#semiconductor assembly

[materialsscienceandengineering]

Advances in semiconductor patterning: New block copolymer achieves 7.6 nm line width

A recently developed block copolymer could help push the limits of integration and miniaturization in semiconductor manufacturing, report scientists at Tokyo Institute of Technology (Tokyo Tech) and Tokyo Ohka Kogyo (TOK). Chemically tailored for reliable directed self-assembly, the proposed compound can arrange itself into perpendicular lamellar structures whose half-pitch width is less than 10 nanometers, outperforming conventional and widely used block copolymers. Miniaturization is one of the fundamental qualities of modern electronics and is largely responsible for the incredible increments in performance witnessed over the past decades. To keep this momentum going, it is necessary to achieve circuit patterns finer than the existing ones on semiconductor chips, which are a crucial part of all electronic devices. Some experts estimate that, by 2037, the smallest distance between features in semiconductor devices, known as "half-pitch," will need to be as small as 8 nm to support next-generation electronics, emphasizing the need for advancements in lithographic processes (method of creating highly complex circuit patterns on semiconductor parts).

Read more.

[poonamcmi]

The Growing Demand of Semiconductor Equipment Driving Innovation

Semiconductors: Enabling Modern Technologies Semiconductors are one of the most important components of modern electronics. They are the building blocks of technologies such as smartphones, computers, vehicles, appliances and more. As technologies become more advanced and integrated into our daily lives, the demand for semiconductors keeps rising exponentially. This growing demand is driving constant innovation in Semiconductor Device which is essential for manufacturing these tiny yet powerful components.

Semiconductor Equipment fabrication requires sophisticated manufacturing processes and precise equipment. Semiconductor Device manufacturers are continuously working to develop more advanced tools that can produce smaller, more powerful and energy-efficient semiconductors. Some of the key equipment types and technologies enabling advances in semiconductor manufacturing are discussed below.

Lithography Systems: Enabling Smaller Circuit Designs Lithography systems are used to transfer electronic circuit patterns onto silicon wafers during the semiconductor fabrication process. As circuits continue to shrink in size to accommodate more transistors in a tiny space, lithography technology needs to keep pace. The mainstream lithography technology currently used is extreme ultraviolet (EUV) lithography which uses short wavelength EUV light to print ever smaller microscopic circuits.

EUV lithography allows semiconductor manufacturers to print minimum features less than 10 nanometers across. Equipment manufacturers are ramping up EUV lithography machine manufacturing to support the transition to this advanced technology needed for the latest and future generations of semiconductors. Several companies are also developing next-generation lithography technologies like nanoimprint lithography and electron-beam lithography to take circuit scaling even further below 10nm.

Deposition Equipment: Laying Down Thin Film Layers Semiconductor manufacturing involves depositing extremely thin layers of various materials like silicon, insulators, polymers or metals onto silicon wafers through deposition processes. Chemical vapor deposition (CVD) and physical vapor deposition (PVD) are commonly used deposition techniques in the industry.

Semiconductor Equipment manufacturers are continuously optimizing deposition systems to achieve ultra-thin yet highly uniform film layers. They are building systems that offer superior step coverage to deposit films of various materials into narrow trenches and holes on complex 3D circuit designs. Advanced deposition technologies like atomic layer deposition (ALD) that allows conformal deposition one atomic layer at a time is also gaining traction for manufacturing next-generation semiconductors.

Etch Systems: Sculpting Circuit Patterns Etch systems play a vital role in semiconductor manufacturing by selectively "removing" excess deposited material to reveal the desired circuit patterns on wafers. Different etch techniques like wet etching, plasma etch and reactive ion etching are used.

As circuit features shrink to nanometer scales, etch equipment must sculpt intricate 3D structures with atomic-level precision and uniformity. Chipmakers are adopting sophisticated plasma etch systems equipped with novel process chemistries, variable frequency plasma sources and endpoint detection tools for higher resolution and selectivity. Equipment vendors are engineering etch systems optimized for materials like metals, dielectrics and compound semiconductors to enable the complex multilayered architectures of tomorrow's advanced chips.

Wafer Inspection and Metrology Tools Enabling Quality Control Error-free manufacturing of sub-10nm semiconductor structures requires comprehensive quality control. Metrology and inspection tools analyze fabricated wafers throughout the process to detect defects or quantify if critical dimensions meet tight specifications.

