#Non-UV Dicing Tapes Market
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Dicing Tapes Market Innovative Strategy 2031
The “Dicing Tapes Market Share, Size, and Trends | 2031” is market research by The Insight Partners. The Dicing Tapes market has perceived tides of change in the recent past. This study offers precise projections after detailed scrutiny of a range of factors impacting the business. Considering the present market scenario, this report brings forward correct predictions on revenue, market size, and CAGR of the Dicing Tapes market. The novel market research which is based on a fact-based foundation is now accessible for purchase. This report can make a variance in wide decision-making and drive business forward in the right direction.
Business is no longer a game of instincts when it comes to capitalizing on new production lines. In a highly competitive Dicing Tapes market, companies may face several challenges. Having trusted market research is always endorsed for both veteran and new entrants. Dicing Tapes Market report presents a thorough analysis of local, regional, and global market scenarios through the following details.
Report Attributes
Details
Segmental Coverage
Product
UV Curable Dicing Type
Non-UV Curable Dicing Type
Backing Material
Polyvinyl Chloride
PET
Polyolefin
Others
Coating
Single Sided
Double Sided)
Regional and Country Coverage
North America (US, Canada, Mexico)
Europe (UK, Germany, France, Russia, Italy, Rest of Europe)
Asia Pacific (China, India, Japan, Australia, Rest of APAC)
South / South & Central America (Brazil, Argentina, Rest of South/South & Central America)
Middle East & Africa (South Africa, Saudi Arabia, UAE, Rest of MEA)
Market Leaders and Key Company Profiles
Nitto Denko Corporation
Lintec Corporation
Sumitomo Bakelite Co. Ltd.
Denka Company Limited
Furukawa Electric Co. Ltd.
3M Company
Mitsui Chemicals
Hitachi Chemical Company, Ltd.
Pantech Tape Co. Ltd
Ultron Systems, Inc.
Other key companies
Competitive Landscape
Knowing the state of rivals is a strategically right move to outperform them. This report is the right place to explore key strategies, developments, and recent launches by key Dicing Tapes market players. This report emphasizes an analysis of business strategies and expected growth opportunities for brands.
Key Coverings:
Current and Future Market Estimates- Dicing Tapes Market Share, CAGR, and Forecast | 2031
Market Dynamics – Drivers, Challenges, Regional Trends, and Market Opportunities
Market Segmentation – Product, Application, End-use Industries, and Regional Growth Prospects.
Competition Matrix – Key Market Players and Strategies
Recent Developments and Innovation Contributing Market Growth
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Key Questions Addressed in the Dicing Tapes Market Research Include:
What are present Dicing Tapes market values, and what can be expected in the upcoming decade?
What are the key segments in the Dicing Tapes market?
What is the regional distribution of the Dicing Tapes market report?
What are the key players and their recent strategies?
What are the key factors driving Dicing Tapes market growth?
What are regulatory concerns and requirements businesses have to compel?
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Non-UV Dicing Tapes Market Recent Trends, In-depth Analysis, Size and Forecast 2022 to 2030
Non-UV Dicing Tapes Market size was $1.59 billion in 2022, and is anticipated to grow to a value of more than $2.13 billion by 2030, with a growing CAGR (compound annual growth rate) of over 6% from 2022 to 2030.
Non-UV dicing tapes are used in the electronics industry for large die sizes. It is composed of flexible films, the majority of which are constructed of PVC. They are used in many different applications, such as wafer and packaging dicing. The process of wafer back grinding, which is applicable in the process of gaining significant momentum among the water fabrication industry, uses non-UV dicing tapes. Without incurring greater switching costs, thin wafers continue to contribute to the production of energy-efficient end products. As a result, it also increases the demand for non-UV dicing tapes and accelerates market growth.
The non-bright (UV) dicing tape market is fundamentally determined by the flooding number of electronic sturdy contraptions. Moreover, the rising prominence of slight electronic things will pad the market's development rate. What's more, different factors, for example, expanded information on the advantages of PET-based non-UV dicing tape and mechanical headways will impact the development of non-bright (UV) dicing tape market. Another huge driver that will extend the market's development rate is upsurge in the interest for PCs and other electrical gadgets. Likewise, rising interest for superior execution adaptable circuits from different end-use ventures will additionally expand the interest for PCB, ICs and other electronic parts, subsequently thriving the development pace of non-bright (UV) dicing tape market. The flooding interest for semiconductor fabricating area will decidedly influence the income development of non-UV dicing tapes market during the estimate time frame referenced previously.
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Global Non-UV Dicing Tapes Market: Segment Assessment
Based By Material Type:
• PVC
• PET
• PO
• Others (EVA, etc)
Based By Thickness:
• 85-125 Micron
• 126-150 Micron
• Below 85 Micron
• Above 150 Micron
Based By Coating Type:
• Single sided
• Double sided
Based By Application:
• Wafer dicing
• Package dicing
• Others (Glass, ceramics)
Competitive Terrain
Major players competing in Global non-UV dicing tapes market are Pantech Tape Co. Ltd., Mitsui Chemicals Inc., AI Technology, Inc., Furukawa Electric Co. Ltd., LINTEC Corporation, Pantech Tape Co. Ltd, and QES GROUP BERHAD.
