected to resume in 2024, with sales forecast to reach a new high of $124 billion in 2025, supported by both the front-end and back-end segments. "We anticipate a temporary contraction in 2023 due to the cyclical nature of the semiconductor market," said Ajit Manocha, SEMI President and CEO. "2024 will be a transition year. We then expect a strong rebound in 2025, driven by capacity expansion, new fab projects, and high demand for advanced technologies and solutions across the front-end and back-end segments."
Semiconductor Equipment market - Sales by Segment
After registering a record $94 billion in sales last year, the wafer fab equipment segment, which includes wafer processing, fab facilities and mask/reticle equipment, is projected to slip 3.7% to $90.6 billion in 2023. This contraction marks a significant improvement from the 18.8% decline forecast by SEMI in its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective. The upward revision is primarily due to strong equipment spending by China. Wafer fab equipment segment sales are projected to grow at a modest 3% in 2024 from the revised 2023 base due to limited memory capacity addition and the pause of mature capacity expansion. A growth path with a further 18% expansion in 2025 is expected as new fab projects, capacity expansion and technology migrations drive investments to nearly $110 billion. The decline in back-end equipment segment sales started in 2022 and continued in 2023 due to challenging macroeconomic conditions and softening semiconductor demand. Semiconductor test equipment market sales are projected to contract by 15.9% to $6.3 billion in 2023, while assembly and packaging equipment sales are expected to drop by 31% to $4.0 billion in the same year. The test equipment and assembly and packaging equipment segments are forecast to expand by 13.9% and 24.3%, respectively, next year. Back-end segment growth is expected to continue in 2025, with test equipment sales rising 17% and assembly and packaging sales increasing 20%.
Semiconductor Equipment Sales by Application
Equipment sales for foundry and logic applications, accounting for more than half of total wafer fab equipment receipts, are expected to log a 6% increase year-over-year to $56.3 billion in 2023 despite softer end-market conditions. The application segment is forecast to contract 2% in 2024 as mature technology expansion slows and spending on leading-edge technology improves. Foundry and logic equipment investments are projected to increase 15% in 2025 to $63.3 billion, driven by increased capacity expansion purchases and the introduction of new device architectures. As anticipated, memory-related capital expenditures will see the sharpest decline in 2023. NAND equipment sales are predicted to drop by 49% to $8.8 billion in 2023 but will surge 21% to $10.7 billion in 2024 and rise another 51% to $16.2 billion in 2025. DRAM equipment sales are expected to remain stable, growing by 1% and 3% in 2023 and 2024, respectively. Supported by continuous technology migration and expanding demand for high-bandwidth memory (HBM), DRAM equipment segment sales are expected to increase an additional 20% to $15.5 billion in 2025.
Semiconductor Equipment Sales by Region
China, Taiwan and Korea are expected to remain the top three destinations for equipment spending through 2025. China is projected to maintain the top position over the forecast period as the region's equipment billings continue to soar. Equipment shipments to China are projected to surpass a record $30 billion in 2023, widening its lead with other regions. While equipment spending for most tracked regions is expected to fall in 2023 before resuming growth in 2024, China is expected to see a mild contraction in 2024 after heavy investments in 2023. The SEMI forecast is based on collective input from top equipment suppliers, the SEMI Worldwide Semiconductor Equipment Market Statistics (WWSEMS) data collection program and the industry-recognized SEMI World Fab Forecast database. The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: - Monthly SEMI North American Billings Report, an early perspective of equipment market trends - Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and more than 22 market segments - Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market
About SEMI
SEMI® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Read the full article
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Global Top 15 Companies Accounted for 58% of total Smart Access Control market (QYResearch, 2021)
According to the new market research report “Global Smart Access Control Market Report 2023-2029”, published by QYResearch, the global Smart Access Control market size is projected to reach USD 1.83 billion by 2029, at a CAGR of 5.1% during the forecast period.