As circuitry becomes smaller, inspection systems equipped with powerful optics, imaging techniques and sensors down to angstrom resolutions are essential. Metrology tools employ techniques like scatterometry, medium-energy ion scattering etc to non-destructively characterize tiny structures and film layers. Automated defect inspection tools scanning whole wafer surfaces help reduce costly reworks. These enabling tools will continue scaling capabilities in lock-step with chip architectures.

Meeting the Cleanroom Challenges of Advanced Node Fabrication Another challenge is managing the contamination control, temperature, humidity and airflows needed for fabricating ever smaller circuits in tightly controlled cleanroom environments. Equipment vendors provide solutions like mini- and macro-environments, advanced filter technologies along with real-time environmental monitoring systems. This helps manufacturers achieve the stringent international cleanroom specifications required at under 10nm process nodes.

Role of Semiconductor Device in Innovation Innovations happening at the level of Semiconductor Equipment underpin ongoing progress in chip technology and the transformation of daily technology products. Continuous advancements are essential to produce smaller, more powerful semiconductors powering capabilities like artificial intelligence, augmented reality and autonomous systems. Rapidly evolving equipment solutions from lithography to metrology demonstrate the collaborative innovation between chipmakers and equipment vendors necessary to sustain Moore's Law scaling. This ensures semiconductors remain a driver for breakthrough technologies of the future. Get More Insights On, Semiconductor Equipment About Author: Money Singh is a seasoned content writer with over four years of experience in the market research sector. Her expertise spans various industries, including food and beverages, biotechnology, chemical and materials, defense and aerospace, consumer goods, etc. (https://www.linkedin.com/in/money-singh-590844163)

[tata-digital]

Vibrant Gujarat: Tata Group's Bold Move with Semiconductor Plant in Dholera

In a significant stride towards technological advancement and industrial growth. Tata Group, under the leadership of Chairman N Chandrasekaran, has unveiled plans to establish. A state-of-the-art semiconductor fabrication plant in Dholera, Gujarat. This ambitious project, slated to commence operations in 2024. Was officially announced during the 10th Vibrant Gujarat Global Summit, marking. A…

[semimediapress]

OSAT companies in mainland China lower chip packaging prices

August 25, 2023 /SemiMedia/ — According to industry insiders, OSAT (Outsourced Semiconductor Assembly and Testing) companies in mainland China are lowering prices to win more orders. The utilization rate of mature wire-bonding and mid-to-high-end flip-chip packaging processes in chip packaging has not yet changed significantly, but OSAT companies in mainland China can provide more substantial…

[zvaigzdelasas]

The Dutch government is scrambling to ensure that the country’s largest company, the semiconductor equipment maker ASML, does not move operations or expand abroad after the tech firm voiced concerns over the country’s hardening stance on migrants.

On Wednesday, the Dutch newspaper De Telegraaf reported that the Dutch government had launched a cross-ministry effort, dubbed “Operation Beethoven”, to encourage ASML to continue to invest in the country.

For months, ASML, which sources parts from around the world but assembles its machines in Veldhoven in the the south of the Netherlands, has been warning against any moves that could hinder its ability to attract skilled foreign labour.

ASML ranks among Europe’s most valuable tech firms; about 40% of its 23,000 employees in the Netherlands are not Dutch [nationals].

In January, the company’s CEO, Peter Wennink, said it was poised to expand its operations. “Ultimately, we can only grow this company if there are enough qualified people,” he told the Dutch broadcaster RTL.

“We prefer to do that here, but if we cannot get those people here, we will get those people in Eastern Europe or in Asia or in the United States.”

His warnings have played out against a backdrop of government policies targeting migrants; the administration has been working to scale back a tax break for highly skilled immigrants while weighing whether to limit the number of foreigners who can attend Dutch universities.

Further moves to tighten immigration could be on the horizon after last autumn’s election, which resulted in the far-right, anti-Islam Party for Freedom (PVV) emerging as the largest party in parliament.[...]

During a January call with investors, Wennink laid bare what that could mean for ASML. “Be careful, because you will soon get exactly what you ask for,” he said. “The consequences of limiting labour migration are large – we need those people to innovate. If we can’t get those people here, we will go somewhere where we can grow.”[...]

This year has seen shares in ASML, which dominates the market for the lithography systems used to create the circuitry in chips, climb to record highs, cementing its place as one of Europe’s largest companies by market value.

If Europe loses ASML it's literally so Joever man [6 Mar 24]

[drstonetrivia]

Chapter 205 Trivia

How does a baby, with their chubby little fingers, snap them? Ryusui was obviously gifted with strong, dexterous fingers from a young age…

The flashback makes it seem like Ryusui is remembering the event, however: babies start walking between 6-18 months and Ryusui is being carried, speaking clearly is 12+ months, and memories like this one would only start from around 2-3 years onward.