Major Regions & Countries Covered:
• North America (the United States, Canada, and Mexico).
• Europe, (Germany, France, UK, Russia, and Italy).
• Asia-Pacific (China, Japan, Korea, India, and Southeast Asia).
• South America (Brazil, Argentina, Colombia, etc.).
• The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, and South Africa).
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Frequently Asked Questions
What is the Growth Outlook for the Non-UV Dicing Tape Market?
What is the Share of the Non-UV Dicing Tape Market?
Which is the Key Driver in the Non-UV Dicing Tape Market?
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How Much Is The Dicing Tapes Industry Worth?
Transparency Market Research delivers key insights on the dicing tapes market in its published report, which include global industry analysis, size, share, growth, trends, and forecasts for 2019–2027. In terms of revenue, the global dicing tapes market is projected to expand at a CAGR of ~6% during the forecast period, due to several factors, about which, TMR offers detailed insights and forecasts in the dicing tapes market report.
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Dicing Tapes Market: An Overview
The demand for printed circuit boards, integrate circuits (ICs) and other electronic components is high. This can be attributed to end users who consume high-performance compact circuits for various electronic gadgets. Dicing tape finds application in the electronics industry for fixing a piece of work during the dicing process, in the manufacturing of semiconductors & other electronics equipment. This, in turn, is increasing the need for dicing tape across the world. This tape finds application in a wide variety of applications, including silicon and GaAs semiconductors, encapsulated package substrates, glass, ceramics, and crystals. Dicing tape is crucial for the full-cut dicing of wafers to improve die quality.
Dicing Tapes Market: Application in Glass Wafers to Provide High Accuracy Cutting
Technological advancements and high demand for aesthetically thin electronic products have led to the reduction in wafer thickness. Wafer processing companies prefer materials with high adhesive strength for the dicing process and UV curable tapes. For delicate wafers, it is essential to eliminate negative charges during back-grinding and dicing processes. Currently, common applications of UV dicing tape and non-UV dicing tape are in ICs, EMC package substrates, QFN (quad flat no-leads) & PCBs (printed circuit boards), Si wafers, ceramics, glass, lenses, and others.
Glass wafers find application in bio ID devices, cell phone cameras, CCD & IR camera windows, and IR cut-off filters, which is increasing at a significant rate. Dicing tape is used during glass wafer dicing processes to reduce damage, shorten process time, and provide high accuracy cutting. Therefore, the dicing tapes market is expected to witness outstanding growth during the forecast period.
High Sales Accompanied by Outstanding Growth Opportunities in Asia Pacific
Manufacturers of dicing tape have a strong market presence in China, Taiwan, and Japan. However, these players are expected to expand their presence in other regions too, such as Europe and the Americas, due to the presence of developed manufacturing industries in these regions. With a budding electronics consumables industry, along with advanced technology, China is anticipated to remain at the top in the dicing tapes market.
Tier 1 manufacturers operating in the industrial electronics industry have sited a sharp increase in demand from South Korea, China, and Taiwan. This will further fuel the growth of the dicing tapes market, globally. Moreover, the size of chips or ICS in electronic devices has reduced due to technological advancements. This is escalating the demand for dicing tape among IC manufacturers. Increasing demand for electronic durables is expected to boost the demand for semiconductors. Wafer dicing tape that is backed with PVC material and synthetic acrylic adhesives has high tear strength and elongation as compared to other tapes. Manufacturers of UV dicing tape are continuously developing new materials with enhanced properties such as high adhesion levels and easy peel-off for clean removal. For instance, raw material suppliers such as Henkel Corporation developed acrylic adhesive materials that decrease rapidly on exposure to UV light.
Global Dicing Tapes Market: Competition Landscape
Key company profiles of major participants in the dicing tapes market are incorporated in the report to analyze the recent key developments, product offerings, financials, and strategies adopted to survive in the market. Manufacturers in the dicing tapes market are extending their scope of products and increasing the number of manufacturing facilities.
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Some of the key players operating in the global dicing tapes market are Nitto Denko Corp, Mitsui Chemicals Inc., Sumitomo Bakelite Co. Ltd., AI Technology, Inc., LINTEC Corporation, Denka Company Limited, Ultron Systems, Inc., Pantech Tape Co. Ltd., QES GROUP BERHAD, Nippon Pulse Motor Taiwan, Loadpoint Limited., Daest Coating India Pvt. Ltd., Shenzhen Xinst Technology Co. Ltd, and Solar Plus Company.
Global Dicing Tapes Market: Classification
Dicing Tapes Market by Product
UV Curable Dicing Type
Non-UV Curable Dicing Type
Dicing Tapes Market by Backing Material
Polyvinyl Chloride
PET
Polyolefin
Others (EVA, etc.)
