#FDSOI

[electronicsbuzz]

[spookygeorgie]

“Just heard about Itachi...Not good”

- Naruto “at some point probably” x

@toastwinchester I hate you

[vriska]

ayy out of curiosity do you have a weapon/meister-sona?(....okay bESIDES Mindfang's cutlass)

I do actually!!! im not very good at drawing people so i havent drawn her much but I made a weapon oc i suppose i could post her fdsoi

[dbmrmarketnews]

Wi-Fi chipset market is expected to gain market growth in the forecast period of 2021 to 2028. Data Bridge Market Research analyses the Wi-Fi chipset market to reach at an estimated value of USD 2307.5 million by 2028 and grow at a CAGR of 4.10% for the forecast.

[shunlongwei]

Altera Corporation Https://www.slw-ele.com; Email: sales@shunlongwei.com

altera Corporation

https://en.wikipedia.org/wiki/Altera Altera Corporation was a leading American manufacturer of programmable logic devices (PLDs), reconfigurable complex digital circuits, from 1984 through 2015.Altera released its first PLD in 1984.

  Altera and intel announced on June 1, 2015 that they had agreed that Intel would acquire Altera in an all-cash transaction valued at approximately $16.7 billion. As of December 28, 2015, the acquisition had been completed.

  The main product lines from Altera (now Intel) are the Stratix, Arria and Cyclone series FPGAs, the MAX series CPLDs and non-volatile FPGAs, Quartus design software, and Enpirion PowerSoC DC-DC power solutions.

Products

FPGAs

The Stratix series FPGAs are the company's largest, highest bandwidth devices, with up to 1.1 million logic elements, integrated transceivers at up to 28 Gbit/s, up to 1.6 Tbit/s of serial switching capability, up to 1,840 GMACs of signal-processing performance, and up to 7 x72 DDR3 memory interfaces at 800 MHz. Cyclone series FPGAs and SoC FPGAs are the company's lowest cost, lowest power FPGAs, with variants offering integrated transceivers up to 5 Gbit/s. In between these two device families are Arria series FPGAs, which provide a balance of performance, power, and cost for mid-range applications such as remote radio heads, video conferencing equipment, and wireline access equipment. Arria FPGAs have integrated transceivers up to 10 Gbit/s.

  SoC FPGAs

Since December 2012, the company has been shipping SoC FPGA devices. According to Altera, fully depleted silicon on insulator (FDSOI) chip manufacturing process is beneficial for FPGAs. These devices integrate FPGAs with full hard processor systems based around ARM processors onto a single device.

  PowerSoC

In May 2013, Altera acquired embedded power chipmaker Enpirion for $134m in cash ($141m including the assumption of debt). Since that time, Enpirion has been incorporated into Altera by becoming its own product offering within the Altera portfolio of products. The Enpirion products are power system-on-a-chip DC-DC converters that enable greater power densities and lower noise performance compared with their discrete equivalent. Unlike converters made from discrete components Enpirion dc-dc converters are simulated, characterized, validated and production qualified at delivery.

  ASICs

Previously Altera offered a publicly available ASIC design flow based on HardCopy ASICs, which transitioned an FPGA design, once finalized, to a form which is not alterable. This design flow reduced design security risks as well as costs for higher volume production. Design engineers could prototype their designs in Stratix series FPGAs, and then migrate these designs to HardCopy ASICs when they were ready for volume production.

  The unique design flow makes hardware/software co-design and co-verification possible. The flow has been benchmarked to deliver systems to market 9 to 12 months faster, on average, than with standard-cell solutions. Design engineers can employ a single RTL, set of intellectual property (IP) cores, and Quartus II design software for both FPGA and ASIC implementations. Altera's HardCopy Design Center manages test insertion.

  IP cores

Altera and its partners offer an array of intellectual property (IP) cores that serve as building blocks that design engineers can drop into their system designs to perform specific functions. IP cores eliminate some of the time-consuming tasks of creating every block in a design from scratch.

  Altera offers an embedded portfolio with a broad selection of soft processor cores:

  Nios II embedded processor

Freescale ColdFire v1 core (free for Cyclone III FPGA).

ARM Cortex-M1 processor

And one hard IP processor core:

  ARM Cortex-A9 processor

Design software

Main article: Altera Quartus

All of Altera's devices are supported by a common design environment, Quartus II design software. Quartus II software is available in a subscription-based edition and a free Web-based edition. It includes a number of tools to foster productivity.