Thus, this isn't Ryusui's memory.

(He was probably told about it, however remembering the 20 digit number as part of a memory is pretty impressive…)

Speaking of, well, speaking: baby Ryusui sure learnt the word "desire" quickly, however pronunciation is harder. The baby speech is present in both languages, with the Japanese version saying "欲ちい"(hochī) rather than "欲しい" (hoshī).

If we assume Ryusui is about 1 year old here for the reasons I listed above, that means that Sai is only 3 years older.

Because of Ryusui's various petrifications, Ryusui's aged about 3 years over that time.

I'm not sure who's the older brother now…

Everyone's mental math methods shown here are references to the chapter 18 bonus story, when Chrome and Senku had the arithme-battle.

Ryusui's fangs seem a lot more prominent this chapter, I guess he's really sinking his teeth into getting Sai on board with their plan!

This man here is Ryusui's uncle, who's been shown in a few flashbacks before. Where Ryusui and Sai's parents are is anyone's guess.

The game character is wielding a gun and a sword, and wearing an outfit that looks like Ryusui's.

Or is Ryusui wearing an outfit that looks like the game character's..? 🤔

The airplane Sai takes is based on a Japan Airlines Boeing 747-300 (or a 747-400, the difference isn't visible from the image). Both types are currently retired, the 300 in 2009 and the 400 in 2011, meaning Sai was still fairly young when he fled to university.

None of Sai's code appears to be indented, but at least it's commented.

The specific integrated development environment (IDE) is hard to identify because most IDEs are highly modifiable and I believe almost any of them can be laid out like this.

Semiconductors take weeks to make even with all the technology we have now. Trying to replicate those numerous steps in the stone world will be, as Senku says, hellish.

The moon here is the exact same one shown in chapter 204, before the KoS arrived in India (literally the same, I superimposed them haha). It's a waning crescent, so it's around October 20th at this point.

We've still seen no proof of Sai's mathematical ability apart from the flashback which could have been an exaggeration by Ryusui, so it's fair that Chrome and Chelsea seem to doubt his capabilities.

Senku says they need "someone" to be ready 24/7 to do quick calculations, however forcing someone to stay up for 24 hours to do stressful math is asking for a disaster. They would have always needed more than one person doing math for safety reasons, even to just compare answers.

(Also the concept of Whyman threatening them and/or attacking them even in space gets me excited!)

Thanks to Sai's petrification scars, he probably doesn't even need his charcoal pencils wrapped since the stain from the dust wouldn't show up on his hands!

Also, Sai is ambidextrous!

The code is mostly base16/hexadecimal (a combination of numbers between 0-9 and letters between A-F), however one of the panels seems to be base32 or something else since the letters M and K are present.

Another code, perhaps? 🤔

Low-level programming languages like machine code and assembly language are difficult to use. Even Inagaki agrees!

This change already happened last chapter, but Chrome's cross-body bags got an upgrade!

There's some old Norse runes carved into the sword, however at least two of the letters are flipped and trying to translate the rest seems to result in gibberish.

In Dragon Quest, the lettering usually simply reads "DRAGON QUEST" so maybe this somehow says "DOCTOR STONE"?

Unsurprisingly, the characters drawn here are inspired by real Dragon Quest characters.

The gaming system shown is the original Nintendo Entertainment System (NES): the Famicom. If you remember a differently-shaped NES, it's because it was replaced with a newer version for American markets.

[submalevolentgrace]

i know it' not this reductively simple, but i'm trying to sorta hone in on why i feel so untrusting of modern technology....

an analogue clock can be made by a clockmaker, by a person, with metals and tools. the metals have to come from somewhere and the tools need to be made, but that can be done by other people.

a digital clock has to be made by corporations. it needs ICs and PCBs, transistors and semiconductors, layers of phosphors and rare earth metals deposited in layers so thin your eyes can't see them, assembled together and reflow soldered by machines that are themselves too complex to be built by a person, down and down for layers. sure if you wanna pedantically miss the point i could buy the parts and solder them together myself, i can program a microcontroller, but none of that tech gets into my hands without being made by strata of corporations, and all harm they cause by squeezing enough blood from the proverbial stone in order to do it at shareholder-pleasing profit.

analogue clocks are made by people, digital clocks are made by corporations... and while supply chains cling to the crumbling cliff of the modern global world, the kids don't know how to read the analogue clock we have sitting on the bench.