Dicing Tapes Market by Thickness
Below 85 Microns
85-125 Microns
126-150 Microns
Above 150 Microns
Dicing Tapes Market by Coating
Single-sided
Double-sided
Dicing Tapes Market by Application
Wafer Dicing
Package Dicing
Others (Glass, Ceramics)
Dicing Tapes Market by Region
North America
Latin America
Europe
Asia Pacific
Middle East & Africa
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Global Semiconductor Dicing Tapes Market 2021 Growth, Latest Trend Analysis and Forecast 2026
Global Semiconductor Dicing Tapes Market Growth 2021-2026 is the latest research study published by MarketandResearch.biz that aims to gather, record, and analyze the data for the concerns linked to the marketing of goods and services and thereby serve the global industry with an excellent market research report. The report identifies industry trends, determines brand awareness and influence, provides industry insights, and offers competitive intelligence. This report carries out an analysis of the growth rate and the market value of the global Semiconductor Dicing Tapes industry based on market dynamics and growth-inducing factors.
The report puts a light on growth opportunity assessment, customer insights, competitive business, and distribution channel assessment. The report estimates the global Semiconductor Dicing Tapes market valuation which comprises the market size, revenue, and share in order to be acquainted with the current market position on both the regional and global platforms. This report will provide you with an accurate understanding of what’s happening in your industry. You’ll have access to important information on topics such as consumer demographics, product trends, pricing analysis.
NOTE: Consumer behaviour has changed within all sectors of the society amid the COVID-19 pandemic. Industries on the other hand will have to restructure their strategies in order to adjust with the changing market requirements. This report offers you an analysis of the COVID-19 impact on the Semiconductor Dicing Tapes market and will help you in strategising your business as per the new industry norms.
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What The Report Encloses:
Critical insights of each segment, including volume growth outlook, and demand & supply pattern
Details of each player – positives & negatives, current status, future developments – of the global Semiconductor Dicing Tapes market
Detailed information regarding the trends influencing the growth of the global Semiconductor Dicing Tapes market
In-depth assessment of the utilization in each end-use industry
Historical data and future growth outlook of the global market
Market size segment by companies, this report covers:
Mitsui Chemicals Tohcello
Lintec
Denka
Nitto
Furukawa Electric
D&X
AI Technology
Taicang Zhanxin
Plusco Tech
Shanghai Guku
Boyan
BYE
Insights drawn from data serve as excellent tools to facilitate a deeper understanding of multiple aspects of the global Semiconductor Dicing Tapes market. This further helps the user with their developmental strategy. The report offers complete company profiles to bring out a clear view of the competitive landscape of the global Semiconductor Dicing Tapes market outlook. It comprises all key players, with their arrangement, product offering, revenue supply by industry sections, market trends, acquisitions and arrangements, contact info, recent growth, and geographic investigation.
This report segments the market based on types are:
UV Curable
Non-UV Curable
Based on application, the market is segmented into:
6 Inch
8 Inch
12 Inch
Others
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Some of the key geographies mentioned in this report include:
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
Comprehensive Research Methodology Which Drives The Global Semiconductor Dicing Tapes Market Statistics Can Be Shown As Follows:
Data Gathering: Data is gathered through paid primary research with players, distributors, researchers, and suppliers. Secondary research is conducted through official company websites and paid sources. This process is also known as market profiling.
Developing a list of respondents based on primary and secondary research techniques
Drafting discussion guide
Validating the gathered data to provide authentic and accurate data
Providing key insights and analysts opinions of global Semiconductor Dicing Tapes industry
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Latest Global Non-UV Dicing Tapes Market Innovations 2021- Furukawa Electric, AI Technology, Pantechnicon Tape and Mitsui Chemicals
Latest Global Non-UV Dicing Tapes Market Innovations 2021- Furukawa Electric, AI Technology, Pantechnicon Tape and Mitsui Chemicals
Global Non-UV Dicing Tapes market 2021-2026 study begins with a detailed outlook, which gives readers a brief overview of the market with clarity and scope. This section elaborates the purpose of the survey, so readers have a directional view of the market. Every chapter related to market and industrial facts has been explained with a brief review in the global Non-UV Dicing Tapes market…
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This non- UV dicing tape market report provides details of new recent developments, trade regulations, import export analysis, production analysis, value chain optimization, market share, impact of domestic and localised market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographical expansions, technological innovations in the market.
#Non Uv Dicing Tape Market#Non Uv Dicing Tape Market share#Non Uv Dicing Tape Market size#Non Uv Dicing Tape Market trends#Non Uv Dicing Tape Market growth#Non Uv Dicing Tape Market growth#Non Uv Dicing Tape Market forecast#Non Uv Dicing Tape Market research
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Dicing Tapes Market To Reach A Valuation Of ~Us$ 1.5 Bn By 2027
Transparency Market Research delivers key insights on the dicing tapes market in its published report, which include global industry analysis, size, share, growth, trends, and forecasts for 2019–2027. In terms of revenue, the global dicing tapes market is projected to expand at a CAGR of ~6% during the forecast period, due to several factors, about which, TMR offers detailed insights and forecasts in the dicing tapes market report.