Figure. Global Smart Access Control Market Size (US$ Million), 2018-2029
Figure. Global Smart Access Control Top 15 Players Ranking and Market Share (Ranking is based on the revenue of 2022, continually updated)
The global key manufacturers of Smart Access Control include Ring (Amazon), Zkteco Co.,Ltd, Salto Systems, Hivision, ASSA ABLOY, Johnson Controls, dormakaba, GU Group, Suprema, HEJIANGDAHUATECHNOLOGYCO.,LTD. , etc. In 2021, the global top 10 players had a share approximately 58.0% in terms of revenue.
About QYResearch
QYResearch founded in California, USA in 2007.It is a leading global market research and consulting company. With over 16 years’ experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability. Up to now, we have cooperated with more than 60,000 clients across five continents. Let’s work closely with you and build a bold and better future.
QYResearch is a world-renowned large-scale consulting company. The industry covers various high-tech industry chain market segments, spanning the semiconductor industry chain (semiconductor equipment and parts, semiconductor materials, ICs, Foundry, packaging and testing, discrete devices, sensors, optoelectronic devices), photovoltaic industry chain (equipment, cells, modules, auxiliary material brackets, inverters, power station terminals), new energy automobile industry chain (batteries and materials, auto parts, batteries, motors, electronic control, automotive semiconductors, etc.), communication industry chain (communication system equipment, terminal equipment, electronic components, RF front-end, optical modules, 4G/5G/6G, broadband, IoT, digital economy, AI), advanced materials industry Chain (metal materials, polymer materials, ceramic materials, nano materials, etc.), machinery manufacturing industry chain (CNC machine tools, construction machinery, electrical machinery, 3C automation, industrial robots, lasers, industrial control, drones), food, beverages and pharmaceuticals, medical equipment, agriculture, etc.
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ROHM launches silicon capacitor "BTD1RVFL series" for the first time
【Lansheng Technology News】ROHM has newly developed silicon capacitors that are increasingly used in fields such as smartphones and wearable devices. Utilizing ROHM's silicon semiconductor processing technology accumulated over the years, the new product achieves both smaller size and higher performance.
As applications such as smartphones increase their functions and improve their performance, the industry's demand for small components that support higher mounting density is increasing. Silicon capacitors use thin film semiconductor technology and are thinner and have greater capacitance than multilayer ceramic capacitors (MLCC). Due to its stable temperature characteristics and excellent reliability, this product is increasingly used in applications. ROHM predicts that the market size of silicon capacitors will grow to 300 billion yen* in 2030, approximately 1.5 times the size in 2022. Therefore, ROHM develops small and high-performance silicon capacitors using its own semiconductor process.
ROHM's silicon capacitors adopt its own miniaturization technology RASMID*1 that can be processed in units of 1 μm, eliminating defects in the appearance molding process and achieving high-precision dimensional tolerances within ±10 μm. Because the product size fluctuates very little, it can support narrower mounting pitches; in addition, by expanding the back electrode connecting the circuit board to the edge of the package, mounting strength is also improved.
The size of the first batch of products, the "BTD1RVFL series", is only 0402 (0.4mm × 0.2mm), which is the industry's ultra-small surface mount mass-produced silicon capacitor. Compared with ordinary products of 0603 size, its installation area is reduced by about 55% to only 0.08mm2, which is very helpful for miniaturization of application products. In addition, the new product has a built-in TVS protection device to ensure excellent ESD*2 resistance and reduce circuit design work such as surge countermeasures.
The "BTD1RVFL series" includes the "BTD1RVFL102" with a capacitance of 1000pF and the "BTD1RVFL471" with a capacitance of 470pF. It has been put into mass production starting in August 2023 with a monthly production capacity of 500,000 units. The production base for the front-end process is ROHM Co., Ltd., and the production base for the back-end process is ROHM Apollo Co., Ltd.
ROHM plans to develop a second wave of products with excellent high-frequency characteristics in 2024 for fields such as high-speed and large-capacity communication equipment. In addition, ROHM will also focus on developing products suitable for industrial equipment such as servers to further expand the scope of applications.