Pre：Oki Electric Industry

Next：Fairchild Semiconductor

[shivani111blog]

Wi-Fi Chipset Market Research Report- Upcoming Trends, Growth Drivers and challenges-Forecast to 2022

A new market study, titled “Wi-Fi Chipset Market Research Report- Forecast to 2022 ”has been featured on Market Research Future.

 Market Summary:

 Global Wi-Fi Chipset Market is expected to register a 6.02% CAGR, registering substantial growth during the forecast period. The market was valued at USD 18,153.6 Million in 2018; it is expected to reach USD 27,183.7 Million by 2025. North America accounted for the largest market value of USD 6,833.8 Million in 2018; the market is expected to register a CAGR of 5.65% during the forecast period.

A wireless chipset is a hardware component or a system-on-chip (SoC) that allows a device to communicate with another wireless device. Hardware components such as external wireless local area network (WLAN) cards or WLAN adapters make extensive use of wireless (Wi-Fi) chipset. The Wi-Fi chipset is used in several applications such as smartphones, personal computers, and laptops. The Wi-Fi chipset is often available in three operating bands—single, dual, and tri bands. Developments in computer-aided systems, wearable technology, the Internet of Things (IoT), automation technologies are some of the major factors fueling the growth of the global Wi-Fi chipset market.

 Get free sample report @ https://www.marketresearchfuture.com/sample_request/2733

 Key Developments 

In August 2019, Qualcomm Technologies Inc. launched Qualcomm Networking Pro     Series and Qualcomm FastConnect 6800 Subsystem. These series are based on     new chip architecture and help in the adoption of WiFi 6.

In July 2019, MediaTek Inc. launched two new gaming-grade system-on-chip, Helio     G90, and G90T. These chips can detect the degrading quality of Wi-Fi and     automatically switch to an LTE connection.

In December 2018, Intel Corporation launched a B365 chipset made using the 22 nm     fabrication process. It supports hardware RAID for PCIe and SATA storage     devices.

In July 2018, In contract with Pioneer Corporation, a leading provider of     digital products, Cypress Semiconductor Corporation provided Wi-Fi and     Bluetooth Combo Solution for in-vehicle infotainment systems. The     AVH-W8400NEX receiver of Pioneer used the CYW89359 combo solution provided     by Cypres.

 Segmentation

By Type: Mobile Wi-Fi,     Industrial Wi-Fi, and Others

By Fabrication Technology:     FinFET, Fdsoi Cmos, Silicon on Insulator (SOI) and Sige

By Die Size: 28nm, 20nm,     14nm, 10nm, and Others

By Application: Smartphone, Tablets,     PC, and Others

By Region: North America,     Asia-Pacific, Europe, Middle East & Africa, and South America

  Regional Analysis

·         The Global Wi-Fi Chipset Market, by region, has been segmented into North America, Europe, Asia-Pacific, Middle East & Africa, and South America. North America region is expected to dominate the Wi-Fi chipset market during the forecast period due to an already established infrastructure and increasing ownership of Wi-Fi-enabled smartphones and tablets in this region.

 Get complete report @ https://www.marketresearchfuture.com/reports/wi-fi-chipset-market-2733

  About Us:

At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.

Media Contact:                                      

Market Research Future                                                

Office No. 528, Amanora Chambers

Magarpatta Road, Hadapsar,

Pune - 411028                        

Maharashtra, India                                    

+1 646 845 9312                                

Email: sales@marketresearchfuture.com

[ajaymaxlove-blog]

Silicon On Insulator (SOI) Market : Industry Analysis and Forecast (2019–2026)

Silicon On Insulator (SOI) Market is expected to reach US$ XX Mn in 2026 in terms of revenue with a CAGR of XX% during the forecasting period 2019 to 2026.

The growth of Silicon Insulator Market is primarily attributed to the significant growth of consumer electronics market. Furthermore, miniaturization of semiconductor devices coupled with low operating voltage and high performance is expected to favour the growth of Silicon On Insulator (SOI) Market in near future

Growing demand for microcontrollers, microprocessors, and gaming consoles drive the growth of the Silicon Insulator Market. Furthermore, the rise in necessity for the market is attributed because of their usage in mobile phones, tablets, digital cameras, and other such electronic devices. However, the factors such as time consuming manufacturing process, volatility of raw material prices, and complex product development process hamper the growth of the market.