Dicing Tapes Market: An Overview
The demand for printed circuit boards, integrate circuits (ICs) and other electronic components is high. This can be attributed to end users who consume high-performance compact circuits for various electronic gadgets. Dicing tape finds application in the electronics industry for fixing a piece of work during the dicing process, in the manufacturing of semiconductors & other electronics equipment. This, in turn, is increasing the need for dicing tape across the world. This tape finds application in a wide variety of applications, including silicon and GaAs semiconductors, encapsulated package substrates, glass, ceramics, and crystals. Dicing tape is crucial for the full-cut dicing of wafers to improve die quality.
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Dicing Tapes Market: Application in Glass Wafers to Provide High Accuracy Cutting
Technological advancements and high demand for aesthetically thin electronic products have led to the reduction in wafer thickness. Wafer processing companies prefer materials with high adhesive strength for the dicing process and UV curable tapes. For delicate wafers, it is essential to eliminate negative charges during back-grinding and dicing processes. Currently, common applications of UV dicing tape and non-UV dicing tape are in ICs, EMC package substrates, QFN (quad flat no-leads) & PCBs (printed circuit boards), Si wafers, ceramics, glass, lenses, and others.
Glass wafers find application in bio ID devices, cell phone cameras, CCD & IR camera windows, and IR cut-off filters, which is increasing at a significant rate. Dicing tape is used during glass wafer dicing processes to reduce damage, shorten process time, and provide high accuracy cutting. Therefore, the dicing tapes market is expected to witness outstanding growth during the forecast period.
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Dicing Tapes Market: Clear Understanding of The Competitive Landscape and Key Product Segments
Manufacturing semiconductors requires automation efficiency and productivity and one of the production steps in this process is wafer dicing. Dicing tapes are basically designed to hold the semiconductor wafer during dicing process. This process separates the dies and also keeps the chips within tight tolerances regarding dimensions, edges, orientation and position. Dicing tapes are made of materials such as PVC, polyolefin, or poly-ethylene backing with an adhesive to hold the dies in place. Majorly there are two types of dicing tapes in the market, UV film sensitive tapes and silicone free adhesive plastic films.
Silicone free adhesive films results in cleaner process and more consistent adhesive properties as the tape contains no silicone release agents. These films are made of PVC with a rubber base adhesive. As the global electronics and semiconductors market is growing the market of UV dicing tapes which are categorized in pressure sensitive adhesive tapes is expected to grow at a faster rates because of its certain properties such as strong adhesion and superior performance in high heat and pressure conditions. These tapes are used in wafer dicing, back grinding, PBC grinding and glass dicing applications.
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Dicing tapes market: Dynamics
The global electronics and semiconductor industry is very vast and is expected to grow due to the demand of compact electronics components and semiconductors which reduces the size of electronic device or the appliance making it easy to handle, and transport. The market for polyolefin UV tapes is expected to grow in the coming years due to its high adhesive and high temperature and pressure bearable properties. As the global electronics and semiconductor market is growing it is paving the path for UV dicing tapes.
The dicing tapes market is driven by the demand for small electronic components such as IC’s and electronic chips. Two categories of tapes are mostly used, blue and UV tape. Blue tapes are suitable in dicing standard silicon wafers and is sometimes simultaneously used with costly UV tape when it comes to dicing of more delicate materials such as GaAs. Plasma dicing is attracting the interests of the global electronic and semiconductor industry as a practical alternative to conventional methods that use saw blades and lasers. Plasma dicing ensures the increase in wafer throughput, dye per wafer and dye yields due to less damage in processing. Adding to this, another threat to the growing market of Dicing tapes is the dicing of robust packages in high volume. Packages such as BGA, QFN, or CSPs, a tape less, jig based systems which use vacuum system for the wafer through-put.
Dicing tapes market: segmentation
Dicing tape market is segmented on the basis of material
UV dicing tapes
Non UV dicing tapes
Silicon free adhesive films
Dicing tapes market is segmented on the basis of strength
Adhesive strength
Tensile strength
Elongation
Dicing tapes market is segmented on the basis of thickness
Backing film thickness
Adhesive thickness
Dicing tapes market is segmented on the basis of thickness
Back Grinding
Wafer Dicing
Dicing tapes market: Geographical outlook of the dicing tapes market in the respective regions.
The global dicing tapes market is divided in seven regions
North America
Latin America
Western Europe
Eastern Europe
Asia Pacific excluding Japan (APEJ)
Middle East & Africa (MEA)
Japan
Asia Pacific is estimated to be the largest market for dicing tapes accounting for over half of the global revenue and over 10% of CAGR followed by second largest North America region. PO UV tapes segment holds the largest market in North America. The growing demand for semiconductors and minute components such as chips and IC’s has driven the dicing tapes market in Asia pacific region. The UV dicing tapes serve the global semiconductor and electronics market with many benefits one of which is the high resistance to temperature and pressure and the other is that these tapes can be recycled. These factors are expected to play a key role in the growth of the dicing tapes market. However, the market in Europe is quiet mature so the growth of dicing tape market in this region is expected to grow at a slower rate.