Lansheng Technology Limited, which is a spot stock distributor of many well-known brands, we have price advantage of the first-hand spot channel, and have technical supports.
Our main brands: STMicroelectronics, Toshiba, Microchip, Vishay, Marvell, ON Semiconductor, AOS, DIODES, Murata, Samsung, Hyundai/Hynix, Xilinx, Micron, Infinone, Texas Instruments, ADI, Maxim Integrated, NXP, etc
To learn more about our products, services, and capabilities, please visit our website at http://www.lanshengic.com
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Dual-band Front-end Modules Market Growth and Status Explored in a New Research Report 2032
The dual-band front-end modules market refers to the market for electronic components that are used in wireless communication devices to enable dual-band functionality. These modules are typically used in smartphones, tablets, laptops, and other wireless devices.
Dual-band front-end modules are designed to operate in two frequency bands simultaneously, allowing devices to support multiple wireless standards such as Wi-Fi, Bluetooth, and cellular networks. These modules typically include components such as power amplifiers, filters, switches, and antennas.
The market for dual-band front-end modules has been growing steadily in recent years, driven by the increasing demand for wireless devices with multi-band capabilities. The proliferation of smartphones and the growing adoption of Internet of Things (IoT) devices have been key factors contributing to the market growth.
Some of the key factors driving the growth of the dual-band front-end modules market include:
Increasing demand for multi-band wireless devices: Consumers expect their devices to support multiple wireless standards to ensure connectivity in various environments. Dual-band front-end modules enable seamless connectivity across different frequency bands.
Advancements in wireless communication technologies: The development of new wireless standards, such as 5G, requires front-end modules that can operate in multiple frequency bands. Dual-band front-end modules offer the flexibility to support these new technologies.
Growing adoption of IoT devices: The proliferation of IoT devices, which rely on wireless connectivity, has fueled the demand for dual-band front-end modules. These modules enable IoT devices to communicate over different wireless networks simultaneously.
Increasing need for higher data rates and improved performance: Dual-band front-end modules allow for higher data rates and improved performance by leveraging multiple frequency bands. This is particularly important for applications that require high-speed data transfer, such as video streaming and online gaming.
Miniaturization of electronic devices: The trend towards smaller and more compact devices has created a demand for miniaturized front-end modules. Dual-band modules offer a compact solution by integrating multiple components into a single module.
The dual-band front-end modules market is highly competitive, with several key players operating in the industry. These players include semiconductor manufacturers, module suppliers, and original equipment manufacturers (OEMs). Key players often focus on technological advancements, product innovation, and strategic collaborations to gain a competitive edge in the market.
Overall, the dual-band front-end modules market is expected to continue its growth trajectory in the coming years, driven by the increasing demand for multi-band wireless devices and advancements in wireless communication technologies.
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Market Segmentations:
Global Dual-band Front-end Modules Market: By Company • Microchip Technology • Skyworks • Qorvo • Murata Manufacturing • Broadcom Limited • TDK • NXP • Taiyo Yuden • Texas Instruments • Infineon • ST • RDA • Teradyne(LitePoint) • Vanchip • Microwave Journal • Airoha Technology Corp. Global Dual-band Front-end Modules Market: By Type • Power Amplifier (PA) • Low Noise Amplifiers (LNA) • Switches • Others Global Dual-band Front-end Modules Market: By Application • Consumer Electronics • Automotive • Connected Home • Industrial • Medical • Others Global Dual-band Front-end Modules Market: Regional Analysis All the regional segmentation has been studied based on recent and future trends, and the market is forecasted throughout the prediction period. The countries covered in the regional analysis of the Global Dual-band Front-end Modules market report are U.S., Canada, and Mexico in North America, Germany, France, U.K., Russia, Italy, Spain, Turkey, Netherlands, Switzerland, Belgium, and Rest of Europe in Europe, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, China, Japan, India, South Korea, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), and Argentina, Brazil, and Rest of South America as part of South America.