The Silicon On Insulator (SOI) Market can be segmented into wafer-size, wafer-type, technology, product, application, and geography. Based on wafer type, Silicon On Insulator (SOI) Market can be classified into RFSOI, FDSOI, and others. RFSOI is expected to emerge as one of the most attractive wafer type segment of the Silicon Insulator Market in the forecast period. Significant demand from APAC will support the growth of this segment in the analysis period. FDSOI is also expected to become another most lucrative wafer type segment in the forecast period.

The report study has analyzed revenue impact of covid-19 pandemic on the sales revenue of market leaders, market followers and disrupters in the report and same is reflected in our analysis.

BESOI, ELTRAN, SoS, SiMOX and smart cut are the technology segment of the market. The smart cut is predicted to grow with the highest CAGR during the analysis period. Product segment is categorized into RF FE, MEMS, power, optical and others. RF FE is expected to be one of the most opportunist segments for Silicon On Insulator (SOI) Market. Based on application SOI market is categorized into automotive, computing and mobile, entertainment and gaming, photonics, telecommunications and others. In 2016, computing and mobile held the largest market share in SOI market owing to the increasing use of SOI in mobile application across the globe.

Geographically, the global silicon on insulator market is segmented into North America, Asia-Pacific, Latin America, the Middle East and Africa, and Europe. North America and Europe are estimated to foresee significant growth over the next eight years on account of increased demand for microcontrollers and microprocessors. Mainly the U.S., Germany, France, the UK, and Italy are projected to account for highest growth in the region due to rising R&D endeavors by the companies and presence of numerous market players dedicated to developing technology.

The Silicon On Insulator (SOI) Market ecosystem consists of raw material suppliers, vendors, system integrators, chip manufacturers, and original equipment manufacturer. Several chip manufactures are actively making improvements in their fabrication processes to adopt SOI technology. This helps them ramp up the production of SOI-based devices and gain a competitive edge over others. Leading players are opting for partnerships to consolidate their presence in emerging markets. Major players operating in the silicon on insulator market include Shin-Etsu Chemical Co., Ltd., Global Wafers Co., Ltd., Soitec, Wafer World Inc., Ultrasil Corporation, IBM, and Intel Corporation.

The objective of the report is to present comprehensive analysis Silicon On Insulator (SOI) Market  including all the stakeholders of the industry. The past and current status of the industry with forecasted market size and trends are presented in the report with analysis of complicated data in simple language. The report covers all the aspects of industry with dedicated study of key players that includes market leaders, followers and new entrants by region. PORTER, SVOR, PESTEL analysis with the potential impact of micro-economic factors by region on the market have been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which will give clear futuristic view of the industry to the decision makers.

The report also helps in understanding Silicon On Insulator (SOI) Market  dynamics, structure by analyzing the market segments, and project the Silicon On Insulator (SOI) Market    size. Clear representation of competitive analysis of key player by type, price, financial position, product portfolio, growth strategies, and regional presence in the Silicon On Insulator (SOI) Market   make the report investor’s guide.Market Scope of the Silicon On Insulator (SOI) Market: Silicon On Insulator (SOI) Market By Wafer Size

• 200 mm and Less than 200 mm • 300 mm Silicon On Insulator (SOI) Market By Wafer type

• RF-SOI • FD-SOI • PD-SOI • Power SOI • Emerging-SOI Silicon On Insulator (SOI) Market By Technology

• BESOI • ELTRAN • SoS • SiMOX • Smart Cut Silicon On Insulator (SOI) Market BY PRODUCT

• MEMS • RF SOI • Optical SOI • Memory Device • SOI Transistor • Image Sensor Markets Silicon On Insulator (SOI) Market By Application

• Consumer Electronics • Automotive • Datacom • Industrial Silicon On Insulator (SOI) Market By Geography

• North America • Europe • Asia-Pacific • Middle East & Africa • Latin America Key Players operating in the Silicon On Insulator (SOI) Market:

• Shin-Etsu Chemical Co • Global Wafers Co., Ltd. • Soitec • Wafer World Inc. • Ultrasil Corporation • IBM • Intel Corporation • NXP Semiconductors N.V. • Globalwafers Co. , Ltd. • STMicroelectronics N.V. • Skyworks Solutions • Murata Manufacturing Co., Ltd. • Qorvo, Inc. • Sony Corporation • Magnachip Semiconductor • Towerjazz • NXP Semiconductors N.V. • United Microelectronics Corporation • Qualcomm Inc. • TowerJazz • ARM Holdings PLC • Freescale Semiconductor Inc. • Applied Material Inc.