Dicing tapes market: Key players
Furukawa Electric Co. Ltd.
Nitto Denko Corporation
Mitsui Corporation
Lintec Corporation
Sumitomo Bakelite Co. Ltd.
Denka Company Limited
Pantech Tape Co. Ltd
Ultron Systems, Inc.
NEPTCO, Inc.
Nippon Pulse Motor Taiwan
Loadpoint Limited
AI Technology, Inc.
Minitron Electronic GmbH.
Denka electronics & products
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Sales of UV Tape Market to Record Exponential Growth During 2020
Theglobal UV tapes market is projected to reflect an impressive CAGR during the forecast period by 2020
Analysis of UV Tape Market Based on Segmentation
UV tapes are a kind of pressure-sensitive tapes with more adhesive power, which decreases drastically on exposure to UV light, thereby providing easy and clean removal of semiconductor chips after it has attained its purpose. These tapes are used to protect semiconductor wafers against surface damage and scratching during shipping and storage of wafers. These tapes are manufactured by using PO, PVC or PET as row material with acrylic adhesive to keep pieces of semiconductor in place. These tapes are usually thinner as compare to other tapes, which vary between 70 to 150 micrometers.
In terms of volume and value, UV tapes held less than 1% of the global PSA tapes market in 2014. Rise in demand for consumer electronics combined with miniaturization of electronic devices is boosting the demand for semiconductors, which in return causing increasing demand for UV tapes. Large number of governments in Asia Pacific are concentrating on sustainable development and have formulated the regulations for it. Such initiatives and regulations are recognized as key driving factors of the market. Whereas, higher cost of UV tapes than that of non-UV tapes is trivial restraint in UV tapes market.
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Large Scale Semiconductor Foundries to Boost Demand of UV Tapes in Asia Pacific
Geographically, North America and Asia Pacific represented leading markets for UV tapes market in 2014. Asia Pacific is estimated to register 5.4X higher revenue than North America, in terms of value, by the end of 2020. In Asia Pacific, existence of large scale semiconductor foundries is the key factor behind gush in demand for UV tapes in the region. Asia Pacific is anticipated to remain most prominent market for UV tapes in terms of value, followed by North America and Europe.
Polyolefin-based UV tapes segment, by product type are anticipated to reflect highest CAGR followed by polyvinyl chloride and polyethylene terephthalate (PET). Polyolefin-based UV tapes are estimated to remain the largest market segment over the forecast period whereas, PVC is likely to witness 1.5X expansion in its revenue by the end of 2020.
UV tape market has been segmented on the basis of application type into back-grinding and water dicing. Water dicing and back-grinding are two successive processes applied in semiconductor processing. It is because of this that in both applications, UV tapes account nearly same market share. However, other applications such as telecommunications and aerospace are likely to be more emerging applications than both of these applications. Water dicing and back-grinding are anticipated to ride on significant CAGR over the forecast period.
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Some Leading Market Players
Prominent market players operating in the global UV tape market, which are profiled in this report include Sumitomo Bakelite Co. Ltd., Furukawa Electric Co., Ltd., Lintec Chemicals, Mitsui Chemicals, and Nitto Denko Corporation. These are some key manufacturers and raw material providers, while Dow Chemical Co, BASF SE, and Henkel AG & Company are some other key raw material suppliers.
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UV Tape Market to Penetrate Untapped Regions 2020
The global UV tapes market is projected to reflect an impressive CAGR during the forecast period by 2020
Analysis of UV Tape Market Based on Segmentation
UV tapes are a kind of pressure-sensitive tapes with more adhesive power, which decreases drastically on exposure to UV light, thereby providing easy and clean removal of semiconductor chips after it has attained its purpose. These tapes are used to protect semiconductor wafers against surface damage and scratching during shipping and storage of wafers. These tapes are manufactured by using PO, PVC or PET as row material with acrylic adhesive to keep pieces of semiconductor in place. These tapes are usually thinner as compare to other tapes, which vary between 70 to 150 micrometers.
In terms of volume and value, UV tapes held less than 1% of the global PSA tapes market in 2014. Rise in demand for consumer electronics combined with miniaturization of electronic devices is boosting the demand for semiconductors, which in return causing increasing demand for UV tapes. Large number of governments in Asia Pacific are concentrating on sustainable development and have formulated the regulations for it. Such initiatives and regulations are recognized as key driving factors of the market. Whereas, higher cost of UV tapes than that of non-UV tapes is trivial restraint in UV tapes market.