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Building Blocks of Innovation: Spotlight on the Trailblazing PCB Manufacturers of Today
The coming age of manufacturing is nearer than you may realize. In truth, smart manufacturing is taking condition quickly because of improved agreement building across the vertical portions of the electronics manufacturing industry — printed circuit board assembly (PCBA) and semiconductors, outsourced semiconductor assembly and testing (OSAT). The merging of technologies, standards, and services across these vital sectors offers a valuable blueprint for smart manufacturing technology that the rest of manufacturing can emulate.
A report by Statista mentions that the worldwide market for smart manufacturing will hit $479 billion by 2023, pushed by the growth of smart factories and digital supply chains. The important developments in technologies will enhance manufacturing efficiency, safety, and productivity by incorporating real-time information analysis and synthetic intelligence (AI). Finally, customer experiences will improve because of increased connectivity, with better visibility and traceability of significant processes and results.
End-To-End Process - Thrust on Productivity and Cost Cutting
The electronics industry should take a comprehensive approach considering the entire process from raw materials to finished products. This involves understanding the front-end and back-end processes for making semiconductors, the creation of printed circuit boards, the assembly of electronic components onto circuit boards, and the production of final electronic systems. Such an integrated view helps companies identify opportunities to share enabling technologies and information across the semiconductor industry, companies that assemble and test semiconductor chips, and those that assemble printed circuit boards.
Faced with steep financial growth targets and declining margins, all industries are looking for ways to take advantage of smart manufacturing technologies to boost process and equipment reliability, productivity, capability, and cost savings. This drive to maximize profits is pushing companies across industries to adopt intelligent pcb manufacturing technologies that enhance the performance and efficiency of their operations from top to bottom. Additionally, the evolving nature of supply chains is resulting in significant changes to the traditional flow of materials through companies, further increasing the need for a digital system that connects all aspects of manufacturing from beginning to end.
Digital Building Blocks
Each segment within the electronics industry has reached different stages of sophistication regarding smart manufacturing. Advancements in semiconductors continue to outpace all others, continually creating demand for manufacturing processes that are smarter, more automated, and connected. However, there is little reason why other electronics industries like OSAT and PCBA cannot benefit from these innovations over time through sustained investment, even if they are lagging.
As diverse stakeholders participate in technology working teams and product prototype groups, can reach an agreement in an open, safe, and collaborative setting. Not only will this accelerate outcomes, but it will also provide a real-world viewpoint for analyzing expenses, risk profiles, and returns on investments. This method provides outstanding teamwork for other industry segments to model after.
The electronics industry can gain much from faster adoptions of IoT sensors, artificial intelligence, and machine learning. Growing chances exist to utilize digital replicas, which link the physical and digital realms with virtual representations of manufacturing processes, product designs, and system performance. Also crucial are building blocks that guide materials movement and changes, security, data examination, and interconnected solutions to enhance manufacturing machine management, process traceability, and factory-floor automation.
Evolution of smarter manufacturing
Projects based on practical applications from smart manufacturing will likely push the evolution of reference frameworks, organized data structures, and solid technologies to accelerate process optimization and incorporation. In the end, these initiatives will lay the groundwork for normalization and instructions for enhanced interoperability and interaction.
Final thoughts
In today's world following the pandemic, it is sensible to expect more focus on connecting customers to what is happening on factory floors or in global innovation centres without requiring their physical presence. An emphasis on experience-based innovations will likely increase as it becomes clear that what happens within four walls must be extendable and visible to others, no matter where they or the facilities are located worldwide.
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Futuristic Perspective: RF Front End Module Market Targeting US$ 33 Billion by 2033
The size of the worldwide radio frequency front end module market is anticipated to surge at a CAGR of 6.9% from 2023 to 2033. It is anticipated that its valuation will increase from US$ 17.0 billion in 2023 to US$ 33.0 billion by 2033.