Maximize Market Research, a global market research firm with a dedicated team of specialists and data has carried out extensive research about the current Silicon On Insulator (SOI) Market outlook. The report encompasses the silicon on insulator market by different segments and region, providing the in-depth analysis of the overall industry ecosystem, useful for taking an informed strategic decision by the key stakeholders in the industry. Importantly, the report delivers forecasts and share of the market, further giving an insight into the market dynamics, and future opportunities that might exist in the silicon on insulator market. The driving forces, as well as considerable restraints, have been explained in depth. In addition to this, competitive landscape describing the strategic growth of the competitors have been taken into consideration for enhancing market know-how of our clients and at the same time explain Silicon On Insulator (SOI) Market positioning of competitors.

About Us:

Maximize Market Research provides B2B and B2C market research on 20,000 high growth emerging technologies & opportunities in  Chemical, Healthcare, Pharmaceuticals, Electronics & Communications, Internet of Things, Food and Beverages, Aerospace and Defense and other manufacturing sectors.</p>

Contact info:

Name: Vikas Godage Organization: MAXIMIZE MARKET RESEARCH PVT. LTD. Email: sales@maximizemarketresearch.com Contact: +919607065656/ +919607195908 Website: www.maximizemarketresearch.com

[researchreportinsight]

Silicon on Insulator (SOI) Market - Global Industry with Overall Analysis, Demand and upcoming Trends Forecast to 2023

30 May 2019 - Global Silicon On Insulator (SOI) Market is anticipated to witness an exponential growth in the forecast period. Silicon on insulator (SOI) technology implies a layered form of the substrate that has silicon-insulator-silicon as its layers as a substitute of conventional silicon substrates in the semiconductor industry, particularly microelectronics, to improve performance.

Factors such as surge in use of SOI wafers in advanced devices such as tablets, smartphones, wearables, and earphones/headphones. Furthermore, while manufacturing thin wafers, the use of SOI technology stops the wastage of silicon, which decreases the price of semiconductor devices. Hence, the real use of silicon during the manufacture of thin SOI wafers are likely to drive the silicon on insulator (SOI) market in the forthcoming period.

Request Sample Copy of This Report @ https://www.millioninsights.com/industry-reports/silicon-on-insulator-soi-market/request-sample

On the other hand, volatility of raw material prices, time-consuming manufacturing process, and complex product growth procedure are anticipated to hinder market growth in the future. However, technological advancement is likely to create lucrative opportunities for the market. Globally, market is anticipated to expand at a significant CAGR in the upcoming period as the scope, product types, and its applications are increasing across the globe.

Silicon on insulator (SOI) market could be explored by wafer size, wafer type, product type, application, technology, and geography. Market could be explored by wafer size as 300 mm and 200 mm. The “300-mm wafer” segment accounted for a prominent share in the market. It is likely to witness substantial growth in the years to come. The key factors that could be attributed to the growth of the market include Wafer and foundry companies are increasing their capacity for producing 300-mm wafers.

Based on wafer type, the silicon on insulator (SOI) market could span RF SOI and FDSOI. Market could be explored by product type as Optical SOI, SOI Transistor, MEMS, RF SOI, Image Sensor Markets and Memory Device. The “RF-SOI” segment accounted for a prominent share in the market. It is likely to witness substantial growth in the years to come.

The key applications that could be explored in the market include Automotive, Consumer Electronics, Datacom and Industrial. The “Consumer Electronics” segment accounted for a prominent share in the market. It is likely to witness substantial growth in the years to come. The key factors that could be attributed to the growth of the market include growing demand for SOI products in smartphones and other consumer electronics devices. The market could be explored based on technology as SoS, BESOI, ELTRAN, Smart Cut and SiMOX.

APAC is a leading region in the market. It is likely to maintain its dominance in the forecast period owing to factors, such as the presence of a huge number of consumer electronic corporations, smartphone manufacturers, and progressive ICT technology providers, and foundry and wafer players in APAC. APAC is followed by North American and the European region owing to the increasing demand for SOI is attributed to their application in digital cameras, mobile phones, notebooks, and other such electronic devices.