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Large Scale Semiconductor Foundries to Boost Demand of UV Tapes in Asia Pacific
Geographically, North America and Asia Pacific represented leading markets for UV tapes market in 2014. Asia Pacific is estimated to register 5.4X higher revenue than North America, in terms of value, by the end of 2020. In Asia Pacific, existence of large scale semiconductor foundries is the key factor behind gush in demand for UV tapes in the region. Asia Pacific is anticipated to remain most prominent market for UV tapes in terms of value, followed by North America and Europe.
Polyolefin-based UV tapes segment, by product type are anticipated to reflect highest CAGR followed by polyvinyl chloride and polyethylene terephthalate (PET). Polyolefin-based UV tapes are estimated to remain the largest market segment over the forecast period whereas, PVC is likely to witness 1.5X expansion in its revenue by the end of 2020.
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UV tape market has been segmented on the basis of application type into back-grinding and water dicing. Water dicing and back-grinding are two successive processes applied in semiconductor processing. It is because of this that in both applications, UV tapes account nearly same market share. However, other applications such as telecommunications and aerospace are likely to be more emerging applications than both of these applications. Water dicing and back-grinding are anticipated to ride on significant CAGR over the forecast period.
Some Leading Market Players
Prominent market players operating in the global UV tape market, which are profiled in this report include Sumitomo Bakelite Co. Ltd., Furukawa Electric Co., Ltd., Lintec Chemicals, Mitsui Chemicals, and Nitto Denko Corporation. These are some key manufacturers and raw material providers, while Dow Chemical Co, BASF SE, and Henkel AG & Company are some other key raw material suppliers.
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Ultraviolet Adhesive Market: Future Demand, Market Analysis & Outlook to 2025
6th September: This Report Studies the Global Ultraviolet Adhesive Market size, industry status and forecast, competition landscape and growth opportunity. This Research Report categorizes the Global Ultraviolet Adhesive Industry by Companies, Region, Application, Type and end-use Industry.
The Global Ultraviolet Adhesive market is expected to witness substantial growth over the upcoming years owing to its wide scale application in shielding of semiconductor wafers against breaking and grinding. UV adhesive is also extensively used in wafer back grinding, package dicing and wafer dicing, these factors are expected to propel growth for the market over the forecast period. Moreover, the strong adhesive strength of UV adhesive saves cost and also improves quality of semiconductor processing. With growing demand for miniaturization of electronics coupled with high demand of consumer electronic devices is expected to propel demand for the UV adhesive market.
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Technical advancements in the field of UV adhesive market is expected to further propel market growth over the forecast period. UV adhesive are classified as class of pressure sensitive adhesive. UV adhesives are generally thinner than conventional PSA. Common raw materials used in the manufacturing of UV adhesive include Polyolefin, PVC and Polyethylene. High cost of UV adhesive in comparison to Non UV adhesive is expected to hinder growth for the market. Moreover, undesirable effects of UV adhesive on materials such as Polyethylene and rubber.
The global ultraviolet adhesive industry report is a professional and in depth study on the current state of the global UV Adhesive industry. The report offers an overview about the classification, definition, industry chain structure and applications. The analysis of the UV Industry is provided by looking at the trends of industry. Development policies and plans are also discussed, and manufacturing processes and cost structures analyzed. UV adhesive industry export/import consumption, demand & supply figures, cost price and production value gross margins are also provided. The report also talks about the various factors driving the growth for the industry.
The report also focuses on key players of the industry players providing information such as capacity production, product picture & specification, price, cost, contact information and production value. Downstream raw materials and equipment and upstream demand analysis is also carried out. ultraviolet adhesive industry development marketing channels and trends are also analyzed. Finally, the viability of new investment projects are assessed and overall research conclusions offered. Some of the key questions answered by the report are market size and its growth rate. It talks about the key market trends and major growth driving forces of the industry. The report also talks about the key challenges faced by the industry.
Some of the major players in the industry Furukawa Electric Co., Ltd., Mitsui Chemicals, Nitto Denko Corporation, Sumitomo Bakelite Co. Ltd., Lintec Chemicals, Beijing Huaxia Yongle Adhesive Tape Co., Ltd., Pantech Tape Co., Ltd., Ellsworth Adhesives, Nadco Adhesive and Labels, Inc., Shenzhen KHJ Technology Co., Ltd., Nippon Pulse Motor Taiwan, UMC Powerchip, Guangzhou Keysun Adhesive Manufactory, Alpha Beta Global Adhesive and Adhesives Co., Ltd., Xiamen Naikos Industrial Co., Ltd., Shanghai Huishi Package Material Co., Ltd., Guangzhou Kenill Industry Co., Ltd. and Taiwan Semiconductor Manufacturing Company Ltd.
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Non-UV Dicing Tapes Market size was $1.59 billion in 2022, and is anticipated to grow to a value of more than $2.13 billion by 2030, with a growing CAGR (compound annual growth rate) of over 6% from 2022 to 2030.