[materialsscienceandengineering]

A recently developed block copolymer could help push the limits of integration and miniaturization in semiconductor manufacturing, report scientists in Tokyo Tech and TOK. Chemically tailored for reliable directed self-assembly, the proposed compound can arrange itself into perpendicular lamellar structures whose half-pitch width is less than 10 nanometers, outperforming conventional and widely used block copolymers. Miniaturization is one of the fundamental qualities of modern electronics and is largely responsible for the incredible increments in performance witnessed over the past decades. To keep this momentum going, it is necessary to achieve circuit patterns finer than the existing ones on semiconductor chips, which are a crucial part of all electronic devices. Some experts estimate that, by 2037, the smallest distance between features in semiconductor devices, known as 'half-pitch,' will need to be as small as 8 nm to support next-generation electronics, emphasizing the need for advancements in lithographic processes (method of creating highly complex circuit patterns on semiconductor parts).

Read more.

[mariacallous]

President Yoon Suk Yeol’s conservative People Power Party (PPP) suffered a major setback in South Korea’s parliamentary election held on April 10, 2024. Of the 300 seats in the National Assembly, the PPP secured only 108 seats through direct and proportional elections. Meanwhile, the major progressive opposition Democratic Party of Korea (DPK) and its satellite parties expanded its majority to 175 seats, hampering Yoon’s ability to govern for his remaining three years in office. Although the Yoon government’s domestic agenda may become further imperiled, his active foreign policy agenda will largely stay intact, including his staunch support for the U.S.-South Korea alliance and promotion of South Korea as a global pivotal state.

A referendum on President Yoon

South Korea’s midterm election was largely seen as a referendum on Yoon. Since coming to office in May 2022, Yoon’s domestic approval ratings have remained low, rarely breaking past 40 percent. Although support for the DPK and its party leader, Lee Jae-myung, has tracked equally as low, South Koreans were more likely to associate their country’s current economic woes, including inflation and high prices, with the ruling government.

A series of small, but unfortunate events and gaffes by Yoon during the election campaign may have also helped tip the scales in favor of opposition candidates in contested districts. In the months leading up to South Korea’s election, minor scandals surrounding the president’s wife and his former defense minister, an ongoing strike by the country’s medical doctors, and the president’s seemingly trivial comment about the price of green onions made him look out of touch.

Moreover, the rapid growth in support for a new progressive party founded by former Minister of Justice Cho Kuk just a month before the election attests to Yoon’s domestic unpopularity. Cho established the Rebuilding Korea Party (RKP) explicitly to challenge the Yoon administration, which he described as “dictatorial” and “anti-democratic.”  Despite the former justice minister’s own corruption scandals and indictment, the RKP performed better than any other third party, winning 12 seats in the party-list proportional voting system.

Domestic political challenges

A divided government and ongoing political polarization will make it especially difficult for government and opposition leaders to make compromises and find bold solutions to pressing social and economic problems, such as high inflation, falling birth rates, and the lack of affordable housing.

Yoon will continue to face challenges in implementing his domestic priorities. During recent town hall meetings, the president unveiled several policy initiatives in hopes of attracting voters, including plans for new housing through urban redevelopment and new infrastructure projects. Just prior to the election, Yoon promised major investment in a new industrial complex for the development of semiconductors and artificial intelligence and pledged to relocate the National Assembly out of Seoul to the administrative city of Sejong in the middle of the country. However, his government will face obstacles in the National Assembly in financing such projects with progressives holding a commanding majority.

Greater continuity in foreign policy

The basic contours of Yoon’s foreign and national security policy, including support for the U.S.-South Korean alliance, deterring North Korea, and the U.S.-Japan-Korea trilateral, will persist. Relations with the United States will also remain positive given wide public support, even among progressives, for the U.S.-South Korea alliance.

Likewise, the South Korean public’s unfavorable views of China and broad recognition of Chinese coercive actions in the region have muted major criticism that Yoon has antagonized China. Despite the Yoon government’s close alignment with Washington, Seoul has also maintained space to engage Beijing diplomatically. Last week, the Yoon government announced Seoul would host a China-Japan-South Korea trilateral summit in late May.

Nevertheless, the DPK’s electoral gains will take some of the wind out of Yoon’s foreign policy sails. The DPK may complicate further South Korean rapprochement with Japan and demand that Yoon seek greater concessions from Tokyo to address historical grievances. This in turn may slow the pace of U.S.-Japan-Korea trilateral cooperation and the implementation of the deliverables announced during the Camp David trilateral summit in 2023, particularly those that call for greater military cooperation with Japan.