Leading players operating in the silicon on insulator (SOI) market include Freescale Semiconductor Inc., Applied Materials Inc., ARM Holdings PLC, Global Wafers Co., Ltd., GlobalFoundries, Murata Manufacturing, IBM Corporation, Sony Corporation, and NXP Semiconductors. The leading companies are taking up partnerships, mergers and acquisitions, and joint ventures in order to boost the inorganic growth of the industry.

View Full Report with TOC @ https://www.millioninsights.com/industry-reports/silicon-on-insulator-soi-market

Market Segment:

Geographically, this report is segmented into several key Regions, with production, consumption, revenue (M USD), market share and growth rate of Silicon on Insulator (SOI) In-Depth in these regions, from 2012 to 2023 (forecast), covering

• North America (United States, Canada and Mexico)

• Europe (Germany, France, UK, Russia and Italy)

• Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

• South America (Brazil, Argentina, Columbia)

• Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Global Silicon on Insulator (SOI) In-Depth market competition by top manufacturers, with production, price, revenue (value) and market share for each manufacturer; the top players including

• Soitec (France)

• Shin-Etsu Chemical (Japan)

• GlobalWafers (Taiwan)

• STMicroelectronics N.V. (CH)

• NXP Semiconductors N.V. (NL)

• Skyworks Solutions, Inc. (US)

• Murata Manufacturing Co., Ltd. (JP)

• Qorvo, Inc. (US)

• Sony Corporation (JP)

• Magnachip Semiconductor (KR)

• United Microelectronics Corporation (TW)

[moneydjnews]

晶圓代工二哥格芯，中國成都廠驚爆裁員停工

日前因為陸續宣布暫停先進製程發展，以及出售新加坡 8 吋廠給予世界先進等事件，引發外界對於其營運狀況質疑的晶圓代工大廠格芯，12 日晚間又再傳出令人震驚的消息。因為根據中國媒體的報導，先前成為格芯在中國重點投資項目的成都 FDSOI 廠，目前除了產線完全停擺、設備陸續出清之外，還要求離職同仁歸還訓練費用。這一連串的事件，也引起市場上的關注。

根據中國媒體《半導體行業觀察》的最新報導，一名自稱格芯中國成都廠前員工在微信上爆料，指格芯中國成都廠內部設備早已一一出清，同時在 2018 年格芯停止一期的投資之後，之後第二期的 FDSOI 生態系統建設也已晶停擺。另外，由於最早一批格芯成都廠內部員工，在赴新加坡廠受訓的整個內容不確實情況下，使得許多員工回國後紛紛離職，而且大多都是模組工程師。

不過，爆料的人表示，格芯一開始對離職同仁的態度是要求離職同仁需返還培訓費用。但是，隨後卻轉變為離職不需返…

[t2mip]

Ultra-high-speed 14-bit at 4.32Gbps ADC IP Cores

T2MIP, the global independent semiconductor IP Cores provider & Technology experts, is pleased to announce the availability of its partner’s silicon and production-proven 14-bit Wideband Time-Interleaved Pipeline ADC IP cores supporting 4.32 Gsps sampling speed in 28nm FDSOI process with full modification rights and unlimited usage.

The 14-bit, 4.32Gbps Pipeline ADC IP Cores, extracted from a Production Chipset, supports 60dB Signal Noise Ratio (SNR) with input frequencies ranging from 54MHz to 1.7GHz. They are used in a variety of applications, including audio applications, microcontrollers, high-speed STB, Wi-Fi, automotive, radar, and 5G applications.

 The ADC IP Cores includes two internal power supply regulators (LDO) for the analog part:

- A 1.1v LDO with an external decoupling capacitor to reach a high-power rejection ratio,

- A 1.5v LDO with an internal capacitor for the input buffer and biasing

The digital part is supplied by the external 1.0V.

This ultra-high-speed wide-band Analog-to-Digital Converter IP cores, is based on 16 Time-Interleaved Pipeline sub-ADC followed by a digital correction algorithm for gain, offset, and skew correction. The differential input is terminated by a 100 Ohms resistor (100 Ohms differential) and followed by an input buffer driving the sub-ADC. The signal amplitude is 1Vpp differential. The analog source driving the ADC should be coupled to the input pins with two external capacitors of 1nF minimum. The input common models are generated internally.