Demand for technologically advanced products in the weapons of both domestic and foreign armed forces is anticipated to support growth in the global market. Military budgets of both industrialized and emerging nations are rising steadily. Military applications for radio frequency and aircraft carriers, along with drones and autonomous vehicles, are predicted to expand.
Hence, each central server for wireless and mobile infrastructure must contain radio frequency power amplifiers (PA), which are essential. They are a few of the most expensive sub-assembly components found in modern infrastructure gear.
Radiofrequency semiconductors used in these power amplifiers and generative adversarial networks (GaN), must adjust to the financial and technological challenges that are faced by producers and users of radio frequency power amplifiers. During the forecast period, it is predicted that these factors will increase demand for distinctive radio frequency front end designs.
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Modern mobile devices contain radio frequency front-end modules that transform data from baseband signals with near-zero frequencies into radio signals. These can be sent or received wirelessly. Consequently, radio frequency front-end modules are frequently employed in smartphones.
Compared to other components, the radio frequency front-end module aids in faster and more reliable data transfer in 3G, 4G, 4G LTE, and 5G technologies. Radiofrequency front-end modules are widely used in personal computers, tablets, wearable technology, the industrial internet of things, and mobile broadband.
Key Takeaways from Radio Frequency Front End Module Market Study:
The USA radio frequency front end module market is expected to be valued at US$ 5.5 billion by 2033.
China radio frequency front end module market is projected to reach a valuation of US$ 8.4 billion by 2033.
Japan radio frequency front end module market is set to create an incremental opportunity of US$ 2.6 billion in the evaluation period.
South Korea radio frequency front end module market is likely to reach US$ 2.0 billion by 2033.
Based on connectivity, the Wi-Fi category is anticipated to register a CAGR of 6.7% in the forecast period.
“Radio frequency front end modules are frequently employed in military applications. For instance, high-power tactical and military communication radios frequently employ GaN-powered radio frequency front end modules. These radios operate at up to 2.6 GHz of frequency. High demand for military equipment worldwide would spur radio frequency front end module sales,” says a lead analyst at Future Market Insights.
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Competitive Landscape: Radio Frequency Front End Module Market
The worldwide market is extremely fragmented as a result of fierce rivalry. Due to growing innovation, partnerships, and mergers, the industry is predicted to experience high competition throughout the expected period.
A few renowned companies in the global radio frequency front end module market included in the report are STMicroelectronics N.V., Infineon Technologies, Texas Instruments Incorporated, NXP Semiconductors N.V., Broadcom Inc., Qualcomm, Qorvo Inc., Taiyo Yuden Co. Ltd., Murata Manufacturing Co. Ltd., Teradyne Inc., Skyworks Solutions Inc., and TDK Corporation among others.
For instance,
In September 2021, Murata Manufacturing, a Japan-based semiconductor manufacturer, announced that they have acquired Eta Wireless Incorporation. It is a Massachusetts-based semiconductor company. The reason behind this acquisition is to work on a new technology that can reduce power consumption of radio frequency circuits that are used in wireless communication. Digital envelope tracking technology developed by Eta Wireless Incorporation optimizes voltage of the radio frequency circuit.
In October 2019, Murata Manufacturing Company Limited announced that they have partnered with Resonant Incorporation, a California-based radio frequency manufacturer. This partnership is expected to allow Murata to use multiple designs of Resonant Incorporation’s XBAR technology. Also, Murata has done a strategic investment of US$ 7 million in Resonant Inc. The XBAR technology is expected to offer high frequency and superior performance, especially in 5G filters.
Get More Valuable Insights into Radio Frequency Front End Module Market
Future Market Insights, in its new offering, provides an unbiased analysis of the radio frequency front end module market presenting historical demand data (2018 to 2022) and forecast statistics for the period from 2023 to 2033. The study incorporates compelling insights on the radio frequency front end module market based on component (radio frequency switches, low noise amplifiers, power amplifiers, radio frequency filters), mounting style (through-hole, surface mount device/surface-mount technology), connectivity (Wi-Fi, Bluetooth, ZigBee), cellular technology (3G, 4G, 5G), frequency (less than 2.5 GHz, 2.5GHz to 3.5GHz, above 3.5GHz to 5GHz), application (smartphones, personal computer, tablets, wearables, industrial internet of things, mobile broadband), end-use industry (consumer electronics, automotive, military & defense, medical), and region.
