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NVIDIA MGX And Intel Xeon Powered DC-MHS Servers At SC24

MSI, a leading global provider of high-performance server solutions, displayed its AI server based on the NVIDIA MGX architecture and DC-MHS server portfolio powered by Intel Xeon 6 processors at booth 3655 at Supercomputing 2024 (SC24) from November 19–21 MSI’s most recent products are made with the goal of optimising compute density, energy efficiency, and modular flexibility in order to meet the demanding requirements of AI, HPC, and data-intensive applications. MSI provides the scalable performance and resilience required for data centres to keep up with changing HPC demands with its Intel Xeon 6 DC-MHS servers, which are designed on a flexible DC-MHS architecture.

NVIDIA MGX Server for Next-Gen AI

With its two Intel Xeon 6 CPUs and eight FHFL dual width GPU slots, MSI’s CG480-S5063 AI server, which is based on the MGX architecture, is specifically designed to meet the high needs of AI. It supports the potent NVIDIA H200 NVL GPUs, which enable enormous parallel processing for workloads related to AI, LLM, and data analytics. High throughput for data-intensive applications is provided by its 20 PCIe 5.0 E1.S NVMe bays and 32 DDR5 DIMM slots, while PCIe 5.0 x16 slots allow for flexible and fast network integration. For AI systems that prioritize optimal computational efficiency and scalability, this 4U server provides the performance and scalability required.

Intel Xeon 6 DC-MHS Servers Solutions for HPC Data Centers

High-performance data center and HPC environments benefit from unparalleled scalability and flexibility with MSI’s Intel Xeon 6 processor-based DC-MHS servers and server motherboards. Microsoft’s solutions provide optimal resource allocation across a variety of applications with Intel Xeon 6 processors, which have P-cores for optimal performance and E-cores for energy-efficient operations under heavy workloads.

Data centers can effectively scale and swiftly adjust to the ever-increasing demands of AI, analytics, and intensive computing workloads with these DC-MHS solutions, which were designed with efficient thermal management and modularity in mind. They use Extended Volume Air Cooling (EVAC) CPU heatsinks to maintain stable operation even under intense use. These solutions, which combine the potent Intel Xeon 6 processors with the flexible DC-MHS architecture, give data centers the tools they need to remain competitive in the quickly changing HPC market of today.

DC-MHS Servers

Intel Xeon 6 processors, DDR5 DIMM slots, and broad PCIe 5.0 compatibility enable MSI DC-MHS servers to provide unparalleled computational density and modular scalability. These platforms, which are based on the OCP DC-MHS architecture, offer data centers the adaptability, strength, and efficiency they need to succeed in demanding HPC and AI environments. They include DC-SCM2 server management modules with A speed AST2600 BMC support and improved front I/O design.

For demanding computation and memory-bound workloads in HPC environments, the CD270-S3061-X2 is a 2U, two-node server. The system offers significant processing power and memory bandwidth necessary for parallel tasks,with its single Intel Xeon 6 CPU with up to 350W TDP and 16 DDR5 DIMM slots per node. High-speed data access is made possible by its six PCIe 5.0 x4 U.2 NVMe bays per node, which makes it perfect for high-performance and scalable data center architecture.

The CX270-S5062 is a 2U server with 32 DDR5 DIMM slots and dual-socket Intel Xeon 6 processors with a maximum TDP of 350W each that is designed for maximum computation throughput. This device facilitates quick data processing and AI-driven calculations by supporting up to 24 PCIe 5.0 x4 U.2 NVMe bays and dual GPU options to offer both large storage and GPU acceleration capabilities.

A single Intel Xeon 6 processor with a maximum TDP of 350W powers the CX271-S3066, a 2U server that offers balanced performance and scalability. This server, which supports up to 24 PCIe 5.0 x4 U.2 NVMe bays and 16 DDR5 DIMM slots, is designed for data-centric applications that need quick access to data and effective processing, guaranteeing that data centers can quickly meet the demands of AI and HPC.

DC-MHS Server Motherboards

The latest Intel Xeon 6 processors with P-cores and E-cores power the full-width M-FLW and density-optimized M-DNO (Type-4, Type-2) motherboards in the MSI DC-MHS series, which offers optimal performance and energy efficiency for a range of compute-intensive applications. These motherboards offer the processing power and scalability required for sophisticated AI, data analytics, and HPC applications with their DDR5 memory slots, fast PCIe 5.0 connectivity, and flexible I/O options.

A single Intel Xeon 6 CPU, up to 500W TDP, and 12 DDR5 DIMM slots are supported by the D3071 M-DNO Type-2 HPM.

32 DDR5 DIMM slots, up to 350W TDP, and dual Intel Xeon 6 CPUs are supported by the D5062 M-FLW HPM.

The D3066 M-DNO Type-4 HPM has 16 DDR5 DIMM slots, a single Intel Xeon 6 processor, and a maximum TDP of 350W.

The D3061 M-DNO Type-2 HPM has 12 DDR5 DIMM slots, a single Intel Xeon 6 processor, and a maximum TDP of 350W.

The OCP DC-SCM v2.0-compliant MGT1 DC-SCM2 Module facilitates cross-platform use, lowers deployment and maintenance expenses, and streamlines testing and validation.

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