Opposition party members may also feel more emboldened to speak out against Yoon’s hostile approach to North Korea in contrast to the DPK’s desire for greater inter-Korea engagement. Yoon’s revised unification plan for the two Koreas, which incorporates principles of freedom and democracy, will likely be criticized by DPK members.

A lame duck?

The term “lame duck” has been repeatedly used to describe Yoon’s remaining time in office. However, Yoon’s predicament may not significantly diverge from his first two years in office since the DPK did not win a supermajority—over 200 seats—needed to overcome filibusters and override presidential vetoes. The election results are also unlikely to change the overall tenor of South Korea’s polarized politics, as the ruling and opposition parties continue to highlight scandals and pursue corruption charges against their political opponents. Although political momentum may shift to the DPK, the PPP will likely regroup in preparation for the next presidential election in 2027 as it did following even greater losses by the conservative party in the 2020 parliamentary elections.

For South Korea’s allies and partners, some concern may emerge regarding whether the Yoon government can sustain its activist foreign policy agenda, including support for Ukraine or increased attention to Taiwan and cross-Strait relations. Yoon, however, is unlikely to backtrack on the idea of South Korea becoming a global pivotal state, as foreign policy and national security issues are typically the prerogatives of the president in South Korean politics, and Yoon remains at the helm of Korea’s strong executive branch.

Seoul recently hosted the third Summit for Democracy in March, and in May will co-host the AI Safety Summit and the China-Japan-Korea trilateral summit. NATO is looking toward South Korea and other Asian countries for greater support on Ukraine. Although unlikely, a more inward-looking South Korea resulting from the president’s so-called “lame-duck” status would be a loss for the international community.

Beyond partisan politics, the DPK too has a stake in elevating South Korea’s global role. Although North Korea and Japan issues elicit starkly different responses from South Korean progressives and conservatives, in recent years, attitudes towards the U.S.-South Korea alliance and China have somewhat converged. The United States and its allies should therefore continue to work with Seoul, irrespective of the party in power, to promote regional security and global order.

[ableelectropolishing]

Electropolishing for Deburring Critical Metal Parts

Stamping and machining processes can leave metal parts with burrs that can affect the fit, function and durability of metal parts.

When these parts are destined for food or pharmaceutical production equipment or fuel lines and gear assemblies used in aerospace manufacturing, burrs are more than just a surface imperfection – they’re a potentially catastrophic defect that can prevent the proper sealing or connection between two parts, become dislodged near moving parts, or cause seizing of screws and other fasteners.

To prevent such risks, manufacturers in many industries often specify electropolishing as the final step in finishing their critical metal parts.

How Does Electropolishing Work?

Electropolishing is a highly effective finishing process for removing metal surface defects like microburrs caused by processes like broaching, fine blanking, grinding, lapping or milling.

Using a combination of a chemical bath and a rectified electrical current, electropolishing removes a precise and uniform layer of surface material, leaving behind a shiny, smooth, passive and defect-free surface.

Among other advantages, electropolishing can remove a microscopically precise amount of surface material with surface roughness improvement of up to 50%, eliminating surface defects for high-quality results within very tight tolerances.

By eliminating microcracks and other defects that can harbor bacteria or become initiation sites for corrosion, electropolishing also leaves metal parts with significantly improved resistance to corrosion and pathogen growth. The ultrasmooth surface finish that electropolishing leaves behind has been shown to inhibit the formation of bacterial biofilms that can be resistant to ordinary cleaning methods. The finish also leaves behind a surface that is easier to clean, without cracks or defects where pathogens can hide – a critical advantage for medical, pharmaceutical and food and beverage production.

Why Use Electropolishing for Deburring?

Fragile or intricate metal parts, like those used for medical devices and implants, are not well suited for finishing processes like mechanical or vibratory polishing, which can damage fragile parts or create inconsistent results for parts with complex shapes.

Successful deburring for critical metal parts is contingent upon the ability to remove a precise layer of surface material. No other process can match electropolishing for its ability to control the material removal to +/- .0002”.

By deburring the threads on metal fasteners, for example, electropolishing can reduce the risk of adhesion between two mating surfaces, also known as “galling,” which can cause material between the surfaces to deteriorate and seize up when parts are pressed together.

Burrs can also shorten the lifespan of a part, by breaking off or becoming an initiation site for corrosion.

Larger burrs that occur as the result of rough milling or displaced metal from drilling operations, however, may need pre-treatment using other methods. Likewise, heavy die break burrs caused by improper tooling maintenance will generally require additional treatment.