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Global Semiconductor Dicing Tapes Market 2021 Growth, Latest Trend Analysis and Forecast 2026
Global Semiconductor Dicing Tapes Market Growth 2021-2026 is the latest research study published by MarketandResearch.biz that aims to gather, record, and analyze the data for the concerns linked to the marketing of goods and services and thereby serve the global industry with an excellent market research report. The report identifies industry trends, determines brand awareness and influence, provides industry insights, and offers competitive intelligence. This report carries out an analysis of the growth rate and the market value of the global Semiconductor Dicing Tapes industry based on market dynamics and growth-inducing factors.
The report puts a light on growth opportunity assessment, customer insights, competitive business, and distribution channel assessment. The report estimates the global Semiconductor Dicing Tapes market valuation which comprises the market size, revenue, and share in order to be acquainted with the current market position on both the regional and global platforms. This report will provide you with an accurate understanding of what’s happening in your industry. You’ll have access to important information on topics such as consumer demographics, product trends, pricing analysis.
NOTE: Consumer behaviour has changed within all sectors of the society amid the COVID-19 pandemic. Industries on the other hand will have to restructure their strategies in order to adjust with the changing market requirements. This report offers you an analysis of the COVID-19 impact on the Semiconductor Dicing Tapes market and will help you in strategising your business as per the new industry norms.
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What The Report Encloses:
Critical insights of each segment, including volume growth outlook, and demand & supply pattern
Details of each player – positives & negatives, current status, future developments – of the global Semiconductor Dicing Tapes market
Detailed information regarding the trends influencing the growth of the global Semiconductor Dicing Tapes market
In-depth assessment of the utilization in each end-use industry
Historical data and future growth outlook of the global market
Market size segment by companies, this report covers:
Mitsui Chemicals Tohcello
Lintec
Denka
Nitto
Furukawa Electric
D&X
AI Technology
Taicang Zhanxin
Plusco Tech
Shanghai Guku
Boyan
BYE
Insights drawn from data serve as excellent tools to facilitate a deeper understanding of multiple aspects of the global Semiconductor Dicing Tapes market. This further helps the user with their developmental strategy. The report offers complete company profiles to bring out a clear view of the competitive landscape of the global Semiconductor Dicing Tapes market outlook. It comprises all key players, with their arrangement, product offering, revenue supply by industry sections, market trends, acquisitions and arrangements, contact info, recent growth, and geographic investigation.
This report segments the market based on types are:
UV Curable
Non-UV Curable
Based on application, the market is segmented into:
6 Inch
8 Inch
12 Inch
Others
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Some of the key geographies mentioned in this report include:
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
Comprehensive Research Methodology Which Drives The Global Semiconductor Dicing Tapes Market Statistics Can Be Shown As Follows:
Data Gathering: Data is gathered through paid primary research with players, distributors, researchers, and suppliers. Secondary research is conducted through official company websites and paid sources. This process is also known as market profiling.
Developing a list of respondents based on primary and secondary research techniques
Drafting discussion guide
Validating the gathered data to provide authentic and accurate data
Providing key insights and analysts opinions of global Semiconductor Dicing Tapes industry
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This report can be customized to meet the client's requirements. Please connect with our sales team ([email protected]), who will ensure that you get a report that suits your needs. You can also get in touch with our executives on +1-201-465-4211 to share your research requirements.
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Email: [email protected]
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Wafer Backgrinding Tape Market Opportunities Enhancement and Developments by 2027
Wafer Back Grinding Tape for Surface Protection of Semiconductor Wafers
The wafer back grinding is process of reducing wafer thickness for packaging of integrated circuits. Wafer back grinding tapes are applicable for surface protection of semiconductor wafers during back grinding process.
These tapes help to hold packages during dicing process. Moreover, this can be easily removed from wafer without stress using irradiation technique. They are also used in wide area material, not only semiconductor wafer, but also sapphire, glass, ceramics, and others.
The wafer back grinding tapes constitute of two-ply construction of adhesive layer and backing film. It offers various advantages including overall cost reduction, prevention of wafer from breakage, and wafer surface protection.
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Key Drivers of Global Wafer Back Grinding Tape Market
Demand for wafer back grinding tapes is expected to increase, owing to rise in need of semiconductor wafer fabrication for production of photonic and electrical circuits. These are expected to be key factors driving the global wafer back grinding tape market during the forecast period.
Wafer fabrication helps in building components for various products such as smartphones, television amplifiers, optical computer components, and other electronic components. Moreover, increase in consumer electronics market indirectly drives the demand for wafer back grinding tape. This factor is expected to fuel the global Wafer back grinding tape market during the forecast period.
Companies operating in the global wafer back grinding tape market are investing to expand their product portfolios and improve their distribution networks. They have adopted strategies such as mergers & acquisitions, development of new products, joint ventures, and expansions to cater to increase in demand for wafer back grinding tape in different regions. For instance, in April 2017, LINTEC Corporation, introduced the Back Grinding Tape Laminator “RAD-3520F/12”, to protect the circuit surface of the wafer during the back grinding.