 Pipeline ADC IP Cores is a mixed-signal system made up of a comparator, switch-capacitor circuits, biassing circuits, bandgap voltage reference, sample and hold amplifier (SHA), and multiplying digital-to-analog converter (MDAC). It connects all the specs at the circuit and system levels. A pipeline ADC IP Core is designed using two or more low resolution Flash ADCs. The architecture is divided into number of stages where each stage consists of Sample and Hold circuit. This circuit samples the analog signal and holds the sampled value for a short interval of time. This signal is fed to Flash ADC to get the binary output. The generated binary outputs from each stage is then time-aligned (Pipelined) to the Shift Register and further undergoes error detection and correction using Digital Error Correction Logic to obtain the final Binary output.

T2M’s extensive range of wireless IP cores also includes Bluetooth Dual mode v5.2 RF Transceiver IP Cores in 22nm ULL, BLE v5.2 / 15.4 (0.5mm2) RF Transceiver IP Cores in 40/55nm, NB-IoT/Cat M UE RF Transceiver IP Cores in 40ULP, and Sub6 GHz RF Transceiver IP Cores, all of which can be ported

Availability: This Analog Data convertor IP cores is available for immediate licensing. For further information on licensing options and pricing please drop a request at contact.

About T2M: T2M-IP is the global independent semiconductor technology experts, supplying complex semiconductor IP Cores, Software, KGD and disruptive technologies enabling accelerated development of your Wearables, IOT, Communications, Storage, Servers, Networking, TV, STB and Satellite SoCs. For more information, please visit: www.t-2-m.com

[elegantbee]

Most Read articles – 18nm FDSOI, fabless, lithium ion capacitors

What are the most popular topics covered? An 18nm FDSOI physical IP foundry platform, speed-limiting car tech, the size of the fabless market, lithium ion capacitors and the overall semiconductor market.

This story continues at Most Read articles – 18nm FDSOI, fabless, lithium ion capacitors

Or just read more coverage at Electronics Weekly

from https://www.electronicsweekly.com/blogs/electro-ramblings/latest-news/most-read-articles-18nm-fdsoi-fabless-lithium-ion-capacitors-2019-03/ via awesome!! from Blogger http://annepanadventures.blogspot.com/2019/03/most-read-articles-18nm-fdsoi-fabless.html via Stesha Guglielmo

[themonicanerkar31]

Wi-Fi Chipset Market’s Growth Rises with Advantages, Citing COVID-19 Impact

The Covid-19 Impact on Wi-Fi Chipset Market is expected to reach USD 27,183.7 Million by 2025 at a CAGR of 6.02% during the forecast period. Market Research Future (MRFR), in its report, envelops segmentations and drivers to provide a better glimpse of the market in the coming years. A growing number of public Wi-Fi hotspots and proliferation of smart devices such as personal computers and tablets are expected to create significant growth opportunities for the market in the coming years. However, standards and security associated with Wi-Fi technology are expected to limit the growth of the market during the forecast period. The extensive use of smart devices such as tablets and personal computers is expected to drive the Wi-Fi chipset market during the forecast period.

Competitive Analysis

The Key Players of the Global Wi-Fi Chipset Market are Qualcomm Technologies Inc. (US), Mediatek Inc. (Taiwan), Intel Corporation (US), STMicroelectronics NV (Switzerland), Cypress Semiconductor Corporation (US), Taiwan Semiconductor Manufacturing Co Ltd (Taiwan), Global Foundries (US), Broadcom Inc (US), Marvell Technology Group Ltd (Bermuda), On Semiconductor (Quantenna Communications Inc) (US), Peraso Technologies, Inc. (Canada), Texas Instruments Inc. (US), Samsung Electronics Co Ltd. (South Korea), and United Microelectronics Corporation (Taian).

In April 2019, Taiwan Semiconductor Manufacturing Co Ltd has developed 5-nanometer technology, which is used for the designing and fabrication of semiconductor components. This technology offers an advanced logic process to address the exponentially growing demand for computing power-driven by AI and 5G.

In September 2018, GLOBALFOUNDRIES launched a new 12nm Leading-Performance (12LP) FinFET semiconductor manufacturing process. This technology delivers better density and a performance boost over GLOBALFOUNDRIES’s current generation 14nm FinFET offering.

Browse Full Report Details @ https://www.marketresearchfuture.com/reports/wi-fi-chipset-market-2733

Segmental Analysis

The Global Wi-Fi Chipset Market has been segmented based on Type, Fabrication Technology, Die Size, Application, and Region.