Much in the way that lightning is drawn to the highest points, electropolishing delivers higher current density on the high points or edges which makes it ideal for micro-deburring The customized nature of the electropolishing process, from racking to chemical formulation to timing, would be of little value if it could not be reproduced consistently. But unlike other finishing processes, electropolishing is prized for its consistent results.

Electropolishing also offers a key advantage for parts with critical microfinishes or made from the lighter, more fragile materials increasingly used in the manufacturing of medical devices, electrical components and semiconductors, among other industries. These parts are not suitable for mass finishing techniques that can create distortion, nicks and scratches. Electropolished parts are individually racked to prevent contact and ensure the even application of the process for even the most fragile parts.

Advantages of Electropolishing for Deburring

The electropolishing process can be customized by alloy, by application and by the desired results. Beyond its ability to remove a uniform layer of surface material to eliminate surface defects like microburrs, microcracks, scale and staining, electropolishing offers many collateral benefits for the manufacturers of critical metal parts.

Microscopically precise removal of surface material with control to +/-.0002”

Customized racking to accommodate fragile and complex parts small and large

Leaves parts with enhanced durability and cycle life

Creation of a pathogen-resistant surface

Superior cleanability

Ultraclean finish

Decorative finish

One stop process for cleaning and removing surface defects

30X more corrosion resistance than passivation alone

Parts are also left passivated in the process

Improves conductivity of copper and aluminum alloys

What Alloys Can Be Electropolished?

A long list of alloys can be effectively deburred using electropolishing. The process is also equally effective on parts that are fully annealed or hardened. That is one reason that electropolishing is frequently specified for the final deburring and finishing of parts after all fabrication and heat treating processes have been completed.

Electropolishing is effective for a wide variety of alloys including:

Stainless Steel 200-300 Series

Stainless Steel 400 Series

Stainless Steel: Precipitating Hardening Grades

Nitinol

Titanium

Aluminum

Carbon Steels

Copper

Brass

Nickel Alloys

Specialty Alloys

And more

Electropolishing for Critical Metal Parts

As the world’s largest electropolishing specialist with seven decades of electropolishing expertise and innovation, Able Electropolishing provides consultation and collaboration from the earliest stages of prototyping through production to create highly customized electropolishing processes for a wide variety of metal parts.

[jcmarchi]

US launches $1.6B bid to outpace Asia in packaging tech

New Post has been published on https://thedigitalinsider.com/us-launches-1-6b-bid-to-outpace-asia-in-packaging-tech/

US launches $1.6B bid to outpace Asia in packaging tech

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The US is betting big on the future of semiconductor technology, launching a $1.6 billion competition to revolutionise chip packaging and challenge Asia’s longstanding dominance in the field. On July 9, 2024, the US Department of Commerce unveiled its ambitious plan to turbocharge domestic advanced packaging capabilities, a critical yet often overlooked aspect of semiconductor manufacturing. 

This move, part of the Biden-Harris Administration’s CHIPS for America program, comes as the US seeks to revitalise its semiconductor industry and reduce dependence on foreign suppliers. Advanced packaging, a crucial step in semiconductor production, has long been dominated by Asian countries like Taiwan and South Korea. By investing heavily in this area, the US aims to reshape the global semiconductor landscape and position itself at the forefront of next-generation chip technology, marking a significant shift in the industry’s balance of power.

US Secretary of Commerce Gina Raimondo emphasised the importance of this move, stating, “President Biden was clear that we need to build a vibrant domestic semiconductor ecosystem here in the US, and advanced packaging is a huge part of that. Thanks to the Biden-Harris Administration’s commitment to investing in America, the US will have multiple advanced packaging options across the country and push the envelope in new packaging technologies.”

The competition will focus on five key R&D areas: equipment and process integration, power delivery and thermal management, connector technology, chiplets ecosystem, and co-design/electronic design automation. The Department of Commerce anticipates making several awards of approximately $150 million each in federal funding per research area, leveraging additional investments from industry and academia.

This strategic investment comes at a crucial time, as emerging AI applications are pushing the boundaries of current technologies. Advanced packaging allows for improvements in system performance, reduced physical footprint, lower power consumption, and decreased costs – all critical factors in maintaining technological leadership.

The Biden-Harris Administration’s push to revitalise American semiconductor manufacturing comes as the global chip shortage has highlighted the risks of overreliance on foreign suppliers. Asia, particularly Taiwan, currently dominates the advanced packaging market. According to a 2021 report by the Semiconductor Industry Association, the US accounts for only 3% of global packaging, testing, and assembly capacity, while Taiwan holds a 54% share, followed by China at 16%.

Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio outlined an ambitious vision for the program: “Within a decade, through R&D funded by CHIPS for America, we will create a domestic packaging industry where advanced node chips manufactured in the US and abroad can be packaged within the States and where innovative designs and architectures are enabled through leading-edge packaging capabilities.”

The announcement builds on previous efforts by the CHIPS for America program. In February 2024, the program released its first funding opportunity for the National Advanced Packaging Manufacturing Program (NAPMP), focusing on advanced packaging substrates and substrate materials. That initiative garnered significant interest, with over 100 concept papers submitted from 28 states. On May 22, 2024, eight teams were selected to submit complete applications for funding of up to $100 million each over five years.

According to Laurie, the goal is to create multiple high-volume packaging facilities by the decade’s end and reduce reliance on Asian supply lines that pose a security risk that the US “just can’t accept.” In short, the government is prioritising ensuring America’s leadership in all elements of semiconductor manufacturing, “of which advanced packaging is one of the most exciting and critical areas,” White House spokeswoman Robyn Patterson said.

The latest competition is expected to attract significant interest from the US semiconductor ecosystem and shift that balance. It promises substantial federal funding and the opportunity to shape the future of American chip manufacturing. As the global demand for advanced semiconductors continues to grow, driven by AI, 5G, and other emerging technologies, the stakes for technological leadership have never been higher.

As the US embarks on this ambitious endeavour, the world will see if this $1.6 billion bet can challenge Asia’s stronghold on advanced chip packaging and restore America’s position at the forefront of semiconductor innovation.

(Photo by Braden Collum)

See also: Global semiconductor shortage: How the US plans to close the talent gap

Want to learn more about AI and big data from industry leaders? Check out AI & Big Data Expo taking place in Amsterdam, California, and London. The comprehensive event is co-located with other leading events including Intelligent Automation Conference, BlockX, Digital Transformation Week, and Cyber Security & Cloud Expo.

Explore other upcoming enterprise technology events and webinars powered by TechForge here.

Tags: ai, AI semiconductor, artificial intelligence, chips act, law, legal, Legislation, Politics, semiconductor, usa

[head-post]

US chip maker Onsemi invests $2 billion in Czech Republic

Onsemi, the US chip maker, plans to invest up to $2 billion in its production facility in the Czech Republic, according to Euractiv.

The decision came after negotiations with the government led to the largest foreign investment in the country’s history. The company’s chip production in the town of Rožnov pod Radhoštem, near the Slovakian border, is expected to increase dramatically. It will contribute more than 240 million euros a year to the country’s GDP.

Czech Prime Minister Petr Fiala stated:

It is not the acquisition of an assembly plant, it is the acquisition of a centre of modern technologies, production with high added value.

Industry and Trade Minister Josef Síkela supported the opinion. He called the expansion of the Onsemi plant a strategic investment in the future of Czech industry. Síkela also noted that chips were playing an increasingly important role in the automotive industry, as they currently accounted for 10 per cent of the cost of every electric vehicle and would continue to do so.

According to the minister, Onsemi chose Volkswagen Group, including Czech car manufacturer Škoda Auto, as a strategic partner.

[The investment] would solidify advanced power semiconductor supply chains for its European and global customer base.

The Czech government will hold talks on stimulus with Onsemi in the coming months.

Read more HERE

[allthebrazilianpolitics]

Brazilian carmakers halt production as demand slumps

For the past two years, Brazilian carmakers have struggled with a shortage of inputs, particularly the semiconductors used to calibrate cars’ fuel injection, power in-car entertainment systems, or operate cruise control. Now, a lack of demand has upended the industry. 

Fewer than 130,000 new cars were registered in Brazil last month, the second-lowest level since the early stages of the pandemic. The result stems from a mix of a decelerating economy, stubborn inflation, high interest rates, and already worrying levels of household indebtedness. 

In this context, multiple carmakers will halt production and send assembly line employees on vacation. This week, General Motors, Hyundai, and Stellantis (which owns Fiat, Jeep, Peugeot, and Citroën) will shut down production lines. Hyundai will be the first to make the move on Monday.

Continue reading.

[ctechstudy]

What are the characteristics of different generations of computer?

Generations of Computers

First generation: vacuum tubes (1940–1956)

The earliest computers used gigantic, room-sized vacuum tubes as their main memory and magnetic drums as their circuitry. The original computers were highly expensive to run and consumed a lot of power in addition to producing a lot of heat, which frequently led to problems. A maximum of 20,000 characters may fit within the device.