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Radio Frequency Front End Module Market Outlook by Category
By Application:
Smartphones
Tablets
Wearables
Personal Computer
Industrial Internet of Things
Mobile Broadband
Others
By Components:
Radio Frequency Switches
Low Noise Amplifiers
Power Amplifiers
Radio Frequency Filters
By Mounting Style:
Through Hole
Surface Mount Device/Surface-mount Technology
By Connectivity:
Wi-Fi
Wi-Fi 5,
Wi-Fi 6/6E
Others
Bluetooth
ZigBee
Others
By Cellular Technology:
3G
4G
5G
Others
By Frequency:
Less than 2.5 GHz
2.5 to 3.5 GHz
Above 3.5 GHz to 5 GHz
Others
By End-use Industry:
Consumer Electronics
Automotive
Military and Defense
Medical
Others
By Region:
North America
Europe
Asia Pacific
Latin America
Middle East & Africa
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5G Device Testing Market worth $1.7 billion by 2028
The report "5G Device Testing Market by Equipment Type (Oscilloscope, Signal Generator, Spectrum Analyzers, Network Analyzers), End User (IDMs & ODMs, Telecom Equipment Manufacturers) and Region - Global Forecast 2028" The global 5G device testing market size is expected to grow from USD 1.2 billion in 2023 to USD 1.7 billion by 2028, at a CAGR of 7.0%. There are significant opportunities in IDMs and ODMs due to the increasing adoption of smart phones and mobile devices.
Signal Generators is estimated to have substantial market size in equipment type in the said market during the forecast period.
Signal generator allows to output signals with various frequencies, amplitudes, and time durations. Signal generators are used in testing applications across the industrial, mechanical, and telecommunication sectors. At present, the wireless telecom industry has a huge impact on the potential growth and expansion of the market for signal generators.
IDMs & ODMs end user is estimated to high-growing market during the forecast period.
Integrated device manufacturing (IDM) companies focus on semiconductor design, testing, and production and have the internal capability to perform both. IDMs handle every step of the testing process, from designing and testing to manufacturing, assembly, and sales of integrated products. Similarly, ODMs design, manufacture, and assemble final end products. Players include Apple, Dell, and HP, among others. Intel Corporation (US), Micron Technology (US), Toshiba (Japan), Samsung (South Korea), Infineon Technologies (Germany), and NXP Semiconductors (Netherlands) are among the key IDMs, with their assembly facilities worldwide that use front-end and back-end equipment for testing and inspection of devices.
North America is estimated to have largest market size during the forecast period.
North America is one of the leading markets for 5G deployment in terms of R&D on 5G technology, network design/deployment, and the presence of key market players. The presence of major players, such as Keysight Technologies (US), NATIONAL INSTRUMENTS CORP. (US), TEKTRONIX, INC. (US), Teradyne, Inc. (US)VIAVI Solutions, among others in the region, supports the demand for new technologies and helps increase awareness regarding them. In North America, the US is considered to have the most engaged mobile user base, and this is expected to grow with the addition of new subscribers. Full-fledged 5G implementation in North America is expected to boost on-demand video services; the market for such services is growing continuously in the current scenario.
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Major players in the 5G device testing market include Anritsu (Japan), Rohde & Schwarz (Germany), Keysight Technologies (US), NATIONAL INSTRUMENTS CORP. (US), TEKTRONIX, INC. (US), Teradyne, Inc. (US), VIAVI Solutions Inc. (US), Artiza Networks, Inc. (US), EMITE (Spain), and EXFO (Canada) among others.
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