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UV Wafer Back Grinding Tape Segment to Offer Attractive Opportunities
The UV type segment of wafer back grinding tape market expected to grow at highest CAGR rate during forecast period
The UV wafer back grinding tapes are used in a diverse range of materials. Moreover, these wafer back grinding tapes offer various advantages such as surface protection, easy de-taping, and strong adhesive strength.
These factors are expected to increase the demand of the UV wafer back grinding tape during the forecast period.
Limited Usage for Emerging Applications Can Hinder Market Growth
Wafer back grinding tapes are applicable in back grinding process for reducing wafers from their original thickness to a diminished thickness suitable for final packaging of die after dicing.
However, the usage of back grinding tape is limited for the assembly of ultra-thin cheap. This is expected to restrain the usage of the wafer back grinding tapes.
Asia Pacific to Hold Major Share of Global Wafer Back Grinding Tape Market
Asia Pacific is a leading consumer of wafer back grinding tape, followed by North America and Europe. China and India are key markets in the region. In terms of demand, the two countries account for major share of the wafer back grinding tape market in the region. Increase in demand for wafer back grinding tapes in Asia Pacific can be attributed to continued increase in industrialization and rise in need of the consumer electronics in the region.
An increase in investments for the production of the various electronics components has been observed in developing countries of Asia Pacific region. This is expected to drive the demand of wafer back grinding tapes required for electronics assembly and semiconductor packaging.
Key Players Operating in Global Market
The global wafer back grinding tape market is highly concentrated with top manufacturers accounting for approximately 25%–35% of the market share. A few of the key players operating in the global wafer back grinding tape market are:
FURUKAWA ELECTRIC CO., LTD.
Sumitomo Bakelite Co., Ltd.
Mitsui Chemicals America, Inc.
Nitto Denko Corporation
LINTEC Corporation
Loadpoint Limited
Denka Company Limited
Pantech Tape Co. Ltd
NEPTCO, Inc.
Global Wafer Back Grinding Tape Market: Research Scope
Global Wafer Back Grinding Tape Market, by Type
UV
Non-UV
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The Global Non-UV Dicing Tapes Market size was $1.59 billion in 2022, and is anticipated to grow to a value of more than $2.13 billion by 2030, with a growing CAGR (compound annual growth rate) of over 6% from 2022 to 2030.
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UV Tape Market to Reflect a Holistic Expansion 2020
The global UV tapes market is projected to reflect an impressive CAGR during the forecast period by 2020
Analysis of UV Tape Market Based on Segmentation
UV tapes are a kind of pressure-sensitive tapes with more adhesive power, which decreases drastically on exposure to UV light, thereby providing easy and clean removal of semiconductor chips after it has attained its purpose. These tapes are used to protect semiconductor wafers against surface damage and scratching during shipping and storage of wafers. These tapes are manufactured by using PO, PVC or PET as row material with acrylic adhesive to keep pieces of semiconductor in place. These tapes are usually thinner as compare to other tapes, which vary between 70 to 150 micrometers.
In terms of volume and value, UV tapes held less than 1% of the global PSA tapes market in 2014. Rise in demand for consumer electronics combined with miniaturization of electronic devices is boosting the demand for semiconductors, which in return causing increasing demand for UV tapes. Large number of governments in Asia Pacific are concentrating on sustainable development and have formulated the regulations for it. Such initiatives and regulations are recognized as key driving factors of the market. Whereas, higher cost of UV tapes than that of non-UV tapes is trivial restraint in UV tapes market.
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Large Scale Semiconductor Foundries to Boost Demand of UV Tapes in Asia Pacific
Geographically, North America and Asia Pacific represented leading markets for UV tapes market in 2014. Asia Pacific is estimated to register 5.4X higher revenue than North America, in terms of value, by the end of 2020. In Asia Pacific, existence of large scale semiconductor foundries is the key factor behind gush in demand for UV tapes in the region. Asia Pacific is anticipated to remain most prominent market for UV tapes in terms of value, followed by North America and Europe.
Polyolefin-based UV tapes segment, by product type are anticipated to reflect highest CAGR followed by polyvinyl chloride and polyethylene terephthalate (PET). Polyolefin-based UV tapes are estimated to remain the largest market segment over the forecast period whereas, PVC is likely to witness 1.5X expansion in its revenue by the end of 2020.
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UV tape market has been segmented on the basis of application type into back-grinding and water dicing. Water dicing and back-grinding are two successive processes applied in semiconductor processing. It is because of this that in both applications, UV tapes account nearly same market share. However, other applications such as telecommunications and aerospace are likely to be more emerging applications than both of these applications. Water dicing and back-grinding are anticipated to ride on significant CAGR over the forecast period.
Some Leading Market Players
Prominent market players operating in the global UV tape market, which are profiled in this report include Sumitomo Bakelite Co. Ltd., Furukawa Electric Co., Ltd., Lintec Chemicals, Mitsui Chemicals, and Nitto Denko Corporation. These are some key manufacturers and raw material providers, while Dow Chemical Co, BASF SE, and Henkel AG & Company are some other key raw material suppliers.
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