First-generation computers were limited to solving a single issue at a time and depended on machine language, the most basic programming language that computers could understand. Operators would need days or perhaps weeks to build up a new issue. Printouts were used for output displays, and input was dependent on punched cards and paper tape.

The Von Neumann architecture, which shows the design architecture of an electrical digital computer, was first established during this generation. J. Presper Eckert created the UNIVAC and ENIAC computers, which later served as examples of first-generation computer technology. The United States Census Bureau received the UNIVAC, the first commercial computer, in 1951.

Second Generation: Transistors (1956–1963)

Transistors would take the role of vacuum tubes in the second generation of computers, changing the world. The transistor was created in 1947 at Bell Labs, but it wasn't used often in computers until the late 1950s. Hardware innovations, including magnetic core memory, magnetic tape, and the magnetic disc, were also included in this generation of computers.

Since the transistor outperformed the vacuum tube, computers of the second generation are now smaller, quicker, cheaper, more energy-efficient, and more dependable. The transistor was a tremendous advance over the vacuum tube, even though it still produced a lot of heat that may harm the computer. For input and output, a second-generation computer still used punched cards.

When Did Assembly Languages First Appear on Computers?

Symbolic, or assembly, languages were introduced to second-generation computers in place of the obscure binary language, enabling programmers to define instructions in words. High-level programming languages, such as the earliest iterations of COBOL and FORTRAN, were also being created around this time. These were also the first computers that used a magnetic core rather than a magnetic drum to store instructions in memory.

The atomic energy sector was the target market for the first computers of this generation.

Third generation: integrated circuits (1964–1971)

The third generation of computers was distinguished by the advancement of the integrated circuit. Computer speed and efficiency significantly increased once transistors were shrunk and installed on silicon chips or semiconductors.

Users would interact with a third-generation computer through keyboards, displays, and interfaces with an operating system instead of punched cards and printouts. This allowed the device to execute several programs at once with central software that supervised the memory. Because they were more compact and affordable than their forerunners, computers were made available to the general public for the first time.

Have You Ever heard..? Small electronic components known as integrated circuit (IC) chips are constructed using semiconductor material.

In the 1950s, Jack Kilby of Texas Instruments and Robert Noyce of Fairchild Semiconductor created the first integrated circuit.

Fourth generation: microprocessors (1971–present)

The fourth generation of computers was introduced with the microprocessor, which allowed thousands of integrated circuits to be packed onto a single silicon chip. The original generation's technology, which once filled a whole room, can now fit in the palm of your hand. Input/output controls, memory, the central processor unit, and other components were all combined into a single chip in the 1971-developed Intel 4004 chip.

IBM released its first personal computer for home use in 1981, while Apple released the Macintosh in 1984. As more and more commonplace goods started to employ the microprocessor chip, microprocessors also left the domain of desktop computers and entered numerous spheres of existence.

As these tiny computers gained strength, they could be connected to one another to create networks, which eventually resulted in the creation of the Internet. Each fourth-generation computer also saw the introduction of the mouse, portable devices, and graphical user interfaces (GUIs).

The fourth generation of computers was introduced with the microprocessor, which allowed thousands of integrated circuits to be packed onto a single silicon chip. The original generation's technology, which once filled a whole room, can now fit in the palm of your hand. Input/output controls, memory, the central processor unit, and other components were all combined into a single chip in the 1971-developed Intel 4004 chip.

Fifth Generation Computers

AI is the enabling technology for the fifth generation of computers. It enables machines to behave just like people. It is frequently used in speech recognition, medical, and entertainment systems. It has also demonstrated impressive success in the area of gaming, where computers are capable of defeating human opponents.

The fifth generation of computers has the greatest speed, the smallest size, and a much larger usage area. Although complete AI has not yet been attained, it is frequently predicted that this dream will likewise come true very soon, given current progress.

When comparing the characteristics of different computer generations, it is sometimes claimed that while there has been a significant advancement in terms of operating speed and accuracy, the dimensions have decreased with time. Additionally, value is declining while reliability is really rising.

The main characteristics of fifth-generation computers are:

Main electrical part

Utilizes parallel process and Ultra Large-Scale Integration (ULSI) technologies based on artificial intelligence (ULSI has millions of transistors on a single microchip)

Language

Recognize simple language (human language).

Size

Portable and small in size.

Input / output device

Keypad, display, mouse, trackpad (or touchpad), touchscreen, pen, voice input (recognize voice/speech), laser scanner, etc.

Example of the fifth generation

Desktops, laptops, tablets, smartphones, etc.