Based on type, the market has been classified as mobile Wi-Fi, industrial Wi-Fi, and others. The mobile Wi-Fi segment accounted for the largest market share in 2018; it is expected to register the highest CAGR during the forecast period. Wi-Fi has features and is available in many shapes and sizes. For Instance, ZTE Velocity for AT&T provides plentiful information on its built-in display. Also, some models such as the Huawei E5377TS-32 can use any SIM card. The Wi-Fi chipsets used in smartphones and tablets are categorized in this segment. Industrial Wi-Fi devices use a broad spectrum of Ethernet solutions that can be custom codded and are protected for sensitive data. It increases network security and reduces downtime.

Based on fabrication technology, the market has been classified as FinFET, Fdsoi Cmos, Silicon on Insulator (SOI), and Sige. The FinFET segment accounted for the largest market share in 2018; it is expected to register the highest CAGR during the forecast period. Fin Field Effect Transistor (FinFET) is a multi-gate transistor structure used for manufacturing CPUs and memory modules that are smaller in size and provide faster performance and less energy consumption. FinFET devices are designed using a conducting channel that is built above the silicon on insulator (SoI) substrate, thus creating a fin-shaped silicon structure termed as a gate electrode. Fully Depleted Silicon on Insulator, or FDSOI, is a planar process technology that delivers the benefits of reduced silicon geometries while simplifying the manufacturing process. This fabrication process technology relies on two primary innovations. FDSOI CMOS remains a planar technology, which makes it easier to transition from conventional technologies. SOI is the fabrication of silicon semiconductor devices in a layered silicon insulator or silicon substrate. SOI technology allows continuous miniaturization of a MOSFET device. It is compatible with the fabrication process without any special equipment or retooling of an existing factory. SiGe or silicon-germanium is an alloy with any molar ratio of silicon and germanium, i.e., with a molecular formula of the form Si1−xGex. It is commonly used as a semiconductor material in integrated circuits (ICs) for heterojunction bipolar transistors or as a strain-inducing layer for CMOS transistors.

Based on die size, the market has been classified as 28nm, 20nm, 14nm, 10nm, and others. The 14nm segment accounted for the largest market share in 2018; it is expected to register the highest CAGR during the forecast period, and the 20nm segment was second highest in value. The 28nm is a half-node semiconductor manufacturing process which is used as a stopgap between the 32 nm and 22 nm processes. 28nm technology delivers higher performance, saves more energy, and it is more eco-friendly than other technologies. The 20nm technology has the capability of providing better density and power value than 22nm or 28 nm technology nodes as it uses energy-efficient transistors and interconnects, and the leading double patterning technique. 14nm FinFET process technology is considered ideal for power-efficient and high-performance system on chips (SoCs). The 10nm technology was first introduced between 2018–2019 and is characterized by its use in FinFET transistors with a 30–40s nm fin pitches. The other segment of die size includes technologies such as 16nm, 7nm, 5nm, and 3nm.

Based on application, the market has been classified as smartphone, tablets pc, and others. The smartphone segment accounted for the largest market share in 2018, it is expected to register the highest CAGR during the forecast period, and the PC segment was second highest in value. A number of smartphones, including iOS and Android handsets, are equipped with Wi-Fi chips with the cellular modem (2G/3G/4G). There is a communication processor chip, which includes Wi-Fi, Bluetooth, and GPS, among others. The rising popularity of smartphones, tablets, and laptops resulting in demand for high data speed, ultimately increasing the demand for Wi-Fi chipsets. The desktop PCs do not come with inbuilt Wi-Fi; if the user wants to have wireless connectivity there are few options such as USB Wi-Fi adapters, a PCI-E Wi-Fi card, or a new motherboard with built-in Wi-Fi.

[dbmrmarketnews]

https://www.databridgemarketresearch.com/reports/middle-east-and-africa-wi-fi-chipset-market

[evgenychernyavskiy]

A glimpse of the world from an Analogue

A glimpse of the world from an Analogue

A glimpse of the world from an Analogue Integrated Circuit designer’s perspective – Part 1 – A veteran of 31 years in the Analogue Integrated Circuit industry, Ash Madni takes a personal look at how rapidly the electronics have evolved over his career from 1985 with 3GHz Bipolar technology to 300GHz FDSOI… This story continues at A glimpse of the world from an Analogue Integrated Circuit…